THERM-A-GAP™ GEL17MF
Thermally Conductive Dispensable Gel
Limited Release Only
Customer Value Proposition:
THERM-A-GAPTM
GEL17MF
is
a
unique thermal management solution
for the high speed manufacture of
electronic assemblies. This gap filling
material is designed for dispensing
at high speed to fill a range of
printed circuit
board
topographies
and
to efficiently
conduct
heat
between hot components and heat sink
materials.
The material has a gel-like structure
and requires a low compressive force to
deform under assembly pressure leaving
solder joints, PCB components and leads
stress free. Simply dispense the thermal
gel compound onto the component,
assemble the heat sink or chassis over
the material, and the product is ready
to ship. The ease of application of this
material is also ideal for rework and field
repair situations.
THERM-A-GAP TM GEL17MF requires
no
cure
cycle,
refrigeration
or
mixing, reducing the Total Cost of
Ownership as well as capital and
operational expenditures. The material
can be stored at room temperature
without any filler settling issues and is
supplied as a one-component gel
compound, packaged for pneumatic
dispensing (cartridge or syringe) or in
easy access pail containers.
Contact Information:
Parker Hannifin Ltd
Chomerics Division Europe
Unit 6 Century Point
Halifax Road
High Wycombe, Bucks, HP12 3SL
United Kingdom
phone + 44 (0) 1494 455 400
fax + 44 (0) 1494 455 466
[email protected]
www.parker.com/chomerics
Product Features:
Typical Applications:
• Ultra low deflection force
• High thermal conductivity
• Excellent tack surface
reduces contact resistance
• Fully cured / no pump out
• Accommodates a variety of
bond line thicknesses
• Easily dispensed at high
speed
• Highly cost effective thermal
management solution
• Meets RoHS specifications
• Meets Bellcore silicone
specifications
• Automotive Electronic Control
Units (ECU’s)
• Power Supplies and
Semiconductors
• Memory and Power Modules
• Microprocessors / Graphics
Processors
• Flat Panel Displays and
Consumer Electronics
Product Information
Table 1 - Typical Properties
Typical Properties
GEL17MF
Physical
Color
Light Orange
Visual
Flow Rate
41
Grams/min.
luer lock syringe (90 PSI)
Specific Gravity
2.6
ASTM D792
PTML, %
0.4
TGA
Force vs. Deflection.
5%
10%
25%
50%
0.010
0.15
0.22
0.51
Thermal
Thermal Conductivity, W/m-K
Electrical
ASTM C165 MOD
0.100in thickness 1.0 in2 area,
0.025 in/min rate
1.9
ASTM D5470
1
ASTM D1269
200
ASTM E831
-55 to 200
--
200 ( 8 )
ASTM D149
1014
ASTM D257
Shelf Life, months from date of manufacture
18
Inventory control
RoHS Compliant
yes
--
Heat Capacity, J/g-K
Coefficient of Thermal Expansion, ppm/K
Continuous Use Temperature, °C
Regulatory
Test Methods
Dielectric Strength, Vac / mil, (KVac/mm)
Volume Resistivity, ohm-cm
The user, through its own analysis and testing, is solely responsible for making the final selection of the system and components and assuring that all performance, endurance, maintenance, safety
and warning requirements of the application are met. The user must analyze all aspects of the application, follow applicable industry standards, and follow the information concerning the product in
the current product catalog and in any other materials provided from Parker or its subsidiaries or authorized distributors.
Part Numbering Information:
Graph 1 - Deflection vs Load @ 0.025in/min:
• 69–11–GEL17MF–25kg–M25kgPail
• 65–00–GEL17MF–0300–M300ccCartridge
• 65–00–GEL17MF–0055–M55ccSyringe
• 65–00–GEL17MF–0030–M30ccSyringe
3,5
3,0
GEL17MF (.060")
Load (psi)
2,5
2,0
1,5
Installation Guidelines:
1,0
0,5
0,0
0
5
10
15
20
25
30
Tested 1"sq with 1" sq Al probe
Thermal GEL17MF is supplied in tin pails and cartridges. The
35
gel is reworkable and excess material can be easily wiped off.
40
45
50
55
60
Deflection (%)
www.parker.com/chomerics
© 2008 Parker Hannifin Corporation. All rights reserved.
2013
CHOMERICS is a registered trademark of Parker Hannifin Corporation. THERM-A-GAP is a trademark of Parker Hannifin Corporation.
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