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http://www.univ-toulouse.fr
The thermal compound, also called thermal grease, is usually composed of synthetic oils or silicone
associated with metal oxide particles. This thermal joint compound is used for drawing heat away
from processors by transmission to heatsink. This key point for electronics and computer
industries is performed by optimizing the surface heat transfer between 2 components by reduction of air
presence as much as possible, air being the main insulating factor limiting the efficiency of heat transfer.
The Laboratory of Chemical Engineering in Toulouse (LGC) has developed a new process for
manufacturing a composite material that consists in mixing a doped aqueous dispersion of mica with a
material like graphite which provides specific physical and chemical properties to the final product.
This proposed material is as efficient as best products available on the market: its excellent thermal
conductivity allows quick response time under transient regime. The viscosity level depends on the blend
composition. Application mode and packaging are easier than those of current products: retention time is
reduced, the compound dries in situ and real time. This material is very competitive in terms of price,
strong added value, and gets significant environmental qualities: it does not require any use of
organic solvent and the final product can be recycled.
Collaborations with thermal compounds manufacturers and electronics
industries are sought for integrating and commercializing the technology.
Development
Industrial scale-up is validated
Intellectual Property Rights
French patent FR2924263 - PCT WO 2009/07 1807 A2
Co-ownership UPS - INPT - CNRS
Inventors - Laboratories
Pierre
GROS - LGC UPS
http://lgc.inp-toulouse.fr
Jacques PROSDOCIMI - INPT
Advantages
No solvent, no binder
No treatment required
Easy to implement
Thermal conductivity:
from 1.9 to 5 W/m.K
Applications
Thermal joint compounds, thin films, thermal adhesive
for microprocessors and electronic chips
Collaborations
License - Technical collaboration
Targeted Industries
- Power electronics
- Microelectronics
- Microcomputers
- Telecoms
Structured and adhesive
Price
Recyclable
http://www.upstlse.fr
Technology Transfer Manager
Olivier BEAUDOIN
Université de Toulouse Valorisation
+33 (0)5 34 41 35 30
[email protected]