Intel® Xeon® Processor
E5-1600/2600/4600 v1 and v2
Product Families
Thermal / Mechanical Design Guide
September 2013
Document Number: 326512-003
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2
Document Number: 326512-003
Contents
1
Introduction .............................................................................................................. 9
1.1
References ....................................................................................................... 10
1.2
Definition of Terms ............................................................................................ 10
2
LGA2011-0 Socket ................................................................................................... 13
2.1
Contact/Land Mating Location ............................................................................. 16
2.2
Board Layout .................................................................................................... 16
2.2.1 Suggested Silkscreen Marking for Socket Identification................................ 17
2.3
Attachment to Motherboard ................................................................................ 18
2.4
Socket Components........................................................................................... 18
2.4.1 Socket Body Housing .............................................................................. 18
2.4.2 Solder Balls ........................................................................................... 19
2.4.3 Contacts ............................................................................................... 19
2.4.4 Pick and Place Cover............................................................................... 19
2.4.5 Socket Standoffs and Package Seating Plane.............................................. 21
2.5
Durability ......................................................................................................... 21
2.6
Markings .......................................................................................................... 21
2.7
Component Insertion Forces ............................................................................... 22
2.8
Socket Size ...................................................................................................... 22
3
Independent Loading Mechanism (ILM)................................................................... 23
3.1
Square ILM Design Concept ................................................................................ 24
3.1.1 Square ILM Assembly Design Overview ..................................................... 24
3.2
ILM Features .................................................................................................... 26
3.2.1 ILM Closing sequence ............................................................................. 26
3.2.2 ILM Opening Sequence............................................................................ 28
3.2.3 ILM Back Plate Design Overview ............................................................... 30
3.3
ILM Assembly ................................................................................................... 31
3.3.1 Manufacturing Assembly Flow .................................................................. 31
3.4
Processor Installation......................................................................................... 32
3.5
Narrow ILM ...................................................................................................... 34
3.5.1 Introduction .......................................................................................... 34
3.5.2 Comparison Between Square ILM and Narrow ILM ...................................... 35
3.5.3 ILM Keepout Zones................................................................................. 35
3.6
ILM Cover ........................................................................................................ 36
3.7
Heatsink to ILM interface.................................................................................... 37
4
LGA2011-0 Socket and ILM Electrical, Mechanical, and
Environmental Specifications................................................................................... 39
4.1
Component Mass............................................................................................... 39
4.2
Package/Socket Stackup Height .......................................................................... 39
4.3
Loading Specifications........................................................................................ 39
4.4
Electrical Requirements ...................................................................................... 40
4.5
Environmental Requirements .............................................................................. 41
5
Thermal Solutions ................................................................................................... 43
5.1
Performance Targets.......................................................................................... 43
5.1.1 Performance Targets - Square ILM/Heatsink Application .............................. 43
5.1.2 Performance Targets - Narrow ILM/Heatsink Application .............................. 47
5.1.3 Reference Heatsink Assembly .................................................................. 49
5.2
Structural Considerations ................................................................................... 51
5.3
Thermal Design Guidelines ................................................................................. 51
5.3.1 Intel® Turbo Boost Technology................................................................. 52
5.3.2 Thermal Characterization Parameter ......................................................... 52
5.3.3 Fan Speed Control .................................................................................. 53
Document Number: 326512-003
3
5.3.4
5.3.5
5.3.6
Thermal Features....................................................................................53
Tcontrol Relief ........................................................................................54
Short Duration TCC Activation and Catastrophic Thermal Management for Intel®
Xeon® Processor E5-1600/2600 / 4600 v1 and v2 Product Families ..............56
Absolute Processor Temperature and Thermal Excursion .........................................56
DTS Based Thermal Specification .........................................................................57
5.5.1 Implementation ......................................................................................57
5.5.2 Considerations for Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 v2
Product Family Processors........................................................................57
5.5.3 DTS Based Thermal Profile, Tcontrol and Margin for the Intel Xeon Processor E51600/E5-2600/E5-4600 v1 Product Family .................................................57
5.5.4 Power Calculation for the Intel Xeon Processor E5-1600/E5-2600/E5-4600 v1
Product Family .......................................................................................58
5.5.5 Averaging the DTS Based Thermal Specification for the Intel Xeon E5-1400/E52600/E5-4600 v1 Product Family ..............................................................59
5.5.6 Capabilities for the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 v2
Product Family .......................................................................................59
5.4
5.5
6
Quality and Reliability Requirements .......................................................................63
6.1
Use Conditions ..................................................................................................63
6.2
Intel Reference Component Validation ..................................................................64
6.2.1 Board Functional Test Sequence ...............................................................64
6.2.2 Post-Test Pass Criteria Examples ..............................................................65
6.2.3 Recommended BIOS/Processor/Memory Test Procedures .............................65
6.3
Material and Recycling Requirements....................................................................65
A
Mechanical Drawings ...............................................................................................67
B
Socket Mechanical Drawings ....................................................................................93
C
Component Suppliers ...............................................................................................99
C.1
Intel Enabled Supplier Information .......................................................................99
C.1.1 Intel Reference or Collaboration Thermal Solutions......................................99
C.1.2 Socket and ILM Components .................................................................. 100
D
Thermal Test Vehicle.............................................................................................. 103
D.1
LGA2011-0 TTV ............................................................................................... 104
D.2
Thermocouple Attach Drawing ........................................................................... 105
E
Embedded Thermal Solutions ................................................................................. 107
E.1
Performance Targets ........................................................................................ 107
E.2
Thermal Design Guidelines ................................................................................ 108
E.2.1 High Case Temperature Thermal Profile ................................................... 108
E.3
Mechanical Drawings and Supplier Information .................................................... 109
F
Heatsink Load Characterization.............................................................................. 115
F.1
Introduction .................................................................................................... 115
F.2
Heatsink Load Fixture....................................................................................... 115
F.3
Procedure for Measuring Heatsink Load............................................................... 115
Figures
1-1
2-1
2-2
2-3
2-4
2-5
2-6
4
Platform Socket Stack ............................................................................................ 9
Hexagonal Array in LGA2011-0 ...............................................................................13
Contact Wiping Direction ........................................................................................14
Schematic of LGA2011-0 Socket with Pick and Place Cover Removed ...........................14
LGA2011-0 Socket Contact Numbering (Top View of Socket).......................................15
Offset between LGA Land Center and Solder Ball Center .............................................16
LGA2011-0 Socket Land Pattern (Top View of Board) .................................................17
Document Number: 326512-003
2-7
2-8
2-9
3-1
3-2
3-3
3-4
3-5
3-6
3-7
3-8
3-9
3-10
3-11
3-12
3-13
3-14
3-15
3-16
3-17
4-1
5-1
5-2
5-3
5-4
5-5
5-6
A-1
A-2
A-3
A-4
A-5
A-6
A-7
A-8
A-9
A-10
A-11
A-12
A-13
A-14
A-15
A-16
A-17
A-18
A-19
A-20
A-21
A-22
A-23
A-24
A-25
B-1
B-2
B-3
B-4
Suggested Board Marking ...................................................................................... 18
LGA2011-0 Pick and Place Cover............................................................................. 20
Pick and Place Cover ............................................................................................. 21
Square ILM Part Terminology ................................................................................. 24
Square ILM Assembly ............................................................................................ 25
Square ILM as a Universal Retention Mechanism ....................................................... 26
ILM Interlocking Feature ........................................................................................ 27
ILM Lever Closing Sequence ................................................................................... 28
Opening ILM ........................................................................................................ 29
Opening Sequence for ILM and Loadplate (cont.) ...................................................... 29
ILM Keying .......................................................................................................... 30
ILM Back Plate ..................................................................................................... 31
Assembling Socket, Back Plate and ILM onto the Motherboard .................................... 31
Optional Step: Lock down the Hinge Lever ............................................................... 32
Pin 1 Markings on the ILM Frames........................................................................... 33
Package Insertion ................................................................................................. 33
Closing ILM and Loadplate ..................................................................................... 34
Narrow ILM .......................................................................................................... 35
ILM with Cover ..................................................................................................... 36
Heatsink to ILM Interface....................................................................................... 37
Flow Chart of Knowledge-Based Reliability Evaluation Methodology.............................. 41
2U Square Heatsink Performance Curves Using Socket-LGA2011-0 TTV........................ 45
1U Square Heatsink Performance Curves Using Socket-LGA2011-0 TTV........................ 46
1U Narrow Heatsink Performance Curves Using Socket-LGA2011-0 TTV ....................... 49
Reference Square ILM/Heatsink Assembly ................................................................ 50
Reference Narrow ILM/Heatsink Assembly................................................................ 51
Processor Thermal Characterization Parameter Relationships ...................................... 53
Square ILM Board Keepouts 1 of 4 .......................................................................... 68
Square ILM Board Keepouts 2 of 4 .......................................................................... 69
Square ILM Board Keepouts 3 of 4 .......................................................................... 70
Square ILM Board Keepouts 4 of 4 .......................................................................... 71
Narrow ILM Board Keepouts 1 of 4 .......................................................................... 72
Narrow ILM Board Keepouts 2 of 4 .......................................................................... 73
Narrow ILM Board Keepouts 3 of 4 .......................................................................... 74
Narrow ILM Board Keepouts 4 of 4 .......................................................................... 75
2U Square Heatsink Assembly Without TIM 1 of 2 ..................................................... 76
2U Square Heatsink Assembly Without TIM 2 of 2 ..................................................... 77
2U Square Heatsink Volumetric 1 of 2 ..................................................................... 78
2U Square Heatsink Volumetric 2 of 2 ..................................................................... 79
Heatsink Screw M4x0.7 ......................................................................................... 80
Heatsink Compression Spring ................................................................................. 81
Heatsink Retaining Ring......................................................................................... 82
Heatsink Delrin Spacer .......................................................................................... 83
1U Square Heatsink Assembly 1 of 2 ....................................................................... 84
1U Square Heatsink Assembly 2 of 2 ....................................................................... 85
1U Square Heatsink Geometry 1 of 2....................................................................... 86
1U Square Heatsink Geometry 2 of 2....................................................................... 87
Heatsink Cup For Spring Retention .......................................................................... 88
1U Narrow Heatsink Assembly 1 of 2 ....................................................................... 89
1U Narrow Heatsink Assembly 2 of 2 ....................................................................... 90
1U Narrow Heatsink Geometry 1 of 2 ...................................................................... 91
1U Narrow Heatsink Geometry 2 of 2 ...................................................................... 92
Socket Mechanical Drawing (Sheet 1 of 4)................................................................ 94
Socket Mechanical Drawing (Sheet 2 of 4)................................................................ 95
Socket Mechanical Drawing (Sheet 3 of 4)................................................................ 96
Socket Mechanical Drawing (Sheet 4 of 4)................................................................ 97
Document Number: 326512-003
5
D-1
E-1
E-2
E-3
E-4
F-1
F-2
Groove for Thermocouple Attach on Intel® Xeon® Processor E5-2600 Product Family
Thermal Test Vehicle ........................................................................................... 106
ATCA Heatsink Performance Curves ....................................................................... 108
High Case Temperature Thermal Profile.................................................................. 109
ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) .............................................. 111
ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) .............................................. 112
Heatsink Load Fixtures......................................................................................... 115
Heatsink Fixture Assembly.................................................................................... 116
Tables
1-1
1-2
2-1
3-1
4-1
4-2
4-3
4-4
5-1
5-2
5-3
5-4
5-5
5-6
5-7
5-8
5-9
5-10
5-11
5-12
6-1
6-2
A-1
B-1
C-1
C-2
C-3
D-1
D-2
E-1
E-2
E-3
E-4
6
Reference Documents ............................................................................................10
Terms and Descriptions..........................................................................................10
LGA2011-0 Socket Attributes ..................................................................................13
Square ILM Assembly Component Thickness and Material ...........................................25
Socket and Retention Component Mass ....................................................................39
2011-land Package and LGA2011-0 Socket Stackup Height .........................................39
Socket and ILM Mechanical Specifications .................................................................40
Electrical Requirements for LGA2011-0 Socket ..........................................................41
Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families, 8 Core/6 Core Processor
Reference Thermal Boundary Conditions (Square ILM/HS) ..........................................43
Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families, 4 Core Processor
Reference Thermal Boundary Conditions (Square ILM/HS) ..........................................43
Intel® Xeon® Processor E5-1600/2600 v2 Product Families, Processor Reference Thermal
Boundary Conditions (Square ILM/HS) .....................................................................44
Performance Curve Data (Graphs in Fig 5-1 and 5-2) .................................................46
Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families, 8 Core/6 Core Processor
Reference Thermal Boundary Conditions (Narrow ILM/HS) ..........................................47
Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families, 4 Core Processor
Reference Thermal Boundary Conditions (Narrow ILM/HS) ..........................................47
Intel® Xeon® Processor E5-1600/2600 v2 Product Families, Processor Reference Thermal
Boundary Conditions (Narrow ILM/HS) .....................................................................48
Performance Curve Data ........................................................................................49
TCONTROL and DTS Relationship.............................................................................54
Sign Convention....................................................................................................54
TCONTROL Relief for E5-1600/E5-2600/E5-4600 v1 Product Families..............................55
Averaging Coefficients ...........................................................................................59
Server Use Conditions Environment (System Level) ...................................................63
Server Use Conditions Environment (System Level) ...................................................64
Mechanical Drawing List .........................................................................................67
Socket Drawing List...............................................................................................93
Suppliers for the Intel Reference Thermal Solutions ...................................................99
Suppliers for the LGA2011-0 Socket and ILM .......................................................... 100
Suppliers for the LGA-2011-0 Socket and ILM (Continued)........................................ 101
Correction Offsets Intel® Xeon® Processor E5-1600 / E5-2600 / E5-4600 v1 Product
Families ..................................................................................................................
........................................................................................................................ 103
Correction Offsets Intel® Xeon® Processor E5-1600/ E5-2600/ E5-4600 v2 Product Families
........................................................................................................................ 103
8-Core/6-Core Processor Reference Thermal Boundary Conditions (E5 v1 Product Family)
........................................................................................................................ 107
Processor Reference Thermal Boundary Conditions (E5 v2 Product Family).................. 107
Embedded Heatsink Component Suppliers .............................................................. 109
Mechanical Drawings List...................................................................................... 110
Document Number: 326512-003
Revision History
Revision
Number
Description
Revision Date
-001
•
Initial Release
March 2012
-002
•
Added section 5.3.6 Short Duration TCC Activation and Catastrophic Thermal Management
September
2012
-003
•
Added E-5 v2 Product Family information
September
2013
§
Document Number: 326512-003
7
8
Document Number: 326512-003
Introduction
1
Introduction
This document provides guidelines for the design of thermal and mechanical solutions
for the:
• Intel® Xeon® Processor E5-1600/2600/4600 v1 and v2 Product Families
processors in 2 and 4-socket servers, and 2-socket workstations. The processors
covered are listed in the processor family datasheets listed in Table 1-1.
The components described in this document include:
• The processor thermal solution (heatsink) and associated retention hardware.
• The LGA2011-0 socket, the Independent Loading Mechanism (ILM) and back plate.
Figure 1-1.
Platform Socket Stack
Heatsink
Independent Loading
Mechanism (ILM)
Processor
LGA 2011-0 Socket
Motherboard
ILM Back Plate
The goals of this document are:
• To assist board and system thermal mechanical designers.
• To assist designers and suppliers of processor heatsinks.
Thermal profiles and other processor specifications are provided in the appropriate
processor Datasheet.
Document Number: 326512-003
9
Introduction
1.1
References
Material and concepts available in the following documents may be beneficial when
reading this document.
Table 1-1.
Reference Documents
Document
Notes
European Blue Angel Recycling Standards
1
Platform Environment Control Interface (PECI) Specification
4
Platform Digital Thermal Sensor (DTS) Based Thermal Specifications and Overview
4
Manufacturing With Intel Components Using Lead-Free Technology
3
Entry-level Electronics Bay Specification
2
Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families Datasheet - Volume One
(326508)
3
Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families Datasheet - Volume Two
(326509)
3
Intel® Xeon® Processor E5-1600 and E5-2600 v2 Product Families Datasheet - Volume One
(329187)
3
Intel® Xeon® Processor E5-1600 and E5-2600 v2 Product Families Datasheet - Volume Two
(329188)
3
Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families Specification Update
(326510)
3
Intel® Xeon® Processor E5-1600 and E5-2600 v2 Product Families Specification Update
(329189)
3
Intel® Xeon® Processor E5-1600/2600/4600 v1 and v2 Product Families – Thermal Model
(326608)
3
Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families – Mechanical Model
(326609)
3
Intel® Xeon® Processor E5-1600 and E5-2600 v2 Product Families – Mechanical Model
(329299)
3
Notes:
1.
Available at http://www.blauer-engel.de
2.
Available at http://ssiforum.oaktree.com/
3.
Available at https://learn.intel.com/portal/scripts/general/logon.aspx (Code: ME709). Available
electronically.
4.
Contact your Intel representative for the latest version.
1.2
Definition of Terms
Table 1-2.
Terms and Descriptions (Sheet 1 of 2)
Term
10
Description
Bypass
Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
DTS
Digital Thermal Sensor reports a relative die temperature as an offset from TCC
activation temperature.
FSC
Fan Speed Control
IHS
Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
Square ILM
Independent Loading Mechanism provides the force needed to seat the 2011-LGA
package onto the socket contacts and has 80 × 80mm heatsink mounting hole pattern.
Document Number: 326512-003
Introduction
Table 1-2.
Terms and Descriptions (Sheet 2 of 2)
Term
Description
Narrow ILM
Independent Loading Mechanism provides the force needed to seat the 2011-LGA
package onto the socket contacts and has 56 × 94mm heatsink mounting hole pattern
LGA2011-0 socket
The processor mates with the system board through this surface mount, 2011-contact
socket for Intel® Xeon® Processor 5-1600/E5-2600/E5-4600 Product Families-based
platform.
PECI
The Platform Environment Control Interface (PECI) is a one-wire interface that provides
a communication channel between Intel processor and chipset components to external
monitoring devices.
ΨCA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (TCASE – TLA) / Total
Package Power. Heat source should always be specified for Ψ measurements.
ΨCS
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (TCASE – TS) / Total
Package Power.
ΨSA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (TS – TLA) / Total Package Power.
TCASE
The case temperature of the processor measured at the geometric center of the topside
of the IHS.
TCASE_MAX
The maximum case temperature as specified in a component specification.
TCC
Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
by using clock modulation and/or operating frequency and input voltage adjustment
when the die temperature is very near its operating limits.
TCONTROL
TCONTROL is a static value below TCC activation used as a trigger point for fan speed
control. When DTS > TCONTROL, the processor must comply to the thermal profile.
TDP
Thermal Design Power: Thermal solution should be designed to dissipate this target
power level. TDP is not the maximum power that the processor can dissipate.
Thermal Monitor
A power reduction feature designed to decrease temperature after the processor has
reached its maximum operating temperature.
Thermal Profile
Line that defines case temperature specification of a processor at a given power level.
TIM
Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
TLA
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
TSA
The system ambient air temperature external to a system chassis. This temperature is
usually measured at the chassis air inlets.
U
A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U
equals 3.50 in, and so forth.
§
Document Number: 326512-003
11
Introduction
12
Document Number: 326512-003
LGA2011-0 Socket
2
LGA2011-0 Socket
This section describes a surface mount, LGA (Land Grid Array) socket intended for the
processors in the Intel® Xeon® Processor E5-1600/2600/4600 v1 and v2 Product
Families-based platform. The socket provides I/O, power and ground contacts. The
socket contains 2011 contacts arrayed about a cavity in the center of the socket with
lead-free solder balls for surface mounting on the motherboard.
The socket has 2011 contacts. The LGA2011-0 socket is introducing a hexagonal area
array ball-out which provides many benefits:
• Socket contact density increased by 12% while maintaining 40 mil minimum via
pitch requirements.
• Corresponding square pitch array’s would require a 38 mil via pitch for the same
package size.
