SD Memory Card Connectors
DM1 Series
Withstands higher force of card insertion.
Apr.1.2016 Copyright 2016 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Card
Standard type
Metal cover extends over the back of the connector.
■Features
1. Withstands higher force of card insertion
Card
Metal cover extends over the back of the connector
allowing it to withstand force of up to 400N (static load)
when dropped or accidentally hit. (Fig.1)
2. No damage to the card when accidentally
pulled-out
The connectors will release the card when a moderate
pull-out force of about 4N is applied. There will be no
damage to the lock components and all connector
functions will not be affected. (Fig.2)
Reverse type
Metal cover extends over the back of the connector.
Fig.1
No damage to the card when
accidentally pulled-out.
3. Accidental card fall-out prevention
Built-in lock feature holds the card securely in place.
(Fig.3)
4. Reliable Card Insertion and Withdrawal
Built-in Push-in / Push-out ejection mechanism assures
simple and reliable card insertion and withdrawal.
5. Designed to accept Secure Digital I/O card
(Built-in Ground Contact)
The connector allows use of various expansion
modules, including the Bluetooth communication
modules.
Fig.2
Accidental card
fall-out prevention
Fig.3
C39
■Product Specifications
Rating
Current rating 0.5A DC
Voltage rating 125V AC
Apr.1.2016 Copyright 2016 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Item
C40
Operating temperature range : -25ç to +85ç (Note 1) Operating humidity range : Relative humidity 95%
max. (No condensation)
Storage temperature range : -40ç to +85ç (Note 2)
Specification
Conditions
1. Insulation resistance
2. Withstanding voltage
3. Contact resistance
4. Vibration
1000Mø min. (Initial value)
No flashover or insulation breakdown
100mø max. (Initial value)
No electrical discontinuity of 100ns or more
500V DC
500V AC / one minute
100mA DC
Frequency : 10 to 55Hz, single amplitude of 0.75mm, 2 hours / 3 axis
5. Humidity
Contact resistance : 40mø max. from initial value
Insulation resistance : 100Mø min.
96 hours at temperature of 40ç ± 2ç and
humidity of 90% to 95%
6. Temperature cycle
Contact resistance : 40mø max. from initial value
Insulation resistance : 100Mø min.
Temperature : -55ç/ +5ç to +35ç/ +85ç/ +5ç to +35ç
Duration : 30 / 5 / 30 / 5 (Minutes) 5 cycles
7. Durability (mating/un-mating) Contact resistance : 40mø max. from initial value
10000 cycles at 400 to 600 cycles per hour
8. Resistance to soldering heat No deformation of components affecting performance.
Reflow : At the recommended temperature profile
Manual soldering : 350ç for 3 seconds
Note1 : Includes temperature rise caused by current flow.
Note2 : The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature
Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during
transportation.
■Materials / Finish
Component
Insulator
Material
Heat resistant thermoplastic compound
Contacts
Phosphor bronze
Cover
Stainless steel
Others
Stainless steel
Piano wire
Finish
Color: Black
Contact area: Gold plating
Termination area: Tinned copper plating
Remarks
UL94V-0
Termination area: Tinned copper plating
--------------------
-------------------Nickel plating
--------------------
■Product Number Structure
DM1 AA - SF - PEJ
1
1 Series name
2 Connector type
2
: DM1
: AA : Standard receptacle
: B : Reverse receptacle
3
4
3 Terminal type
SF : Right angle surface mount
DSF : Reverse right angle surface mount
4 Eject mechanism codes
PEJ : Card Push insert/Push withdraw
--------------------
■Standard type
BPCB mounting pattern
22.4±0.05
15±0.05
1.7±0.05
P=2.5±0.05
1.35±0.05
2±0.05
4.125±0.05
9-1.1±0.05
HRS No.
DM1AA-SF-PEJ(82)
609-0004-8 82
23.2±0.05
4.55±0.05
4-2 +0.1
0
3
2-Ø
1.
3-1 +0.1
0
2
Card detection switch
+0
0 .1
1.6±0.05
20.75±0.05
18.15±0.05
9.2±0.05
Part No.
2
Write protection switch
2 +0.1
0
1.2±0.05
C
L
1
1
1
28
13.2
9.75
8.05
t=0.2,W=0.6
P2.5
No.6
No.7
No.1
2.5
5.625
No.4
No.2 No.3
No.5
2.9
15
No.8
3-0.5
23.2
4.55
18.15
20.75
9.2
No.9
4-1.5
30.5
1
24.15 (Card slot dimension)
1
C
L
2-Ø1.2
C
L
C
Lindicates the center line of card slot.
