Volume 10 // Number 1
FICO ISS: UNIQUE
FEATURES FOR INCREASED
SYSTEM OUTPUT
Datacon // Cyclical Uplooking Camera Search
with “The Smart Accuracy Mode”
Esec // New High-Speed Solution on
Die Bonder 2100
CONTENT
content
Esec: Soft Solder Die Bonding // 4-5
With its new generation of leading edge
soft solder die bonders, Esec offers the ideal
solution for power packaging
Corporate News // 6
Strong results for Besi
Honours go to Datacon
Fico: Proven process for improved
product development // 14
With its Stage-Gate™ process,
Fico speeds up product developments
for improved time to market
Fico: Individual laser marking // 15
Datacon: Cyclical uplooking camera
search on 2200 evo // 8-9
The partial use of the uplooking
camera combines two die attach strategies
with excellent accuracy
Meco: Even more power at
a lower cost // 10-11
Meco launches its Direct Plating Line for
metallization directly onto silicon
Esec: X becomes Z // 12-13
Esec’s new Z-Pattern© process achieves
best bonding quality at
record-breaking throughput
Fico’s expanded functionality of its
stand-alone laser marker allows individual,
product-specific marking
Fico: Singulation of small products // 17
Fico manages to saw and handle smallest products
Besi: Expanding production capacity
in Asia with Zollner // 18
Gradually increased assembly labor in Malaysia will
reduce time to market for faster lead times
Esec: Shaping the technological future // 19
For more than 20 years, Esec has been successfully
forming tomorrow’s industry specialists
07 Fast and reliable
singulation
Fico // Fico’s singulation
process knowledge
incorporated in Fico ISS
increases yields and
lowers cost of ownership.
IMPRINT
EDITORIAL OFFICE Esec Ltd., Hinterbergstrasse 32, 6330 Cham, Switzerland,
Tel: +41 41 749 58 47, Fax: +41 41 749 51 77, www.besi.com, [email protected]
EDITOR-IN-CHIEF Frida C. Hirt COPY EDITOR Polyglotte Sàrl, 1167 Lussy-sur-Morges,
Switzerland LAYOUT & PRINT Victor Hotz AG, Steinhausen, Switzerland
PHOTOGRAPHS BE Semiconductor Industries N.V. (Besi) CIRCULATION 6,000 English
© 2010 BE Semiconductor Industries N.V. (Besi), The Netherlands. All rights reserved.
Contents (text and pictures) may not be reproduced in whole or part without the written
consent of Besi.
2 // Spotlights 2010-01
EDITORIAL
For the Benefit of our
Customers
Given rapid industry growth this year, particularly in our die attach business, our
key priority for 2010 has been the expansion of our production capacity and supply chain worldwide to meet increased customer demand and reduce system cycle
times. Toward this end, we exceeded our production goals in the first half of 2010
at all our worldwide facilities and, in particular, tripled our direct shipments from
our Malaysian operations and significantly increased production from our Swiss
die attach facilities. In addition, we expanded our Asian production capacity and
sales & service capabilities to better service our customers. A dedicated spares
organization centered in Switzerland and Singapore, under the direction of Danilo
Gerletti, will also facilitate faster delivery times and improve our performance in
meeting customer demand.
On the development front, Besi has enjoyed great success this year with recently
introduced products such as Esec’s new soft solder system, Fico’s foil assisted
molding system and Datacon’s new thin die processes and flip chip machines. In
the coming months, we shall be releasing new platforms and machine generations, further demonstrating our innovation strength. The new Datacon Die Sorter
will spearhead this next launch phase in January 2011.
Besi’s vision and strategy for the future continues to focus on the development of
a technology-led company, serving both mainstream and niche assembly markets.
In this vision, our European operations will maintain their focus on preserving and
enhancing our core strength, our intellectual capital base, through the ongoing
development of new systems and process solutions for the assembly equipment
market. Our Asian operations will primarily produce our leading edge products
for more rapid direct shipment to local customers, while maintaining our exacting
product standards.
We look forward to sharing our progress with you in the near future.
Richard W. Blickman
President & CEO Besi
Spotlights 2010-01 // 3
DIE ATTACH
1
1: The flexible machine
concept can handle a wide
variety of packages like SOT,
SOD, SO, PSSO, PSOP, DPAK,
TO, PQFN, Power LED and
power modules on one single
platform.
2: Process control has
been brought to perfection,
reducing gas consumption
by up to 50% and keeping
equipment running costs at a
minimum.