LGA2011-0 has 1.016 mm (40 mil) hexagonal pitch in a 58x43 grid array with 24x16
grid depopulation in the center of the array and selective depopulation elsewhere.
Figure 2-1.
Hexagonal Array in LGA2011-0
l
mi
40
40
m
il
34.7 mil
40 mil
Table 2-1.
LGA2011-0 Socket Attributes
LGA2011-0 Socket
Component Size
Attributes
58.5 mm(L)X51 mm (W)
Pitch
1.016 mm (Hex Array)
Ball Count
2011
Contact wiping direction is 180 degrees as shown in Figure 2-2.
Document Number: 326512-003
13
LGA2011-0 Socket
Figure 2-2.
Contact Wiping Direction
Contact Wiping Direction
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). The design includes a back plate which is integral to having
a uniform load on the socket solder joints and the contacts. Socket loading
specifications are listed in Chapter 4. Schematic for LGA2011-0 socket is shown in
Figure 2-3. The seating plane is shown on the outer periphery of the socket.
Figure 2-3.
14
Schematic of LGA2011-0 Socket with Pick and Place Cover Removed
Document Number: 326512-003
LGA2011-0 Socket
Figure 2-4.
LGA2011-0 Socket Contact Numbering (Top View of Socket)
Document Number: 326512-003
15
LGA2011-0 Socket
2.1
Contact/Land Mating Location
All socket contacts are designed such that the contact tip lands within the substrate pad
boundary before any actuation load is applied and remain within the pad boundary at
final installation, after actuation load is applied. The offset between LGA land center
and solder ball center is defined in Figure 2-5.
Figure 2-5.
Offset between LGA Land Center and Solder Ball Center
Note:
2.2
All dimensions are in mm.
Board Layout
The land pattern for the LGA2011-0 socket is 40 mils hexagonal array. For CTF (Critical
to Function) joints, the pad size will primarily be a circular Metal Defined (MD) pad and
these pads should be designated as a Critical Dimension to the PCB vendors with a
17 mil ±1 mil tolerance. Some CTF pads will have a SMD Pad (20 x 17 mil). For
additional pad configurations details including the NCTF (Non-Critical to Function)
joints, see Section 2.3.
Note:
16
There is no round-off (conversion) error between socket pitch (1.016 mm) and board
pitch (40 mil) as these values are equivalent.
Document Number: 326512-003
LGA2011-0 Socket
Figure 2-6.
LGA2011-0 Socket Land Pattern (Top View of Board)
2.2.1
Suggested Silkscreen Marking for Socket Identification
Intel is recommending that customers mark the socket name approximately where
shown in Figure 3-7. The final silkscreen location may vary with different motherboard
designs, but should always be visible after ILM and component assembly.
Document Number: 326512-003
17
LGA2011-0 Socket
Figure 2-7.
Suggested Board Marking
Pin 1 of Socket
Add Silkscreen
In this location
2.3
Attachment to Motherboard
The socket is attached to the motherboard by 2011 solder balls. There are no additional
external methods (that is, screw, extra solder, adhesive, and so forth) to attach the
socket.
As indicated in Figure 2-9, the Independent Loading Mechanism (ILM) is not present
during the attach (reflow) process.
2.4
Socket Components
The socket has two main components, the socket body and Pick and Place (PnP) cover,
and is delivered as a single integral assembly. Refer to Appendix B for detailed
drawings.
2.4.1
Socket Body Housing
The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable
of withstanding 260°C for 40 seconds (typical reflow/rework). The socket coefficient of
thermal expansion (in the XY plane), and creep properties, must be such that the
integrity of the socket is maintained for the conditions listed in Chapter 6.
The color of the housing will be dark as compared to the solder balls to provide the
contrast needed for pick and place vision systems.
18
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LGA2011-0 Socket
2.4.2
Solder Balls
A total of 2011 solder balls corresponding to the contacts are on the bottom of the
socket for surface mounting with the motherboard.
The socket has the following solder ball material:
• Lead free SAC305 (SnAgCu) solder alloy with a silver (Ag) content 3%, copper (Cu)
0.5%,tin (Sn) 96.5% and a melting temperature of approximately 217°C. The
immersion silver (ImAg) motherboard surface finish and solder paste alloy must be
compatible with the SAC alloy solder paste.
The co-planarity (profile) and true position requirements are defined in Appendix B.
2.4.3
Contacts
The base material for the contacts is high strength copper alloy.
For the area on socket contacts where processor lands will mate, there is a 0.381 μm
[15 μinches] minimum gold plating over 1.27 μm [50 μinches] minimum nickel
underplate.
No contamination by solder in the contact area is allowed during solder reflow.
2.4.4
Pick and Place Cover
The cover provides a planar surface for vacuum pick up used to place components in
the Surface Mount Technology (SMT) manufacturing line. The cover remains on the
socket during reflow to help prevent contamination during reflow. The cover can
withstand 260°C for 40 seconds (typical reflow/rework profile) and the conditions listed
in Chapter 6 without degrading.
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19
LGA2011-0 Socket
Figure 2-8.
LGA2011-0 Pick and Place Cover
As indicated in Figure 2-9, the pick and place (PnP) cover remains on the socket during
ILM installation. Once the ILM with its cover is installed, Intel is recommending the PnP
cover be removed to help prevent damage to the socket contacts. To reduce the risk of
bent contacts the PnP Cover and ILM Cover were designed to not be compatible. See
Section 3.3 for additional information on ILM assembly to the board.
Cover retention must be sufficient to support the socket weight during lifting,
translation, and placement (board manufacturing), and during board and system
shipping and handling. Covers can be removed without tools.
The pick and place covers are designed to be interchangeable between socket
suppliers.
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LGA2011-0 Socket
Figure 2-9.
Pick and Place Cover
ILM
Pick and Place Cover
Note:
Figure is representative and may not show the most current revision of parts.
2.4.5
Socket Standoffs and Package Seating Plane
Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow and are specified in Appendix B.
Similarly, a seating plane on the topside of the socket establishes the minimum
package height. See Section 4.2 for the calculated IHS height above the motherboard.
2.5
Durability
The socket must withstand 30 cycles of processor insertion and removal. The maximum
part average and single pin resistances from Table 4-4 must be met when mated in the
1st and 30th cycles.
The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
2.6
Markings
There are three markings on the socket:
• LGA2011-0: Font type is Helvetica Bold - minimum 6 point (2.125 mm).
• Manufacturer's insignia (font size at supplier's discretion).
• Lot identification code (allows traceability of manufacturing date and location).
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21
LGA2011-0 Socket
All markings must withstand 260°C for 40 seconds (typical reflow/rework profile)
without degrading, and must be visible after the socket is mounted on the
motherboard.
LGA2011-0 and the manufacturer's insignia are molded or laser marked on the side
wall.
2.7
Component Insertion Forces
Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for
Ergonomics/Human Factors Engineering of Semiconductor Manufacturing Equipment,
example Table R2-7 (Maximum Grip Forces). The socket must be designed so that it
requires no force to insert the package into the socket.
2.8
Socket Size
Socket information needed for motherboard design is given in Appendix B.
This information should be used in conjunction with the reference motherboard keepout drawings provided in Appendix A to ensure compatibility with the reference thermal
mechanical components.
§
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Independent Loading Mechanism (ILM)
3
Independent Loading
Mechanism (ILM)
The Independent Loading Mechanism (ILM) provides the force needed to seat the
2011-land LGA package onto the socket contacts. The ILM is physically separate from
the socket body. The assembly of the ILM is expected to occur after attaching the
socket to the board. The exact assembly location is dependent on manufacturing
preference and test flow. See the Manufacturing Advantage Service (MAS) document
for this platform for additional guidance.
The mechanical design of the ILM is a key contributor to the overall functionality of the
LGA2011-0 socket. Intel performs detailed studies on integration of processor package,
socket and ILM as a system. These studies directly impact the design of the ILM. The
Intel reference ILM will be “built to print” from Intel controlled drawings. Intel
recommends using the Intel Reference ILM. Custom non-Intel ILM designs do not
benefit from Intel's detailed studies and may not incorporate critical design
parameters.
There are two types of ILMs for socket LGA2011-0:
1. Square ILM - This ILM has 80x80 mm heatsink mounting hole pattern. Please refer
to Section 3.1 for more details
2. Narrow ILM - This ILM has 56x94 mm heatsink mounting hole pattern. Please refer
to Section 3.1 and Section 3.5 for common features with square ILM and specific
features of narrow ILM.
Note:
The ILM has two critical functions: deliver the force to seat the processor onto the
socket contacts and distribute the resulting load evenly through the socket solder
joints. Another purpose of ILM is to ensure electrical integrity/performance of the
socket and package.
Note:
This design will be “built to print” from Intel controlled drawings.
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23
Independent Loading Mechanism (ILM)
3.1
Square ILM Design Concept
The square ILM consists of two assemblies that will be procured as a set from the
enabled vendors. These two components are the ILM assembly and back plate.
3.1.1
Square ILM Assembly Design Overview
Figure 3-1.
Square ILM Part Terminology
Loadplate
Hinge Lever
Active Lever
Captive Nut
(4X)
Hinge Clevis
Heat Sink stud
(4X)
Frame
Clevis Rivet
C
(4X)
Active Clevis
Frame Insulator
The square ILM assembly consists of five major pieces as shown in Figure 3-1 and
Figure 3-2, hinge lever, active lever, load plate, load frame, ILM cover and the captive
fasteners. For clarity the ILM cover is not shown in this view.
Note:
24
The ILM assembly also contains an ILM cover as described in Section 3.6.
Document Number: 326512-003
Independent Loading Mechanism (ILM)
Figure 3-2.
Square ILM Assembly
4 point load plate
(fingers)
Hinge lever arm
ILM frame
Active lever arm
Note:
For clarity, the ILM cover is not shown in Figure 3-2.
The hinge lever and active lever are designed to place equal force on both ends of the
ILM load plate.The frame provides the hinge locations for the levers. The hinge lever
connects the load plate to the frame. When closed, the load plate applies four point
loads onto the IHS at the “finger” features shown in Figure 3-2. Four point loading
contributes to minimizing package and socket warpage as compared to two point
loading. The reaction force from closing the load plate is transmitted to the frame and
through the captive fasteners to the back plate. Some of the load is passed through the
socket body to the board inducing a slight compression on the solder joints.
Table 3-1.
Square ILM Assembly Component Thickness and Material
Component
Thickness (mm)
Material
ILM Frame
1.5
301 Stainless Steel
ILM Loadplate
1.5
301 Stainless Steel
ILM Backplate
2.2
S50C Low Carbon Steel
Figure 3-3 shows the attachment points of the thermal solution to the ILM frame and
the ILM to the back plate. This attachment method requires four holes in the
motherboard for the ILM and no additional holes for the thermal solution. Orientation of
the ILM is controlled with a key on the socket body. Orientation of the thermal solution
is an option with a key to the ILM.
Note:
Some customer reference boards (CRB) have four additional outer holes in the board.
These holes are legacy and are not required for the current ILM reference design.
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25
Independent Loading Mechanism (ILM)
Figure 3-3.
Square ILM as a Universal Retention Mechanism
3.2
ILM Features
These features are common to the square and narrow ILM:
• Allows for topside thermal solution attach to a rigid structure. This eliminates the
motherboard thickness dependency from the mechanical stackup.
• Captive nuts clamp the ILM frame to the board, providing good clamping and hence
reduced board bending leading to higher solder joint reliability.
• ILM levers provide an interlocking mechanism to ensure proper opening or closing
sequence for the operator. This has been implemented in both square and narrow
ILM.
3.2.1
ILM Closing sequence
When closing the ILM, the interlocking features are intended to prevent the hinge lever
from being latched first. If an attempt is made to close the hinge lever first, the hinge
lever end stop will prevent the user from latching the active lever, indicating something
is done wrong. Text on the ILM cover indicates the proper order of operation. Please
refer to Figure 3-4.
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Independent Loading Mechanism (ILM)
If hinge lever is pressed down first, it raises the load plate up at an angle higher than
the active lever can make contact with, forcing a user to push it down. Also the hinge
lever end stop will block the active lever from being able to be latched.
Figure 3-4.
ILM Interlocking Feature
Hinge Lever
IInterlocking
t l ki ffeature
t
on hinge lever.
Document Number: 326512-003
Active Lever.
27
Independent Loading Mechanism (ILM)
Figure 3-5.
ILM Lever Closing Sequence
Step 1
Close Active Lever
Step 2
Close Hinge Lever
ILM lever closing sequence is shown in Figure 3-5.
1. Latch Active Lever first.
2. Close Hinge Lever second.
Note:
The ILM closing sequence is marked on the ILM load plate.
3.2.2
ILM Opening Sequence
For the opening sequence, the goal is to always open the hinge lever first to prevent
the loadplate from springing open. The only option is to release the hinge lever first.
The hinge lever in a closed position will block the active lever from being unlatched. By
opening hinge lever first, it creates clearance to open the active lever.
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Independent Loading Mechanism (ILM)
Figure 3-6.
Opening ILM
Step 1
Open Hinge Lever
Opening the hinge lever
provides the clearance to
open the active lever
Step 2
Open Active Lever
The ILM opening sequence is shown in Figure 3-6.
1. Open hinge lever
2. Open active lever
Note:
The opening sequence is also marked on the ILM load plate
Figure 3-7.
Opening Sequence for ILM and Loadplate (cont.)
3. Open the load plate by pushing down on the hinge lever Figure 3-7, this will cause
the load plate tab to rise above the socket. Grasp the tab, only after it has risen
away from the socket, open load plate to full open position.
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29
Independent Loading Mechanism (ILM)
Note:
ILM cover not shown for clarity.
3.2.2.1
ILM Keying
This feature is incorporated in the square and narrow ILM. As indicated in Figure 3-8,
the socket protrusion and ILM key features prevent 180-degree rotation of ILM
assembly with respect to socket. This result in a specific orientation with respect to ILM
active lever and pin 1 of the socket body.
Figure 3-8.
ILM Keying
If the ILM is attempted to be
installed 180° out of phase, the
ILM frame will interfere with
socket protrusion
ILM keying feature molded in
socket body and corresponding
ILM key feature in the frame.
3.2.3
ILM Back Plate Design Overview
The backplate design is common for square and narrow ILM. The back plate for dual
processor server products consists of a flat steel back plate with threaded studs to
attach to the ILM frame. A clearance hole is located at the center of the plate to allow
access to test points and backside capacitors. Two additional cut-outs on the backplate
provide clearance for backside voltage regulator components. An insulator is pre
applied by the vendor to the side with the threaded studs.
Note:
30
The ILM Back Plate is designed to work with board thicknesses from 0.062 to 0.100
inches. If the board is outside of this range, the backplate will require modification.
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Independent Loading Mechanism (ILM)
Figure 3-9.
ILM Back Plate
Clearance cutouts (3x)
6-32 Threaded Studs (4x)
3.3
ILM Assembly
The ILM assembly instructions are briefly outlined here.The ILM assembly instructions
shown here are for illustration. For High Volume Manufacturing please refer to the
appropriate platform Manufacturing Advantage Service document.
3.3.1
Manufacturing Assembly Flow
The assembly of the ILM to the socket is documented in the steps below and graphically
in Figure 3-10.
Figure 3-10. Assembling Socket, Back Plate and ILM onto the Motherboard
1
2
3
Note:
2
3
The steps in Figure 3-10 are for illustration only and may not show the most current
revision of parts.
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31
Independent Loading Mechanism (ILM)
1. Using SMT, mount the socket onto the circuit board. Intel provides detailed
instruction for lead free manufacturing of complex interconnects on the Intel
Learning Network (http://iln.intel.com/Portal/Scripts/Home/Home.aspx).
2. Assemble the back plate onto the bottom side of the board ensuring that all 4 studs
protrude through the board.
3. Place the Independent Load Mechanism (ILM) with cover onto the board. The load
plate should be unlatched. See Section 3.2.2.
4. Tighten the (4) Torx-20 screwed to 9 ±1 in-lb.
5. Lift the load plate to the open position and with the tool remove the PnP cover from
the socket body.
6. Close the ILM and latch it per the instructions in Section 3.2.1.
3.4
Processor Installation
Note:
For complete ILM assembly instructions please refer to the appropriate Manufacturing
Advantage Service document.
he hinge lever can be locked down to keep it out of the way when removing the PnP
cover and installing the processor (Figure 3-11). If the hinge lever is locked down when
the ILM is open, then the load plate will be locked in the open position and less likely to
fall closed if bumped.
Both the Square and Narrow ILM have a Pin 1 marking on the frame to help indicate
proper package alignment (Figure 3-12).
Figure 3-11. Optional Step: Lock down the Hinge Lever
Optional Step
Lock down
Hinge Lever
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Independent Loading Mechanism (ILM)
Figure 3-12. Pin 1 Markings on the ILM Frames
Figure 3-13. Package Insertion
Matching corner
heights 4x
Finger Cutouts for
Package insertion &
removal
Note:
Pin 1
indicators
Package Keying
features 4x
Figure 3-13 is for illustration only and may not show the most current revision of parts.
A tool is available for the installation or removal of the processor. Please work with your
local CQE for tool availability.
7. Hold processor along the right and left edges of the package to match socket finger
cutouts (East - West edges). Make sure processor’s Pin1 indicator is aligned with
Pin 1 indicator on the socket corner. Keeping the processor horizontal, lower it
gently into the socket with a purely vertical motion.Verify the package is fully
seated; package corners must be at the same height with respect to all four socket
corners.
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Independent Loading Mechanism (ILM)
Figure 3-14. Closing ILM and Loadplate
Note:
Figure 3-14 is for or illustration only and may not show most current parts.
8. Carefully lower the ILM load plate on top of the processor,
9. Verify that Load-lever-cam is over the load-plate-tab; actuate Load lever with a
smooth uniform motion and latch to the ILM (with thumb).
10. Close the Hinge lever with a smooth uniform motion and latch to the ILM.
3.5
Narrow ILM
3.5.1
Introduction
In addition to the square ILM discussed in Section 3.1, Intel is enabling a second sku of
ILM referred to as the narrow ILM (Figure 3-15.) This second ILM is targeted for
constrained layouts where the space available on either side of the LGA2011-0 socket
requires narrow heatsink mount points.
Note:
This alternate narrow ILM should only be used if space constraints on the board require
it. The topside keepouts and restricted heatsink width associated with this design
present increased challenges in routing, component placement, and thermals.
Note:
This design will be “built to print” from Intel controlled drawings.
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Independent Loading Mechanism (ILM)
Figure 3-15. Narrow ILM
Narrow hinge lever arm
Narrow frame
Narrow active lever arm
3.5.2
Comparison Between Square ILM and Narrow ILM
3.5.2.1
Part Comparison
The narrow ILM is a similar design to the square ILM and shares a majority of the parts.
The only parts that are different in the narrow ILM are the ILM frame, hinge lever arm,
and active lever arm.
3.5.2.2
Mechanical Requirements
The narrow ILM has the same mechanical requirements as the square ILM (refer to the
LGA2011-0 Socket and ILM Electrical, Mechanical, and Environmental Specifications in
this document.)
3.5.3
ILM Keepout Zones
ILM keepout zones (KOZ) refer to zones around the socket on the top and bottom of
the board that must be kept clear of components to accommodate the ILM assembly
and back plate. Appendix A, “Mechanical Drawings” shows the different KOZ for both
the square and the narrow ILM.
Note:
The keepout zones only account for the mechanical clearance. It is up to the
system/board architect to determine additional clearance required for finger and/or tool
access.
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Independent Loading Mechanism (ILM)
Note:
Some customer reference boards (CRB) have four additional outer holes in the board.
These holes are legacy and are not required for the current ILM reference design and
are thus not shown in the current KOZ.
3.6
ILM Cover
Intel has developed a cover that will snap on to the ILM for the LGA2011 socket family.
The ILM cover is intended to reduce the potential for socket contact damage from the
operator / customer fingers being close to the socket contacts to remove or install the
pick and place cover. By design the ILM cover and pick and place covers can not be
installed simultaneously.
