Semiconductor Foundry to the World

Taiwan Semiconductor
Manufacturing Company, Ltd.
The Creator and Leader of the Foundry Industry
Introduction to TSMC TSMC Introduction
Market Overview
Technology Leadership
Capacity Leadership
Services Leadership
Taiwan Semiconductor
Manufacturing Company, Ltd.
TSMC Is The Creator And Leader of the IC Foundry Industry
We are committed to leadership in capacity, technology and service
Founded in 1987
“Our vision is to be the most reputable, service-oriented maximum-total-benefits silicon
foundry in the world, thereby earning the reward of also being the largest and most profitable
foundry. To this end, we maintain a consistent focus on our foundry business, concentrating
our commitment to being our customers’ “Virtual Fab”.
Dr. Morris Chang
Chairman
TSMC Employee Growth
14,000
13,138
13,000
12,000
11,000
10,000
9,000
8,000
7,455
7,000
5,594
6,000
5,000
4,117
4,000
3,412
3,000
2,000
1,000
5,908
258
586
809
1,187
1,501
1,893
2,294
2,681
0
1987 1988 1989 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000
TSMC Revenue
NT $ M
Year 2000 : NT$166.2 Bn
180,000
160,000
4Q: NT$53.8 Bn
4Q
3Q
2Q
1Q
140,000
120,000
100,000
80,000
60,000
40,000
20,000
0
1988 1989 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000
Foundry Market Demand
B US$
M 8” eq. Wafers
35
35
1999-2004 Foundry Wafer CAGR= 28%
1999-2004 Foundry Market CAGR= 26%
34.9
30
Foundry Wafer
30
27.8
25
25.8
20
19.9
13.7
10
7.5
10.2
20
15
14.7
12.0
10
6.3
1999
25
19.8
15.4
15
5
Foundry Market
5
2000
2001
2002
2003
2004
Source: Dataquest, TSMC
TSMC: The Market Share Leader
By Revenue (WW Foundry Industry,2000)
~ U.S. $13.7 Billion
Foundry
10-15%
Others 5%
TSMC
39%
IDM Foundry
20%
Anam 3%
Chartered 8%
IDM Captive
85-90%
Source: IC Insights, TSMC
UMC
24%
TSMC Leadership in Communications
Normalized to TSMC wafer shipment excluding memory
1
1
56%
26%
0
TSMC
Source: Company News, TSMC 2001/Q1
Competitor 1
Competitor 2
Sales by Market Segment
% of Sales
80%
69%
66%
66%
65%
65%
64%
60%
60%
40%
40%
30%
33%
35%
34%
36%
34%
20%
1%
1%
0%
Net Sales
(NT$Bn)
0%
0%
1998
1999
1Q’ 00
50.2
73.1
28.3
2Q’ 00
31.8
Pre-merger)
1%
0%
0%
3Q’ 00
4Q’ 00
47.5
53.9
2000
166.2
System Co.
