Global Die-level Packaging Equipment Market 2015-2019 Report Description ICs manufactured in the global semiconductor industry are delicate, and thus vulnerable to contamination causing malfunction. To prevent from such malfunctions, silicon chips or ICs are protected using packaging materials. Wafer-level packaging and die-level packaging are the most predominant packaging types. Wafer-level packaging involves the packaging of individual ICs through the best-fit packaging processes conducted in wafer-level manufacturing during the semiconductor production process, while die-level packaging involves packaging of each dice and not the wafer as a whole. Technavio's analysts forecast the global die-level packaging equipment market to grow at a CAGR of 1.24% during 2014-2019. This report covers the present scenario and growth prospects of the global die-level packaging equipment market for 2015-2019. To calculate the market size, the report considers revenue generated from the sales of die-level packaging equipment worldwide. However, the report does not consider the following while calculating the market size: • Support or maintenance services offered for/with die-level packaging equipment • Components used in the production of die-level packaging equipment • Aftermarket sales of die-level packaging equipment View more details of "Global Die-level Packaging Equipment Market" @ http://www.bigmarketresearch.com/global-die-level-packaging-equipment-2015-2019market Report Description Global Die-level Packaging Equipment Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market. Key Regions • Americas • APAC • EMEA Key Vendors • ASM International • BE Semiconductor Industries • DISCO • Kulicke & Soffa Industries Report Description Market Driver • Rise in Demand for Smartphones and Tablets • For a full, detailed list, view our report Market Challenge • Rapid Changes in Technology • For a full, detailed list, view our report Market Trend • Short Replacement Cycle of Portable Electronic Devices • For a full, detailed list, view our report Get sample copy of this report @ http://www.bigmarketresearch.com/reportenquiry/320973 Table Of Contents 01. Executive Summary 02. List of Abbreviations 03. Scope of the Report 04. Market Research Methodology 05. Introduction 06. Industry Overview 07. Market Landscape 08. Geographical Segmentation 09. Buying Criteria 10. Market Growth Drivers 11. Drivers and Their Impact 12. Market Challenges 13. Impact of Drivers and Challenges 14. Market Trends 15. Trends and Their Impact 16. Vendor Landscape 17. Key Vendor Analysis 18. Other Reports in this Series FOR MORE DETAILS Visit us at : www.bigmarketresearch.com Stay With Us: TELEPHONE: + 1-800-910-6452 EMAIL: [email protected] 5933 NE Win Sivers Drive, #205, Portland, OR 97220 United States

ICs manufactured in the global semiconductor industry are delicate, and thus vulnerable to contamination causing malfunction. To prevent from such malfunctions, silicon chips or ICs are protected using packaging materials. Wafer-level packaging and die-level packaging are the most predominant packaging types. Wafer-level packaging involves the packaging of individual ICs through the best-fit packaging processes conducted in wafer-level manufacturing during the semiconductor production process, while die-level packaging involves packaging of each dice and not the wafer as a whole. Technavio's analysts forecast the global die-level packaging equipment market to grow at a CAGR of 1.24% during 2014-2019. This report covers the present scenario and growth prospects of the global die-level packaging equipment market for 2015-2019. To calculate the market size, the report considers revenue generated from the sales of die-level packaging equipment worldwide. However, the report does not consider the following while calculating the market size: • Support or maintenance services offered for/with die-level packaging equipment • Components used in the production of die-level packaging equipment • Aftermarket sales of die-level packaging equipment View more details of "Global Die-level Packaging Equipment Market" @ http://www.bigmarketresearch.com/global-die-level-packaging-equipment-2015-2019-market