1
0.55
1
1
C
L
Card detection switch
Write protection switch
When card When card
is ejected is inserted
When card is inserted
When card
is ejected WRITE PROTECT WRITE ENABLE
OPEN
22.4
CLOSE
OPEN
OPEN
CLOSE
Weight:2.2g
5
11
6
1
BCard insertion/withdrawal dimensions
5
Apr.1.2016 Copyright 2016 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
2 +0.1
0
1.2±0.05
2 +0.1
0
25.4±0.05
SD Card
Card pushed-in for insertion
SD Card
Card fully inserted
SD Card
Card ejected
(Card ejected dimension)
C41
■Reverse type
BPCB mounting pattern
9.47±0.05
12.8±0.05
11.2±0.05
9.75±0.05
28.5±0.05
23.48±0.05
26.98±0.05
0.8±0.05
1.05±0.05
1.4±0.05
WP
11.93±0.05
B
Center of Card dimension
1.2
+0.1
(Land)
0
0.8
+0.1
(Through
0
hole)
1.2
+0.1
(Land)
0
0.8
+0.1
(Through
0
hole)
+0.1
(Through
0
hole)
C(5:1)
hole)
+0.1
(Through
0
1.5
(Land)
+0.1
-0.1
1.9
+0.1
(Through
0
1.3
11.23±0.05
14.13±0.05
(R0
1.2
+0.1
(Land)
0
0.8
+0.1
(Through
0
(R0
.6)
.6)
.4)
.4)
(R0
.6)
(R0
2
2.03±0.05
12.57±0.05
.4)
2
2
5.62
3
(R0
8.63
A
8-1.1±0.05
B(5:1)
hole)
+0.1
(Land)
0
A
C
A(5:1)
1.7
COMMON FOR CD & WP
14.25±0.05
3
18.68
16.85
2
6.95
7.65
2
5.62
C
L
1
6-0.65
2
1.4±0.05
CARD DETECT
1.25±0.05
2
609-0003-5 82
0.8±0.05
5.625±0.05
+0.1
-0.1 (Land)
DM1B-DSF-PEJ(82)
12.5±0.05
P=2.5±0.05
2.4
HRS No.
28.25±0.05
Part No.
(R0
28
No.7
(14.35)
No.6
No.5
No.4
No.3
No.2
No.1
1.05
No.9
0.35
2
27.2
27.45
(1.77)
2
29
2
(5):Card pushed for insertion
(6):Card fully inserted
29.9
2
1.5
2.9
2
1.85
No.8
C
L
1
10:Card ejected(Card ejected dimension)
Apr.1.2016 Copyright 2016 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
11-2.5±0.05
8.05±0.05
1
C
L
(0.25)
SD Card
1
2
C
Lindicates the center line of the card slot.
indicates the dimension of DIP terminals.
Card detection switch
When card When card
is ejected
is ejected
1
C
L
OPEN
Weight:2.1g
C42
CLOSE
Write protection switch
When card is ejected
When card
is ejected WRITE PROTECT WRITE ENABLE
OPEN
OPEN
CLOSE
hole)
BPackaging specifications
.5
Ø1
4.35±0.3
3.4±0.3
36±0.1
4±0.1
2±0.15
44±0.3
Unreeling direction
.5
4±0.1
36±0.1
4.6±0.3
3.4±0.3
2±0.15
44±0.3
40.4±0.1
20.2±0.1
.1
+0
0
1.75±0.1
●Embossed Carrier Tape Dimensions(Reverse type) 450 pcs/reel
Ø1
Unreeling direction
●Reel dimensions
44.4
+2
0
Unreeling direction
End section
Blank section(160mm min.)
Mounting section(450)
(Ø380)
D
(Ø150)
Apr.1.2016 Copyright 2016 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
40.4±0.1
20.2±0.1
.1
+0
0
1.75±0.1
●Embossed Carrier Tape Dimensions (Standard type) 450 pcs/reel
Lead section (400mm min.)
Embossed carrier tape Blank section (100mm min.)
Top cover tape
C43
BRecommended Temperature Profile
(ç)
Peak : 250ç MAX
250
230ç min.
50
seconds
Apr.1.2016 Copyright 2016 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Temperature
200
C44
Powered by TCPDF (www.tcpdf.org)
200ç
150
100
Soldering
150ç
90 to 120 seconds
Preheating
50
Time (Seconds)
HRS test condition
Solder method
: Reflow, IR/hot air
Environment
: Room air
Solder composition : Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.'s
Part Number:M705-GRN360-K2-V)
Test board
: Glass epoxy 60mm∞100mm∞1.0mm thick
Metal mask
: 0.15mm thick
Number of reflow cycles : 2cycles max.
The temperature profiles shown are based on the above
conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume / thickness and board
size / thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.