4 // Spotlights 2010-01
Die Bonder 2009 SSI –
The Solution for Power
Packaging
Esec introduces a new generation of leading edge Soft Solder Die Bonders,
bringing a new player to the market that is faster and more adapted for matrix
strips than previously available models. Developed in close cooperation with
long-term customers, the new Die Bonder 2009 SSI incorporates numerous innovations that lead to increased speed – 40% faster than conventional equipment. Since its formal launch in 2009, the Esec Die Bonder 2009 SSI is well on
its way to conquering the market.
2
Author // René Betschart
The newly developed machine concept, combined
with process technology leadership in soft solder
processing, provides customers with a new platform designed for tomorrow’s challenges in power
die attach. It offers the flexibility to handle a vast
variety of power module packages on one platform.
Its advanced indexer exchange concept ensures
rapid conversion and helps to convert from one
product to another. With its wide application range,
handling both ultra-thin and ultra-wide lead frames
is a challenge easily met. In conjunction with the
new point-to-line pick and place capability, the Die
Bonder 2009 SSI increases the process speed and
thus lowers the cost of ownership, particularly in
the growing market of matrix applications. Another
feature keeping equipment running costs very low
is improved process control, with up to 50% less
gas consumption than conventional solutions on the
market.
Undisputed Market Leader
Esec has been market leader in Soft Solder Die
Bonders for more than 10 years and its product
development succeeds through close collaboration
with long-term customers. Working together from
the design stage to the final process/product solution
enables Esec to meet current and future customer
requirements most effectively, which in turn places
Esec in a strong position for future market growth.
The most significant market growth for the Soft
Solder Die Bonder 2009 SSI is currently in Mainland
China and the South East Asia (SEA) region, which
today already contribute three quarters of Esec’s
soft soldering business and thus represent the most
important markets.
In the fourth quarter of 2010, the Die Bonder 2009 SSI
will be replaced with the 2009 SSIE model, which
basically is the same machine, but will include the
next generation of motion control hardware.
The new Soft Solder Die Bonder 2009 SSI, introduced
to the market in March 2009, and the awardwinning die attach platform Die Bonder 2100 xP
launched in May 2008, completes Esec’s product
range, representing the most modern assembly
equipment assortment available on the market today.
René Betschart
joined Esec in 1996 and has
been Head of the Product Line
Soft Solder Technology at Esec
since June 2009. Before that,
he held various management
positions within the Esec
R&D and product support
departments.
Die Bonder 2009 SSI – Key Facts
• Highest speed through new point-to-line pick and
place, and high accuracy dispensing technology
• Best process quality from patented dispensing and
bonding technology
• Widest application range handling ultra-thin up
to ultra-wide lead frames
• Fastest time to yield, thanks to fast product
changeover with exchangeable indexer,
user-friendly menu structure and easy-to-use
mechanical design
• Most expandable machine design with multiprocess capability and ultra-thin die handling
Spotlights 2010-01 // 5
INSIDE BESI
corporate News
Strong 2010 financial Results
Also Fico’s packaging business showed very healthy
increases in growth as well.
Second quarter revenue and net income levels
represent the most visible evidence of the progress
Besi has made via its organizational restructuring
and acquisitions into a broad based equipment supplier efficiently serving both mainstream and niche
assembly markets. Second quarter revenue and gross
margins exceeded prior guidance and adjusted net
margins reached 12.3%. Profitability in the second
quarter of 2010 was favorably influenced by sequential revenue growth of 58%, improved gross margins
and operating leverage as Besi was able to ramp
revenue with only a limited increase in its overhead
levels. A positive sequential profit trends is expected
to continue into the third quarter of 2010 based on
forecasted revenue growth of 10–15%.
In its second quarter earnings announcement (ended
June 30, 2010), Besi reported substantial growth in
orders, backlog, revenue and profitability. Revenue
and order levels reached EUR 89.5 million and EUR
133.7 million respectively due to the continued
expansion of industry demand for memory, personal computing and smart phone devices and Besi’s
ability to ramp production at its global facilities more
rapidly than anticipated. The product line Die Attach
(comprising systems by Datacon and Esec) was the
main source of growth of Besi’s consolidated results.
Access the complete Half Year Report 2010 on
www.besi.com
Honours Go To Datacon
EVENTS CALENDAR
(as per September 2010, subject to change)
For the second time in a row, Datacon was voted
by Skyworks as the best supplier in the “Capital
Equipment” category. Since 2007, Skyworks, an innovator of high reliability in analog and mixed signal
semiconductors, has been distinguishing various
categories of winners among its suppliers at its annual supplier conference. In the “Capital Equipment”
category, quality in the areas of OEM, Equipment
Service and Supply are most important.
