Data Sheet
JTAG Technologies Symphony 228x™ and Symphony 228xPLUS™
Boundary-Scan Upgrade for Teradyne TestStation™
(GR228x and TS12x) and Spectrum 8800 In-Circuit Testers
Features
•
Low-cost implementation of JTAG Technologies
boundary-scan testing and in-system programming
on Teradyne’s TestStation (GR228x and TS12x) and
Spectrum 8800 in-circuit testers
•
Off-line bench top and fixtureless test application
preparation
•
Interchangeability of application files between
PC development environment and TestStation or
Spectrum production environment
•
Single production fixture for boundary-scan and in-circuit testing
•
Reduced fixture complexity and costs as a result of boundary-scan access to a large portion of the digital nets on a board
•
Ability to test analog portions of the board or UUT
using inherent ICT capabilities
•
Choice of using high-performance JTAG
Technologies controller or existing Teradyne ICT hardware
•
Retention of the familiar ICT operating system and user interface for production, with minimal impact on existing shop operations
•
Easy to retrofit to existing fixtures and programs using
Custom Function Module designed to fit to Teradyne
Custom Function Board
•
Available for a variety of TestStation/Spectrum systems and versions including older configurations
•
Best-of-class boundary-scan tools from JTAG Technologies
Fig. 1. Symphony 228x JTAG Upgrade
for Teradyne TestStation (GR228x and
TS12x) and Spectrum 8800 ICTs
(Photo of TestStation, courtesy of Teradyne)
The Impact of High-Density PCB Design on In-Circuit Testing
As electronics designers continue to drive greater densities onto their printed circuit boards, testing for the
occurrence of manufacturing faults becomes an increasingly difficult challenge for the test engineers. For digital
target boards, fixture-based in-circuit testers (ICT) are bumping against their limits in terms of the number of
available test nodes, inadequate spacing between test points, and inaccessible nodes underneath ball-grid array
packages and within inner board layers. As a result, the test coverage on complex boards is decreasing,
resulting in several undesirable and costly outcomes:
• To keep up with the IC device packaging technology, ICT test fixtures are becoming more complex, more
expensive, and less reliable.
• ICT misses an increasing percentage of defects, shifting detection and correction later in the production process, and thereby weakening the effectiveness of process control.
• As a result, more faults must be found in functional testing, requiring highly skilled engineering resources for
test development and “Bone-pile” resolution.
These trends are causing test professionals to look for effective and budget-minded solutions, often by
combining available test techniques in an optimized test strategy for maximum value.
Boundary-Scan Upgrade for
In-Circuit Test Systems
Test Strategy Considerations
Choosing between the many possible combinations of inspection methods (for example, optical, X-ray,
and boundary-scan) depends on several factors including the characteristics of the product to be tested,
production throughput requirements, and the anticipated fault spectrum. Because boundary-scan and ICT
are complementary test methodologies, this combination often provides an optimal test strategy with lowest
overall cost and maximum coverage for anticipated fault types. Two particularly valuable test platforms are the
JTAG Technologies Symphony 228x™ and Symphony 228xPLUS™, combining the boundary-scan solution of
JTAG Technologies within Teradyne in-circuit test systems.
Symphony 228x
Compiler for
DSM
Application
Development
Teradyne
ICT System
Teradyne
Runtime
Software
Results
Collection
Teradyne
DSM
Hardware
Diagnostics
Test Fixture
Unit
Under Test
JT 37x7/PCI
Controller
Test Fixture
Unit
Under Test
JTAG Technologies
Integration Package
Teradyne
Runtime
Software
Testing Only
Test
and/or
Programming
Application
Files
Testing and
In-System
Programming
Compiler for
JT 37x7
Symphony 228xPLUS
Teradyne
ICT System
Diagnostics
Fig. 2. Symphony 228x and 228xPLUS Process Flow
The JTAG Technologies Solution
Symphony 228xPLUS by JTAG Technologies is unique in its architecture, delivering the benefits of
both boundary-scan and ICT without disrupting your existing test methodology. Test and in-system programming applications are generated on JTAG Technologies industry-leading development
tools and easily ported to the TestStation or Spectrum production system. There, the applications
run on a high-performance JTAG Technologies controller delivering high throughput in your in-system flash
programming as well as testing applications. Alternatively, if the applications consist only of testing, Symphony
228x can execute the test applications using the Teradyne Deep Serial Memory (DSM), avoiding the need for
additional equipment.
