chunichisha

●発行
2016年11月25日
●体裁
CD 版（PDF ファイル
●本体価格
92,000円（＋税、送料共）
全195 頁）
chunichisha
株式会社中日社
http://www.chunichisha.co.jp
〒111-0053 東京都台東区浅草橋3-24-8 伊藤ビル
TEL.03-3861-5201 FAX.03-3861-5202
Wide angle camera
半導体、特にInFO-WLPによりモーションプロセッ
サM10を内蔵したA10のＣＴ写真やA9との比較など、
A10解析関連情報を数多く掲載している。
また、各チップ・モジュールにおけるEMI対策状
況を掲載。さらに6sPlusの情報を付加することで従
来端末との違いと次世代機へ向けた施策を垣間見る
ことができる。
内容構成
【Summary on Apple iPhone 7 Plus】
・Summary on Apple iPhone 7 Plus
・External Views and Function Keys of iPhone 7 Plus
・Chipset for iPhone 7 and iPhone 7 Plus Based on
Qualcomm
・Functional Block Supposed for Apple iPhone 7/7 Plus
・Key Components of Apple iPhone 7 Plus
【Specifications of Apple iPhone 7 Plus】
・Transition of Apple iPhones
・Transition of iPhone Mother Boards
・Comparison of Apple iPhone 7 Series and 6s Series
・Features and Specification of Apple iPhone 7 Plus
・Comparison of Chipset for Intel-based and Qualcommbased iPhone 7/7 Plus
・Qualcomm MDM9645 vs Intel XMM7360（裏面へ続く）
Weight: 0.75g
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資料名
iPhone 7 Plus
キーデバイス解析
資料名
貴社名
部
お名前
部課名
ご住所
お支払い予定
●申込先
部
TEL.
日締め
株式会社
日払い
銀行振込
（備考）
郵便振替
〒111-0053 東京都台東区浅草橋3-24-8 伊藤ビル
内
容
【Teardown Analysis of Apple iPhone 7 Plus】
・Inner Structure of Apple iPhone 7 Plus
・External Views of Apple iPhone 7 Plus
・Details of Key Semiconductor/Electronic Devices
・X-ray Pictures of Touch ID Sensor for iPhone 7 and
iPhone 7 Plus
・Transition of iPhone Main Cameras
・CT Analysis of Dual Camera Area by UHS's Si-300
・Key Parts of Apple iPhone 7 Plus Dual Camera
・X-ray Pictures of Dual Lens Camera Module
・Disassembly of Apple iPhone 7 Plus Camera Module
・Structure of iPhone 7 and 7 Plus Camera Module
・Camera Differences of iPhone 7 Plus and Huawei Honor
8
・New True Tone Flash for iPhone 7 and iPhone 7 Plus
・X-ray Pictures of 7MP "Face Time" Camera Module
・Key Parts of Apple iPhone 7 Plus "Face Time" Cameras
・Comparison of New Taptic Engines for iPhone 7 Series
・Overcoat and Cushion Seal Around Connectors
・Special Treatment for Speaker Housing for iPhone 7 Series
・Differences of Home Button for iPhone 6s Plus and iPhone 7 Plus
・Comparison of 3D Touch Sensor Assy
・Mechanism of Apple 3D Touch Sensor
・Cross-sectional Views of Qualcomm MDM9645M
・Footprint Comparison of A9 CPU and A10 Fusion
・TMV-PoP for A9 CPU vs InFO WLP PoP for A10 Fusion
・Chip and Package Pictures of Apple/TSMC A10 Fusion
CPU
・X-ray Pictures of A10 Fusion and LPDDR4 Packages
・X-ray CT Analysis around A10 Fusion CPU
・De-coupling Capacitor for Apple A10 Fusion
・Cross-sectional Views of iPhone 7 Plus Mother Board
・X-ray Pictures of Apple A10 Fusion InFO-PoP Sliced
・Cross-sectional Views of Apple A10 Fusion CPU Package
・Image of A10 Fusion CPU InFO-WLP
・Alps Electric Compass, HSCDTDOOxA
・LCP Antenna Cables for iPhone 7 Series