SEMICON TAIWAN
8 – 10 September 2010,
Booth No. 720
World Trade Center,
Taipei, Taiwan
SMT HYBRID PACKAGING
3 – 5 May 2011
Nurnberg, Germany
SEMICON SINGAPORE
IMAPS USA
2 – 4 November 2010
Raleigh, North Carolina
SEMICON KOREA
26 – 28 January 2011,
Booth No. 1566
COEX, Seoul, Korea
11 – 13 May 2011,
Booth No. 1102
Suntec, Singapore
SEMICON WEST
12 – 14 July 2011,
Booth No. 5867
Moscone Center, San
Francisco (USA)
SEMICON CHINA
15 – 17 March 2011,
Booth No. 2623
Shanghai New
International Expo
Centre, Shanghai
IPC APEX EXPO USA
12 – 14 April 2011,
Booth No. 365
Mandalay Bay Resort &
Convention Center,
Las Vegas
Gregg Taran (right), Besi Vice President Sales & Customer Service
Europe & North America, accepts the best supplier award on
behalf of Datacon from Bruce Freyman (left), Vice President of
Global Operations, Skyworks.
6 // Spotlights 2010-01
LABELEXPO EUROPE
28 September –
1 October 2011
Brussels, Belgium
SINGULATION
Fast and Reliable Saw
Singulation with Fico ISS
The modular design of the Fico ISS is just one of the numerous key innovations making
it one of the leading singulation systems in the market. Its unique features such as
up-side-down sawing process, the patented chuck system, easy and fast conversion and
the reliable gravity based scrap management system are designed to significantly
increase system output.
Author // Henri in ’t Veld
The Fico ISS (Integrated Sawing System) is a fully
automatic saw singulation system, based on the
existing MISS II platform. The high quality singulation and advanced inspection & sorting methods are
suitable for a wide variety of products. Overmolded
caps, substrate materials or film-based array substrates, these are product types that can be singulated
with the Fico ISS. Fico’s long-term experience and
high quality standards offer a unique and cost-effective solution for saw singulation and sorting of your
products. Due to the fully integrated solution of the
Fico sawing engine and the Fico device sorter, the
resulting footprint of 4 square meters is the smallest
one in the market today.
Fast Sorting Cycle
The high performance eight head device sorter
results in a significantly faster sorting throughput.
The eight picker-heads with the patented automatic pitch adjustment provide a high output for the
overall sorting system. On top of this each individual
picker-head can make a Z-stroke to ensure that
always eight products are handled. Furthermore the
flexibility of the individual Z-strokes results in easier
placement in case of multiple position offload.
Clean Sawing Process
Remaining dust from a laser marker or solder flux
can often show up as severe contamination at the
bottom (ball-)side of the products. An optional three
nozzle high pressure rinsing action cleans the proAdditional Highlight of the Fico ISS:
• Dual spindle configuration enable
highest output of 18,500 UPH
• A special magazine loader pusher guarantees
optimal substrate transfer, regardless of the
substrate warpage
• Patented in-line blade diameter measurement
with automatic coolant adjustment
• Fastest conversion / product changeover
in less than 5 minutes
• Fully integrated dicing engine with
data feedback system
In the Fico ISS sawing and sorting are integrated in one machine.
ducts after the sawing process is finished. The newly
developed parallel clean & dry system guarantees
optimal drying of the products without influencing
the output. It uses a specially developed foam roller
which removes both water and dust in combination
with a vacuum / suction action. The new system
results in faster and more reliable drying.
Unique Upside-Down Sawing Process
One of the unique features if the Fico ISS is the
upside-down sawing process. In combination with
the reliable gravity based scrap management system
it prevents saw blade breakage, and possible yield
loss.
Henri in ’t Veld
has been Product Manager
Singulation at Fico in Duiven
(The Netherlands) since 2005.
His fields of expertise are
mainly dicing and sawing.
Fico equipment significantly increases yields, whilst
keeping the cost of ownership low. On top of this,
Fico’s process knowledge and support contribute the
improvement of current processes and enable the
introduction of new packages.
