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Global Die-level Packaging Equipment Market 2015-2019

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ICs manufactured in the global semiconductor industry are delicate, and thus vulnerable to contamination causing malfunction. To prevent from such malfunctions, silicon chips or ICs are protected using packaging materials. Wafer-level packaging and
Global Die-level Packaging Equipment Market 2015-2019
Report Description
ICs manufactured in the global semiconductor industry are delicate, and thus vulnerable to
contamination causing malfunction. To prevent from such malfunctions, silicon chips or ICs
are protected using packaging materials. Wafer-level packaging and die-level packaging are
the most predominant packaging types. Wafer-level packaging involves the packaging of
individual ICs through the best-fit packaging processes conducted in wafer-level
manufacturing during the semiconductor production process, while die-level packaging
involves packaging of each dice and not the wafer as a whole.
Technavio's analysts forecast the global die-level packaging equipment market to grow at a
CAGR of 1.24% during 2014-2019.
This report covers the present scenario and growth prospects of the global die-level
packaging equipment market for 2015-2019. To calculate the market size, the report
considers revenue generated from the sales of die-level packaging equipment worldwide.
However, the report does not consider the following while calculating the market size:
• Support or maintenance services offered for/with die-level packaging equipment
• Components used in the production of die-level packaging equipment
• Aftermarket sales of die-level packaging equipment
View more details of "Global Die-level Packaging Equipment Market" @
http://www.bigmarketresearch.com/global-die-level-packaging-equipment-2015-2019market
Report Description
Global Die-level Packaging Equipment Market 2015-2019, has been prepared based on an
in-depth market analysis with inputs from industry experts. The report covers the market
landscape and its growth prospects in the coming years. The report includes a discussion
of the key vendors operating in this market.
Key Regions
• Americas
• APAC
• EMEA
Key Vendors
• ASM International
• BE Semiconductor Industries
• DISCO
• Kulicke & Soffa Industries
Report Description
Market Driver
• Rise in Demand for Smartphones and Tablets
• For a full, detailed list, view our report
Market Challenge
• Rapid Changes in Technology
• For a full, detailed list, view our report
Market Trend
• Short Replacement Cycle of Portable Electronic Devices
• For a full, detailed list, view our report
Get sample copy of this report @ http://www.bigmarketresearch.com/reportenquiry/320973
Table Of Contents
01. Executive Summary
02. List of Abbreviations
03. Scope of the Report
04. Market Research Methodology
05. Introduction
06. Industry Overview
07. Market Landscape
08. Geographical Segmentation
09. Buying Criteria
10. Market Growth Drivers
11. Drivers and Their Impact
12. Market Challenges
13. Impact of Drivers and Challenges
14. Market Trends
15. Trends and Their Impact
16. Vendor Landscape
17. Key Vendor Analysis
18. Other Reports in this Series
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