The ILM cover concept is shown in Figure 3-16.
This cover is intended to be used in place of the pick and place cover once the ILM is
assembled to the board. The ILM will be offered with the ILM cover pre assembled as
well as a discrete part.
ILM cover features:
• Pre-assembled by the ILM vendors to the ILM load plate. It will also be offered as a
discrete component.
• The ILM cover will pop off if a processor is installed in the socket.
• ILM Cover can be installed while the ILM is open.
• Maintain inter-changeability between validated ILM vendors for LGA2011-0 socket.
• The ILM cover for the LGA2011-0 socket will have a flammability rating of V-0 per
UL 60950-1.
Figure 3-16. ILM with Cover
Note:
36
Intel recommends removing the Pick and Place cover (PnP) of the socket body in
manufacturing as soon as possible at the time when ILM is being installed.
Document Number: 326512-003
Independent Loading Mechanism (ILM)
3.7
Heatsink to ILM interface
Heatsinks for processors in the LGA2011-0 socket attach directly to the ILM via M4
fasteners. Figure 3-17 shows the critical dimension features the thermal solution
vendor must meet.
Figure 3-17. Heatsink to ILM Interface
80.00
38.00
80.00
38.00
M4x0.7
4 PL
4.178 +0.38/ -0.20
Note:
See Note Below
For IHS height above board see Table 4-1
§
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Independent Loading Mechanism (ILM)
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LGA2011-0 Socket and ILM Electrical, Mechanical, and Environmental Specifications
4
LGA2011-0 Socket and ILM
Electrical, Mechanical, and
Environmental Specifications
This chapter describes the electrical, mechanical, and environmental specifications for
the LGA2011-0 socket and the Independent Loading Mechanism.
4.1
Component Mass
Table 4-1.
Socket and Retention Component Mass
Component
Mass
Socket Body, Contacts and PnP Cover
251g
Square ILM Assembly
82g
Narrow ILM Assembly
79g
Backplate
84g
Note:
1.
This is an approximate mass.
4.2
Package/Socket Stackup Height
Table 4-2 provides the stackup height of a processor in the 2011-0-land LGA package
and LGA2011-0 socket with the ILM closed and the processor fully seated in the socket.
Table 4-2.
2011-land Package and LGA2011-0 Socket Stackup Height
Integrated Stackup Height (mm)
From Top of Board to Top of IHS
8.014 ±0.34 mm
Notes:
1.
This data is provided for information only, and should be derived from: (a) the height of the socket seating
plane above the motherboard after reflow, given in Appendix B, (b) the height of the package, from the
package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that
are given in the corresponding processor EDS listed in Table 1-1.
2.
This value is a RSS calculation at 3 Sigma.
4.3
Loading Specifications
The socket will be tested against the conditions listed in Section 6 with heatsink and
the ILM attached, under the loading conditions outlined in this chapter.
Table 4-3 provides load specifications for the LGA2011-0 socket with the ILM installed.
The maximum limits should not be exceeded during heatsink assembly, shipping
conditions, or standard use condition. Exceeding these limits during test may result in
component failure. The socket body should not be used as a mechanical reference or
load-bearing surface for thermal solutions.
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LGA2011-0 Socket and ILM Electrical, Mechanical, and Environmental Specifications
Table 4-3.
Socket and ILM Mechanical Specifications
Parameter
Min
Max
Notes
Static compressive load from ILM cover to
processor IHS
445 N [100 lbf]
712 N [160 lbf]
3, 4, 7, 8
Heatsink Static Compressive Load BOL
222 N [50 lbf]
356 N [80 lbf]
1, 2, 3, 4, 8, 10
Heatsink Static Compressive Load EOL
178 N [40 lbf]
356 N [80 lbf]
1, 3, 4, 8, 9
Dynamic Load (with heatsink installed)
N/A
540 N [121 lbf]
1, 3, 5, 6, 8
Pick and Place Cover Insertion / Removal force
N/A
6.2 N [1.7 lbf]
8
Load Lever actuation force
N/A
31 N [7.0 lbf] in the
vertical direction
8
Maximum heatsink mass
N/A
550g
11
Notes:
1.
These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top
surface.
2.
This is the minimum and maximum static force that can be applied by the heatsink and it’s retention
solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated
to these limits.
3.
Loading limits are for the LGA2011-0 socket.
4.
This minimum limit defines the compressive force required to electrically seat the processor onto the socket
contacts.
5.
Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
6.
Test condition used a heatsink mass of 550 gm [1.21 lb.] with 50 g acceleration measured at heatsink
mass. The dynamic portion of this specification in the product application can have flexibility in specific
values, but the ultimate product of mass times acceleration should not exceed this dynamic load.
7.
Conditions must be satisfied at the beginning of life (BOL) and the loading system stiffness for nonreference designs need to meet a specific stiffness range to satisfy end of life loading requirements.
8.
These loading values are preliminary and subjected to change.
9.
End of Life (EOL) minimum heatsink static load. The methods and techniques to evaluate heat sink EOL
load are included in Appendix F.
10. Beginning of Life (EOL) heat sink load. The methods and techniques to evaluate heat sink BOL load will be
included in a later release of this document.
11. The maximum mass includes all components in the thermal solution. This mass limit is evaluated using the
POR heatsink attached to a PCB.
4.4
Electrical Requirements
LGA2011-0 socket electrical requirements are measured from the socket-seating plane
of the processor to the component side of the socket PCB to which it is attached. All
specifications are maximum values (unless otherwise stated) for a single socket
contact, but includes effects of adjacent contacts where indicated.
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LGA2011-0 Socket and ILM Electrical, Mechanical, and Environmental Specifications
Table 4-4.
Electrical Requirements for LGA2011-0 Socket
Parameter
4.5
Value
Comment
Maximum Socket Part Average
Resistance (EOL @ 100°C)
25 mΩ
This is the maximum allowable part average
socket resistance allowed under all use
conditions (EOL and 100°C). This is monitored by
measuring the daisy chain resistance of all
socket contacts in series across the socket and
dividing by the number of contacts measured.
The resulting value must be below 25 mΩ at all
use conditions (EOL) and elevated temperature
(100C).
Maximum Single Pin Resistance
(mean + 4 sigma) (EOL @ 100°C)
38 mΩ
This is the maximum validated single contact
resistance on the socket under all use conditions
(EOL) and at elevated temperature (100°C). This
accounts for resistance variation across the
socket. While it is possible that a single contact
may reach a resistance of 38 mΩ, the maximum
socket part average resistance spec insures that
all contacts averaged together will not be higher
than 25 mΩ
Dielectric Withstand Voltage
360 Volts RMS
Insulation Resistance
800 MΩ
Environmental Requirements
Design, including materials, shall be consistent with the manufacture of units that meet
the following environmental reference points.
The reliability targets in this chapter are based on the expected field use environment
for these products. The test sequence for new sockets will be developed using the
knowledge-based reliability evaluation methodology, which is acceleration factor
dependent. A simplified process flow of this methodology can be seen in Figure 4-1.
Figure 4-1.
Flow Chart of Knowledge-Based Reliability Evaluation Methodology
Establish the
market/expected use
environment for the
technology
Develop Speculative
stress conditions based on
historical data, content
experts, and literature
search
Freeze stressing
requirements and perform
additional data turns
Perform stressing to
validate accelerated
stressing assumptions and
determine acceleration
factors
A detailed description of this methodology can be found at:
ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf
§
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LGA2011-0 Socket and ILM Electrical, Mechanical, and Environmental Specifications
42
Document Number: 326512-003
Thermal Solutions
5
Thermal Solutions
This section describes a 1U reference heatsink and design targets for 2U heatsinks.
5.1
Performance Targets
5.1.1
Performance Targets - Square ILM/Heatsink Application
Table 5-1, Table 5-2, and Table 5-3 provide boundary conditions and performance
targets for 1U, 2U, and Tower heatsinks used in conjunction with the square ILM for 8
core/6 core and 4 core processors, respectively. These values are used to generate
processor thermal specifications and to provide guidance for heatsink design.
All Boundary Conditions are specified at 35°C system ambient temperature and at sea
level. Figure 5-1 shows Ψca and pressure drop for the 1U heatsink versus the airflow
provided. Best-fit equations are provided to prevent errors associated with reading the
graph.
Table 5-1.
Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families, 8 Core/6
Core Processor Reference Thermal Boundary Conditions (Square ILM/HS)
TDP
Heatsink
Technology
ΨCA2
TLA1
(oC)
(oC/W)
Airflow3
(CFM)
Delta P
inch of
H2O (Pa)
Heatsink
Volumetric4
(mm)
150W (2S WS Only)
Cu Base, Al
Fins (Cu-Al)/
Heatpipe
0.208
35.2
21.8
0.120
100x100x124
135W(2U)
Cu Base, Al
Fins (CuAl)/Heatpipe
0.179
47.4
26
0.140
91.5x91.5x64
130W (1S WS Only)
Cu Base, Al
Fins (Cu-Al)/
Heatpipe
0.192
39
2600 RPM
N/A
100x100x124
130W (1U)
0.243
53.3
16
0.406
91.5x91.5x25.5
115W(1U)
0.241
51.7
16
0.406
91.5x91.5x25.5
0.406
91.5x91.5x25.5
95W (1U)
Cu Base, Al
Fins (Cu-Al)
0.241
49.5
16
70W (1U)
0.239
46.8
16
60W (1U)
0.239
45.7
16
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Thermal Solutions
Table 5-2.
Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families, 4 Core
Processor Reference Thermal Boundary Conditions (Square ILM/HS)
4 Core Processor
Heatsink
Technology
130W (1S WS Only)
Cu Base, Al
Fins (Cu-Al)/
Heatpipe
130W (2U)
ΨCA2
TLA1
(oC)
(oC/W)
0.210
39
Cu Base, Al
Fins (CuAl)/Heatpipe
0.199
47.1
95W (1U)
Cu Base, Al
Fins (Cu-Al)
0.261
49.5
80W (1U)
Cu Base, Al
Fins (Cu-Al)
0.269
47.9
Airflow3(
CFM)
Delta P
(inch of
H2O)
Heatsink
Volumetric4
(mm)
2600 RPM
N/A
100x100x124
26
0.140
91.5x91.5x64
16
0.406
91.5x91.5x25.5
16
0.406
91.5x91.5x25.5
Notes:
1.
Local ambient temperature of the air entering the heatsink.
2.
Max target (mean + 3 sigma) for thermal characterization parameter (Section 5.3.2).
3.
Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches
H2O.
4.
Dimensions of heatsink do not include socket or processor.
5.
General note: All heatsinks are Non-Direct Chassis Attach (DCA).
Table 5-3.
Intel® Xeon® Processor E5-1600/2600 v2 Product Families, Processor
Reference Thermal Boundary Conditions (Square ILM/HS) (Sheet 1 of 2)
Processor
44
Heatsink
Technology6
ΨCA2
(oC/W)
TLA1
(oC)
Airflow3
(CFM)
Delta P
inch of
H2O (Pa)
Heatsink
Volumetric4
(mm)
EP 12-core 130W
(1U)
Cu Base, Al
Fins (Cu-Al)
0.252
53.3
16
0.406
91.5x91.5x25.5
EP/EP 4S 12-core
115W (1U)
Cu Base, Al
Fins (Cu-Al)
0.251
51.7
16
0.406
91.5x91.5x25.5
EP WS 8-core
150W
Cu Base, Al
Fins (Cu-Al)/
Heatpipe
0.236
35.2
21.8
0.120
100x100x124
EP/EP 4S 10-core
130W (1U)
Cu Base, Al
Fins (Cu-Al)
0.265
53.4
16
0.406
91.5x91.5x25.5
EP 4S 8-core
130W (1U)
Cu Base, Al
Fins (Cu-Al)
0.269
52.8
16
0.406
91.5x91.5x25.5
EP 8-core
130W (2U)
Cu Base, Al
Fins (CuAl)/Heatpipe
0.207
47.1
26
0.140
91.5x91.5x64
EP 6-core
130W (2U)
Cu Base, Al
Fins (CuAl)/Heatpipe
0.207
47.1
26
0.140
91.5x91.5x64
EP 10-core
115W (1U)
Cu Base, Al
Fins (Cu-Al)
0.265
51.7
16
0.406
91.5x91.5x25.5
EP/EP 4S 10-core
95W (1U)
Cu Base, Al
Fins (Cu-Al)
0.264
49.5
16
0.406
91.5x91.5x25.5
EP/EP 4S 8-core
95W (1U)
Cu Base, Al
Fins (Cu-Al)
0.269
49.5
16
0.406
91.5x91.5x25.5
EP 10-core
70W (1U)
Cu Base, Al
Fins (Cu-Al)
0.262
46.8
16
0.406
91.5x91.5x25.5
EP 1S WS 6-core
130W
Cu Base, Al
Fins (Cu-Al)/
Heatpipe
0.232
39.0
21.8
0.120
100x100x124
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Thermal Solutions
Table 5-3.
Intel® Xeon® Processor E5-1600/2600 v2 Product Families, Processor
Reference Thermal Boundary Conditions (Square ILM/HS) (Sheet 2 of 2)
Processor
Heatsink
Technology6
ΨCA2
(oC/W)
TLA1
(oC)
EP 1S WS 4-core
130W
Cu Base, Al
Fins (Cu-Al)/
Heatpipe
0.234
39.0
EP 4-core
130W (2U)
Cu Base, Al
Fins (CuAl)/Heatpipe
0.221
47.1
EP 4S 6-core
95W (1U)
Cu Base, Al
Fins (Cu-Al)
0.283
EP 4S 4-core
95W (1U)
Cu Base, Al
Fins (Cu-Al)
EP 6-core
80W (1U)
Airflow3
(CFM)
Delta P
inch of
H2O (Pa)
Heatsink
Volumetric4
(mm)
21.8
0.120
100x100x124
26
0.140
91.5x91.5x64
49.5
16
0.406
91.5x91.5x25.5
0.285
49.5
16
0.406
91.5x91.5x25.5
Cu Base, Al
Fins (Cu-Al)
0.281
47.9
16
0.406
91.5x91.5x25.5
EP 4-core
80W
Cu Base, Al
Fins (Cu-Al)
0.285
47.9
16
0.406
91.5x91.5x25.5
EP 6-core
60W
Cu Base, Al
Fins (Cu-Al)
0.280
45.7
16
0.406
91.5x91.5x25.5
Notes:
1.
Local ambient temperature of the air entering the heatsink.
2.
Max target (mean + 3 sigma) for thermal characterization parameter (Section 5.3.2).
3.
Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches
H2O.
4.
Dimensions of heatsink do not include socket or processor.
5.
General note: All heatsinks are Non-Direct Chassis Attach (DCA).
Document Number: 326512-003
45
Thermal Solutions
Figure 5-1.
2U Square Heatsink Performance Curves Using Socket-LGA2011-0 TTV
Table 5-4.
Performance Curve Data (Graphs in Fig 5-1 and 5-2)
Design Type
46
σ
α
β
γ
A
B
Airflow
(CFM)
1U Cu/Al
0.006
0.156
1.609
1.0366
2.41E-04
2.15E-02
16
2U Heatpipe
0.005
0.131
1.39
0.9862
6.91E-05
3.6E-03
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Figure 5-2.
1U Square Heatsink Performance Curves Using Socket-LGA2011-0 TTV
0.50
0.45
1.40
1.20
0.40
1.00
(in H20)
ψ
0.80
0.60
∆P
0.35
ca
(°C/W)
1.60
Ψca = 0.156+1.609*(CFM)-1.0366=0.265°C/W
ΔP =2.41E-4x(CFM)2 + 2.15E-2x(CFM)=0.406 "H20 @16 CFM
0.30
0.25
0.40
0.20
0.20
0.15
0.00
0
5
10
15
20
25
30
35
40
45
50
Airflow (CFM)
Equation 5-1.
Ψca ( mean ) = α + βx ( CFM ) – γ
Equation 5-2.
ΔP = Ax ( CFM ) 2+ Bx ( CFM )
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47
Thermal Solutions
5.1.2
Performance Targets - Narrow ILM/Heatsink Application
Table 5-5 and Table 5-6 provides boundary conditions and performance targets for 1U
narrow heatsink used in conjunction with the narrow ILM for 8 core/6 core and 4 core
processors respectively. These values are used to generate processor thermal
specifications and to provide guidance for heatsink design.
All Boundary Conditions are specified at 35°C system ambient temperature and at sea
level and Figure 5-3 shows ΨCA and pressure drop for the 1U heatsink versus the airflow
provided. Best-fit equations are provided to prevent errors associated with reading the
graph.
Boundary Conditions added for the narrow ILM/heatsink reference design have no
impact on the released thermal profiles/Tcase specifications. There is no change to the
Tcase specification.
Table 5-5.
Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families, 8 Core/6
Core Processor Reference Thermal Boundary Conditions (Narrow ILM/HS)
TDP
Heatsink
Technology
130W (1U)
0.323
95W (1U)
0.316
70W (1U)
Cu Base, Al
Fins (Cu-Al)
60W (1U)
Table 5-6.
ΨCA2
TLA1
(oC)
(oC/W)
0.300
43
Airflow3
(CFM)
14
Delta P
inch of
H2O (Pa)
0.347
Heatsink
Volumetric4
(mm)
70x106x25.5
0.283
Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families, 4 Core
Processor Reference Thermal Boundary Conditions (Narrow ILM/HS)
4 Core Processor
80W (1U)
Heatsink
Technology
Cu Base, Al
Fins (Cu-Al)
ΨCA2
TLA1
(oC)
(oC/W)
0.325
43
Airflow3(
CFM)
14
Delta P
(inch of
H2O)
0.347
Heatsink
Volumetric4
(mm)
70x106x25.5
Notes:
1.
Local ambient temperature of the air entering the heatsink.
2.
Max target (mean + 3 sigma) for thermal characterization parameter (Section 5.3.2).
3.
Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches
H2O.
4.
Dimensions of heatsink do not include socket or processor.
5.
General note: All heatsinks are Non-Direct Chassis Attach (DCA).
48
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Table 5-7.
Intel® Xeon® Processor E5-1600/2600 v2 Product Families, Processor
Reference Thermal Boundary Conditions (Narrow ILM/HS)
Processor
Heatsink
Technology
ΨCA2
12-core 130W (1U)
0.331
12-core 115W (1U)
0.322
10-core 130W (1U)
0.346
8-core 130W (1U)
0.352
10-core 115W (1U)
0.339
10-core 95W (1U)
8-core 95W (1U)
TLA1
(oC)
(oC/W)
Airflow3
(CFM)
Delta P
inch of
H2O (Pa)
Heatsink
Volumetric4
(mm)
0.337
Cu Base, Al
Fins (Cu-Al)
0.337
10-core 70W (1U)
0.329
6-core 95W (1U)
0.358
4-core 95W (1U)
0.358
6-core 80W (1U)
0.350
4-core 80W (1U)
0.350
6-core 60W (1U)
0.334
43
14
0.347
70x106x25.5
Notes:
1.
Local ambient temperature of the air entering the heatsink.
2.
Max target (mean + 3 sigma) for thermal characterization parameter (Section 5.3.2).
3.
Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches
H2O.
4.
Dimensions of heatsink do not include socket or processor.
General note: All heatsinks are Non-Direct Chassis Attach (DCA).
Document Number: 326512-003
49
Thermal Solutions
Figure 5-3.
1U Narrow Heatsink Performance Curves Using Socket-LGA2011-0 TTV
Table 5-8.
Performance Curve Data
Design Type
1U Cu/Al
σ
0.006
α
0.151
β
1.254
γ
0.874
A
B
5.12E-04
1.76E-02
Airflow
(CFM)
14
Equation 5-3.
Ψca ( mean ) = α + βx ( CFM ) – γ
Equation 5-4.
ΔP = Ax ( CFM ) 2+ Bx ( CFM )
5.1.3
Reference Heatsink Assembly
The assembly process for the reference heatsink begins with application of PCM45F TIM
to improve conduction from the IHS. The recommended TIM to ensure full coverage of
the IHS is 35x35 mm square with a thickness of 0.25 mm.