Spotlights 2010-01 // 7
DIE ATTACH
Cyclical Uplooking Camera
Search with “The Smart
Accuracy Mode”
The Datacon 2200evo platform basically provides two different die attach strategies. The first method is to attach the components in the “accuracy mode”
by using the uplooking camera. The advantage is a very high placement accuracy, but with an impact on the cycle time. The second method is “direct die
attach”, where the components will be aligned with the wafer camera and be
placed directly onto the board with the fastest possible speed, but with lower
accuracy. Now Datacon provides a functionality to combine both methods by
using the uplooking camera only partly, with excellent accuracy and only a low
UPH impact.
plooking camera search with 2200evo
Author // Bernhard Dablander
accuracy mode”
This production mode works with a special algorithm
platform
at production start and cyclically in the production
des
2
run, to detect the position of the picked component
on the pickup tool. At production start, a programattach
st
mable number of components will be measured
e
1
using the uplooking camera. Based on this search
ach the
result, the position of the component on the tool and
n
the
the reproducibility (Cpk value) of the pickup process
Bernhard Dablander
by using joined Datacon in 1989.
will be calculated. After a number of components,
camera. As Product Specialist of the
the pickup position will be corrected so that the
s a very 2200 platform, he makes a
component is at the target position on the pickup
tool. If the calculated Cpk value exceeds the defined
accuracy significant contribution to the
target Cpk by at least 1 sigma (>1.33 in our exampct on the platform’s continued improvele in Fig.1), the machine switches to speed mode
he 2nd ments anticipating the market
and the components are attached directly without
requirements.
ect die
the uplooking camera. After a number of directly
the
attached components, the machine periodically
ill
be
checks components again with the uplooking camewafer camera and be placed directly onto the board with the fastest possible speed
curacy. Now Datacon provides a functionality to combine both methods by using the
only partly, with excellent accuracy and only a low UPH impact.
ing camera: This production
ith a special algorithm at
and cyclically in the production
the position of the picked
e pickup tool.
rt, a programmable number of
be measured using the
a. Based on this search result,
component on the tool and the
pk value) of the pickup process
ated. After a number of
e pickup position will be
the component is at the target
ckup tool.
Cpk value exceeds the defined
least 1 sigma
(>1.33
in our
8 // Spotlights
2010-01
1), the machine switches to
the components are attached
Process capability window: warm up phase
Fig.1: Compensation phase at production start with accuracy mode
1: Compensation phase at production start with accuracy
and switch to speed mode.
mode and switch to speed mode.
If the calculated Cpk value drops below the
defined Cpk value (1.0 in our example in Fig.1)
during production for any reason, the machine
switches automatically back from speed mode to
100% accuracy mode (uplooking camera). The
ra. Depending on the search result, the machine will
dynamically adjust the pickup position to have the
component always centered on the pickup tool. If the
calculated Cpk value drops below the defined Cpk
value (1.0 in our example in Fig.2) during production
for any reason, the machine switches automatically
back from speed mode to 100% accuracy mode
(uplooking camera). The machine would now run in
the uplooking camera mode until the calculated Cpk
value exceeds again the required target value (1.3).
This can happen if either the component release process is not stable (sticky tape) or the 3s calculation
is running outside the limits because of some other
circumstance.
This feature can be installed on all Datacon 2200evo
machines by activating the function with a software
option. The required software is v007p50, v008 or
higher.
Process capability window: production
Fig. 2: Production run in speed mode showing a short phase with
2: Production run in speed mode showing a short phase with
100% uplooking camera due to calculated cpk dropping below
100% uplooking
camera due to calculated cpk dropping below
defined
limit (e.g. 1.0)
defined limit (e.g. 1.0)
This functionality ensures that the machine is
always running in the right production mode
even if the material quality changes.
Fig.3: Th
percenta
Accur
applic
camer
se with
below
Cpk calculation from the position of the
component on the pickup tool
The calculation by the uplooking camera continuously monitors the stability of the component position
on the pickup tool. Depending on the uplooking
camera Cpk result, the machine decides if it is possible to run this component at the required accuracy
with speed mode (i.e. without using the uplooking
camera).
Pickup position correction
With reference to the search result of the uplooking
camera, the machine calculates dynamic corrections
of the pickup position, in order to have the component perfectly centered on the tool. This adjustment compensates for thermal drifts caused by the
warming up of the machine during the start phase or
room temperature changes.
The cyclical uplooking camera search offers excellent accuracy.
Throughput improvement
The throughput improvement for a standard single
die application with a component size of 3x3mm
is about 20% to 30% compared to production at
100% accuracy mode (Fig. 3).
Accuracy
Example of a typical single die application, utilizing
the cyclical uplooking camera adjust.
