RD_FASE2 - ATLAS Pixel 23 September 2014 G. Darbo – INFN / Genova On behalf of ATLAS Tracker RD_FASE2 o Indico agenda: hCps://agenda.infn.it/conferenceDisplay.py?confId=8544 G. Darbo – INFN / Genova RD_FASE2 – ATLAS Pixels Pisa, 23 September 2014 ITk (Inner Tracker) Timeline – V1.0 ! Dates: • Nov 2014: ITk collaboraPon kick-‐off meePng • Sep 2017: Pixel TDR @ LHCC – Jan 2018: interim-‐MoU 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 ITk-‐IDR CB Endorse Pixel TDR ~ 2019 PreproducPon 2-‐3 Years Pixel ProducPon ITk Ready for InstallaPon APR-‐OCT PIXEL Begin IntegraPon UCG, LHCC, Pixel-‐MOU, RRB UCG, LHCC, Strip-‐MOU, RRB STRIP ITk-‐Kick off EB Approval YR=1 Strips TDR 2 3 ~ 2018 PreproducPon 4 5 ITk Commission on Surface 3-‐4 Year Strip ProducPon 6 7 8 9 10 CB= collaboraPon board, EB=execuPve board, IMOU=interim memorandum of understanding, UCG=upgrade cost group, RRB= Resources review board, IDR=iniPal design review (internal), TDR=technical design report (external) Ref.: S. McMahon ITK Week. Sept. 2014 G. Darbo – INFN / Genova RD_FASE2 – ATLAS Pixel Pisa, 23 September 2014 2 Path to the TDR : Procedural View Path to the TDR : procedural view Now$till$end$2014:$ ! ! ssa " Define$key$parameters$and$fix$them;$agreement$of$the$whole$community.$ " Help$SIM$group$to$prepare$a$prioritized$list$of$questions$to$address$with$the$next$simulation$ production.$ " First$analysis$of$existing$ideas$based$on$the$requirements.$ ! 2015:$ " Exploit$new$simulation$tools$to$answer$open$questions.$ " R&D$on$critical$items$reviewed$in$a$more$formal$way$ " Progressively$reduce$the$number$of$design$variations$from$~∞$to$$~2,$moving$from$the$stage$ of$pure$conceptual$designs$to$an$initial$physical$design$following$specifications$ " Prepare$cost$review$ " Prepare$input$for$Strip$TDR$ 3 Years of R&D (2014/16) is planned in ATLAS before Pixel TDR. ! 2016:$ " Continue$R&D$on$critical$aspects.$ " Refine$designs$and$prepare$for$a$formal$review$process$that$will$identify$baseline$and$options$ for$the$Pixel$TDR.$ " Define$a$detailed$production$and$funding$plan;$address$production$issues;$initial$qualification$ of$vendors,$to$demonstrate$the$feasibility$of$the$proposed$design/production$schedule.$ Ref.: P. MoreOni, ITk Week. Sept. 2014 G. Darbo – INFN / Genova PM'MGS','IDR'to'TDR' RD_FASE2 – ATLAS Pixel 12/9/2014' 4' Pisa, 23 September 2014 3 Layout Studies – Extend at High-η LoI layout under refinement: Total pixel area: 8.2 m2 – present Pixels + IBL = 1.9 m2 • Study extensions at η ≥ 4. Ex.: rings and/or long-‐ IBL • Look at engineering and services. LeCer of Intent Layout Possible High-‐η extension G. Darbo – INFN / Genova RD_FASE2 – ATLAS Pixel Pisa, 23 September 2014 4 ITk Collaboration Roadmap to the 2014 ITk-‐IDR(*) and beyond 17th and 20th October The IDR Review 4th November ITk kick-‐off meePng Before End 2014 ATLAS EB approval of ITk-‐IDR Early 2015 CB Endorsement of ITk-‐IDR