IDM
Fabless
Sales by Application
Based on Quantity Sold at 8”equivalent
3Q’00
942K
4Q’00
1,001K
2000
20%
17%
3,408K
16%
4%
3%
33%
12%
33%
35%
Communications
Based on Quantity Sold at 8”equivalent
14%
11%
33%
29%
Consumer
4%
36%
Others
Memory
Computer
TSMC Leads in VDSM (0.25um & below)
Wafer Shipment in 2000
Normalized to TSMC Wafer shipment
1
0.8
0.6
0.4
0.2
0
TSMC
Nearest Competitor
Source: Company News, TSMC
TSMC Is the Technology Leader
Industry’s Leading Portfolio of Process Technologies
Logic Processes to 0.13um
Embedded Non-Volatile Memory to 0.18um
Mixed Signal & RF Processes
High Voltage Processes to 0.25um
Image Sensor Technology to 0.35um
Embedded DRAM to 0.25um
Copper and Low-K Dielectric Processes
TSMC: The R&D Investment Leader
NT $ M
4,000
R&D
3,500
3,000
2,500
2,000
1,500
1,000
500
0
1992
1993
1994
1995
1996
1997
1998
1999
R&D expense between 1992 and 1997 have not been restated under the current definition
2000
TSMC Roadmap
Leading Foundry vs. SIA Roadmap
Minimum Feature Size of Production
1
TSMC
0.5
0.4
0.3
SIA
Roadmap
0.2
0.1 ’95
’03
’96
’97
’98
’99
’00
’01
’02
0.13um Technology Leadership
Excellent yield (lot average>92%) demonstrated for 4Mb
6T SRAM vehicle
More than a dozen customer tape-outs (LV,G,LP)
First in offering 0.13um CyberShuttle (Nov.00)
5 customers received functional devices in 1st
silicon (CPU,communications & FPGA)
First in starting 0.13um risk production (multiple customer
products-WIP greater than 3,000 wafers)
Deploying 0.13um manufacturing to 2 fabs in 2001,and to 6 fabs
in 2002 (incl. 300 fabs) with ample capacity to meet customer demand
TSMC Logic Technology Features
(Front End)
0.35 um
0.25 um
0.18 um
0.15 um
0.13 um
CL035
CL025
CL018
CL015
CL013
Risk Production
Nov., 1996
Jan., 1998
Q1, 1999
Q1, 2000
Q4, 2000*
# of metal layers
4
5
6
7
8
3.3V
2.5V
1.8V
1.2V
1.0V
I/O Voltage
3.3, 5V
2.5, 3.3, 5V
1.8, 3.3V
1.2V, 3.3V
1.0V, 2.5V
Lithography
I-Line
DUV-stepper
DUV-Scanner
DUV-Scanner
ArF
No
No
Yes
Yes
Yes
Diffused well
R well
SSR
SSR
SSR
LOCOS
STI
STI
STI
STI
Gate oxide thickness
70A
50A
32A
20A
17A
Gate delay ( ps/gate )
61
38
28.6
20
14
Technology
Core Voltage
PSM
Well formation
Isolation
* For CL013G
TSMC Logic Technology Features
(Back End)
Technology
Risk Production
# of metal layers
Silicide
Inter Metal Dielectric
Via Fill
Metal Scheme
Emb 6T SRAM cell
0.35 um
0.25 um
0.18 um
0.15 um
0.13 um
CL035
CL025
CL018
CL015
CL013
Nov., 1996
Jan., 1998
Q1, 1999
Q1, 2000
Q4, 2000
4
5
6
7
8
TiSi2
TiSi2
CoSi2
CoSi2
CoSi2
Undoped Ox
Undoped Ox
low K <= 3.7
low K <= 3.6
low K <= 2.9~3.6
W E.B.
W CMP
W CMP / Cu
W CMP / Cu
Cu
AlCu
AlCu
AlCu/Cu
AlCu/Cu
Cu
15.25 um2
7.56 um2
4.65 um2
3.42 um2
2.43 um2
TSMC Industry Leading Capacity
(by Fab)
Unit: K pcs, 8" Equivalent Wafer
Actual
Output
12,000
12”
Fab
Installed
Plan
11,460
11,000
10,000
9,166
9,000
8,000
7,329
7,000
5,873
6,000
8”
Fab
4,520
5,000
4,000
3,409
3,000
1,838
2,000
1,000
374 528 680
99 163 228
’90
’04
’92
’94
844
1,2061,212
6”