The die placement accuracy with cyclical uplooking
Fig. 2:camera
Production
run inthe
speed
mode showing
short phase with
fulfills
required
20μm3sa specification
100% uplooking camera due to calculated cpk dropping below
(Fig. 4).
defined limit (e.g. 1.0)
This Throughput
functionalityimprovement
ensures that the machine is
always running in the right production mode
even if the material quality changes.
Target performance
Easy to use
The accuracy setting must be defined in the component dataset (e.g. 20μm, Cpk 1.0). The machine now
decides automatically whether this component is
capable of reaching the accuracy taking into account
all production factors, such as pattern recognition,
tooling and stickiness of the wafer tape. If the machine can’t reach the required accuracy for any reason
during component pick up, all components will be
Fig.3:
Throughput
from the
speed to
mode,
order
of the
aligned
usingimprovement
the uplooking
camera
get inthe
best
percentage
components
running without uplooking camera.
possiblefrom
accuracy
result.
Accuracy: Example of a typical single die
application, utilizing the cyclical uplooking
Accuracy
camera
adjust.
Mean (µm)
Stddev (µm)
3 sigma (µm)
Accuary (µm)
cp
cpk
Target performance
Cpk calculation from the position of the
component on the pickup tool:
The calculation with the uplooking camera
continuously monitors the stability of the
component position on the pickup tool.
Depending on the uplooking camera Cpk result,
the machine decides if it is possible to run this
component at the required accuracy with speed
Fig.3: Throughput improvement from the speed mode, in order of the
mode
without
using running
the
camera).
percentage
fromimprovement
components
camera.
3: (i.e.
Throughput
from uplooking
thewithout
speed uplooking
mode,
in order
of the
percentage from components running without uplooking camera.
Accuracy: Example of a typical single die
application, utilizing the cyclical uplooking
ne is
camera adjust.
mode Pickup position correction:
In reference to the search result of the uplooking
camera, the machine calculates dynamic
overview
X
Y
-1.0 0.3
3.4 2.9
10.1 8.8
20.0 20.0
2.0 2.3
1.9 2.2
Fig.4: XY placement result measured with post bond inspection.´
4: XY placement result measured with post bond inspection.
Mean (µm)
Stddev (µm)
3 sigma (µm)
Accuracy (µm)
cp
cpk
X
-1,0
3,4
10,1
20,0
2,0
1,9
Y
0,3
2,9
8,8
20,0
2,3
2,2
Spotlights 2010-01 // 9
PLATING
Light assisted Ni plating.
Light assisted Cu plating.
Even more power at
a lower cost!
After the introduction of the Meco
Cell Plating Line (CPL) in 2009, Meco
recently launched its Direct Plating
Line (DPL) for metallization directly
onto silicon. The DPL which can be
used together with the CPL platform,
perfectly fits into advanced metallization routes which are currently developed by the PV industry.
Author // Martijn Zwegers
10 // Spotlights 2010-01
The photovoltaic market is growing rapidly with growth rates of 40 – 50 % per
year. Although different solar cell technologies can be distinguished within the
PV industry, mono c-Si and multi c-Si cells strongly dominate this market. For
the formation of the front electrode on the solar cell, silver paste is deposited by
a screen printing process. To form electrical contact with the cell emitter a firing
step is subsequently done where glass particles in the Ag paste “eat” through the
dielectric SiN layer on top of the cell emitter. This is a well-established production
method within the PV industry although there are areas for further improvement.
Because of their poor aspect ratio, screen printed contact fingers are typically 110
– 120 μm wide to obtain sufficient electrical conductance. These wide contact
fingers create a relatively large shading area on the active surface of the solar
cell. As all PV manufacturers are working on further increasing the efficiency of
solar cells new metallization techniques are currently becoming mass production
ready, where the goal is to achieve finer contact fingers with the same or even
better conductivity as screen printed contact fingers.