Spring 2015 Final report from High eta task force January 2016 Start Pixel TDR for delivery in 2017 (*) IDR – Ini]al Design report Updates to the ITK ITk OrganizaPon Chart Phase II Pixel Project Coordinator: Paolo oreOni Organisation : MITk-SC ITK chair S. McMahon Pixel Coordinator P. Morretini Strip Coordinator I. Gregor Collaboration Institute Matters Software M. Elsing Upgrade Coordinator P. Allport Readout A. Grillo Mechanics A. Catinaccio G. Viehhauser Costing and Finance C. Buttar + Performance & Layout H.Hayward A. Korn Technical Coordinator B. Di Girolomo Production Prep & Test Facilities G. Darbo – INFN / Genova 29/01/2014 Upgrade-Physics Groups P. Wells S. McMahon ITK-SC: 29.01.2014 Country! Number of Institutions! Australia! 3! Canada! 4! CERN! 1! China! 1 (cluster)! Czech Republic! 3! France! 5! Germany! 10! Italy! 6: BO, CS, GE, MI, TN, UD! Japan! 7! Netherland! 1! Norway! 2! Poland! 2! Switzerland! 2! Spain! 2! Slovenia! 1! Sweden! 2! South Africa! 2! Taiwan! 1! United Kingdom! 12! United States! 16! Total! 83! RD_FASE2 – ATLAS Pixel 18 Pisa, 23 September 2014 5 ATLAS ITk Responsibility Organograms Name! Pixel hCps://twiki.cern.ch/twiki/pub/Atlas/ InnerDetectorOrganisa]on/ PixelOrganiza]onJune2014.pdf ITk hCps://twiki.cern.ch/twiki/bin/viewauth/ Atlas/ITkPixelOrganiza]on ATLAS ITk Pixel Organogram Responsibility! Level! Paolo Morettini ! ITK pixel Project Leader ! L1 ! Paolo Morettini ! Pixel DAQ Software ! L2 ! Claudia Gemme ! ITK Design Group Coordinator! L3 ! Claudia Gemme ! Pixel Det. Publication Resp. ! L2 ! Danilo Giugni ! Pixel Engineering/ITK Project Engineer ! L2 ! Clara Troncon ! ID Speak. Comm. chair ! L2 ! M.P. Giordani ! Pixel Det. Data Quality Monit. coord ! L2 ! Silvia Miglioranzi ! Pixel Det. Offline Software coord ! L2 ! Silvia Miglioranzi ! Pixel Det. Performance coord ! L2 ! A. Gabrielli ! ROD ! L3 ! GE! MI ! UD ! BO ! Paolo Morettini + Maurice Garcia Sciveres Richard Bates, Claudia Gemme, Danilo Giuni, Philippe Grenier G. Darbo – INFN / Genova RD_FASE2 – ATLAS Pixel Pisa, 23 September 2014 6 FTE 2015 on ATLAS Related R&D Total 13.8 FTE for the 3 R&D of interest of ITk. Prev=2015 Sezione BO CS GE MI TN UD RD_FASE2 HVR_CCPD &&&&&&&&&&&&1.00 &&&&&&&&&&&&0.40 &&&&&&&&&&&&0.90 &&&&&&&&&&&&&&( &&&&&&&&&&&&2.15 &&&&&&&&&&&&1.60 &&&&&&&&&&&&1.40 &&&&&&&&&&&&2.05 &&&&&&&&&&&&2.80 &&&&&&&&&&&&&&( &&&&&&&&&&&&0.50 &&&&&&&&&&&&&&( CHIPIX65 &&&&&&&&&&&&&&( &&&&&&&&&&&&&&( &&&&&&&&&&&&&&( &&&&&&&&&&&&1.00 &&&&&&&&&&&&&&( &&&&&&&&&&&&&&( Totale ========8.75 ========1.00 G. Darbo – INFN / Genova ========4.05 Sezione BO BO BO BO BO BO BO CS CS CS GE GE GE GE GE GE GE GE GE MI MI MI MI MI MI MI MI MI MI MI TN TN TN TN TN UD UD First+Name Davide Alessandro Matteo Carla Antonio Maximiliano Mauro Anna AntonioE Daniela Michele Valentina Giovanni Andrea Claudia Elisa Paolo Leonardo Mario Gianluca Attilio Mauro Simone Valentino Chiara Francesco