close

Enter

Log in using OpenID

Semiconductor Assembly and Testing Services (SATS) Market

embed
Semiconductor Assembly and Testing Service Market, By Service (Assembly, Packaging, Testing), By Application (Consumer Electronics, Information Technology, Telecommunication, Automotive, Industrial) - Forecast till 2022
Semiconductor Assembly and Testing Services (SATS) Market Research Report- Global Forecast 2022
Semiconductor Assembly and
Testing Services (SATS)
Market Research ReportGlobal Forecast 2022
P a g e |1
Copyright © 2017 Market Research Future.
Semiconductor Assembly and Testing Services (SATS) Market Research Report- Global Forecast 2022
VIEW REPORT
PRESS RELEASE
SAMPLE REPORT
P a g e |2
Copyright © 2017 Market Research Future.
Semiconductor Assembly and Testing Services (SATS) Market Research Report- Global Forecast 2022
Summary:
The global Semiconductor Assembly and Testing Services market is expected to grow at USD ~43 billion by the end
of year 2022 with ~5% of CAGR.
Market Overview:
Global Semiconductor Assembly and Testing Services Market is growing significantly. High development in the
field of technology, need of efficient consumer electronic products, changing trends and high adoption automation
into the manufacturing process are some of the key drivers for the market of Semiconductor Assembly and Testing
Services.
Today, the semiconductor industry is more than of USD 400 billion and with the rise in the spending in investment
in the in development of new products, the market will continue to show the positive growth rate in the coming
picture. This is the main factor which is driving the market of semiconductor assembly and testing services whereas
changing technological environment, government rules towards the use of ecofriendly environment and e-wastage
is expected to hinder the market growth during forecast period.
Today, the market of semiconductor products is increasing at exponential rate. High consumption of products in
the different regions is giving huge pressure on the OEMs. As the technology is growing, the average life cycle of
products is decreasing due to the availability of substitutes. For the expansion and business growth, companies are
adopting multiple business strategies including mergers and acquisition. In last five years, the R&D expense of
companies has increased tremendously due to the increase in the revenue and growing competition. Market
Research Future has predicted that Asia-Pacific is dominating the market of Semiconductor Assembly and Testing
Services due to the rich presence of semiconductor manufacturing companies in China, Japan, South Korea and
Taiwan.
For the purpose of this study, Market Research Future has segmented the market of Semiconductor Assembly and
Testing Services into Services and Application. Services includes assembly, packaging and testing whereas the
applications has been segmented as consumer electronics, IT, Telecommunication, Automotive, Industrial among
others.
Segmentation:
The Global Semiconductor Assembly and Testing Services (SATS) is segmented in to 4 key dynamics for the
convenience of the report and enhanced understanding;
Segmentation by Services: Comprising assembly, packaging and testing.
Segmentation by Application: Comprising consumer electronics, Information technology, telecommunications and
automotive industrial.
P a g e |3
Copyright © 2017 Market Research Future.
Semiconductor Assembly and Testing Services (SATS) Market Research Report- Global Forecast 2022
Segmentation by Packaging Solution: Comprises Copper wire and gold wire bonding, Copper clip, Flip chip,
Wafer level packaging, TSV.
Segmentation by Regions: Comprises Geographical regions – North America, Europe, APAC and Rest of the
World.
Regional Analysis:
Semiconductor Assembly and Testing Services (SATS) global market is expected to be dominated by Asia Pacific
with the largest market share due to high development in field of manufacturing industry and high presence of
semiconductor manufacturing companies gives a competitive advantage over other regions.
North America stands as second biggest market for Semiconductor Assembly and Testing Services where U.S. is
the major contributors in the market growth due to the growing telecommunication and IT industry. Asia-Pacific is
also expected to be the fastest growing market during the forecast period. The economic developments of Asian
countries is inviting major big players to establish their business unit in Asian Countries.
Competitive Dashboard:
Advanced Semiconductor Engineering, Inc. (U.S.), Amkor Technology, Inc. (U.S.), Siliconware Precision
Industries Co., Ltd. (Taiwan), STATS ChipPAC Ltd (Signapore), Powertech Technology Inc. (Taiwan), CORWIL
Technology (U.S.), Chipbond Technology Corporation (U.S.), Integrated Micro-Electronics, Inc. (U.S.), Global
Foundries (U.S.) among others are some of the prominent players profiled in MRFR Analysis and are at the
forefront of competition in the Global Semiconductor Assembly and Testing Services (SATS) Market.
Industry/ Innovation/ Related News:
May 24, 2017 – Amkor Technology Inc. recently completed the acquisition of Europe’s largest OSATS
(Outsourced Semiconductor Assembly and Test Services) company, Nanium S.A. Portugal-based Nanium provides
semiconductor assembly, packaging, test, engineering and manufacturing services. Their solutions include package
designing, wafer-level packaging (WLP), wafer probe, assembly and test, supply-chain management and drop
shipping. The deal is a step on Nanium’s part to enhance the use of WLFO technology to expand its market share
in the packaging market. By leveraging Nanium’s technology, Amkor will be able to strengthen its foothold in the
fast-growing market of wafer-level packaging for smartphones, tablets and other applications. Management
believes that the deal could expand Nanium’s scale of manufacturing, thereby increasing the company’s customer
base.
November, 2017 – Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have
finally received all anti-trust approvals for the proposed and long-awaited merger between the two IC packaging
houses. The combination of ASE and SPIL will also enable the two companies to share R&D and product
development. ASE, SPIL and other OSATs have seen an increase in R&D costs, particularly in the development of
P a g e |4
Copyright © 2017 Market Research Future.
Semiconductor Assembly and Testing Services (SATS) Market Research Report- Global Forecast 2022
advanced packaging. Fewer OSATs can afford to make the necessary investments in advanced packaging, a move
that is fueling the merger and acquisition activity in the arena.
P a g e |5
Copyright © 2017 Market Research Future.
Semiconductor Assembly and Testing Services (SATS) Market Research Report- Global Forecast 2022
P a g e |6
Copyright © 2017 Market Research Future.
1/--pages
Report inappropriate content