The Meco CPL is based on electroplating Ag or Ni-Cu-Sn onto a seed layer of Ag
paste. As the width of the contact finger is largely determined by the width of the
seed layer it will typically become 65 – 70 micron after plating. This gives efficiency improvements of 0.3 – 0.4 % where electroplating is used in combination with
the well-known screen printing process. For next
generation solar cells, ultimately even more efficiency
improvement is required: first the SiN layer of the
solar cell is opened with a wet etching process, or
more commonly by laser ablation to form the pattern
of the front electrode. At this point the Meco DPL
comes in: by using a Light Assisted Plating process
first a base layer of Ni is deposited directly onto the
silicon emitter of the solar cell. This is followed by a
light assisted Cu plating process and as soon as the
conductivity of the plated layer is sufficiently low
further thickening of the contact fingers is done with
a CPL Cu electroplating process. Finally a thin capping layer of Ag or Sn is plated onto Cu. Alternately
after the Light Assisted Ni plating process we can
also offer a Light Assisted Ag plating process followed by a CPL Ag electroplating step. State-of-the art
laser sources can machine < 20 micron wide tracks
into SiN. After the plating process this results in solid
metal contact fingers of 35 – 40 micron wide, or
even less! Compared to conventionally screen printed solar cells this leads to efficiency improvements
up to + 1%. In addition to that, for the front side
metallization process the screen printing step can
completely be eliminated saving enormous amounts
of expensive Ag paste!
The Meco DPL + CPL leads to a true revolution in
both efficiency improvement and cost reduction at
the same time!
Martijn Zwegers
joined Meco in 2007 and
holds a master’s degree in
Physics. In his function as
Sales & Product Manager CPL,
he focuses on commercialization of plating equipment for
the metallization of crystalline
solar cells.
Available Metallization Routes
SiN
Plated Ag
LIP Ag
LIP Ni
SiN
Plated Ag
LIP Ag
LIP Ni
SiN
SiN
Plated Ag or Sn
Plated Cu
LIP Cu
LIP Ni
SiN
n doped silicon
n doped silicon
p doped silicon
p doped silicon
Plated Ag or Sn
Plated Cu
LIP Cu
LIP Ni
SiN
Spotlights 2010-01 // 11
DIE ATTACH
Introducing Z-Pattern© for
Small Die Epoxy Dispensing
For small die applications (0.8–1.5mm) the epoxy process is done with
a single dot printing or with a cross pattern writing process. Both solutions
have some limitations in terms of UPH, epoxy coverage, fillet symmetry and
tailing characteristics. For this reason Esec introduces the new Z-Pattern©
writing process that combines the advantages of both solutions in one pattern, achieving the best die bonding quality at record-breaking throughput of
20,000 per hour.
Author // Dr. Roland Stalder
As one of the leaders in die attach for more than
two decades, Esec is committed to surpassing its
customers’ needs by constantly setting new industry
standards in die attach. With its latest die attach
platform, the revolutionary Die Bonder 2100, Esec
demonstrates time and time again its innovative
strength.
Dr. Roland Stalder
is a Process Expert in Research and Development and
has been working for the last
14 years on numerous process
innovations on Esec’s die
bonding platforms. During this
time he applied for several
patents in the field. Prior to
joining Esec he worked for
NASA and earned a Ph.D. in
physics from the Swiss Federal
Institute of Technology (ETH
Zurich) in 1992.
Esec introduces the Z-Pattern© for small die bonding
in the range of 0.8-1.5 mm, achieving best process
quality at unbeatable UPH rates. The new process
combines the strengths of both: the process quality
of a cross pattern writing and the UPH performance
of a single dot printing. Compared to the cross
pattern the new Z-pattern gives 40% faster dispense
process times, provides an excellent epoxy volume
stability of ± 2%, reduces the average tail length (at
any dispense height) by 50%, increases the pre-wetting area due to unhindered epoxy flow by 20% and
also improves the epoxy symmetry and the resulting
fillet coverage. Compared to the single dot printing,
the new Z-Pattern© delivers equivalent shortest dispense process times with improved volume stability,
due to its much shorter and better controlled tail
lengths. It also offers much better epoxy coverage
and fillet quality.
When we compare the epoxy tailing behavior of the
various patterns, we find that with the single dot,
the complete epoxy volume is dispensed at the tail
position, resulting in long epoxy tails and potential dripping problems. With the cross pattern, the
dispense nozzle moves 5 times through the tailing
position in the center and builds up a considerable
volume under the tail. By using the Z-Pattern© the
tail is pulled off at a clean position, where the dispense nozzle has not dispensed previously. Therefore
the epoxy amount in the tail of the Z-Pattern© is
minimized and easily controlled by a single parameter “Dispense stop delay”.
12 // Spotlights 2010-01
For all these reasons, the new Z-Pattern© is the
preferred solution for small die epoxy dispensing in
the range from 0.8 – 1.5 mm and is implemented
for ease of use in the “autocalc pattern selection”
of the Die Bonder 2100 platform (SW release 2.3).
