UIC Engineering Measurement of Interface Traps in HgCdTe and InAs/GaSb Superlattice Metal-InsulatorSemiconductor Structure Michael McGovern UIC REU 2006 August 3rd, 2006 UIC Engineering Astronomy Security Applications Electronics Medicine UIC Engineering Current consists of the flow of “conduction band” electrons and “valence band holes” The p-i-n photodiode has 3 layers: mostly holes (p), mostly electrons (n) and a region of negligible carrier concentration (i) Ideally no current can flow under “reverse bias” Optically generated carriers can cause current flow As reverse bias is increased, avalanche effect begins and significant current flows Carriers are multiplied in the avalanche effect leading to increased signal p-i-n Photodiode UIC Engineering Passivation The surface of the semiconductor has dangling bonds and allows Hg to evaporate Dangling bonds and Hg evaporation reduce device sensitivity The surface can be passivated to reduce these problems Passivation itself leads to other problems Surface states will appear at the interface that will allow carrier recombination •HgCdTe Infrared Detector Material: History, Status and Outlook, Rogalski, A InAs/GaSb Superlattice UIC Engineering The InAs/GaSb superlattice consists of alternating layers of InAs and GaSb The band gap of InAs is about .8eV, while that of GaSb is about .4eV The result is a periodic potential ~50Å ~100Å InAs/GaSb Superlattice UIC Engineering The potential resembles a “particle in a well” The Schrödinger equation can be used to find the electron wave function The solution can be found exactly. While not difficult, this is tedious and the resulting expression is very long The result is that there is a single lowest allowed energy level for electrons in the conduction band that can be altered by varying the superlattice geometry UIC Engineering HgCdTe • Hg1-xCdxTe has a narrow band gap that varies with x • Band gap corresponds to energies in the IR spectrum • “Direct band gap”: High absorption coefficient UIC Engineering C-V Measurements Interface trapped charges can exchange charges with the semiconductor layer This increases the capacitance under negative voltage Physics of Semiconductor Devices, Second Edition, Sze, S., Chap. 7, John Wiley and Sons, New York, 1981 UIC Engineering Terman Method The Terman method can extract trap density information from C-V data: When a voltage is applied across a Metal-Iinsulator-Semiconductor (MIS) structure, part of the voltage drop appears across the insulator and part occurs between the bulk and surface of the semiconductor. The second contribution is the “surface potential” From the charge that accumulates at the surface, the surface potential can be determined UIC Engineering Terman Method Some of the charge will come from the normal doping of the semiconductor, while some will come from interface traps A surface potential function for the ideal case of no traps can be constructed The rate at which the difference between the actual applied voltage for a given capacitance and the ideal voltage at the same capacitance changes with respect to surface potential is proportional to the interface traps exchanging charge at that potential UIC Engineering Results 16.00 15.00 Capacitance (pF) 14.00 13.00 Foward 12.00 Reverse 11.00 10.00 9.00 -30.00 -20.00 8.00 -10.00 0.00 10.00 20.00 30.00 Voltage (V) Graph shows CV data for MIS device with 4000Å ZnS passivant layer Results UIC Engineering 16.00 15.00 Capacitance (pF) 14.00 13.00 Foward 12.00 Reverse Ideal 11.00 10.00 9.00 -30.00 -20.00 8.00 -10.00 0.00 10.00 20.00 30.00 Voltage (V) An ideal curve was constructed in order to use the Terman method Results UIC Engineering Dit(traps/eVcm^2) 3E+15 2E+15 1E+15 0 -1.00E-01 0.00E+00 -1E+15 1.00E-01 2.00E-01 3.00E-01 -2E+15 -3E+15 -4E+15 The maximum trap density is about 2*10^15 traps/eVcm^2 The best results previously obtained on MCT gave 5*10^12 traps/eVcm^2. We have a long way to go The density is still negative at some points, which does not make sense Results UIC Engineering Dit 2E+15 1.5E+15 1E+15 Dit 5E+14 0 -1.00E-01 0.00E+00 -5E+14 1.00E-01 2.00E-01 Same set of data, reverse pass 3.00E-01 InAs/GaSb C-V Curve UIC Engineering Capacitance (pF) 6.20E+01 6.10E+01 6.00E+01 5.90E+01 5.80E+01 5.70E+01 5.60E+01 5.50E+01 5.40E+01 -2.00E -1.50E -1.00E -5.00E 0.00E+ 5.00E+ 1.00E+ +01 +01 +01 +00 00 00 01 Voltage (V) The capacitance grows again after reaching a minimum rather than saturating at a low value. This may indicate that the frequency is not high enough There is a bump on the C-V curve. The cause of this is unknown The Terman method can not be used on this data because it assumes high frequency UIC Acknowledgements Engineering NSF CTS-0630470 & 0434201 GOALI: Atomic-scale Investigation of High Dielectric Constant Thin Films Using In Situ and Other Techniques, (Director C.G. Takoudis) NSF EEC-0453432 Grant, Novel Materials and Processing in Chemical and Biomedical Engineering (Director C.G. Takoudis), funded by the DoD-ASSURE and NSF-REU Programs Shubhrangshu Mallick Dr. An Professor Ghosh Professor Takoudis
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