Fab
’96
’98
’00
’02
Note : Fab-1/2 : 6" Wafer Fab-3/4/5/6/7/8/VIS/WT/SSMC: 8" Wafer
Fab12~23 and 300PL: 12" Wafer 1990-1999 Actual Output,2000-2005 Installed Capacity Plan
Fab23
Fab22
Fab21
Fab20
Fab19
Fab18
Fab17
Fab16
Fab15
Fab14
Fab12
300PL
SSMC
WT
VIS
Fab8
Fab7
Fab6
Fab5
Fab4
Fab3
Fab2
Fab1
TSMC Is The Capacity Leader
In 2001 TSMC will continue to be the foundry industry’s
largest manufacturer of wafers
The company has one 300mm pilot line running and
three full scale 300mm fabs under construction
But leadership is more than planned capacity
Flexibility
Timely expansion
Consistency across fabs
TSMC Industry Leading Capacity
Plan (by Technology)
Unit: K pcs, 8" Equivalent Wafer
12,000
=0.07um
Actual
Output
Installed
Plan
11,460
11,000
=0.10um
=0.13um
10,000
9,166
=0.15um
9,000
=0.18um
8,000
7,329
<=0.25um
7,000
5,873
6,000
<=0.35um
4,520
5,000
<=0.5um
4,000
3,409
0.6um
3,000
1,838
2,000
0.8um
1,206 1,212
1,000
528 680 844
99 163 228 374
>=1.0um
>=2.0um
’90 ’91 ’92 ’93 ’94 ’95 ’96 ’97 ’98 ’99 ’00 ’01
’02 ’03 ’04 ’05
Capacity by Fabs TSMC & Affiliates
(8” equiv, k)
FAB
Installed Capacity: Annual (Monthly)
1998
1999
2000
FAB-1
252.0 (21.2)
233.0 (19.6)
205.0 (17.1)
FAB-2
940.0 (79.0)
943.0 (79.0)
936.0 (77.5)
FAB-3
478.0 (41.0)
524.0 (45.0)
FAB-4
353.0 (31.0)
455.0 (39.0)
348.0 (31.0)
FAB-5
FAB-6
116.0 (13.0)
0.0
222.0 (28.0)
0.0
417.0 (39.0)
158.0 (32.0)
FAB-7A
0.0
26.0 (10.0)
366.0 (44.0)
FAB-7B
0.0
0.0
FAB-8A
0.0
0.0
0.0
334.0 (31.0)
0.0
77.0 (17.0)
FAB-8B
WaferTech
SSMC
26.0 (8.0)
Annual Growth
Growth Rate
Annual
Rate
0.0
282.0 (28.0)
0.4 ( 0.4)
30.0 (9.0)
VIS
TotalInstalled
InstalledCapacity
Capacity
Total
154.0 (20.3)
426.0 (36.0)
184.0 (22.0)
1,644
1,895
3,409
38%
15%
80%
TSMC Emerging As Capacity Leader
Year 2001
Year 2000
3.4M(4.3%)
TSMC
▲4.5M(5.2%)
5.1M(6.5%)
Hyundai
▲5.4M(6.1%)
3.7M(4.7%)
Intel
▲4.5M(5.1%)
4.1M(5.3%)
Toshiba
▲4.3M(4.9%)
3.9M(5.0%)
Samsung
▲4.3M(4.8%)
3.8M(4.8%)
NEC
▲4.0M(4.6%)
3.7M(4.7%)
Hitachi
▲3.8M(4.3%)
2.5M(3.2%)
STM
▲3.4M(3.9%)
3.1M(4.0%)
2.4M(3.0%)
2.5M(3.1%)
WW Total 79M Wafers (8”eq.)
15.2M(19.3%)
Source: Semico, SICAS, Dataquest, TSMC
Philips
UMC
Motorola
Others
▲3.1M(3.6%)
▲2.8M(3.2%)
▲2.7M(3.0%)
16M((▼ 18.1%)
WW Total 88M Wafers (8”eq.)
TSMC Is The Foundry Industry
Service Leader
The Industry’s Leading Design Service Alliance
The Industry’s Leading Prototype Service, CyberShuttle
The Industry’s Award Winning Quality Assurance Program
The Industry’s Leading Mask Making Service
Turnkey Assembly and Test Services
The Industry Leader in Internet Services via eFoundry Suite
TSMC Design Services
3rd Party
Alliances
TSMC
Services
Design Service Portal
IC Design Alliances
Implementation Service
EDA Alliances
Reference Flow
Library / IP Alliances
Library, Embedded Memory Service
Technology Files, Design Kits
EDA Alliances
Prototype Verification Service
Pure Foundry Service
Fab 1
Fab 2
Fab 3
Fab 4
Fab 5
Wafer
Tech
Fab 6
your Virtual Fab - Technology, Capacity, Service
Fab 11
Fab 7 ………………….