This innovation is currently used in high-volume
production at various customer sites for rectangular
die sizes of 2.0 mm and beyond. Record-breaking
20,000 dispense writing cycles per hour are achieved
(SW release 3.0) for a 2.0 x 2.0 mm die size with
highest process quality and 100% post dispense
quality check.
Unique Process Know-How
Esec is a process innovator and, as such, strongly
positioned in the market. New generations of complex micro-electronic components are introduced
in ever shorter time cycles. Therefore, technology
as well as processes increasingly demand faster
innovation. Working closely with customers and
suppliers, Esec utilizes its comprehensive process
know-how and culture of innovation to develop
and introduce technological advances to the
market, as well as to provide a continuous flow
of product improvements. This occurs not only in
new systems and machines, but also in modules
and software releases that comprise latest process
innovation, such as the Z-Pattern© process. These
releases are made available to existing customers every so often each year to keep pace with
anticipated market requirements. Esec’s innovative
products and continuous improvements enable
customers to achieve significant productivity and
quality advances in their manufacturing activities.
A key factor in guaranteeing advantageous cost of
ownership.
«X» becomes «Z»: The Z-Pattern© achieves unreached throughput in small die attach.
Benefits of the new Esec Z-Pattern©
1.0
1.0
1.0
0.5
0.5
0.5
0.0
0.0
0.0
– 0.5
– 0.5
– 0.5
– 1.0
– 1.0
– 0.5
0.0
0.5
1.0
– 1.0
– 1.0
– 0.5
0.0
0.5
1.0
– 1.0
– 1.0
3D view of the Epoxy Cross
Pattern 2 x 2 mm
– 0.5
0.0
0.5
1.0
3D view of the Epoxy
Z-Pattern© 2 x 2 mm
Dot
Cross Pattern
Z-Pattern
Print/Write time
30 ms
83 ms
43 ms
Tail breaking time
44 ms
39 ms
31 ms
Dispense
Process time
74 ms
122 ms
74 ms
Rating
Production speed
Tailing
Epoxy symmetry
Epoxy coverage &
fillet
***
*
***
*
**
***
***
**
**
*
***
***
Spotlights 2010-01 // 13
PACKAGING
Improved Product
Development
Besi is in a highly competitive global market. To become and remain the
leading supplier of semiconductor equipment we have to provide our
customers with the best products and services. Excelling at new product
development is the way to achieve this.
Author // Frank Rood
Fico has introduced the Stage-Gate™ process to
improve the product generation capabilities. It
is a system that provides a guideline for product
development and project portfolio management. The
system has a strong emphasis on market input and
business cases (“doing the right things”), as well as
on testing and validation (“doing things right”).
Frank Rood
Vice President Packaging, Fico
R&D, has been working for
15 years in the semiconductor
business, 10 years of which
with Fico. Frank has a degree
in Precision Engineering and
a strong affinity with product
development.
Go-Hold
versus
Kill-Recycle
Another strong feature of Stage-Gate™ is the use of
a series of stages. Each stage is entered through a
go/kill decision point (gate), where a choice is made
to continue or stop a development.
Stages
Fico’s innovation system is broken down into five
stages. Development activities are exercised and
information is gathered during each stage. All stages
are multi or cross-functional and a set of parallel
activities is undertaken by different Fico departments,
working together as a team.
Gates
Each stage is preceded by a gate, where a defined
group decides to continue, recycle, halt, or cancel the
project. Gates serve as quality-control checkpoints: is
this project being executed as defined? The priority
of the project is also determined in the gate, only
successful projects are selected. Finally, gates are the
points where the path and resource commitments for
the next stage are decided.
Recycle
Kill
prioritizing
Go versus Hold
Go
Hold
Stage Gate provides quality-control checkpoints supporting
efficient and effective decision making.
Advantages
Stage-Gate™ was introduced in May 2008 and up to
now it has yielded many benefits:
• More focus on marketing and customer input: the
right input at the right time helps to develop a
successful product.
• More focus in R&D: Fico optimizes its resources
and fast, successful product development by selecting the projects, which deliver the highest added
value for our customers.
• Improved testing: our customers receive a fully
functional and thoroughly tested product.
Further improvement
With the Stage-Gate™ process in place, Fico shifts its
main focus onto speeding up product development,
so you can enjoy new products and features sooner
than before.
Discovery
Idea
Stage
Business case
Scoping
Gate 1
Go to
Scoping
Stage 1
Gate 2
Go to
Business case
Stage 2
Beta Testing
Development
Gate 3
Go to
Development
Stage 3
Gate 4
Go to
Beta Testing
Stage 4
Launch
Gate 5
Go to
Launch
Fico’s technology project stages: 5 stages for successful product development and project portfolio management.