With either alternative, diagnostics of detected faults are fully supported by the JTAG Technologies software,
often with pin level accuracy. Figure 2 illustrates the process flow, showing the JTAG Technologies applications
running at the Teradyne in-circuit tester. The combined test system delivers the following benefits:
• Reduced fixture complexity and cost as a result of boundary-scan access to a large portion of the digital nets
on the board
• Ability to test analog portions of the UUT using inherent TestStation/Spectrum capabilities
• Ability to perform in-system programming of flash memories and PLDs via boundary-scan at very high speed,
thereby minimizing usage of the ICT system (using JTAG Technologies controller hardware)
• Retention of the familiar TestStation/Spectrum operating system and user interface for production, with minimal impact on existing shop operations
• Off-loading the TestStation system by developing and verifying Boundary-Scan test applications using JTAG Technologies tools on a lower-cost PC-based system
• Straightforward porting of applications from the development system to the in-circuit tester for production
Boundary-Scan Upgrade for
In-Circuit Test Systems
The JTAG Technologies’ development tools support automatic generation of tests for the infrastructure, interconnections, memory cluster interconnections and clusters of non-scan devices as well as in-system
programming of flash memory and CPLDs. For Symphony 228x, test applications are compiled to run on the
in-circuit tester’s DSM. With Symphony 228xPLUS, test and in-system programming applications are executed
on the JTAG Technologies boundary-scan controller. When a JTAG Technologies boundary-scan controller
is used, its output is passed to the fixture via JT 2147 Custom Function Modules, designed for mounting on
a Teradyne Custom Function Board. The CFM provides isolation of power and ground between the JTAG
Technologies controller and the ICT system. Figure 3 illustrates the application with a maximum of two CFM’s
per Custom Function Board.
Fig. 3. Configuration with 4 CFMs to the
target board under test
Test and in-system programming actions are fully integrated in the TestStation/Spectrum test program and
can easily be launched from there. Failure messages are retrieved without operator intervention. Diagnostics
of detected faults are provided, often with pin-level accuracy, by the JTAG Technologies BSD software.
The JTAG Technologies Symphony 228x Package consists of:
• BCS228x
Boundary-Scan Compiler for GR228x and TS12x
• BRC228x
Boundary-Scan Result Collector for GR228x and TS12x
• PM 3790 Boundary-Scan Diagnostics (BSD) software package
• RTP228x
Module for integrating Boundary-Scan Diagnostics into test plan
• Integration Doc
Description of integration of boundary-scan into test plan
The JTAG Technologies Symphony 228xPLUS Package consists of:
• JT 37x7/PCI
High-performance boundary-scan controller with PCI interface
• JT 2147
Custom Function Module, including one TAP interface
• PIP 2176
Production (runtime) integration software
• PM 3790 Boundary-Scan Diagnostics (BSD) software package
• Integration Doc
Description of integration of boundary-scan into test system
Boundary-Scan Upgrade for
In-Circuit Test Systems
Ordering Information
Symphony 228x and Symphony 228xPLUS are supported on all GR228x, TS12x, and Spectrum 8800 system
configurations. If the tester includes Teradyne’s Deep Serial Memory (DSM) option, no additional hardware is
necessary to perform boundary-scan testing. To support testing and in-system programming, specify
Symphony 228xPLUS and one of the JTAG Technologies controllers.
Product Number
Description
Symphony 228x
Boundary-Scan upgrade for Teradyne TestStation (GR228x and TS12x) and Spectrum 8800 in-circuit testers using Teradyne’s DSM hardware option without a controller from JTAG Technologies (testing only)
Symphony 228xPLUS/x7
Boundary-Scan upgrade for Teradyne TestStation (GR228x and TS12x) and Spectrum 8800 in-circuit testers using JTAG Technologies JT 37x7/PCI controller (testing and in-system programming and Custom Function Module)
JT 2147
Custom Function Module (can be ordered separately)
Note: x7 = 07 for JT 3707/PCI, 17 for JT 3717/PCI, or 27 for JT 3727/PCI
USA, Canada and Mexico:
United Kingdom:
Finland:
Phone: (Toll Free) 877 FOR JTAG
Fax:
410 604 2109
Email: [email protected]
Phone: +44 (0) 1234 831212
Fax:
+44 (0) 1234 831616
Email [email protected]
Phone: +358 (0) 9 22431457
Fax:
+358 (0) 9 22431467
Email: [email protected]
France and Portugal:
Germany:
Sweden:
Phone: +33 (0) 8 7120 8965
Fax:
+33 (0) 1 3930 2978
Email: [email protected]
Phone: +49 8203 959 1350
Fax:
+49 8203 959 5
Email: [email protected]
Phone: +46 (0) 8 754 6200
Fax: +46 (0) 8 754 6200
Email: [email protected]
Europe and rest of the world:
Phone: +31 (0) 40 2950870
Fax:
+31 (0) 40 2468471
Email: [email protected]
China (also Malaysia, Singapore,
Taiwan & Thailand):
Phone: +86 (021) 5831 1577
Fax:
+86 (021) 5831 2167
JTAG Technologies has offices, distributors, and representatives around the world.
Locate your nearest office on our website or send an email to [email protected].
www.jtag.com
JTAG Technologies B.V. reserves the right to make changes in design or specification at any time without notice.
Data subject to change without notice. Printed May 2007. ©2007 JTAG Technologies.
All brand names or product names mentioned are trademarks or registered trademarks of their respective owners.