・X-ray and Inside Pictures of Bosch Sensortec BMP280
・X-ray Pictures of SK Hynix 32GB NAND Memory
・X-ray Pictures of Samsung 256GB 3D NAND Memory
・Audio CODEC and Audio Amplifiers for iPhone 7 Series
・EMI Shielded Packages on Apple iPhone 7 Series
・Anti-static Stickers for Apple iPhones
・EMI Shielded Packages for iPhone 7 Series
・Cross-sectional Views
・Analysis of Elements Coated
・Built-in Sensors for iPhone 7/7 Plus
・Sensors and Their Suppliers
・Sips for Apple iPhone 7 and 8
【Appendix on Apple iPhone 7 Plus】
・LTE Carrier Aggregation
・6 Models of iPhone 7 and iPhone 7 Plus on the Market
・Cellular and Wireless System of Apple iPhone 7 Series
・Murata's RF Switches and FEMs
・Murata's RF Modules
・AVAGO RF Products
構
成
・Avago's PA, FBAR Duplexers, and GPS FEMs for RF
Front-End
・Chipset by Qualcomm
・iPhone 7 Board Lay-out Based on Qualcomm Chipset
・Intel's and Qualcomm's Chipset for iPhone Series
・Bands Supported by Intel and Qualcomm RF & Modem
Ics
・Qualcomm WTR3925 and WTR4905, RFIC
・Qualcomm WTR3925, RFIC
・Specification of Qualcomm MDM9645M
・Outline of Apple A10 Fusion CPU
・What Is An Apple A10 Fusion (part number APL1W2
4)?
・Effectiveness of InFO-WLP
・Outline of Apple A10 Fusion CPU & InFO-WLP
・Specification Comparison of Apple A9 CPU and A10 Fusion
・Key Components of Apple iPhone 6s/6s Plus
・Transition of Apple SoC Chip
・An Example of Apple Ax CPU Series
・CPUの性能向上のサイクルと消費電力・発熱量
・History of Apple Ax CPUs
・Impact of TSMC's InFO-WLP to Other OSAT
・TSMC's FOWLP Formation: Chip-First(Die-Up)
・Possibility of TSMC's InFO-PoP Manufacturing Process
・Different LPDDR4 Capacity of iPhone 7 Series
・Samsung LPDDR4 Line-up
・Samsung Mobile LPDDR4 Development
・Samsung Line-up of LPDDR4
・Low Power DRAM Bandwidth Roadmap
・PoP Package Issues: Thickness
・Pop Package Issues: Electrical
・2GB or 3GB LPDDR4 for iPhone 7 Series
・PoP Package Issues: Thermal
・32GB, 128GB and 256GB NAND Memories for iPhone 7
Series
・Samsung Re-entries to Supply NAND Memories to iPhones
・Why Is EMI Shielding Required to The Individual Packages?
・Effectiveness of EMI Shielding Performance
・Measurement data of different shielding methods. All
data is normalized to the non-shielded reference part
・LGA vs BGA for Mobile NAND Memories
・Requirements to Thermal Conductive Sheet for Portable
Products
・Transition of Camera Specification for Apple iPhones
・Camera Comparison of iPhone 7 and iPhone 7 Plus
・Bosch Sensortec's MEMS Sensors
・Texas Instruments Battery Charger SN2400ABO
・Lattice Semiconductor FPGA, ICE5LP4K
・Features and Application of NXP NFC Control IC
・Background of NFC Type-F and NXP's Product Examples
・What is the Difference of IP67 and IP68?
・Features of LCD Substrates
・Antenna LCP Cables for iPhone 5 and iPhone 7 Series
・Apple's Patent for Water-proof iPhones

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