Fuji Electric
The GreenPACK
Innovating Energy Technology
The innovative package technology
Ultra compact
Size down by 50%
2-Pack
New structure: Thermal impedance -50%
Power cycling lifetime: 20 x higher
1010
10
8
Number of Cycles
10
9
Conventional structure
New structure
Tj,min=25°C
Current structure
Tj,min = 25°C
Tj,max=125°C
New structure
Power circuit board
Silicone gel
F(t)=1% line
Al wirebond
Power chip
107
Terminal
DCB-substrate
Solder
10
Duty: 1sec ON/9sec OFF
6
Cu-baseplate
Tj
D
Tj
105
TC
1sec
Terminal
High temperature
epoxy resin
Power chip
Cu-pins
Nano-metal-joint
Si3N4 substrate
Thick Cu-block
9sec
104
10
20
30
40
50
60
80
100
150 175 200
D
Tj[°C]
Low leakage inductance: <15nH
Easy paralleling
Modular drive concept
Lower junction temperature
160
150
Comparison of junction temperature
Conventional packages
The GreenPACK
152.9
Test conditions:
IC = 84.9 Arms
VCC= 600 V
Tf = 90°C
Tj [°C]
140
130
137.2
130.7
130.6
125.1
120
110
125.1
117.0
113.2
109.5
106.1
100
103.2
97.3
90
80
IGBT
FWD
Device 7MBR 100VJC-120-50
Chip size ratio
Power cycling lifetime [cyc]
(at Tj,min=25°C)
IGBT
FWD
2MBi 100VA-120
IGBT
FWD
2MBi 75VA-120
IGBT
FWD
V-IGBT & V-FWD
IGBT
FWD
RC-IGBT
IGBT
FWD
SiC-Hybrid
100%
100%
75%
75%
75%
75%
1x107
2x107
1x106
5x108
>109
>1010