Shojaii Hitesh Alberto Clara GianFFranco David Roberto DMS GiovanniE Marina MarioEPaolo Total RD_FASE2 – ATLAS Pixel Family+Name Ruolo Falchieri Tecn.Cat.D Gabrielli RIC Negrini RIC Sbarra RIC Sidoti RIC Sioli PA Villa PA MastroberardinoRUE Policicchio AssegnistaE Salvatore AssegnistaE Biasotti AssegnistaE Ceriale Dott.E Darbo DR Gaudiello Dott.E Gemme RIC Guido AssegnistaE Morettini 1FRIC Rossi DR Sannino PA Alimonti RIC Andreazza PA Citterio DTEC Coelli TEC Liberali PA Meroni DR Ragusa PO Seyedruhollah Dott.E Shrimali AssegnistaE Stabile AssegnistaE Troncon 1FRIC DallaEBettaE PAE Macii Dott.E Mendicino Dott.E Sultan Dott.E Verzellesi POE Cobal PA Giordani RUE 37 Total RD_FASE2 HVR_CCPD EEEEEEEEEEEE0.20 EEEEEEEEEEEEEEF EEEEEEEEEEEE0.20 EEEEEEEEEEEE0.10 EEEEEEEEEEEE0.20 EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEE0.20 EEEEEEEEEEEE0.20 EEEEEEEEEEEEEEF EEEEEEEEEEEE0.20 EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEE0.10 EEEEEEEEEEEE0.30 EEEEEEEEEEEEEEF EEEEEEEEEEEE0.30 EEEEEEEEEEEEEEF EEEEEEEEEEEE0.30 EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEE0.10 EEEEEEEEEEEEEEF EEEEEEEEEEEE0.20 EEEEEEEEEEEE0.55 EEEEEEEEEEEE0.30 EEEEEEEEEEEE0.30 EEEEEEEEEEEE0.30 EEEEEEEEEEEE0.30 EEEEEEEEEEEE0.10 EEEEEEEEEEEE0.10 EEEEEEEEEEEEEEF EEEEEEEEEEEE0.60 EEEEEEEEEEEE0.20 EEEEEEEEEEEEEEF EEEEEEEEEEEE0.20 EEEEEEEEEEEE0.30 EEEEEEEEEEEE0.20 EEEEEEEEEEEE0.50 EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEE0.30 EEEEEEEEEEEEEEF EEEEEEEEEEEE0.15 EEEEEEEEEEEE0.30 EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEE0.20 EEEEEEEEEEEE0.20 EEEEEEEEEEEE0.30 EEEEEEEEEEEE0.20 EEEEEEEEEEEE0.30 EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEE0.50 EEEEEEEEEEEEEEF EEEEEEEEEEEE0.30 EEEEEEEEEEEE0.20 EEEEEEEEEEEEEEF EEEEEEEEEEEE0.40 EEEEEEEEEEEEEEF EEEEEEEEEEEE0.50 EEEEEEEEEEEEEEF EEEEEEEEEEEE0.50 EEEEEEEEEEEEEEF EEEEEEEEEEEE1.00 EEEEEEEEEEEEEEF EEEEEEEEEEEE0.40 EEEEEEEEEEEEEEF EEEEEEEEEEEE0.20 EEEEEEEEEEEEEEF EEEEEEEEEEEE0.30 EEEEEEEEEEEEEEF 8.75 4.05 CHIPIX65 EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEE0.40 EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEE0.30 EEEEEEEEEEEEEEF EEEEEEEEEEEE0.30 EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF EEEEEEEEEEEEEEF 1 Pisa, 23 September 2014 7 2015 Activities 2015: Ac]vi]es and line of funding • ConHnue with 3D Sensor plan: produce modules, test in lab and TB, irradiate, procure sensors for next FBK run. • Bump-‐bonding: for tesPng FBK sensors and to develop for future RD53 requirements (high-‐density bump-‐bonding with indium) • CO2 cooling: contribute to ATLAS stave R&D, thermal simulaPon and test with CO2 plant • MulH-‐module R/O: use leading experience of ROD designer (BO) to develop a 16 module table-‐top road for architecture study and for test-‐beam applicaPon. • Upgrade to USBPix3: most diffused single module system based on USB. Upgrade also for use if HV/HR-‐CMOS • HV/HR-‐CMOS: presented a new project in CSN5 (BO, GE, MI) • CHIPIX65: INFN interface to RD53 collaboraPon – Approved as CSN5 Call (Sept.2013) G. Darbo – INFN / Genova RD_FASE2 – ATLAS Pixel Pisa, 23 September 2014 8 3D – GE: Module Assembly, Irradiation, TB ! Assembly 3D modules: • To irradiate with p-‐ and n-‐irradiaPon at 2x1016 neq/cm2 § FE-‐I4 heavily acPvate wit low energy neutron (from reactor) – Tantalum is present in technologies below 250 nm § FE-‐I3 has shown to resist neutron irradiaPon, no acPvaPon, bener ToT measurement (7-‐bits instead of 4-‐bits) • Assembly using PCB (bener for laser test) and flex hybrids ! Irradia]on plans with CMS and ATLAS 3D/Sensor community • Ljubljana (reactor): can reach 2x1016, usable with FE-‐I3 – may need some gamma for p-‐spray acPvaPon (to increase breakdown) • KIT (Karlsruhe) 24 MeV protons (too high TID for reaching target NIEL dose – FE-‐I4 “suffers”), • PS (CERN) 24 GeV protons takes long Pme, but best equilibrium between TID/NIEL ! Test beam: experience with EUDet telescope both in Desy and CERN ! Fund request: • 10 k€ for module assembly, PCB, IrradiaPon, test-‐beam mechanics • consider ~ 30-‐40 modules assembled. G. Darbo – INFN / Genova RD_FASE2 – ATLAS Pixel Pisa, 23 September 2014 9 3D – TN: PicoScope TN Involved in design, TCAD simula]on and 3D diode structure measurements • New 3D design: TCAD simulaPon of mip on 50x50 pixel § electrode distance reduced § High speed signals (<1ns) Need direct comparison between measurements and simula]on to op]mize design • Test on ad-‐hoc structures (OK) • High speed laser (OK) • High-‐bandwidth amplifier (OK) • High sampling oscilloscope (not available) PicoScope modules (High speed A/D Converters with USB computer interface) are a valid sustainable cost alterna]ve. G. Darbo – INFN / Genova www.picotech.com RD_FASE2 – ATLAS Pixel Pisa, 23 September 2014 10 Evaporative CO2 cooling Milano TRACI 2014 Ac5vi5es • Completed design of TRACI v.3 § 100 W transportable CO2 recirculaPng system § CollaboraPon: CERN, NIKHEF, MILANO, SHEFFIELD, OXFORD, LIVERPOOL § Test on M PUMPS, Corbola (RO) • Purchasing of components on-‐going: § Being part of collaboraPon allows purchase sharing § In Milano co-‐funded by LHCb and Dotazioni • InstallaPon before end 2014 2015 Plans • L’ufficio tecnico is involved in the design of the ITk cooling § Strengthen the know-‐how acquired from IBL construcPon • Finite Element Analysis of stave designs based on mini-‐piping § Ti pipe, 𝜙 2 mm Thermal simulaPon (IBL) • Test of prototypes with TRACI § Need to build a setup based on TRACI, similar to what done for IBL § Funds: 10 k€ (cold box + piping/valves + acquisiPon system) G. Darbo – INFN / Genova RD_FASE2 – ATLAS Pixel Test setup (IBL) 11 Pisa, 23 September 2014 11 Stand-alone prototype board including IBL BOC and ROD features • Standalone test board to R/O up to 16 FE-‐I4 with BOC+ROD func]onality • Compa]ble