Next, position the heatsink such that the heatsink fins are parallel to system airflow.
While lowering the heatsink onto the IHS, align the four captive screws of the heatsink
to the four threaded studs on the ILM frame.
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Using a #2 Phillips driver, torque the four captive screws to 9 inch-pounds ±1 inchpound.
Fastener sequencing (starting the threads on all four screws before torquing), may
mitigate against cross-threading.
Compliance to Board Keepout Zones in Appendix A is assumed for this assembly
process.
Square ILM/Heatsink assembly shown below in Figure 5-4. Narrow ILM/Heatsink
assembly shown below in Figure 5-5.
Figure 5-4.
Reference Square ILM/Heatsink Assembly
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Thermal Solutions
Figure 5-5.
Reference Narrow ILM/Heatsink Assembly
1U Narrow Heatsink
Independent Loading Mechanism
(ILM) with Load Plate
Processor Package
LGA2011 Socket
Motherboard
Backplate with Insulator
5.2
Structural Considerations
Mass of the reference heatsink and the target mass for heatsinks does not exceed
550 g (Server segment).
From Table 4-3, the Dynamic Compressive Load of 540N[121 lbf] max allows for
designs that exceed 550 g[1.21lb] as long as the dynamic load does not exceed
540N[121 lbf]. The Static Compressive Load (Table 4-3) should also be considered in
dynamic assessments.
The heatsink limit of 550 g[1.21lb] and use of ILM Frame have eliminated the need for
Direct Chassis Attach retention (as used with previous Intel® Xeon® processors using
socket LGA771).
Placement of board-to-chassis mounting holes also impacts board deflection and
resultant socket solder ball stress. Customers need to assess shock for their designs as
their heatsink retention, heatsink mass and chassis mounting holes may vary.
5.3
Thermal Design Guidelines
Additional information regarding processor thermal features is contained in the
appropriate datasheet.
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Document Number: 326512-003
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5.3.1
Intel® Turbo Boost Technology
Intel® Turbo Boost Technology available on certain processor SKUs, opportunistically,
and automatically, allows the processor to run faster than the marked frequency if the
part is operating below its power, temperature and current limits.
Heatsink performance (lower ΨCA as described in Section 5.3.2) is one of several
factors that can impact the amount of Intel Turbo Boost Technology frequency benefit.
Intel Turbo Boost Technology performance is also constrained by ICC, and VCC limits.
Increased IMON accuracy may provide more Intel Turbo Boost Technology benefit on
TDP limited applications, as compared to lower ΨCA, as temperature is not typically the
limiter for these workloads. Voltage Regulator Module (VRM) and Enterprise Voltage
Regulator-Down (EVRD) 12.0 Design Guidelines
With Intel Turbo Boost Technology enabled, the processor may run more consistently at
higher power levels (but still within TDP), and be more likely to operate above
TCONTROL, as compared to when Intel Turbo Boost Technology is disabled. This may
result in higher acoustics.
5.3.2
Thermal Characterization Parameter
The case-to-local ambient Thermal Characterization Parameter (ΨCA) is defined by:
Equation 5-5.
ΨCA = (TCASE - TLA) / TDP
Where:
TCASE
=
TLA
=
TDP
=
Processor case temperature (°C). For TCASE specification see Intel®
Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
External Design Specification (EDS) - Volume One.
Average ambient temperature entering the processor heat sink fin
section (°C).
TDP (W) assumes all power dissipates through the integrated heat
spreader. This inexact assumption is convenient for heatsink design.
TTVs are often used to dissipate TDP. .
Equation 5-6.
ΨCA = ΨCS + ΨSA
Where:
ΨCS
=
ΨSA
=
Thermal characterization parameter of the TIM (°C/W) is dependent
on the thermal conductivity and thickness of the TIM.
Thermal characterization parameter from heatsink-to-local ambient
(°C/W) is dependent on the thermal conductivity and geometry of the
heatsink and dependent on the air velocity through the heatsink fins.
Figure 5-6 illustrates the thermal characterization parameters.
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53
Thermal Solutions
Figure 5-6.
Processor Thermal Characterization Parameter Relationships
5.3.3
Fan Speed Control
In server platforms, processors often share airflow provided by system fans with other
system components such as chipset, memory and hard drives. As such, the thermal
control features in chipset, memory and other components not covered in this
document, should influence system fan speed control to reduce fan power consumption
and help systems meet acoustic targets.
The addition of thermal sensors placed in the system (for example, on front panel or
motherboard) to augment internal device sensors (for example, in processor, chipset
and memory) will improve the ability to implement need-based fan speed control. The
placement of system sensors in cooling zones, where each zone has dedicated fan(s),
can improve the ability to tune fan speed control for optimal performance and/or
acoustics.
System events such as fan or power supply failure, device events such as TCC
Activation or THERMTRIP, and maintenance events such as hot swap time allowance,
need to be comprehended to implement appropriate fan speed control to prevent
undesirable performance or loss of data.
Tcontrol and its upper and lower limits defined by hysteresis, can be used to avoid fan
speed oscillation and undesirable noise variations.
5.3.4
Thermal Features
More information regarding processor thermal features is contained in the appropriate
datasheet.
5.3.4.1
TCONTROL and DTS Relationship
Improved acoustics and lower fan power can be achieved by understanding the
TCONTROL and DTS relationship, and implementing fan speed control accordingly.
54
Document Number: 326512-003
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Table 5-9.
TCONTROL and DTS Relationship
Condition
5.3.4.2
Fan Speed Control
DTS ≤ TCONTROL
Adjust fan speed to maintain DTS ≤ TCONTROL.
DTS > TCONTROL
Adjust fan speed to keep TCASE at or below the TCASE based thermal profile in the
EDS, or adjust fan speed to keep DTS at or below the DTS based thermal profile in
the EDS.
Sign Convention and Temperature Filtering
Digital Thermal Sensor (DTS) and Tcontrol are relative die temperatures offset below
the Thermal Control Circuit (TCC) activation temperature. As such, negative sign
conventions are understood. While DTS and Tcontrol are available over PECI and MSR,
use of these values in fan speed control algorithms requires close attention to sign
convention. See Table 5-10 for the sign convention of various sources.
Table 5-10. Sign Convention
MSR (BWG)
PECI (EDS)
DTS
(+) using
PACKAGE_THERM_STATUS (22:16,
Digital Readout)
(-) using GetTemp()
TCONTROL
(+) using TEMPERATURE_TARGET
(15:8, Temperature Control Offset)
(+) using Temperature Target Read
from RdPkgConfig()
Where a positive (+) sign convention is shown in Table 5-10, no sign bit is actually
assigned, so writers of firmware code may mistakenly assign a positive sign convention
in firmware equations. As appropriate, a negative sign should be introduced.
Where a negative (-) sign convention is shown in Table 5-10, a sign bit is assigned, so
firmware code will read a negative sign convention in firmware equations, as desired.
DTS obtained thru MSR (PACKAGE_THERM_STATUS) is an instantaneous value. As
such, temperature readings over short time intervals may vary considerably using this
MSR. For this reason, DTS obtained thru PECI GetTemp() may be preferred since
temperature filtering will provide the thermal trend.
5.3.5
Tcontrol Relief
Factory configured TCONTROL values are available in the appropriate Dear Customer
Letter or may be extracted by issuing a Mailbox or an RDMSR instruction. See the
appropriate datasheet for more information.
Due to increased thermal headroom based on thermal characterization on the latest
processors, customers have the option to reduce TCONTROL to values lower than the
factory configured values.
In some situations, use of TCONTROL Relief can reduce average fan power and improve
acoustics. There are no plans to change Intel's specification or the factory configured
TCONTROL values on individual processors.
To implement this relief, customers must re-write code to set TCONTROL to the reduced
values provided in the table below. Implementation is optional. Alternately, the factory
configured TCONTROL values can still be used, or some value between factory configured
and Relief. Regardless of TCONTROL values used, BIOS needs to identify the processor
type.
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Thermal Solutions
Table 5-11. TCONTROL Relief for E5-1600/E5-2600/E5-4600 v1 Product Families
TDP, # Core
TCONTROL Relief
Max Core Frequency
Factory Configured
150W 8C
-6
3.10 GHz or Lower
-10
135W 8C
-6
2.90 GHz or lower
-10
130W 8C
NONE
-6
130W 6C
NONE
-6
130W 8C, 1S
-6
3.30 GHz or lower
-10
115W 8C
-6
2.60 GHz or lower
-10
95W 8C
-6
2.40 GHz or lower
-10
95W 6C
-6
2.50 GHz or lower
-10
70W 8C
-6
1.80 GHz or lower
-10
60W 6C
-6
2.00 GHz or lower
-10
130W 4C, 1S
NONE
3.60 GHz
-18
130W 4C, 1S
-6
3.00 GHz or lower
-10
130W 4C
-6
3.30 GHz or lower
-8
95W 4C, 4S
-6
2.00 GHz or lower
-10
80W 4C
-6
2.40 GHz or lower
-10
80W 2C
-6
3.00 GHz or lower
-10
Notes:
1. Unless otherwise specified, Relief values apply to 2-socket and 4-socket SKUs. 1S = 1-socket, 4S = 4-socket.
2. Relief values do not apply to Embedded (NEBS) SKUs.
Implementation of TCONTROL Relief above maintains Intel standards of reliability (based
on modeling of the Intel Reference Design). Thermal Profile still applies. If PECI >=
TCONTROL Relief, then the temperature must meet the TCASE or the DTS based Thermal
Profile.
In some cases, use of Tcontrol Relief as the trigger point for fan speed control may
result in excessive TCC activation. To avoid this, the adjusted trigger point for fan
speed control (FSC) is defined as:
Tcontrol_FSC = - TCONTROL + Tcontrol_offset
Tcontrol_offset must be chosen such that Tcontrol_FSC < Tcontrol Relief. As such,
Tcontrol_FSC is an earlier trigger point for fan speed control, as compared to Tcontrol
Relief, and can be interpreted as overcooling. When overcooling to Tcontrol_FSC,
margin as defined in Section 5.5.3 and Section 5.5.6 can be ignored. As compared to
cooling to Tcontrol Relief, overcooling to Tcontrol_FSC:
• May increase frequency benefit from Intel Turbo Boost Technology as defined in
Section 5.3.1.
• Will increase acoustics
• May result in lower wall power
Customers must characterize a Tcontrol_offset value for their system to meet their
goals for frequency, acoustics and wall power.
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For for E5-1600/E5-2600/E5-4600 v2 Product Families, Tcontrol_offset is
programmable in the processor. For more information, see the Digital Thermal Sensor
(DTS) Based Thermal Specifications and Overview.
5.3.6
Short Duration TCC Activation and Catastrophic Thermal
Management for Intel® Xeon® Processor E5-1600/2600 /
4600 v1 and v2 Product Families
Systems designed to meet thermal capacity may encounter short durations of
throttling, also known as TCC activation, especially when running nonsteady processor
stress applications. This is acceptable and is functionally within the intended
temperature control parameters of the processor. Such short duration TCC activation is
not expected to provide noticeable reductions in application performance, and is
typically within the normal range of processor to processor performance variation.
Normal amounts of TCC activation occur at PECI values less than -0.25. Such
occurrences may cause utilities or operating systems to issue error logs.
PECI = -0.25 indicates a catastrophic thermal failure condition in all studies conducted.
As such, to help prevent loss of data, a soft shutdown can be initiated at PECI = -0.25.
Since customer designs, boundary conditions, and failure scenarios differ, this guidance
should be tested in the customer's system to prevent loss of data during shutdown.
PECI command GetTemp() can be used to obtain non-integer PECI values. Similar
guidance is expected to be available for Intel® Xeon® Processor E5-1600/E5-2600/E54600 Product Family v2 processors.
5.4
Absolute Processor Temperature and Thermal
Excursion
Intel does not test any third party software that reports absolute processor
temperature. As such, Intel cannot recommend the use of software that claims this
capability. Since there is part-to-part variation in the TCC (thermal control circuit)
activation temperature, use of software that reports absolute temperature can be
misleading.
See the appropriate External Design Specification (EDS) for details regarding use of
TEMPERATURE_TARGET register to determine the minimum absolute temperature at
which the TCC will be activated and PROCHOT# will be asserted.
Under fan failure or other anomalous thermal excursions, Tcase may exceed the
thermal profile for a duration totaling less than 360 hours per year without affecting
long term reliability (life) of the processor. For more typical thermal excursions,
Thermal Monitor is expected to control the processor power level as long as conditions
do not allow the Tcase to exceed the temperature at which Thermal Control Circuit
(TCC) activation initially occurred. Under more severe anomalous thermal excursions
when the processor temperature cannot be controlled at or below this Tcase level by
TCC activation, then data integrity is not assured. At some higher threshold,
THERMTRIP_N will enable a shut down in an attempt to prevent permanent damage to
the processor. Thermal Test Vehicle (TTV) may be used to check anomalous thermal
excursion compliance by ensuring that the processor Tcase value, as measured on the
TTV, does not exceed Tcase_max at the anomalous power level for the environmental
condition of interest. This anomalous power level is equal to 75% of the Thermal
Design Power (TDP) limit.
Document Number: 326512-003
57
Thermal Solutions
This guidance can be applied to 150W, 135W, 130W, 115W, 95W, 80W, 70W, 60W
Standard or Basic SKUs in the Intel® Xeon® processor E5-1600/E5-2600/E5-4600 v1
product families. Similar guidance is expected to be available for E5-1600/E5-2600/E54600 v2 product families.
5.5
DTS Based Thermal Specification
Note:
This section only applies to Intel® Xeon® Processor E5-1600/2600/4600 v1 Product
Families.
5.5.1
Implementation
Processor heatsink design must still comply with the Tcase based thermal profile
provided in section 5.1 of the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 v1
Product Families Datasheet - Volume One. Heatsink design compliance can be
determined with thermocouple and TTV as with previous processors.
The heat sink is sized to comply with the Tcase based thermal profile. Customers have
an option to either follow processor based Tcase spec or follow the DTS based thermal
specification. In some situations, implementation of DTS based thermal specification
can reduce average fan power and improve acoustics as compared to the Tcase based
thermal profile.
When all cores are active, a properly sized heatsink will be able to meet the DTS based
thermal specification. When all cores are not active or when Intel Turbo Boost
Technology is active, attempting to comply with the DTS based thermal specification
may drive system fans to increased speed. In such situations, the TCASE temperature
will be below the TCASE based thermal profile by design.
5.5.2
Considerations for Intel® Xeon® Processor E5-1600/E52600/E5-4600 v2 Product Family Processors
The Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 v2 Product Famiy processor
will have new capabilities as compared to the Intel Xeon Processor E5-1600/E52600/E5-4600 v1 Product Family. For example, the v2 processor has a new Package
Configuration Space (PCS) command to read margin (M) from the processor:
RdPkgConfig(), Index 10. For the Intel Xeon Processor E5-1600/E5-2600/E5-4600
Product Family v1, margin (M) must be calculated in firmware. In the following
sections, implementation details specified for the Intel Xeon Processor E5-1600/E52600/E5-4600 v1 Product Family can also be used for the Intel® Xeon® Processor E51600/E5-2600/E5-4600 v2 Product Family processor.
For more information regarding the differences between the Intel® Xeon® Processor
E5-1600/E5-2600/E5-4600 v1 Product Family and the Intel® Xeon® Processor E51600/E5-2600/E5-4600 v2Product Family see the Platform Digital Thermal Sensor
(DTS) Based Thermal Specifications and Overview.
5.5.3
DTS Based Thermal Profile, Tcontrol and Margin for the
Intel Xeon Processor E5-1600/E5-2600/E5-4600 v1
Product Family
Calculation of the DTS based thermal specification is based on both Tcontrol and the
DTS Based Thermal Profile (TDTS):
TDTS = min[TLA + Ψpa * P * F, TEMPERATURE_TARGET [23:16] - Tcc_Offset]
58
Document Number: 326512-003
Thermal Solutions
Where TLA and Ψpa are the intercept and slope terms from the TDTS equations in section
5.1 of the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 v1 Product Families
Datasheet - Volume One. To implement the DTS based thermal specification, these
equations must be programmed in firmware. Since the equations differ with processor
SKU, SKUs can be identified by TDP, Core Count, and a profile identifier (CSR bits). For
associated commands, see Platform Digital Thermal Sensor (DTS) Based Thermal
Specifications and Overview.
Power (P) is calculated in Section 5.5.4. As power dynamically changes, the
specification also changes, so power and TDTS calculations are recommended every 1
second.
Correction factor (F) compensates for the error in power monitoring. The current
estimate for F is 0.95.
The Tcontrol portion of the DTS based thermal specification is a one time calculation:
Tcontrol_spec = TEMPERATURE_TARGET [23:16] - Tcontrol + Tcontrol_offset
Tcontrol is defined in Section 5.3.3. Tcontrol_offset is defined in Section 5.3.5
The final DTS based thermal specification is the maximum of both:
TDTS_max = max[Tcontrol_spec , TDTS]
The margin (M) between the actual die temperature and the DTS based thermal
specification is used in the fan speed control algorithm. When M < 0, increase fan
speed. When M > 0, fan speed may decrease.
M = TDTS_max - Tsensor
OR
M = TDTS_ave – Tsensor
Tsensor represents the absolute temperature of the processor as power changes:
Tsensor = TEMPERATURE_TARGET [23:16] + DTS
TDTS_ave is defined in Section 5.5.5.
TEMPERATURE_TARGET [23:16], the temperature at which the processor thermal
control circuit activates, is a one time PECI readout: RdPkgConfig(), Temperature
Target Read, 23:16.
DTS, the relative temperature from thermal control circuit activation, is negative by
definition, and changes instantaneously. DTS command info is given in Section 5.3.3.
5.5.4
Power Calculation for the Intel Xeon Processor E51600/E5-2600/E5-4600 v1 Product Family
To implement DTS based thermal specification, average power over time must be
calculated:
P = (E2 - E1) / (t2 - t1)
Where:
t1 = time stamp 1
t2 = time stamp 2
E1 = Energy readout at time t1
E2 = Energy readout at time t2
Document Number: 326512-003
59
Thermal Solutions
The recommended time interval between energy readings is 1 second. This helps
ensure the power calculation is accurate by making the error between time stamps
small as compared to the duration between time stamps.
For details regarding energy readings, see Platform Digital Thermal Sensor (DTS)
Based Thermal Specifications and Overview.
5.5.5
Averaging the DTS Based Thermal Specification for the
Intel Xeon E5-1400/E5-2600/E5-4600 v1 Product Family
Averaging the DTS Based Thermal Specification helps keep the rate of change of the
temperature specification on the same scale as the actual processor temperature, and
helps avoid rapid changes in fan speed when power changes rapidly.
An exponential average of the specification can be calculated using a two time constant
model:
TDTS_f = αf x Δt x TDTS_max + TDTS_f_previous x (1- αf x Δt)
TDTS_s = αs x Δt x TDTS_max + TDTS_s_previous x (1- αs x Δt)
TDTS_ave = C x TDTS_f x (1-C) x TDTS_s
Where:
TDTS_max is the instantaneous spec
TDTS_f and TDTS_s are the fast and slow time averages
TDTS_ave is the final two time constant average specification
αf and αs are the time constant coefficients
C is a scale factor
Δt is the scan rate and is recommended to be approximately 1 second
Table 5-12 below shows the initial coefficients recommended for averaging. These
values may change per processor SKU. Customers should tune these coefficients based
on their thermal solutions.
Table 5-12. Averaging Coefficients
Heatsink
Performance
5.5.6
αf (1/s)
αs (1/s)
C
Low
1.0
0.04
0.30
Based on typical processor
Medium
1.0
0.07
0.30
Based on typical processor
High
1.0
0.10
0.40
Based on typical processor
Comment
Capabilities for the Intel® Xeon® Processor E5-1600/E52600/E5-4600 v2 Product Family
For Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 v2 Product Family, the
intercept and slope terms from the TDTS equations (TLA, Ψpa), as defined in
Section 5.5.3, are stored in the processor. This allows margin (M) to be reported by the
processor. The PECI command for margin (M) will be RdPkgConfig(), Index 10.
