CALL 2010
Project profile
EPAMO
Energy-efficient piezo-MEMS tuneable RF front-end
antenna systems for mobile devices
One major limitation of today’s mobile phones is the imperfect
impedance matching of the aerial to the front-end circuitry.
This problem can lead to poor efficiency overall. Additional
shielding of the signal by hand, head or environmental obstacle,
aerial miniaturisation and matching across the broad frequency
spectrum also contribute to degrading the performance. The
ENIAC JU project EPAMO combines the strengths and experience
of leading European specialists to address such issues and develop
new aerial and front-end technologies with the aim of enhancing
the performance of future mobile phones.
Sub Programme
„„ Nanoelectronics for energy
efficiency
„„ Nanoelectronics for wireless
communications
„„ Silicon process and integration
With the introduction of 3G mobile
next generation of transceiver ICs
phone systems, the whole mobile
will be possible. However, for the
telephony industry including equip-
RF front-end, new technologies and
ment manufacturers, materials and
system architectures will be required
component suppliers, design and test
to fulfil the ever-increasing require-
houses as well as simulation tool pro-
ment for higher data rates and en-
viders faced new requirements with
ergy efficiency.
for nanoelectronics
respect to the radio-frequency (RF)
„„ Equipment, materials
architecture of terminals. Current
Facing the challenges
and manufacturing for
and future multi-mode and multi-
The ENIAC JU project EPAMO is ad-
nanoelectronics
band standards in communications,
dressing the major challenges of pro-
enabling the use of an individual
viding cost-efficient solutions for the
handset in mobile networks all over
future high performance RF systems,
the world, will result in a strong in-
enabling
crease in the complexity of the RF ar-
communication systems and relying
chitecture of the phones.
upon highly-miniaturised and inte-
energy-efficient
mobile
In addition, the trend towards the
grated RF components.
ever
of
EPAMO will explore and implement
handsets, including audio, video,
multiple innovative processes and
GPS, browsing and personal com-
testing technologies to realise an
puting, increases the pressure on
adaptive aerial front-end system for
the miniaturisation and cost control
4G mobile phones. With the benefit
for the RF front-end to keep at a rea-
of closed-loop aerial tuning, mobile
sonable level the overall form factor
phone radio power levels can be re-
and average sales price of a mobile
duced by more than 50% while, in
phone.
base stations, a saving of at least 10%
By using advanced CMOS technolo-
seems to be possible.
gies, a further improvement in the
The project will help using the in-
increasing
functionality
EPAMO
stalled mobile phone infrastructure
figurable aerial concept which can
in a more efficient way, reducing the
be fully integrated with today’s RF
number of new base stations to be
front-end module solutions using
installed to cover future data traffic.
advanced heterogeneous 3D integra-
It is estimated that the implementa-
tion technologies. The core of this
tion of this technology has a global
system will be an array of ohmic RF
energy-saving potential of more than
MEMS switches based on piezoelec-
10,000 GWh a year on the basis of a
tric actuation using thin layers of PZT
constant data volume to be transmit-
integrated into a CMOS-like thin film
ted.
technology.
These MEMS switches will be the key
Energy efficiency
Partners:
„„ AixACCT Systems
„„ Boschman Technologies
„„ Christian-Albrechts University of Kiel
„„ EPCOS
„„ EPCOS Netherlands
„„ Fraunhofer Institute for Reliability and
Microintegration
„„ Fraunhofer Institute for Silicon Technology
„„ Landshut Silicon Foundry
„„ MASER Engineering
„„ Okmetic
„„ Picosun
„„ Plan Optik
„„ Silex Microsystems
„„ SolMateS
„„ TNO Defence, Security and Safety
„„ University of Twente
„„ VTT
New switching technology
components in an adaptive match-
EPAMO aims to explore the poten-
ing circuit between the aerial and the
tial of ultra-high density, RF micro-
RF front-end module providing the
electromechanical systems (MEMS)
required switching and filtering func-
switch arrays to be integrated in an
tionality. This innovative RF solution
energy-efficient agile RF transceiver
will boost current and future mobile
with reconfigurable aerial.
phone system performance.
Of particular interest will be high-
The continuing trend towards further
force piezoelectric MEMS actuators
miniaturisation and integration is
„„ Start: April 2011
„„ Finish: March 2014
based on lead zirconate titanate
an ever increasing challenge in the
Countries involved:
(PZT)
high-reliability
design of complex RF systems, due to
metallic contact switches, low-loss
critical RF interaction on signal lines.
silicon and composite glass-silicon
By introducing tuneable RF elements,
„„ Finland
„„ Germany
„„ The Netherlands
„„ Sweden
200-mm diameter wafer substrates.
the overall systems architecture can
Total budget:
With this technology it will be pos-
be simplified, leading to a significant
„„ €13.3 million
sible to produce galvanic switches to
cost reduction in future RF systems.
replace today’s capacitive switches,
Therefore the development of tune-
significantly extending the applica-
able RF components will be a key
tion field for RF MEMS switches. Fine
enabler of future highly-advanced RF
pitch, through-wafer vias will allow
systems and this will strengthen the
high-density 3D system integration
leading position of the European RF
in ultra-small RF module substrates
community and industry in the face
with integrated components.
of worldwide competition.
The project covers the whole develop-
The European mobile phone indus-
ment process including simulation
try today holds a leading position in
and modelling, design and layout,
RF and wireless technologies and the
materials development, process tech-
results of EPAMO offers the potential
nology development, device measure-
to further strengthen this position
ment and reliability/quality testing.
by developing the next generation
thin
films,
Project co-ordinator:
„„ Thomas Metzger, EPCOS
Key project dates:
Details correct at time of print but subject to possible
change. Updates will be included in the project
summary at the end of the project.
of systems and subsystems for the RF
Further miniaturisation
front-end of mobile phones.
The basic idea is to develop a recon-
The ENIAC Joint Undertaking, set up in February 2008, co-ordinates European
nanoelectronics research activities through competitive calls for proposals. It takes
public-private partnerships to the next level, bringing together the ENIAC member
states, the European Commission and AENEAS, the association of R&D actors in this
field, to foster growth and reinforce sustainable European competitiveness.
ENIAC Joint Undertaking • Brussels • Belgium
Tel : +32 2 221 81 02 • email: [email protected] • website: www.eniac.eu