with IBL ROD/BOC firmware today present on separated cards 16 FE-‐I4 chips 8 modules Trigger Busy IBL ROD and BOC features in one card Table-‐TOP • Card foresees commercial standard fast protocols (infiniband, rapid-‐IO,…). • Such protocols are oriented to ATLAS Phase II upgrade G. Darbo – INFN / Genova -‐ PC Iexpress 3 -‐ InfiniBand -‐ RapidIO -‐ 10 Gb/s Ethernet RD_FASE2 – ATLAS Pixel Gb/s Ethernet Control CalibraPon 2 S-‐Links Fund request: 10 k€ • 5 PCB + components • Opto boards + S-‐links • Fibers Pisa, 23 September 2014 12 HVR_CCPD – Cost & Organization 3 year project submiCed to CSN5 • Develop HV/HR-‐CMOS chip (HVR) • Study CapaciPvely Coupled Pixel Detector (CCPD) • ~300 k€ project cost WORKPACKAGES/COORDINATORS/INSTITUTES FY 2015 WP1 2016 WP2 2017 TotalWP3 WP4 Na]onal Coordinator: • Avlio Andreazza (MI) Collabora]ve tools: Sez. Coordinator Bologna Genova Milano BO GE MI Carla*Sbarra Giovanni*Darbo Attilio*Andreazza Total G. Darbo – INFN / Genova 3 Sezioni WP4 Travel Sez.9Coord. k€(((((((((((((((2 k€(((((((((((((((3 MI k€(((((((((((((((2 k€((((((((((((((( 3 GE k€(((((((((((((((2 k€((((((((((((((( 3 GE k€(((((((((((((((6 k€(((((((((((((((9 MI (k€((140( • SharePoint: cern.ch/HVR_CCPD • Proposal on SharePoint INFN$Group WP1 WP2 WP3 Name k€(((((((((((((65 k€(((((((((((((31 k€(((((((((((((((3 HV/HR(CMOS-Chip-Design-&-Test k€(((((((((((((43 k€(((((((((((((38 k€(((((((((((((((3 CCPD-hybridization k€(((((((((((((83 k€(((((((((((((25 k€(((((((((((((((3 Module-assembly-&-Test k€((((((((((191 k€(((((((((((((94 k€(((((((((((((((9 Irradiation-&-Test-beam (k€((120( (k€((100( Travel( (k€((80( WP4( (k€((60( WP3( (k€((40( 0.40 WP2( Res/Tec 3 8 7 18 FTE WP1( 1.60 (k€((20( 2.05 (k€((0( 4.05 2015( RD_FASE2 – ATLAS Pixel 2016( 2017( Pisa, 23 September 2014 13 HV/HR-CMOS – Detector Principle Standard Hybrid Pixel Detector (as ATLAS Pixel and IBL). Signal collected in a silicon sensor coupled to amplifier by bump-‐bonding High Voltage (HV) CMOS pixel detector. Amplifier (at least) on same substrate as detecPon layer – Use p-‐substrate with High ResisPvity: deplePon layer (30 µm) to collect signal by drix under applicaPon of HV. R/O done through “digital chip” – i.e. FE-‐I4 / RD53 ! HVR_CCPD – High Voltage/High Resis]vity CMOS Capaci]vely Coupled Pixel Detector • Use high voltage CMOS technology and modify to high resistivity silicon the substrate to deplete the layer underneath the active chip layer and collect the charge by drift. • Work in collaboration with STMicroelectronics (Agrate) using BCD8sP 70 V/160 nm technology – design by Milano with contribution from Genova • NDA (non disclosure agreement) signed between STM and BO, GE, MI and Karlsruhe • Assembly of module will happen in Genova, irradiation and test beam coordinated by Milano with contribution from Bologna. G. Darbo – INFN / Genova RD_FASE2 – ATLAS Pixel Pisa, 23 September 2014 14 CCPD Hybridization ! HV/HR-‐CMOS chip coupled capaci]vely to R/O chip (CCPD – Capaci]vely Coupled Pixel Detector) instead of “classic” bump-‐bonding • Develop a technique to insert uniform, well defined thickness of dielectric between R/O and HV/HR-‐CMOS chips • Should be a cost effecPve, rad-‐hard process to transfer to industry Process Recipe Spin SU-‐8 photoresist Panern pillars by mask Spacer define the distance between chips Target to D = 5 µm, C ~ 4 fF for 18 µm pad diameter. ! Test program in progress: • See preliminary results next slide Proper qualified glue R/O CHIP ! Ac]vi]es will con]nue in the HVR_CCPD project in CSN5 (new experiment) • Involving BO, GE & MI • Also scientists outside ATLAS will participate. G. Darbo – INFN / Genova RD_FASE2 – ATLAS Pixel Glue deposiPon R/O CHIP Align & pressure DETECTOR CHIP R/O CHIP Pisa, 23 September 2014 15 Deposition of Pillars (spacers) 2-‐inch mask below with different Densi]es of spacers – FE-‐I4/FE-‐I3 Structures. Length = 23.965 mm Pt = 356.60 µm Scale = 1000.0 µm µm FE-‐I4 with matrix of SU8 spacers: 200 µm x 200 µm columns 4.7 µm high FE-‐I4 with matrix of SU8 spacers: 40 µm x 40 µm columns 4.7 µm high 200 0 -200 -400 -600 0 5 10 15 20 mm Length = 21.780 mm Pt = 17.941 µm Scale = 30.000 µm µm 15 10 5 0 -5 -10 0 5 10 15 20 mm Length = 21.780 mm Pt = 5.9246 µm Scale = 10.000 µm µm 6 4 2 0 Profilometer measurements: 4.7 µm high pillars -2 0 5 10 15 20 mm µm L1L1 6 4 2 0 -2 0 R1R1 SU8-‐2005 deposited on 2-‐inch wafer from Siegert Credits: V. Ceriale 5 10 15 20 mm 1 G. Darbo – INFN / Genova StpHt RD_FASE2 – ATLAS TIR Pixel Avg Slope 1.1261 µm 5.9123 µm -0.022624 µm 0.0070799 ° Pisa, 23 September 2014 16 RD_FASE2 – “Richieste 2015” A`vità Descrizione 3D BB MOD BO CS GE MI TN UD 6" Wafer procurement (SOI, wafer bonding, epi) -‐ -‐ -‐ -‐ 10.0 -‐ PicoScope 6407 DigiPzer with 1.5 GHz probes and accessories. -‐ -‐ -‐ -‐ 8.5 -‐ 6" dummy wafers -‐ test deposiPon on 6" and high-‐density bumps (150 k-‐bumps/chip) -‐ -‐ -‐ 20.0 -‐ -‐ BB for 3D sensor test -‐ -‐ 24.0 -‐ -‐ -‐ Upgarde R/O Systems -‐ 2.0 2.0 2.0 -‐ 2.0 Module assembly and irradiaPon, RD on flex -‐ -‐ 10.0 -‐ -‐ -‐ 15.0 -‐ -‐ -‐ -‐ -‐ -‐ -‐ -‐ 10.0 -‐ -‐ 15.0 2.0 36.0 32.0 18.5 2.0 MM-‐R/O MulP module R/O CO2/µCH Develop µ-‐channel cooling Total requested by ATLAS ! Legend: ATLAS Common ATLAS / CMS G. Darbo – INFN / Genova 105.5 ! Trento: • Request of 4 k€ of Travel Money for test-beam participation and support. RD_FASE2 – ATLAS Pixel Pisa, 23 September 2014 17 SPARE SLIDES G. Darbo – INFN / Genova RD_FASE2 – ATLAS Pixel Pisa, 23 September 2014 18 2014 Activities ! 