M < 0; gap to spec, fan speed must increase
M > 0; margin to spec, fan speed may decrease
Use of RdPkgConfig(), Index 10 with the Intel Xeon E5-1600/E5-2600/E5-4600 v1
Product Family will return an illegal command.
60
Document Number: 326512-003
Thermal Solutions
For Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Family v2, coefficients
(αf, αs), scale factor (C), and correction factor (F) will be factory configured.
Document Number: 326512-003
61
Thermal Solutions
62
Document Number: 326512-003
Quality and Reliability Requirements
6
Quality and Reliability
Requirements
6.1
Use Conditions
Intel evaluates reliability performance based on the use conditions (operating
environment) of the end product by using acceleration models.
The use condition environment definitions provided in Table 6-1 and Table 6-2 are
based on speculative use condition assumptions, and are provided as examples only.
Based on the system enabling boundary condition, the solder ball temperature can vary
and needs to be comprehended for reliability assessment.
Table 6-1.
Server Use Conditions Environment (System Level)
Use Environment
Speculative Stress
Condition
Example Use
Condition
Example 7-Yr
Stress Equiv.
Example 10-Yr
Stress Equiv.
Slow small internal
gradient changes due
to external ambient
(temperature cycle
or externally heated)
Fast, large gradient
on/off to max
operating temp.
(power cycle or
internally heated
including power save
features)
Temperature Cycle
ΔT = 35 - 44°C
(solder joint)
550-930 cycles
Temp Cycle
(-25°C to 100°C)
780-1345 cycles
Temp Cycle
(-25°C to 100°C)
High ambient
moisture during lowpower state
(operating voltage)
THB/HAST
T = 25 –30°C
85%RH
(ambient)
110-220 hrs at
110°C 85%RH
145-240 hrs at
110°C 85%RH
High Operating
temperature and
short duration high
temperature
exposures
Bake
T = 95 - 105°C
(contact)
700 – 2500 hrs at
125°C
800 – 3300 hrs at
125°C
Document Number: 326512-003
63
Quality and Reliability Requirements
Table 6-2.
Server Use Conditions Environment (System Level)
Use
Environment
Shipping and
Handling
Example Use
Condition
Speculative Stress Condition
Mechanical Shock
• System-level
• Unpackaged
• Trapezoidal
• 25 g
• velocity change is based on packaged weight
Product Weight (lbs)
Total of 12 drops per
system:
• 2 drops per axis
• ± direction
Non-palletized Product Velocity
Change (in/sec)
< 20 lbs
20 to > 40
40 to > 80
80 to < 100
100 to < 120
≥120
250
225
205
175
145
125
Change in velocity is based upon a 0.5 coefficient of restitution.
Shipping and
Handling
6.2
Total per system:
• 10 minutes per axis
• 3 axes
Random Vibration
• System Level
• Unpackaged
• 5 Hz to 500 Hz
• 2.20 g RMS random
• 5 Hz @ 0.001 g2/Hz to 20 Hz @ 0.01 g2/Hz (slope up)
• 20 Hz to 500 Hz @ 0.01 g2/Hz (flat)
• Random control limit tolerance is ± 3 dB
Intel Reference Component Validation
Intel tests reference components individually and as an assembly on mechanical test
boards and assesses performance to the envelopes specified in previous sections by
varying boundary conditions.
While component validation shows a reference design is tenable for a limited range of
conditions, customers need to assess their specific boundary conditions and perform
reliability testing based on their use conditions.
Intel reference components are also used in board functional tests to assess
performance for specific conditions.
6.2.1
Board Functional Test Sequence
Each test sequence should start with components (baseboard, heatsink assembly, and
so on) that have not been previously submitted to any reliability testing.
Prior to the mechanical shock & vibration test, the units under test should be
preconditioned for 72 hours at 45ºC. The purpose is to account for load relaxation
during burn-in stage.
The test sequence should always start with a visual inspection after assembly, and
BIOS/Processor/memory test. The stress test should be then followed by a visual
inspection and then BIOS/processor/memory test.
64
Document Number: 326512-003
Quality and Reliability Requirements
6.2.2
Post-Test Pass Criteria Examples
The post-test pass criteria examples are:
1. No significant physical damage to the heatsink and retention hardware.
2. Heatsink remains seated and its bottom remains mated flat against the IHS
surface. No visible gap between the heatsink base and processor IHS. No visible tilt
of the heatsink with respect to the retention hardware.
3. No signs of physical damage on baseboard surface due to impact of heatsink.
4. No visible physical damage to the processor package.
5. Successful BIOS/Processor/memory test of post-test samples.
6. Thermal compliance testing to demonstrate that the case temperature specification
can be met.
6.2.3
Recommended BIOS/Processor/Memory Test Procedures
This test is to ensure proper operation of the product before and after environmental
stresses, with the thermal mechanical enabling components assembled. The test shall
be conducted on a fully operational baseboard that has not been exposed to any
battery of tests prior to the test being considered.
Testing setup should include the following components, properly assembled and/or
connected:
• Appropriate system baseboard.
• Processor and memory.
• All enabling components, including socket and thermal solution parts.
The pass criterion is that the system under test shall successfully complete the
checking of BIOS, basic processor functions and memory, without any errors. Intel PC
Diags is an example of software that can be utilized for this test.
6.3
Material and Recycling Requirements
Material shall be resistant to fungal growth. Examples of non-resistant materials
include cellulose materials, animal and vegetable based adhesives, grease, oils, and
many hydrocarbons. Synthetic materials such as PVC formulations, certain
polyurethane compositions (for example, polyester and some polyethers), plastics
which contain organic fillers of laminating materials, paints, and varnishes also are
susceptible to fungal growth. If materials are not fungal growth resistant, then MILSTD-810E, Method 508.4 must be performed to determine material
performance.Cadmium shall not be used in the painting or plating of the socket.CFCs
and HFCs shall not be used in manufacturing the socket.
Any plastic component exceeding 25 gm should be recyclable per the European Blue
Angel recycling standards.
Supplier is responsible for complying with industry standards regarding environmental
care as well as with the specific standards required per Supplier's region. More
specifically, Supplier is responsible for compliance with the European regulations
related to restrictions on the use of Lead and Bromine containing flame-retardants.
Legislation varies by geography, European Union (RoHS/WEEE), China, California, and
so forth.
The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS
compliant.
Document Number: 326512-003
65
Quality and Reliability Requirements
Halogen flame retardant free (HFR-Free) PCB: In future revisions of this
document, Intel will be providing guidance on the mechanical impact to using a HFRfree laminate in the PCB. This will be limited to workstations.
Lead-free and Pb-free: Lead has not been intentionally added, but lead may still
exist as an impurity below 1000 ppm.
RoHS compliant: Lead and other materials banned in RoHS Directive are either
(1) below all applicable substance thresholds as proposed by the EU or (2) an
approved/pending exemption applies.
Note:
RoHS implementation details are not fully defined and may change.
§
66
Document Number: 326512-003
Mechanical Drawings
A
Mechanical Drawings
Table A-1 lists the Mechanical drawings included in this appendix.
Table A-1.
Mechanical Drawing List
Description
Figure
Square ILM Board Keepouts 1 of 4
Figure A-1
Square ILM Board Keepouts 2 of 4
Figure A-2
Square ILM Board Keepouts 3 of 4
Figure A-3
Square ILM Board Keepouts 4 of 4
Figure A-4
Narrow ILM Board Keepouts 1 of 4
Figure A-5
Narrow ILM Board Keepouts 2 of 4
Figure A-6
Narrow ILM Board Keepouts 3 of 4
Figure A-7
Narrow ILM Board Keepouts 4 of 4
Figure A-8
2U Square Heatsink Assembly Without TIM 1 of 2
Figure A-9
2U Square Heatsink Assembly Without TIM 2 of 2
Figure A-10
2U Square Heatsink Volumetric 1 of 2
Figure A-11
2U Square Heatsink Volumetric 2 of 2
Figure A-12
Heatsink Screw M4x0.7
Figure A-13
Heatsink Compression Spring
Figure A-14
Heatsink Retaining Ring
Figure A-15
Heatsink Delrin Spacer
Figure A-16
1U Square Heatsink Assembly 1 of 2
Figure A-17
1U Square Heatsink Assembly 2 of 2
Figure A-18
1U Square Heatsink Geometry 1 of 2
Figure A-19
1U Square Heatsink Geometry 2 of 2
Figure A-20
Heatsink Cup For Spring Retention
Figure A-21
1U Narrow Heatsink Assembly 1 of 2
Figure A-22
1U Narrow Heatsink Assembly 2 of 2
Figure A-23
1U Narrow Heatsink Geometry 1 of 2
Figure A-24
1U Narrow Heatsink Geometry 2 of 2
Figure A-25
Document Number: 326512-003
67
68
A
B
C
D
8
7
6
8
7
BALL 1 CORNER
POSITIONAL MARKING
(FOR REFERENCE ONLY)
93.0
MAX THERMAL
SOLUTION ENVELOPE AND
MECHANICAL PART CLEARANCE
2X FINGER
ACCESS 8
6
(51.0 )
SOCKET BODY OUTLINE
(FOR REFERENCE ONLY)
2X 46.0
SOCKET ILM
HOLE PATTERN
93.0
MAX THERMAL
SOLUTION ENVELOPE
AND MECHANICAL PART CLEARANCE
(FINGER ACCESS NOT INCLUDED)
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
5
5
3.8
4X
SOCKET ILM
MOUNTING HOLES
4
2X 69.2
SOCKET ILM
HOLE PATTERN
(58.5 )
SOCKET BODY OUTLINE
(FOR REFERENCE ONLY)
4
A
-
B
REV
DWG. NO
ZONE
SHT.
1
REV
DESCRIPTION
B
REVISION HISTORY
G11950
ADDED NOTE 8 FOR FURTHER CLARIFICATION
INITIAL RELEASE FOR FUTURE BOARD BUILDS DEVIATING FROM E59036.
CHANGED ZONE 4, UPDATED NOTES FOR CLARIFICATION.
ADDED A NEW ZONE 7 ON PRIMARY SIDE.
CHANGED ZONE 8 FOR UPDATED BACKPLATE.
REMOVED HEATSINK HOLE MOUNTING LOCATIONS
REMOVED LEVER FINGER ACCESS TABS OUTSIDE 93.5x93.5 SQUARE.
REDUCED MAX THERMAL RETENTION OUTLINE TO 93X93MM.
6 FOR ADDITIONAL DETAILS.
3
THIRD ANGLE PROJECTION
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MM
TOLERANCES:
.X ±
0.0 Angles ±
0.0 °
.XX ±
0.00
.XXX ±
0.000
06/30/10
DATE
06/30/10
DATE
D. LLAPITAN
DRAWN BY
D. LLAPITAN
CHECKED BY
N/A
MATERIAL
FINISH
N/A
APPROVED BY DATE
07/05/10
DATE
6
2
6
6
6
R
7
08/26/10
06/30/10
DL
-
APPR
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
5
1
DATE
D
SCALE: 1
G11950
1
DO NOT SCALE DRAWING SHEET 1 OF 4
SIZE DRAWING NUMBER
B
REV
LGA 2011 ENABLING KEEPOUT ZONES
TITLE
PTMI
DEPARTMENT
ZONE 7:
1.9 MM MAX COMPONENT HEGHT.
ZONE 6:
1.5 MM MAX COMPONENT HEIGHT.
ZONE 5:
1.6 MM MAX COMPONENT HEIGHT.
1.50 MM MAX (MMC) COMPONENT HEIGHT BEFORE REFLOW
ZONE 4:
1.67 MM MAX COMPONENT HEIGHT AFTER REFLOW 5
DESIGNED BY
NEAL ULEN
6
ZONE 3:
0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT,
NO ROUTE ZONE
ZONE 2:
7.2 MM MAX COMPONENT HEIGHT.
ZONE 1:
0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT,
SOCKET, ILM, AND FINGER ACCESS KEEPIN ZONE
LEGEND, SHEETS 1 & 2 ONLY
8 SIZE & HEIGHT OF FINGER ACCESS TO BE DETERMINED BY SYSTEM/BOARD ARCHITECT. THIS IS
ILM
MECHANICAL CLEARANCE ONLY AND FINGER AND/OR TOOL ACCESS SHOULD DETERMINED SEPERATELY.
7 ASSUMES PLACEMENT OF A 0805 CAPACITOR WITH DIMENSIONS:
- CAP NOMINAL HEIGHT = 1.25MM (0.049")
- COMPONENT MAX MATERIAL CONDITION HEIGHT NOT TO EXCEED 1.50MM.
6 ASSUMING A GENERIC A MAXIMUM COMPONENT HEIGHT ZONE.
CHOICE OF AND COMPONENT PLACEMENT IN THIS ZONE MUST INCLUDE:
- COMPONENT NOMINAL HEIGHT
- COMPONENT TOLERANCES
- COMPONENT PLACEMENT TILT
- SOLDER REFLOW THICKNESS
DO NOT PLACE COMPONENTS IN THIS ZONE THAT WILL EXCEED THIS MAXIMUM COMPONENT HEIGHT.
SEE NOTE
A HEIGHT RESTRICTION OF 0.0 MM REPRESENTS THE TOP (OR BOTTOM) SURFACE OF THE MOTHERBOARD
AS THE MAXIMUM HEIGHT. THIS IS A NO COMPONENT PLACEMENT ZONE INCLUDING SOLDER BUMPS.
UNLESS OTHERWISE NOTED ALL VIEW DIMENSION ARE NOMINAL. ALL HEIGHT RESTRICTIONS ARE
MAXIMUMS. NEITHER ARE DRIVEN BY IMPLIED TOLERANCES.
ALL ZONES DEFINED WITHIN THE 93.5 X 93.5 MM OUTLINE REPRESENT SPACE THAT RESIDES BENEATH
THE HEATSINK FOOTPRINT.
5 A HEIGHT RESTRICTION ZONE IS DEFINED AS ONE WHERE ALL COMPONENTS PLACED ON THE
SURFACE OF THE MOTHERBOARD MUST HAVE A MAXIMUM HEIGHT NO GREATER THAN THE HEIGHT
DEFINED BY THAT ZONE.
4. MAXIMUM OUTLINE OF SOCKET MUST BE PLACED SYMMETRIC TO THE ILM HOLE PATTERN FOR PROPER
ILM AND SOCKET FUNCTION.
3. SOCKET KEEP OUT DIMENSIONS SHOWN FOR REFERNCE ONLY.
2. DIMENSIONS STATED IN MILLIMETERS AND DEFINE ZONES, THEY HAVE NO TOLERANCES ASSOCIATED
WITH THEM.
1. THIS DRAWING TO BE USED IN CORELATION WITH SUPPLIED 3D DATA BASE FILE. ALL DIMENSIONS AND
TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
NOTES:
3
A
B
C
D
Mechanical Drawings
Figure A-1. Square ILM Board Keepouts 1 of 4
Document Number: 326512-003
Mechanical Drawings
Figure A-2.
Square ILM Board Keepouts 2 of 4
Document Number: 326512-003
69
70
A
B
C
D
8
7
6
8
7
2X 5.0
4X R7.0
22.37
4.8
4X
NO ROUTE
ZONE THRU
ALL LAYERS
6
5
R1.00 TYP
5
AS VIEWED FROM SECONDARY
SIDE OF MAINBOARD
2X 23.40
14.0
71.5
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
4
4
2X 26.50
81.5
3
PTMI
DEPARTMENT
3
R
G11950
SHT.
3
REV
B
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
2
D
SCALE: 1.000
G11950
1
1
DO NOT SCALE DRAWING SHEET 3 OF 4
SIZE DRAWING NUMBER
ZONE 10:
NO COMPONENT PLACEMENT & NO ROUTE ZONE
ZONE 9:
1.8 MM MAX COMPONENT HEIGHT FOR SSI BLADES CONFIGURATION
* ALL OTHER FORM FACTORS DEPENDANT ON SYSTEM CONSTRAINTS.
ZONE 8:
NO COMPONENT PLACEMENT, STIFFENING PLATE CONTACT AREA
LEGEND, SHEET 3 ONLY
DWG. NO
B
REV
A
B
C
D
Mechanical Drawings
Figure A-3. Square ILM Board Keepouts 3 of 4
Document Number: 326512-003
8
7
6
Document Number: 326512-003
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
2
D
SHT.
4
REV
SIZE DRAWING NUMBER
G11950
G11950
B
1
A
B
8
7
TOP SURFACE OF MOTHERBOARD
81.50
4.38
PRIMARY SIDE
3D HEIGHT RESTRICTION ZONES
AND VOLUMETRIC SWEEPS OF LOADPLATE
AND LEVER OPENING/CLOSING
6
97.0° MIN
93.00
97.0° MIN
.03
4
93.0
3
PTMI
DEPARTMENT
SECONDARY SIDE
3D HEIGHT RESTRICTION ZONES
SCALE: 1.500
1
DO NOT SCALE DRAWING SHEET 4 OF 4
B
REV
A
B
C
R
DWG. NO
C
76.50
3
VOLUMETRIC SWEEPS FOR
LOADPLATE AND LEVERS
DURING OPENING AND CLOSING
D
4
D
5
5
Figure A-4.
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
Mechanical Drawings
Square ILM Board Keepouts 4 of 4
71
Mechanical Drawings
Figure A-5. Narrow ILM Board Keepouts 1 of 4
72
Document Number: 326512-003
Mechanical Drawings
Figure A-6.
Narrow ILM Board Keepouts 2 of 4
Document Number: 326512-003
73
Mechanical Drawings
Figure A-7. Narrow ILM Board Keepouts 3 of 4
74
Document Number: 326512-003
Mechanical Drawings
Figure A-8.
Narrow ILM Board Keepouts 4 of 4
Document Number: 326512-003
75
76
A
B
C
D
8
7
6
5
8
7
9
5
4
6
1
2
3
5
5
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
4
4
1
TOP
1
PART NUMBER
E86113-001
E91775-001
3
THIRD ANGLE PROJECTION
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5-1994
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
.X # 0.5
Angles
# 1.0 $
.XX # 0.25
.XXX # 0.127
ITEM NO
E95133-002
2
4
QTY
E95132-002
3
4
G13624-001
4
4
E75155-001
5
4
3
SHT.
1
REV
B
B
DATE
7/21/10
3/29/10
FINISH
2
SEE NOTES
DATE
SEE NOTES
-
-
MATERIAL
3/29/10
D. LLAPITAN
APPROVED BY
DATE
DATE
3/29/10
3/29/10
N. ULEN
N. ULEN
DRAWN BY
CHECKED BY
DATE
DESCRIPTION
PTMI
R
SCALE: 1.500
-
E95133
1
DO NOT SCALE DRAWING SHEET 1 OF 2
B
REV
APPROVED
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
1
ROMLEY 2U HS ASSEMBLY,
DIE CAST BASES ONLY
SIZE DRAWING NUMBER
D
TITLE
DEPARTMENT
PARTS LIST
ROMLEY 2U HS ASSEMBLY
ROMLEY 2U HS VOLUMETRIC
SPRING, COMPRESSION, PRELOADED
ROMLEY HS SCREW, M4 X 0.7
DELRIN RETAINER/SPACER
ROMLEY HS RETAINING RING
INSTALL E-RING SO BURR/PUNCH DIRECTION/SHARP
EDGE IS AWAY FROM DELRIN SPACER.
THE MARK CAN BE AN INK MARK, LASER MARK, PUNCH MARK
OR ANY OTHER PERMANENT MARK THAT IS READABLE AT 1.0X
MAGNIFICATION.
CRITICAL TO FUNCTION DIMENSION.
"RECOMMENDED SCREW TORQUE: 8 IN-LBF"
THIS DRAWING TO BE USED IN CORRELATION WITH
SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES
ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
PRIMARY DIMENSIONS STATED IN MILLIMETERS,
[BRACKETED] DIMENSIONS STATED IN INCHES.