eFoundry™ Suite
Close Collaboration in Design, Engineering and Logistics
Logistics Collaboration
Logistics Collaboration
Engineering Collaboration
Design Collaboration
TSMC-Online
Engineering Collaboration
TSMCDirect
TSMCeJobView
eFoundry™
Suite
TSMCYES
Design Collaboration
TSMCInternet Layout Viewer
Design Collaboration
Engineering Collaboration
eFoundry™ --- Your Virtual Fab
TSMC-Online
E-Commerce center for logistics, engineering and design collaboration
TSMC-Direct
System-to-system integration for collaborative planning and engineering data sharing
TSMC-YES
Collaborative yield enhancement effort between customers and TSMC engineering
community
TSMC-Internet Layout Viewer
Web-based pre-tapeout design layout review between TSMC and customers
TSMC-eJobView
Web-based post-tapeout mask data inspection between TSMC and customers
CyberShuttle Service
Broad spectrum of leading edge technologies with
frequent launches:
0.25um down to 0.13um technology and derivatives such as RF,
mixed-signal, and embedded-flash technologies.
Frequent launches and dependable schedule announced in advance.
Fast prototyping and shared cost :
Reduced prototyping costs by as much as 10-fold.
Shorter prototyping time through expedited lot processing.
In-house backend ceramic packaging and bare die dicing service available
per customers’ request.
TSMC Quality Policy
TSMC will strive to provide superior semiconductor
manufacturing services for worldwide customers and establish
mutually beneficial, long-term partnership.
TSMC will spread the dedication to quality throughout every
facet of the company and achieve a culture of continual
improvement to assure customer satisfaction. There is only one
ultimate goal: Zero defect - in everything we do.
TSMC will adopt expedient containment programs to shield
our customer from any insufficiency until each has been
permanently corrected. We are responsible for and to each
other regarding this goal.
Reliability Assurance
Build in Reliability
All new technologies are developed according to “TSMC technology
development methodology” which includes manufacturability
verification (Cp/Cpk study), T0 pre-qualification plan and T1
qualification plan.
Process Qualification
All new technologies will be qualified prior to the mass production.
Process Monitor
Every released mature process will be monitored and reported on
monthly basis to ensure TSMC wafers quality and reliability.
Continuous improvement activities will be conducted as well.
Technology Support
Consult and support on reliability related design and application issue.
Quality and Reliability Overview
Technology
Development
Process
Reliability
Monitor
Build In
Reliability
Technology
Release
Qualification
Product
Quality Gating
Manufacturing
Incoming
Quality
Control
Customer
Satisfaction
Product
Reliability
Monitor
In-Process
Quality
Control
Outgoing
Quality
Assurance
Customer
Customer
Backend
Satisfaction Corrective
Quality
Measurement
Action
Assurance
Program
Response
LAB
Failure
Analysis
Supplier
Quality
Assistance
Statistical
Process
Control
Customer
Feedback
Total Quality Management
Customer
Satisfaction
Advisory Board
Assembly & Test Services Strategy
Develop and integrate leading edge and cost effective wafer,
test and assembly technologies.
Provide a seamless communication and data link throughout
the entire assembly and test operation.
Continuous quality and service improvement through
internal monitoring and sound supplier management
methodology.
Assembly & Test Customer Benefits
Quality & Engineering
Advanced manufacturing services include mask making, wafer
sort, assembly, and final test
TSMC extends QRA / test engineering / product engineering
support to cover assembly and final test
Responsible for yield improvement and failure analysis
A single contact for engineering, quality, and reliability issues
Service
Single point responsibility from order to unit shipment
Complete WIP visibility throughout the entire process
Competitive cycle times from wafer start to unit ship
Proven drop ship system through fab, sort, assembly, and final test
Cost
Competitive pricing
Reduced inventory cost
Assembly & Test Capabilities
Assembly
Alliance with leading assembly houses
Mainstream and high-performance IC packaging
Reliability Qual Capability
Test
Digital, Mixed Signal, and Memory Test
In-House Wafer Sort and Probe Card Making and Maintenance
Alliance with Leading Test Subcontractors for Final Test Services
Test Program Correlation and Conversion
Taiwan Semiconductor
Manufacturing Company
www.tsmc.com

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