2014: CSN1 funded (Feb and May) R&D Phase 2 ac]vi]es for ATLAS & CMS inner trackers. • Development of 3D and AcPve Edge sensors with FBK – 3 Batches (ATLAS/CMS) • Bump-‐bonding: development of Indium bumps (6” sensors) and produce modules • Develop a technology for pixel detector hybridizaPon using C (dielectric) instead of R (bump-‐bonding) coupling • ComplePon of CO2 test plant (combined ATLAS / LHCb) Assigned on Sezione Category ATLAS/CMS/COMMON Assigned DescripHon Feb 2014 GE 3D COMMON 21 000 Wafer for 3D sensors (common with CMS) Apr 2014 GE 3D COMMON 44 000 3 processes at FBK: 2 commined with MEMS3 May 2014 GE HV ATLAS 13 000 HV-‐CMOS HybridizaPon + 3 FE-‐I4B wafers May 2014 MI BB ATLAS 27 000 BB of 3D (IBL design on 6") + 3 FE-‐I4B wafers May 2014 MI CO2/µ-‐CH ATLAS 20 000 TRACI: co-‐funded with LHCb 125 000 G. Darbo – INFN / Genova RD_FASE2 – ATLAS Pixel Pisa, 23 September 2014 19 Substrates Specifications ! In the backup G. Darbo – INFN / Genova RD_FASE2 – ATLAS Pixel Pisa, 23 September 2014 20 Bump-bonding Program 3D Double Side Batch CMS Single chip (24x) ATLAS FE-‐I4 (13x) (1E, 2E, 3E, 4E) Planar ATLAS/CMS “Batch 2” ATLAS CMS CMS Quads (6x) (2E, 3E) MEDIPIX2 (4x) NA62 test chip (20x) Test structures for Si-‐Si qualificaPon ! In program 4 sensor batches that would need BB in 2014/15: • • • • 3D double side – October - Funds (MI) assigned for 2014 Planar ATLAS/CMS Batch 2 – November – Funds (TO) assigned 2014 3D and Active edge batches coming 2015 – no funds yet, fund request: GE+FI Bumping at IZM and Selex: some money saving with available FE-I4/PSI with bumps from older productions ! R&D on high density indium bumps • Test on dummy wafers: high density (130k bumps/chip) – smaller bump <18µm diameter – fund request: MI G. Darbo – INFN / Genova RD_FASE2 – ATLAS Pixel Pisa, 23 September 2014 21 Prototypes cooling test system status TRACI=Transportable RefrigeraPon Apparatus for Co2 InvesPgaPon CollaboraPon group: CERN, NIKHEF, MILANO, SHEFFIELD, OXFORD, LIVERPOOL Re-‐Design and producPon of the working drawings finished (Milano technical office) TRACI structures assembled (Milano mech. Workshop) Design of the test set-‐up in progress Ordering sensor for the test set-‐up 22/9/14 ..22 TRACI CO2 CIRCULATING PUMP Milano TRACI will use a M-‐PUMPS for CO2 circulaPon Ordered and arriving at the end of September Re-‐designed in collaboraPon with the manufacturer company according to CERN experience (smaller and bener thermal insulated) Note: Actual internal cartridge is in METCAR We foreseen a future R&D using composite CERACOMP cartridge but axer the prototype test Design of the relavant TRACI connecPon lines Finished (Milano technical office) 22/9/14 23 10 SU8-2005 Results 5 0 -5 Profile scan direcPon -10 0 5 10 15 20 mm Length = 21.780 mm Pt = 5.9246 µm Scale = 10.000 µm µm 6 4 2 0 -2 0 5 10 15 20 mm µm L1L1 R1R1 6 4 2 0 ! 1.26 -2 µm of bow. Column highs are very uniform: 4.7 µm over 2 cm 0 5 15 mm ! Results obtained with a spinning 10rota]on of 2500 rpm and S20U8-‐2005 1 StpHt 1.1261 µm TIR 5.9123 µm Avg -0.022624 µm Slope 0.0070799 ° G. Darbo – INFN / Genova RD_FASE2 – ATLAS Pixel Pisa, 23 September 2014 24
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