CRITICAL TO FUNCTION DIMENSION.
ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994.
REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR
SOLVENTS AFTER FINAL ASSEMBLY.
PART NUMBER AND TORQUE SPEC MARK.
PLACE PART NUMBER AND TORQUE SPEC IN ALLOWABLE AREA,
EITHER SIDE OF PART WHERE SHOWN. BELOW PART NUMBER
CALLOUT, PLACE THE FOLLOWING TEXT:
DESIGNED BY
9
8
5
3.
4.
2.
1.
NOTES:
ROLLED PART TO -002
UPDATED VOLUMETRIC TO -002
UPDATED SCREW TO CLIENT VERSION
ADDED DELRIN SPACER TO ASSEMBLY
A
DESCRIPTION
REVISION HISTORY
E95133
RELEASE FOR SUPPLIER FEEDBACK, DIE CAST VER ONLY
REV
-
DWG. NO
ZONE
A
B
C
D
Mechanical Drawings
Figure A-9. 2U Square Heatsink Assembly Without TIM 1 of 2
Document Number: 326512-003
Document Number: 326512-003
A
B
C
D
8
7
6
5
8
SEE DETAIL
A
A
7
SECTION
A-A
6
A
5
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
(9.36
)
[0.369]
SPRING PRELOAD
ASSEMBLY HEIGHT
4
4
4
2
5
3
3
PTMI
DEPARTMENT
3
R
E95133
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
2
ASSEMBLY DETAILS
2
SCALE: 1.500
D
SHT.
B
E95133
1
1
DO NOT SCALE DRAWING SHEET 2 OF 2
1
DETAIL A
SCALE 10.000
REV
SIZE DRAWING NUMBER
9 E-RING PUNCH DIRECTION
AWAY FROM THIS SURFACE
DWG. NO
B
REV
A
B
C
D
Mechanical Drawings
Figure A-10. 2U Square Heatsink Assembly Without TIM 2 of 2
77
Mechanical Drawings
Figure A-11. 2U Square Heatsink Volumetric 1 of 2
78
Document Number: 326512-003
Document Number: 326512-003
A
B
C
D
8
7
6
5
8
80.00
[3.150]
9
38.00 #0.50
[1.496 #0.019 ]
A
7
A-A
9
80.00
[3.150]
38.00 #0.50
[1.496 #0.019 ]
SECTION
6
BOTTOM VIEW
FLATNESS ZONE,
SEE NOTE 7
0.077 [0.0030]
B
SEE DETAIL
5
AIRFLOW DIRECTION
A
C
SEE DETAIL
AIRFLOW DIRECTION
TOP VIEW
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
4
4
DETAIL B
SCALE 10.000
3
PTMI
+0.13
0
[
9
R
]
DWG. NO
E95132
2
0.1 [0.00] A B C
2
SCALE: 1.500
D
SHT.
REV
9
1
E95132
0.00 ORDINATE BASELINE
[0.000
]
1.00
[0.039 ]
4.50 #0.13
[0.177 #0.005 ]
BASE THICKNESS
5.50
[0.217 ]
B
1
DO NOT SCALE DRAWING SHEET 2 OF 2
SIZE DRAWING NUMBER
3.0 [0.118] X 45 $TYP
SEE NOTE 8
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
+0.13
0
+0.005
0.213
-0.000
5.40
0.5 x 45 $
ALL AROUND
9
-0.000 ]
[0.313 +0.005
7.95
10.450
[0.4114]
DETAIL C
SCALE 6.000
DEPARTMENT
3
B
REV
A
B
C
D
Mechanical Drawings
Figure A-12. 2U Square Heatsink Volumetric 2 of 2
79
80
A
B
C
D
8
7
6
5
8
0.5 X 45 $
R0.20
[0.008 ]
DETAIL A
SCALE 40.000
DETAIL B
SCALE 40.000
]
7
SEE DETAIL
CRITICAL INTERFACE FEATURE: 4
THIS SHOULDER MUST
BE SQUARE
[
B
+0.075
0
+0.002
0.128
-0.000
3.250
SEE DETAIL
6
A
5
8
0.40x45 $
4X 0.72
MIN.
[0.028]
TYPE 1, CROSS RECESSED
#2 DRIVER 6
A
6
A
3.50 #0.20
[0.138 #0.007 ]
5.100
[0.2008]
6
5
5
12.50 #0.13
[0.492 #0.005 ]
10.96
8
[0.43 ]
11.66 #0.13
[0.459 #0.005 ]
0.00
[0.000 ]
3.50
[0.138 ]
2X 4.06 #0.17
[0.160 #0.006 ]
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
5
5
8
3.96 #0.06
5
[0.156 #0.002 ]
MAJOR DIA,
M4 x 0.7 FULL LENGTH
TOLERANCE CLASS 6G
INNER CORNERS OF
E-RING GROOVE MUST
BE SQUARE,
R0.10 MAX
4
(5.58
)
[0.220]
6
5.10 #0.05
[0.201 #0.001 ]
5 7
2.00 #0.32
[0.079 #0.012 ]
FOR REVIEW ONLY
4
B
T.AULT
APPROVED
5
3
THIRD ANGLE PROJECTION
FINISH
MATERIAL
2
SEE NOTES
FEB-02-10
SEE NOTES
DATE
DATE
CHECKED BY
FEB-02-10
FEB-02-10
A.VALPIANI
DATE
K.KOZYRA
T.AULT
FEB-02-10
K.KOZYRA
DRAWN BY
APPROVED BY
DATE
DESIGNED BY
M4 X 0.7 FULL LENGTH
EXTERNAL THREAD
TOLERANCE CLASS 6G
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5-1994
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
.X # .5
Angles
# 1.0 $
.XX # 0.25
.XXX # 0.127
5.10 #0.05
[0.201 #0.001 ]
7
(12.50 )
[0.492]
D
SCALE: 1
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
A
B
C
D
E91775
1
B
REV
M4 X 0.7, PHILLIPS #2
R
DO NOT SCALE DRAWING SHEET 1 OF 1
SIZE DRAWING NUMBER
SCREW,
TITLE
CPE/CMTE
DEPARTMENT
INSPECT SHAFT DIAMETER IN THESE LOCATIONS
K.KOZYRA
E-RING GROOVE DIMENSIONS SHALL CONFORM TO JIS B 2805 STANDARDS
THREAD FORMING SHALL CONFORM TO ASME B1.13M-2005 OR JIS X XXXX STANDARDS
APR-14-10
1
PHILLIPS PATTERN PER ASME B18.6.3-1998
FULL THREAD LENGTH GROOVE ADDED
DATE
FEB-02-10
8
9.
5
4.
3.
2.
SECTION A-A
6.00
[0.236]
7.80
[0.307]
REV
7
B
B-5
ORIGINAL RELEASE
1
6
A
-
SHT.
DESCRIPTION
REVISION HISTORY
E91775
THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED
3D DATABASE. ALL DIMENSIONS AND TOLERANCES ON THIS
DRAWING TAKE PRECEDENCE OVER SUPPLIED DATABASE.
PRIMARY DIMENSIONS STATED IN MILLIMETERS.
[BRACKETED] DIMENSIONS STATED IN INCHES.
MATERIAL: 18-8 STAINLESS STEEL; AISI 303, 304, 305; JIS SUS304;
OR EQUIVALENT. MINIMUM YIELD STRENGTH = 90,000 PSI.
TORQUE TO FAILURE SHALL BE NO LESS THAN 20 IN-LBF,
WITH A -3 SIGMA DISTRIBUTION
CRITICAL TO FUNCTION DIMENSION
REV
DWG. NO
ZONE
1.
NOTES:
3
Mechanical Drawings
Figure A-13. Heatsink Screw M4x0.7
Document Number: 326512-003
Document Number: 326512-003
A
B
C
D
8
7
6
5
8
SOLID HEIGHT
7
+0.30
0
4
[0.217 +0.011
-0.000 ]
5.50
A
A
6
FREE HEIGHT
5
12.70
4
[0.500]
FREE HEIGHT
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
1.100
[0.0433]
WIRE DIA.
4
SECTION
4
A-A
+0.08
-0.13
4
]
3
THIRD ANGLE PROJECTION
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5-1994
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
.X # .5
Angles
# 1.0 $
.XX # 0.25
.XXX # 0.127
[0.300 +0.003
-0.005 ]
O.D. 7.62
[
+0.08 4
-0.13
+0.003
0.213
-0.005
I.D. 5.42
3
SHT.
REV
C
SEE NOTE 3.
DATE
01/14/10
12/08/09
11/15/09
1
11/16/09
DATE
FINISH
D. LLAPITAN
APPROVED BY
MATERIAL
2
SEE NOTES
DATE
CHECKED BY
SEE NOTES
11/15/09
11/15/09
DATE
DATE
DRAWN BY
N. ULEN
DESIGNED BY
R
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
-
APPROVED
SCALE: 1
1
DO NOT SCALE DRAWING SHEET 1 OF 1
E86113
C
REV
SPRING, COMPRESSION, PRE-LOAD
SIZE DRAWING NUMBER
D
TITLE
EASD / PTMI
DEPARTMENT
THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED
3D DATABASE. ALL DIMENSIONS AND TOLERANCES ON THIS
DRAWING TAKE PRECEDENCE OVER SUPPLIED DATABASE.
PRIMARY DIMENSIONS STATED IN MILLIMETERS.
[BRACKETED] DIMENSIONS STATED IN INCHES.
SPRING RATE: K=15.80 +/- 1.5 N/MM [K=90.2 +/- 9.0 LBF/IN]
4
FREE HEIGHT: 12.7 MM [0.500 IN]
SOLID HEIGHT:
5.5 MM [0.217 IN]
WIRE DIAMETER: 1.1 MM [0.043 IN]
TOTAL COILS: 5.0 (ONLY TOTAL COILS SHOWN IN THIS DRAWING)
ACTIVE COILS: 3.0
ENDS: GROUND & CLOSED
TURN: LEFT HAND (AS SHOWN IN VIEWS)
MATERIAL: MUSIC WIRE, ASTM A228 OR JIS-G-3522
FINISH: ZINC PLATED
OTHER GEOMETRY: PER THIS DRAWING
CRITICAL TO FUNCTION DIMENSION
N. ULEN
4
3.
2.
1.
NOTES:
1
UPDATED SPRING STIFFNESS AND COIL INFO
ALL SPRING SPECIFICATIONS UPATED.
C
B
NOTE 3
A
DESCRIPTION
REVISION HISTORY
E86113
SUPPLIER FEEDBACK
REV
-
DWG. NO
ZONE
A
B
C
D
Mechanical Drawings
Figure A-14. Heatsink Compression Spring
81
82
A
B
C
D
8
7
6
5
8
7
[
3.20
5
6
0
-0.12
+0.000
0.126
-0.004
]
2.80 #0.30
[0.110 #0.011 ]
5
4X R0.50
MIN.
[0.020 ]
5
5
5.20 #0.10
MAX.
[0.205 #0.003 ]
7.00 #0.20
[0.276 #0.007 ]
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
4
4
0.60 #0.04
[0.0236 #0.0015 ]
5
3
THIRD ANGLE PROJECTION
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5-1994
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
.X # .5
Angles
# 1.0 $
.XX # 0.25
.XXX # 0.127
3
1
C
O.D. TOLERANCE +/-0.10 TO +/-0.20
SNAP DIAMETER 3.175 TO 3.20, PLUS TOLS
I.D. 5.18 TO 5.20
THICKNESS 0.64 +/-.05 TO 0.60 +/- .04
ADDED RING GAP DIMENSION 2.8 +/- 0.3
ADDED NOTE 6 FOR OFF THE SHELF COMPLIANCE
MODIFIED NOTE 5 TO INDICATE CTF MEASUREMENTS BE
TAKEN AFTER ONE (1) INSTALLATION
B
C
C6
NOTE 6
NOTE 5
11/18/09
07/07/09
06/19/09
DATE
1
2
SEE NOTES
FINISH
SEE NOTES
MATERIAL
DATE
CHECKED BY
DATE
06/19/09
06/19/09
DATE
C. HO
06/19/09
N. ULEN
APPROVED BY
DATE
N. ULEN
DRAWN BY
DEPARTMENT
SCALE: 1
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
E75155
1
DO NOT SCALE DRAWING SHEET 1 OF 1
SIZE DRAWING NUMBER
D
R
ROMLEY HS RETAINING RING
EASD / PTMI
TITLE
-
C
REV
APPROVED
MODULUS OF ELASTICITY >= 28000 KSI (193 GPA)
5
MATERIAL PROPERTIES MUST BE MET AFTER FINAL
E-RING MANUFACTURING PROCESS
FINISH: NI PLATED IF NOT STAINLESS
CRITICAL TO FUNCTION DIMENSION
CTF DIMENSIONS SHOULD BE VERIFIED AFTER ONE (1) INSTALLATION
AND REMOVAL FROM THE GROOVE GEOMETRY SPECIFIED IN DRAWING E86111.
E-RING SPECIFICATION JIS B 2805 APPLIES FOR OFF THE
SHELF COMPONENT COMPLIANCE.
THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED
3D DATABASE. ALL DIMENSIONS AND TOLERANCES ON THIS
DRAWING TAKE PRECEDENCE OVER SUPPLIED DATABASE.
PRIMARY DIMENSIONS STATED IN MILLIMETERS.
[BRACKETED] DIMENSIONS STATED IN INCHES.
MATERIAL: SPRING STEEL OR STAINLESS STEEL
YIELD STRENGTH >= 90000 PSI (620 MPA)
5
DESIGNED BY
6.
4.
5
3.
2.
1.
NOTES:
RELEASE FOR THERMAL TARGET SPECIFICATION
A
DESCRIPTION
REVISION HISTORY
E75155
-
REV
C5
B6
C5
B4
ZONE
A
B
C
D
Mechanical Drawings
Figure A-15. Heatsink Retaining Ring
Document Number: 326512-003
Document Number: 326512-003
3
4
.70
1.10
9.10
SECTION
A-A
CRITICAL TO FUNCTION DIMENSION (CTF).
5
6
PART MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001).
PART SHALL BE FREE OF OIL AND DEBRIS.
FINISH: UNSPECIFIED SURFACES MUST CONFORM WITH CLASS C REQUIREMENTS.
4.
3
.50 X 45 $
MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT.
ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL
PRODUCT SPECIFICATION (BS-MTN-0001).
A) DELRIN ACETAL RESIN. 500P NC010.
B) PIGMENT: EAGLE 7058 (1%)
C) COLOR: BLACK.
3.
NO GATING ALLOWED ON THESE COMPONENT MATING SURFACES.
INTERPRET DIMENSIONS PER ASME Y14.5M-1994.
FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD
DATABASE.
IF PROVIDED, MEASUREMENTS SHOULD REFERENCE DATUM
-A- PRIMARY,
DATUM -B- SECONDARY, AND -C- TERTIARY.
2.
6
REFERENCE DOCUMENTS
99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON
EHS WEBSITE - https://supplier.intel.com/static/EHS/)
.60
DISCLOSED IN CONFIDENCE AND ITS CONT
OR WRITTEN CONSENT OF INTEL CORPORAT
1.
NOTES; UNLESS OTHERWISE SPECIFIED:
ION CONFIDENTIAL INFORMATION. IT IS
SPLAYED OR MODIFIED, WITHOUT THE PRI
QTY
ENTS
ION.
THIRD ANGLE PROJECTION
FINISH
2
SEE NOTES
DATE
MATERIAL
SEE NOTES
7/21/10
DATE
CHECKED BY
APPROVED BY
7/21/10
D. LLAPITAN
DATE
7/21/10
DRAWN BY
PTMI
R
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
SCALE: 8.000
1
DO NOT SCALE DRAWING SHEET 1 OF 1
G13624
DELRIN RETAINER, SKT R
SIZE DRAWING NUMBER
C
TITLE
A
REV
C
D
A
A
N. ULEN
N. ULEN
DESCRIPTION
DEPARTMENT
PARTS LIST
DATE
DESIGNED BY
-
APPR
REV
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MM
TOLERANCES:
.X # .25 Angles
# .5 $
.XX # .20
.XXX # .125
5.40 #.10
DATE
7/21/10
1
RTNR, E-RING, DELRIN, SNB
6
1
SHT.
PART NUMBER
TOP G13624-001
A
A
RELEASE FOR SUPPLIER FEEDBACK
DESCRIPTION
REVISION HISTORY
G13624
ITEM NO
A
-
7.70 #.10
REV
ZONE
2
DWG. NO
A
B
C
D
4
THIS DRAWING CONTAINS INTEL CORPORAT
MAY NOT BE DISCLOSED, REPRODUCED, DI
Mechanical Drawings
Figure A-16. Heatsink Delrin Spacer
83
84
A
B
C
D
8
7
6
5
8
7
9
5
6
6
4
1
2
5
3
5
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
4
4
2
1
TOP
4
1
PART NUMBER
E97837-002
E86113-001
E91775-001
3
THIRD ANGLE PROJECTION
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5-1994
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
.X # 0.5
Angles
# 1.0 $
.XX # 0.25
.XXX # 0.127
ITEM NO
E97839-002
3
4
QTY
E97838-001
4
4
E75155-001
5
4
G13624-001
6
4
3
SHT.
B
1
REV
B
DATE
FINISH
2
PTMI
SCALE: 1.500
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
E97839
1
DO NOT SCALE DRAWING SHEET 1 OF 2
SIZE DRAWING NUMBER
D
TITLE
-
B
REV
APPROVED
ROMLEY 1U HS ASSEMBLY
DESCRIPTION
DEPARTMENT
PARTS LIST
SEE NOTES
DATE
SEE NOTES
-
MATERIAL
5/5/10
D. LLAPITAN
-
DATE
APPROVED BY
5/5/10
DATE
DRAWN BY
N. ULEN
5/5/10
N. ULEN
CHECKED BY
DATE
DESIGNED BY
ROMLEY 1U HS ASSEMBLY
ROMLEY 1U HS GEOMETRY
CUP, SPRING RETENTION, WITH SKIRT
SPRING, COMPRESSION, PRELOADED
ROMLEY HS SCREW, M4 X 0.7
ROMLEY HS RETAINING RING
R
INSTALL E-RING SO BURR/PUNCH DIRECTION/SHARP
EDGE IS AWAY FROM BASE CUP SURFACE.
ALLOWABLE PROTRUSION OF CUP FROM BASE.
9
DELRIN RETAINER/SPACER
CRITICAL TO FUNCTION DIMENSION.
8
10
MINIMUM PUSH OUT FORCE = 30 LBF PER CUP.
7
1
THE MARK CAN BE AN INK MARK, LASER MARK, PUNCH MARK
OR ANY OTHER PERMANENT MARK THAT IS READABLE AT 1.0X
MAGNIFICATION.
PRESS FIT BOTTOM OF CUP LIP FLUSH TO TOP SURFACE OF HEAT SINK.
"RECOMMENDED SCREW TORQUE: 8 IN-LBF"
THIS DRAWING TO BE USED IN CORRELATION WITH
SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES
ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
PRIMARY DIMENSIONS STATED IN MILLIMETERS,
[BRACKETED] DIMENSIONS STATED IN INCHES.
CRITICAL TO FUNCTION DIMENSION.
ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994.
REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR
SOLVENTS AFTER FINAL ASSEMBLY.
PART NUMBER AND TORQUE SPEC MARK.
PLACE PART NUMBER AND TORQUE SPEC IN ALLOWABLE AREA,
EITHER SIDE OF PART WHERE SHOWN. BELOW PART NUMBER
CALLOUT, PLACE THE FOLLOWING TEXT:
8/12/10
5/5/10
6
5
3.
4.
2.
1.
NOTES:
ROLLED ASSEMBLY TO -002
UPDATED CUP TO -002
UPDATED SCREW TO CLIENT VERSION
ADDED DELRIN SPACER TO ASSEMBLY
A
DESCRIPTION
REVISION HISTORY
E97839
INITIAL SUPPLIER RELEASE
REV
-
DWG. NO
ZONE
A
B
C
D
Mechanical Drawings
Figure A-17. 1U Square Heatsink Assembly 1 of 2
Document Number: 326512-003
Document Number: 326512-003
A
B
C
D
8
7
6
5
8
SEE DETAIL
A
A
7
SECTION
A-A
6
SEE DETAIL
A
B
5
(4X 9.36
)
[0.369]
SPRING PRELOAD
ASSEMBLY HEIGHT
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
6
DETAIL B
SCALE 6.000
5
3
4
4
2
SEE DETAIL
ASSEMBLY DETAILS
PRESS FIT DETAILS
4
C
3
PTMI
DEPARTMENT
1
DETAIL A
SCALE 6.000
3
R
10
[
0.039
+0.13
0
+0.005
-0.000
7
1.00
&
8
SHT.
]
E97839
REV
B
9 E-RING PUNCH DIRECTION
AWAY FROM THIS SURFACE
2
2
D
SCALE: 1.500
E97839
1
1
DO NOT SCALE DRAWING SHEET 2 OF 2
SIZE DRAWING NUMBER
DETAIL C
SCALE 30.000
E-RING ORIENTATION DETAILS
6
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
0.00 #0.35
[0.000 #0.013 ]
DWG. NO
B
REV
A
B
C
D
Mechanical Drawings
Figure A-18. 1U Square Heatsink Assembly 2 of 2
85
86
A
B
C
D
8
7
6
5
8
[
B
0
-0.25
+0.000
3.602
-0.009
91.50
C
]
7
]
TOP VIEW
[
+1.00
0
+0.039
-0.000
0.520
0
-0.25
+0.000
3.602
-0.009
91.50
[
4X 13.22
]
6
A
+1.00
0
+0.039
-0.000
0.472
]
SEE DETAIL
A
AIRFLOW DIRECTION
[
4X 12.00
5
21.00 #0.25
[0.827 #0.009 ]
9
71X 1.272
[0.0501]
FIN PITCH
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
DETAIL A
SCALE 5.000
4
71X 1.072
[0.0422]
FIN GAP
4
0.500 #0.250
[0.0197 #0.0098 ]
END GAP
BOTH SIDES OF HEATSINK
72X 0.200
[0.0079]
FIN THICKNESS
10
3
THIRD ANGLE PROJECTION
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5-1994
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
.X # .5
Angles
# 1.0 $
.XX # 0.25
.XXX # 0.127
3
SHT.
ADDED NOTE 10, CENTER FIN ARRAY
B
1
REV
B
DATE
5/5/10
DATE
FINISH
D. LLAPITAN
APPROVED BY
MATERIAL
2
SEE NOTES
DATE
CHECKED BY
SEE NOTES
5/5/10
5/5/10
DATE
DATE
DRAWN BY
DESIGNED BY
N. ULEN
N. ULEN
SEE NOTE 8
SCALE: 1
R
-
E97838
1
DO NOT SCALE DRAWING SHEET 1 OF 2
B
REV
APPROVED
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
1
ROMLEY 1U HS GEOMETRY
SIZE DRAWING NUMBER
D
TITLE
EASD / PTMI
DEPARTMENT
CENTER FIN ARRAY ON HEAT SINK BASE.
10
9
8.
7.
5.
6.
3.
4.
2.
THIS DRAWING TO BE USED IN CONJUNCTION WITH
SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES
ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
PRIMARY DIMENSIONS STATED IN MILLIMETERS,
[BRACKETED] DIMENSIONS STATED IN INCHES.
CRITICAL TO FUNCTION DIMENSION.
ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994.
BASE: COPPER, K=380 W/M-K MIN
FINS: QTY 72X 0.2 MM, ALUMINUM, K=220 W/M-K MIN
NA
REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR
SOLVENTS AFTER MACHINING AND FIN ASSEMBLY.
LOCAL FLATNESS ZONE .077 MM [0.003"] CENTERED ON
HEAT SINK BASE.
MECHANICAL STITCHING OR CONNECTION ALLOWED ON TOP SURFACE
OF HEATSINK TO INCREASE FIN ARRAY STRUCTURAL STABILITY,
OVERALL FIN HEIGHT MUST STILL BE MAINTAINED.
CRITICAL TO FUNCTION DIMENSION.
8/12/10
5/5/10
1.
NOTES:
INITIAL SUPPLIER RELEASE
A
-
DESCRIPTION
REVISION HISTORY
E97838
REV
DWG. NO
ZONE
A
B
C
D
Mechanical Drawings
Figure A-19. 1U Square Heatsink Geometry 1 of 2
Document Number: 326512-003
Document Number: 326512-003
A
B
C
D
8
7
6
5
8
80.00
[3.150]
9
9
]
38.00
[1.496]
A
0.10 [0.003] A B C
[
0
-0.06
+0.000
-0.002
0.368
9.35
7
A-A
9
80.00
[3.150]
38.00
[1.496]
SECTION
6
BOTTOM VIEW
1.00 [0.039] A B
FLATNESS ZONE,
SEE NOTE 7
0.077 [0.0030]
B
5
AIRFLOW DIRECTION
A
D
SEE DETAIL
SEE DETAIL
AIRFLOW DIRECTION
TOP VIEW
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
4
4
3
PTMI
DEPARTMENT
3
R
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
DETAIL B
SCALE 6.000
DETAIL D
SCALE 6.000
E97838
2
SHT.
2
SCALE: 1.500
D
REV
9
E97838
B
1
1
DO NOT SCALE DRAWING SHEET 2 OF 2
SIZE DRAWING NUMBER
4.50 #0.13
[0.177 #0.005 ]
BASE THICKNESS
3.0 [0.118] X 45 $
ALL FINS
DWG. NO
B
REV
A
B
C
D
Mechanical Drawings
Figure A-20. 1U Square Heatsink Geometry 2 of 2
87
88
A
B
C
D
8
7
6
5
8
4
4.500
[0.1772 ]
0.000
[0.0000 ]
1.000
[0.0394 ]
A
A
7
6
5
5.50
[0.217 ]
4.50
[0.177 ]
0.000
[0.000 ]
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
4
0.372
4
A-A
+0.06
0
+0.002
-0.000
4
SECTION
[
+0.13
0
+0.005
-0.000
4
0.213
9.45
[
+0.13
0
+0.005
-0.000
0.313
5.40
[
7.95
[
+0.06
0
+0.002
0.411
-0.000
10.45
4
]
]
]
]
0.5 x 45 $TYP.
3
THIRD ANGLE PROJECTION
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5-1994
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
.X # .5
Angles
# 1.0 $
.XX # 0.25
.XXX # 0.127
3
SHT.
B
1
REV
B
DATE
5/5/10
DATE
5/5/10
DATE
FINISH
CHECKED BY
D. LLAPITAN
APPROVED BY
MATERIAL
2
SEE NOTES
5/5/10
N. ULEN
SEE NOTES
DATE
N. ULEN
DRAWN BY
DEPARTMENT
D
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
-
E97837
1
B
REV
APPROVED
DO NOT SCALE DRAWING SHEET 1 OF 1
SIZE DRAWING NUMBER
SCALE: 1
R
1
CUP, SPRING RETENTION
EASD / PTMI
TITLE
DATE
5/5/10
8/12/10
THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED
3D DATABASE. ALL DIMENSIONS AND TOLERANCES ON THIS
DRAWING TAKE PRECEDENCE OVER SUPPLIED DATABASE.
PRIMARY DIMENSIONS STATED IN MILLIMETERS.
[BRACKETED] DIMENSIONS STATED IN INCHES.
MATERIAL: SUS301, 304, 430
CRITICAL TO FUNCTION DIMENSION
DESIGNED BY
3.
4
2.
1.
NOTES:
ROLLED PART TO -002
REMOVED SKIRT AND MADE SHORTER
A
DESCRIPTION
REVISION HISTORY
E97837
INITIAL SUPPLIER RELEASE
REV
-
DWG. NO
ZONE
A
B
C
D
Mechanical Drawings
Figure A-21. Heatsink Cup For Spring Retention
Document Number: 326512-003
Document Number: 326512-003
A
B
C
D
8
7
6
5
8
7
5
6
9
6
4
1
2
5
3
5
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
4
4
2
1
TOP
4
1
PART NUMBER
E97837-002
E86113-001
E91775-001
3
THIRD ANGLE PROJECTION
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5-1994
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
.X # 0.5
Angles
# 1.0 $
.XX # 0.25
.XXX # 0.127
ITEM NO
E95474-002
3
4
QTY
E95465-001
4
4
E75155-001
5
4
G13624-001
6
4
3
SHT.
1
REV
B
DATE
3/23/10
DATE
DRAWN BY
N. ULEN
CHECKED BY
FINISH
MATERIAL
2
SEE NOTES
DATE
SEE NOTES
-
APPROVED BY
3/23/10
3/23/10
N. ULEN
C. HO
DATE
DESIGNED BY
PTMI
SCALE: 1.500
E95474
1
DO NOT SCALE DRAWING SHEET 1 OF 2
SIZE DRAWING NUMBER
D
TITLE
ROMLEY 1U NARROW
HS ASSEMBLY
DESCRIPTION
DEPARTMENT
PARTS LIST
ROMLEY 1U NARROW HS ASSEMBLY
ROMLEY 1U NARROW HS GEOMETRY
CUP, SPRING RETENTION
SPRING, COMPRESSION, PRELOADED
ROMLEY HS SCREW, M4 X 0.7
ROMLEY HS RETAINING RING
-
B
REV
APPROVED
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
INSTALL E-RING SO BURR/PUNCH DIRECTION/SHARP
EDGE IS AWAY FROM BASE CUP SURFACE.
ALLOWABLE PROTRUSION OF CUP FROM BASE.
R
CRITICAL TO FUNCTION DIMENSION.
9
DELRIN RETAINER/SPACER
MINIMUM PUSH OUT FORCE = 30 LBF PER CUP.
8
10
THE MARK CAN BE AN INK MARK, LASER MARK, PUNCH MARK
OR ANY OTHER PERMANENT MARK THAT IS READABLE AT 1.0X
MAGNIFICATION.
PRESS FIT BOTTOM OF CUP LIP FLUSH TO TOP SURFACE OF HEAT SINK.
1
7
"RECOMMENDED SCREW TORQUE: 8 IN-LBF"
THIS DRAWING TO BE USED IN CORRELATION WITH
SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES
ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
PRIMARY DIMENSIONS STATED IN MILLIMETERS,
[BRACKETED] DIMENSIONS STATED IN INCHES.
CRITICAL TO FUNCTION DIMENSION.
ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994.
REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR
SOLVENTS AFTER FINAL ASSEMBLY.
PART NUMBER AND TORQUE SPEC MARK.
PLACE PART NUMBER AND TORQUE SPEC IN ALLOWABLE AREA,
EITHER SIDE OF PART WHERE SHOWN. BELOW PART NUMBER
CALLOUT, PLACE THE FOLLOWING TEXT:
8/13/10
3/23/10
DATE
6
5
3.
4.
2.
NOTES:
B
1.
RELEASE FOR SUPPLIER FEEDBACK
ROLLED ASSEMBLY TO -002
UPDATED CUP TO -002
UPDATED SCREW TO CLIENT VERSION
ADDED DELRIN SPACER TO ASSEMBLY
A
-
DESCRIPTION
REVISION HISTORY
E95474
REV
DWG. NO
ZONE
A
B
C
D
Mechanical Drawings
Figure A-22. 1U Narrow Heatsink Assembly 1 of 2
89
90
7
6
5
A
SECTION
A-A
B
(4X 9.36
)
[0.369]
SPRING PRELOAD
ASSEMBLY HEIGHT
5
6
4
ASSEMBLY DETAILS
2
SEE DETAIL
1
DEPARTMENT
R
10
6
[
0.039
]
SHT.
+0.13
0
+0.005
-0.000
7
1.00
&
E95474
8
2
REV
B
9 E-RING PUNCH DIRECTION
AWAY FROM THIS SURFACE
1
B
REV
D
A
8
SEE DETAIL
7
6
SEE DETAIL
5
DETAIL A
SCALE 6.000
4
C
3
PTMI
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
2
D
SCALE: 1.500
E95474
1
DO NOT SCALE DRAWING SHEET 2 OF 2
SIZE DRAWING NUMBER
DETAIL C
SCALE 30.000
E-RING ORIENTATION DETAILS
A
B
3
0.00 #0.13
[0.000 #0.005 ]
DWG. NO
B
A
3
C
A
DETAIL B
SCALE 6.000
PRESS FIT DETAILS
4
C
D
8
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
Mechanical Drawings
Figure A-23. 1U Narrow Heatsink Assembly 2 of 2
Document Number: 326512-003
Document Number: 326512-003
A
B
C
D
8
7
6
5
0
-0.25
8
C
-0.009 ]
[4.173 +0.000
106.00
SEE DETAIL
C
TOP VIEW
[
]
]
0
-0.25
+0.000
2.756
-0.009
70.00
[
4X 13.76
+1.00
0
+0.039
0.542
-0.000
7
+1.00
0
SEE DETAIL
A
6
GAP ON ONE SIDE OF FIN
ARRAY ALLOWED
NO SHARP PROTRUSIONS ALLOWED
ALONG SIDES OR TOP SIDE EDGE
OF OUTER FINS
AIRFLOW DIRECTION
[0.472 +0.039
-0.000 ]
4X 12.00
5
DETAIL C
SCALE 4.000
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
4
9
45X 1.53
[0.060]
FIN PITCH
21.00 #0.25
[0.827 #0.009 ]
4
3
1
REV
B
CHANGED FIN COUNT TO 46, AND FIN ALIGNMENT CALLOUTS
B
8/13/10
3/23/10
DATE
DATE
3/23/10
DATE
N. ULEN
CHECKED BY
FINISH
MATERIAL
2
SEE NOTES
DATE
SEE NOTES
-
APPROVED BY
3/23/10
3/23/10
N. ULEN
DRAWN BY
C. HO
DATE
DESIGNED BY
SCALE: 1
R
1
-
E95465
1
DO NOT SCALE DRAWING SHEET 1 OF 2
B
REV
APPROVED
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
ROMLEY 1U NARROW
HS GEOMETRY
SIZE DRAWING NUMBER
D
TITLE
EASD / PTMI
DEPARTMENT
THIS DRAWING TO BE USED IN CONJUNCTION WITH
SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES
ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
PRIMARY DIMENSIONS STATED IN MILLIMETERS,
[BRACKETED] DIMENSIONS STATED IN INCHES.
CRITICAL TO FUNCTION DIMENSION.
ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994.
BASE: COPPER, K=380 W/M-K MIN
FINS: QTY 46X 0.2 MM, ALUMINUM, K=220 W/M-K MIN
NA
REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR
SOLVENTS AFTER MACHINING AND FIN ASSEMBLY.
LOCAL FLATNESS ZONE .077 MM [0.003"] CENTERED ON
HEAT SINK BASE.
MECHANICAL STITCHING OR CONNECTION ALLOWED ON TOP SURFACE
OF HEATSINK TO INCREASE FIN ARRAY STRUCTURAL STABILITY,
OVERALL FIN HEIGHT MUST STILL BE MAINTAINED.
CRITICAL TO FUNCTION DIMENSION.
SEE NOTE 8
9
8.
7.
5.
6.
3.
4.
2.
1.
NOTES:
RELEASE FOR SUPPLIER FEEDBACK
A
-
ALIGNMENT OF FIN ARRAY TO ONE
SIDE OF HEAT SINK BASE IS ALLOWED
THIRD ANGLE PROJECTION
SHT.
DESCRIPTION
REVISION HISTORY
E95465
REV
DWG. NO
ZONE
46X 0.20
[0.008]
FIN THICKNESS
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5-1994
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
.X # .5
Angles
# 1.0 $
.XX # 0.25
.XXX # 0.127
DETAIL A
SCALE 4.000
45X 1.33
[0.052]
FIN GAP
3
A
B
C
D
Mechanical Drawings
Figure A-24. 1U Narrow Heatsink Geometry 1 of 2
91
92
A
B
C
D
8
7
6
5
8
9.35
0
-0.06
-0.002 ]
[0.368 +0.000
9
38.00
[1.496]
0.10 [0.003] A B C
56.00
[2.205]
9
A
7
A-A
9
94.00
[3.701]
38.00
[1.496]
SECTION
6
0.077 [0.0030]
FLATNESS ZONE,
SEE NOTE 7
B
1.00 [0.039] A B
5
AIRFLOW DIRECTION
BOTTOM VIEW
A
D
SEE DETAIL
SEE DETAIL
AIRFLOW DIRECTION
TOP VIEW
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
4
4
3
PTMI
DEPARTMENT
3
R
DETAIL B
SCALE 6.000
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
DETAIL D
SCALE 6.000
E95465
2
2
SCALE: 1.500
D
SHT.
REV
9
E95465
4.50 #0.13
[0.177 #0.005 ]
BASE THICKNESS
B
1
1
DO NOT SCALE DRAWING SHEET 2 OF 2
SIZE DRAWING NUMBER
3.0 [0.118] X 45 $
ALL FINS
DWG. NO
B
REV
A
B
C
D
Mechanical Drawings
Figure A-25. 1U Narrow Heatsink Geometry 2 of 2
§
Document Number: 326512-003
Socket Mechanical Drawings
B
Socket Mechanical Drawings
Table B-1 lists the socket drawings included in this appendix.
Table B-1.
Socket Drawing List
Drawing Description
Figure Number
Socket Mechanical Drawing (Sheet 1 of 4)
Figure B-1
Socket Mechanical Drawing (Sheet 2 of 4)
Figure B-2
Socket Mechanical Drawing (Sheet 3 of 4)
Figure B-3
Socket Mechanical Drawing (Sheet 4 of 4)
Figure B-4
Document Number: 326512-003
93
Socket Mechanical Drawings
Figure B-1.
94
Socket Mechanical Drawing (Sheet 1 of 4)
Document Number: 326512-003
Socket Mechanical Drawings
Figure B-2.
Socket Mechanical Drawing (Sheet 2 of 4)
Document Number: 326512-003
95
Socket Mechanical Drawings
Figure B-3.
96
Socket Mechanical Drawing (Sheet 3 of 4)
Document Number: 326512-003
Socket Mechanical Drawings
Figure B-4.
Socket Mechanical Drawing (Sheet 4 of 4)
§
Document Number: 326512-003
97
Socket Mechanical Drawings
98
Document Number: 326512-003
Component Suppliers
C
Component Suppliers
C.1
Intel Enabled Supplier Information
Performance targets for heatsinks are described in Section 5.1. Mechanical drawings
are provided in Appendix A. Mechanical models of the keep in zone and socket are
listed in Table 1-1.
C.1.1
Intel Reference or Collaboration Thermal Solutions
Customers can purchase the Intel reference or collaboration thermal solutions from the
suppliers listed in Table C-1 and Table C-2.
Table C-1.
Suppliers for the Intel Reference Thermal Solutions (Sheet 1 of 2)
Item
Intel Part
Number
Supplier PN
Supplier
Supplier Contact Info
1U Square
Heatsink
Assy
with TIM
(91.5x91.5x25.5)
E89208-002
1A22KDL00_XP
01
Foxconn
Ray Wang (worldwide)
[email protected]
+1-512-351-1493 x273
1U Narrow
Heatsink
Assy
with TIM
(70x106x25.5)
G16544-001
1A22JRB00_XP
01
Foxconn
Ray Wang (worldwide)
[email protected] +1512-351-1493 x273
2U Active/Combo
Heatsink Assy
w/TIM, Fan Guard
E62452-004
1A014QD00NRC_XA14
Foxconn
Ray Wang (worldwide)
[email protected] +1512-351-1493 x273
Delrin eRing
retainer
G13624-001
FT1008-A
ITW
Electronics
Business Asia
Co., Ltd.
Chak Chakir
[email protected]
512-989-7771
Thermal Interface
Material (TIM)
N/A
PCM45F
Honeywell
Judy Oles
[email protected]
+1-509-252-8605
N/A
TC-5022
Dow Corning
Ed Benson
[email protected]
+1-617-803-6174
2U Square
Heatpipe Heatsink
150W, 135W,
130W 1S WS,
130W, 115W, 95W,
80W, 70W, 60W
N/A
SR41H00001
Asia Vital
Components
(AVC)*
www.avc.com.tw
2U Narrow
Heatpipe Heatsink
150W, 135W,
130W, 115W, 95W,
80W, 70W, 60W
N/A
HEL00007-N1GP
Coolermaster
*
www.coolermaster.com
1U Square
Heatpipe Heatsink
130W, 115W, 95W,
80W, 70W, 60W
N/A
Document Number: 326512-003
(Not recommended for
shadowed processor
configurations)
SQ42Q00001
Asia Vital
Components
(AVC)*
www.avc.com.tw
99
Component Suppliers
Table C-1.
Suppliers for the Intel Reference Thermal Solutions (Sheet 2 of 2)
Item
C.1.2
Intel Part
Number
1U Square VaporChamber Heatsink
150W, 130W,
115W, 95W, 80W,
70W, 60W
N/A
1U Narrow
Heatpipe Heatsink
130W, 115W, 95W,
80W, 70W, 60W
N/A
1U Narrow VaporChamber Heatsink
130W, 115W, 95W,
80W, 70W, 60W
N/A
Supplier PN
R2
SQ42T00001
98-12038-M43
Supplier
Supplier Contact Info
Dynatron
Corporation*
(Top
Motor/Dynae
on)
www.dynatron-corp.com
Asia Vital
Components
(AVC)*
www.avc.com.tw
Taiwan
Microloops*
www.microloops.com
(Exceeds SSI blade height
standard)
(Not recommended for
shadowed processor
configurations)
Socket and ILM Components
The LGA2011-0 Socket and ILM Components are described in Chapter 2 and Chapter 3,
respectively. Socket mechanical drawings are provided in Appendix A. Mechanical
models are listed in Table 1-1.
Table C-2.
Suppliers for the LGA2011-0 Socket and ILM
Item
Intel PN
Amtek
Lotes
LGA2011-0
Socket
E64556-002
None
PE201127-435101H
TBD
LGA2011-0 ILM
Square
E91838-003
ITLE91838003
PT44L41-4411
ACA-ZIF-129-Y02
LGA2011-0 ILM
Narrow
E93875-002
ITLE93875002
PT44L43-4411
ACA-ZIF-130-Y02
LGA2011-0
Backplate
E91834-001
ITLE91834001
PT44P41-4401
DCA-HSK-182-T02
SJ Yeoh
[email protected].
cn
(Socket) Katie Wang
katie.wang@foxcon
n.com
Tel: +1-714-6082085
Fax:+1-714-6802099
(ILM) Julia Jiang
[email protected]
+1-408-919-6178
Cathy Yang
[email protected]
Tel: +1-86-2084686519
Supplier Contact
Info
(86) 752 263 4562
100
Foxconn
(Hon Hai)
Document Number: 326512-003
Component Suppliers
Table C-3.
Suppliers for the LGA-2011-0 Socket and ILM (Continued)
Item
Intel PN
Molex
Tyco
LGA2011-0
Socket
E64556-002
1051420132
2069458-1
LGA2011-0 ILM
Square
E91838-003
1051428100
2134439-2
LGA2011-0 ILM
Narrow
E93875-002
1051429100
2134439-1
LGA2011-0
Backplate
E91834-001
1051427000
2134440-1
Carol Liang
[email protected]
Josh Moody
[email protected]
Tel: +1-503-327-8348;
+1-503-327-8346
Supplier Contact
Info
(Asia) Billy Hsieh
[email protected]
§
Document Number: 326512-003
101
Component Suppliers
102
Document Number: 326512-003
Thermal Test Vehicle
D
Thermal Test Vehicle
For thermal analysis of Intel® Xeon® Processor E5-1600 / E5-2600 / E5-4600 v1 and
v2 Product Families, the Thermal Test Vehicle (TTV) can be used with appropriate
correction factors, as shown in Table D-1.
Actual processors experience non-uniform heating that is not simulated by the uniform
heating of the Thermal Test Vehicle (TTV). As a result, to find the actual thermal
characterization parameter (Section 5.3.2), correction offsets must be added to the
thermal characterization parameter found for each TTV.
Equation D-1. ΨCA, Intel Xeon processor = mean ΨCA, TTV + 3σ + Correction Offset
Mean ΨCA, TTV + 3σ accounts for variation (standard deviation) in heatsink and
thermal interface material performance and is determined by the customer.
There are two versions of TTV, depending on Intel® Xeon® Processor E5-1600/E52600/E5-4600 v1 or v2 Product Family processor. Refer to the appropriate processor
datasheet to determine the package size. The correction factors for the processors
along with applicable TTV are listed below.
Table D-1.
Correction Offsets Intel® Xeon® Processor E5-1600 / E5-2600 / E5-4600 v1
Product Families
Processor
TDP (Watts)
Correction Offset for TTV (°C/W)
8-core/6-core
150
-0.027
8-core
135
-0.024
8-core/6-core
130
-0.023
8-core/6-core
115
-0.026
8-core/6-core
95
-0.026
8-core/6-core
70
-0.031
8-core/6-core
Table D-2.
60
-0.030
4-core
130
-0.006
4-core
95
-0.008
4-core
80
-0.009
2-core
80
0.005
Correction Offsets Intel® Xeon® Processor E5-1600/ E5-2600/ E5-4600 v2
Product Families (Sheet 1 of 2)
Processor
EP 12-core 130W (1U)
TDP
(Watts)
Correction Offset for TTV
(°C/W)
Applicable TTV1
130
0.007
---
EP/EP 4S 12-core 115W (1U)
115
0.006
---
EP WS 8-core
150W
150
0.005
---
EP/EP 4S 10-core
130W (1U)
130
-0.001
---
Document Number: 326512-003
103
Thermal Test Vehicle
Table D-2.
Correction Offsets Intel® Xeon® Processor E5-1600/ E5-2600/ E5-4600 v2
Product Families (Sheet 2 of 2)
TDP
(Watts)
Correction Offset for TTV
(°C/W)
Applicable TTV1
EP 4S 8-core
130W (1U)
130
0.003
---
EP 8-core
130W (2U)
130
0.004
---
EP 6-core
130W (2U)
130
0.003
---
EP 10-core
115W (1U)
115
-0.002
---
EP/EP 4S 10-core
95W (1U)
95
-0.002
---
EP/EP 4S 8-core
95W (1U)
95
0.003
---
EP 10-core
70W (1U)
70
-0.004
---
EP 1S WS 6-core
130W
130
0.018
---
EP 1S WS 4-core
130W
130
0.020
---
EP 4-core
130W (2U)
130
0.017
---
EP 4S 6-core
95W (1U)
95
0.018
---
EP 4S 4-core
95W (1U)
95
0.020
---
EP 6-core
80W (1U)
80
0.016
---
EP 4-core
80W
80
0.019
---
EP 6-core
60W
60
0.014
---
Processor
Notes:
1. Refer to appropriate Processor Datasheet for package size.
D.1
LGA2011-0 TTV
As with past programs, a TTV has been developed to allow thermal solution
development. The LGA2011-0 TTV fits in the LGA2011-0 socket to have the correct
mechanical stack up in the testing.
The TTV can be powered using the socket or through pads on the top of the package
substrate.
Either method will provide the user a uniform heating of the embedded thermal source.
Contact your Intel Field Representative for a thermal test board and the collateral for
that board.
104
Document Number: 326512-003
Thermal Test Vehicle
D.2
Thermocouple Attach Drawing
Figure D-1 shows groove dimensions for thermocouple attach on Intel® Xeon®
Processor E5-1600 / E5-2600 / E5-4600 Product Families and Intel® Xeon® Processor
E5-1600 V2/ E5-2600 V2/ E5-4600 V2 Product Families TTV. This drawing is also
applicable to the larger Lukeville test vehicle as it shares the same IHS with the smaller
TTV.
Note:
The following supplier can machine the groove and attach a thermocouple to the IHS.
The supplier information is provided s a convenience to Intel’s general customers and
the list may be subject to change without notice. THERM-X OF CALIFORNIA, 3200
Investment Blvd., Hayward, Ca 94544. Ernesto B Valencia +1-510-441-7566 Ext. 242
[email protected]. The vendor part number is XTMS1565.
Document Number: 326512-003
105
106
A
B
4
3
C
A
4
3
A
SECTION A-A
7
THIRD ANGLE PROJECTION
11/02/2009
DATE
11/02/2009
DATE
DATE
FINISH
DRAWN BY
CHECKED BY
APPROVED BY
MATERIAL
2
DATE
DESIGNED BY
0.381 ± 0.038
SHT.
TITLE
R
01
SCALE
SCALE: 2:1
1:1
REV
1
DO NOT SCALE DRAWINGSHEET 1 OF 1
E85242
01
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
DETAIL C
SCALE 15:1
2X R0.25
NOTE DIRECTION OF
MILLED GROOVE RELATIVE
TO ALIGNMENT NOTCHES
AND PIN #1 INDICATOR
1
LGA2011 IHS GROOVE FOR SOLDER
THERMOCOUPLE ATTACH
REV
SIZE DRAWING NUMBER
-
DEPARTMENT
B
1
PACKAGE CENTER
0.38±0.03
E85242
0.51±0.08
DETAIL B
SCALE 15:1
DETAIL A
SCALE 15:1
DWG. NO
0.79±0.15
1.02±0.25
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
.X ±
0.2 Angles ±
0.5 °
.XX ±
0.05
.XXX ±
0.001
B
SEE DETAIL
PACKAGE EDGES
SEE DETAIL
NOTES: UNLESS OTHERWISE SPECIFIED
1. NORMAL AND LATERAL LOADS ON THE IHS MUST BE
MINIMIZED DURING MACHINING.
2. MACHINE WITH CLEAN DRY AIR ONLY, NO FLUIDS OR OILS.
3. ALL MACHINED SURFACES TO BE #32 MILL FINISH OR
BETTER.
4. IHS MATERIAL IS NICKEL PLATED COPPER.
5. CUT DIRECTION/ORIENTATION OF GROOVES IS AS SHOWN.
6. ALL MACHINED EDGES ARE TO BE FREE OF BURRS.
7 CRITICAL TO FUNCTION DIMENSION.
PACKAGE CENTERLINES
REFERENCED FROM
PACKAGE EDGES
SEE DETAIL
A
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
A
B
Thermal Test Vehicle
Figure D-1. Groove for Thermocouple Attach on Intel® Xeon® Processor E5-2600 Product
Family Thermal Test Vehicle
§
Document Number: 326512-003
Embedded Thermal Solutions
E
Embedded Thermal Solutions
Embedded Server SKU’s target higher case temperatures and/or NEBS thermal profiles
for embedded communications server and storage form factors. This section describes
reference heatsinks for NEBS (Network Equipment Building Systems) compliant ATCA
(Advanced Telecommunications Computing Architecture) systems. These higher case
temperature processors are good for any form factor that needs to meet NEBS
requirements.
E.1
Performance Targets
Table E-1 and Table E-2 provide boundary conditions and performance targets for 1U
and ATCA heatsinks. These values are used to generate processor thermal
specifications and to provide guidance for heatsink design.
Table E-1.
8-Core/6-Core Processor Reference Thermal Boundary Conditions (E5 v1
Product Family)
TDP
Heatsink
Technology5, 6
Ψca2 (oC/W)
TLA1, 4 (oC)
Heatsink
Volumetric3 (mm)
LV95W (8-core)
1U or Custom
0.265
52/67
90x90x25.5
LV70W (6-core)
ATCA
Cu Base/Cu Fins
0.506
52/67
90x90x12.6
Notes:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (Section 5.3.2).
3. Dimensions of heatsink do not include socket or processor.
4. Local Ambient Temperature written X/Yo C means Xo C under Nominal conditions but Yo C is allowed for ShortTerm NEBS excursions.
5. All heatsinks are Non-Direct Chassis Attach (DCA)
6. See Section 5.1 for standard 1U solutions that do not need to meet NEBS.
Table E-2.
Processor Reference Thermal Boundary Conditions (E5 v2 Product Family)
Heatsink
Technology5, 6
Ψca2 (oC/W)
TLA1, 4 (oC)
Heatsink
Volumetric3 (mm)
10-core
95W
1U or Custom
0.235
51/66
90x90x25.5
10-core
70W
ATCA
Cu Base/Cu Fins
0.400
49/64
90x90x12.6
8-core
70W
ATCA
Cu Base/Cu Fins
0.403
49/64
90x90x12.6
6-core
50W
ATCA
Cu Base/Cu Fins
0.541
52/67
90x90x12.6
TDP
Notes:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (Section 5.3.2).
3. Dimensions of heatsink do not include socket or processor.
4. Local Ambient Temperature written X/Yo C means Xo C under Nominal conditions but Yo C is allowed for ShortTerm NEBS excursions.
5. All heatsinks are Non-Direct Chassis Attach (DCA)
6. See Section 5.1 for standard 1U solutions that do not need to meet NEBS.
Document Number: 326512-003
107
Embedded Thermal Solutions
Detailed drawings for the ATCA reference heatsink can be found in Section E.3.
Table E-1 above specifies ΨCA and pressure drop targets and Figure E-1 below shows
ΨCA and pressure drop for the ATCA heatsink versus the airflow provided. Best-fit
equations are provided to prevent errors associated with reading the graph.
Figure E-1.
ATCA Heatsink Performance Curves
1.2
0.3
0.25
0.8
0.2
0.6
0.15
0.4
0.1
ΔP [in
Ψca [°C/W]
1
Yca = 0.180 + 1.374 * CFM ^ - 0.642
0.2
0.05
DP = 0.0009 * x^2 + 0.0106 * x
0
0
0
2
4
6
8
10
12
14
Airflow [CFM]
Note:
Other LGA1366 compatible thermal solutions may work with the same retention. ATCA
heatsink performance curves were created using Socket R TTV.
E.2
Thermal Design Guidelines
E.2.1
High Case Temperature Thermal Profile
High case temperature thermal profiles help relieve thermal constraints for Short-Term
NEBS conditions. To ensure reliability, processors must meet the nominal thermal
profile under standard operating conditions and can only rise up to the Short-Term
specification for NEBS excursions (see Figure E-2). The definition of Short-Term time is
defined for NEBS Level 3 conditions but the key is that it cannot be longer than 360
hours per year.
Fan speed control is treated the same as standard processors. When DTS (Digital
Temperature Sensor) value is less than Tcontrol, the thermal profile can be ignored.
108
Document Number: 326512-003
Embedded Thermal Solutions
Figure E-2.
High Case Temperature Thermal Profile
\
Thermal Profile
90
Short-term Thermal Profile may only be used for short term
excursions to higher ambient temperatures, not to exceed 360
hours per year
Tcase [C]
80
70
Short-Term Thermal Profile
Tc = 0.302 * P + 66.9
Nominal Thermal Profile
Tc = 0.302* P + 51.9
60
50
40
0
5
10
15
20
25
30
35
40
45
50
55
60
Power [W]
Notes:
1.) The thermal specifications shown in this graph are for reference only. In case of conflict, the data in the
datasheet supersedes any data in this figure.
2.) The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not
require NEBS Level 3 compliance.
3.) The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating
temperatures, not to exceed 360 hours per year as compliant with NEBS Level 3.
4.) Implementation of either thermal profile should result in virtually no TCC activation.
5.) Utilization of a thermal solution that exceeds the Short-Term Thermal Profile, or which operates at the ShortTerm Thermal Profile for a duration longer than the limits specified in Note 3 above, do not meet the processor
thermal specifications and may result in permanent damage to the processor.
§
E.3
Mechanical Drawings and Supplier Information
See Appendix B for assembly, retention, and keep out drawings.
The part number below represent Intel reference designs for an ATCA reference
heatsink. Customer implementation of these components may be unique and require
validation by the customer. Customers can obtain these components directly from the
supplier below.
Table E-3.
Embedded Heatsink Component Suppliers
Component
ATCA
Reference
Heat Sink
Intel P/N:
G47264-001
Document Number: 326512-003
Description
Supplier PN
ATCA Copper Fin,
Copper Base
10A01NE500
Supplier Contact Info
Foxconn/FTC Technology, Inc.
Cary Huang
[email protected]
(512) 670-2638 x191
109
Embedded Thermal Solutions
Table E-4.
Mechanical Drawings List
Parameter
110
Value
ATCA Reference Heatsink Fin and Base (Sheet 1 of 2)
Figure E-3
ATCA Reference Heatsink Fin and Base (Sheet 2 of 2)
Figure E-4
Document Number: 326512-003
Embedded Thermal Solutions
Figure E-3.
ATCA Reference Heatsink Fin and Base (Sheet 1 of 2)
Document Number: 326512-003
111
Embedded Thermal Solutions
Figure E-4.
112
ATCA Reference Heatsink Fin and Base (Sheet 2 of 2)
Document Number: 326512-003
Embedded Thermal Solutions
§
Document Number: 326512-003
113
Embedded Thermal Solutions
114
Document Number: 326512-003
Heatsink Load Characterization
F
Heatsink Load
Characterization
F.1
Introduction
Socket LGA2011-0 requires load sharing with the ILM and heatsink for end of life (EOL)
performance. This places additional requirements on the heatsink beyond just
providing the minimum pressure for thermal interface performance.
This Appendix outlines the recommended procedure for verifying the heatsink load on a
fixture that simulates an ILM and processor interface.
F.2
Heatsink Load Fixture
The heatsink load fixtures shown in Figure F-1 has four mount points for the heatsink,
a middle protrusion simulating the surface of the processor’s integrated heat spreader,
and a machined pocket to accept a load cell. There are two versions, one simulating the
square ILM heatsink mount pattern, and one with the narrow ILM geometry.
Figure F-1.
Heatsink Load Fixtures
Sqaure Heatsink Load Fixture
Narrow Heatsink Load Fixture
Heatsink load fixtures, square and narrow version, aluminum block with steel threaded
inserts.
The recommended load cell is the Omega* LCKD-100 available separately from
Omega*. Additionally, a system is needed to query the load cell to obtain the force
provided by the heatsink. Loadcell calibration certification is also recommended.
F.3
Procedure for Measuring Heatsink Load
The following steps are suggested for characterizing the heatsink load with the heatsink
load fixture and load cell.
Note:
This fixture will only measure beginning of life (BOL) load and not end of life load
(EOL). However, if BOL loads as measured here are between approximately 60 and
Document Number: 326512-003
115
Heatsink Load Characterization
70 lbf at low and high stack respectively, then there should be no EOL concerns for the
socket.
• Insert Omega* LCKD-100 load cell into pocket in fixture ensuring no debris is
between the interface that would skew the load measurement. See Figure F-2 for
example assembly.
• Install the heatsink (without any TIM material) to be characterized using a #2
Phillips driver and torque the four captive screws to 9 inch-pounds ±1 inch-pound.
It is recommended that each thread be started before final torquing to avoid any
cross-threading.
• The fixture is designed to provide a low stack height (8.014 minus 0.34 mm),
simulating the low tolerance side of the processor IHS above the board. With this
low stack height, the heatsink load should be above approximately 60 lbf to ensure
adequate end of life load.
• Once the minimum heatsink load from the previous step has been recorded, shim
the fixture by placing a spacer with thickness 0.68 mm between the top of the load
cell and the heatsink base to bring the base of the heatsink to the high tolerance
stack (8.014 plus 0.34 mm) and measure the load. This load should be kept under
approximately 70 blf.
Figure F-2.
Heatsink Fixture Assembly
Heatsink
Fixture
Load cell
Assembly for measuring heatsink load
Note:
The loadcell has a point on it. For heatsinks susceptible to damage in this area of
contact, it is recommended to insert the load cell with the point down.
§
116
Document Number: 326512-003