14 // Spotlights 2010-01
Stage 5
TRIM & FORM
Individual laser
marking
Laser marking of packages is recognized as a standard back-end
process. Fico expanded the functionality of its stand-alone laser marker,
by connecting it as a client to a SECS/GEM host, allowing individual,
product-specific marking.
Author // Mike Krabben
Mike Krabben
has been collaborating
with Fico in Duiven (The
Netherlands), for more than
19 years, bringing innovative
ideas in the field of Trim &
Form to market.
When a leadframe or board enters the laser marker,
its orientation is checked and a marking is made on
the top surface of each product. This marking usually
contains information such as company logo, product
type, manufacturing date and parent lot. The result is
checked directly after marking and, if found correct,
the products are offloaded. The laser marking module is universally designed and can accommodate all
major laser brands. Integration of the laser marker in
an existing Fico Compact Line is also possible.
Inspection
The inspection of each marking is done with a
FicoVision Mark Inspection camera. A check is made
to ensure the product is marked with the correct
information as received by the host, and the quality
of the marking (readability) matches the desired
specification.
SECS/GEM Host
Marking
Newly-added functionality allows each product to
be marked with its own individual marking, using
the mapping information provided by an earlier
operation step requiring traceability, e.g. a tester
unit. Individual identifications can be made to clearly
distinguish reject products from products that passed
the test or need to be reworked.
Fico PLT PC
Strip Tester
Laser Mark PC
Dot code
reader
Fico Vision
camera
Communication
The laser marker is equipped with an additional PC
to exchange the mapping information with a SECS/
GEM host. A dot code on the lead frame or board is
read, identifying the product carrier. This information
is sent to the host by the Product Lot Tracking PC.
The host responds and sends the marking info for
that specific lead frame or board to the laser marker.
The laser marking process can be followed safely during
production.
The laster marking process can be followed safely during production.
Spotlights 2010-01 // 15
For Your LED
Mass Production Needs
High Brightness
Automotive
LCD TV Backlight
Camera Flash
Building Illumination
The Right Leading-Edge Equipment
Esec 2100 FC
• Solder Flip Chip (C4)
Datacon 8800 Chameo
• Thermosonic Flip Chip (GGI)
Datacon 2200 evo
• Phosphor Layer Attach
• High Accuracy Lens and
Frame Attach
• Multi LED Attach
Datacon CS1250
• WLCSP Sorting
Fico AMS-W
• Molding
Fico ISS
• Fast Leadtime
Singulation System
Datacon Die Sorter
• LED and Layer Sorting
• >130 Bins
• CLC Thermo Release
SINGULATION
Left: In order to ensure the
rigidity and flexibility of the
cup and also the suction force
to hold the products in position, a so-called “carpet cup”
is used instead of individual
cups. The cups are interconnected to prevent vacuum
leakages and the rotation of
the cups.
Right: Fico manages to saw
and handle products as small
as 2.5 mm x 2.5 mm
Singulation of Small
Products
Sawing and handling small products introduce specific challenges.
Following the long-term trend of
ever-decreasing product sizes, Fico is
continuously improving its singulation
systems to keep on track.
Author // Roel Moonen
Through technical improvements and process optimization, Fico manages to saw
and handle products as small as 2.5mm x 2.5mm. New developments in vacuum
cup design, vacuum upgrades, optimized pick & place handling and an advanced
inspection method have contributed to a high, reliable performance level.
Cup design
The cups that hold the products during the different process steps need to be
small to handle small products. This affects the rigidity and flexibility of the cup
and also the suction force to hold the products in position. To cope with these
possible issues, a so-called “carpet cup” is used instead of individual cups. One
carpet can consist of up to 50 cups in a specified matrix, and its size can be
altered to fill a complete chuck. The cups are interconnected to prevent vacuum leakages and the rotation of the cups. This results in better support for the
products during sawing. By the use of carpet cups, product quality remains at the
same high level as that of larger products.
Pick & Place
Handling of very small products requires a new approach. In general, smaller
products are lighter than larger ones and the pitches are very small. Fico has optimized the pick strategy to handle the small pitch between neighboring devices
without decreasing throughput. To eliminate the chance of misplaced products in
trays – or even missing products – several new suction cups are used that have
proved to be very reliable and accurate during in-house tests.
Roel Moonen
studied applied physics, and is
working as Process Engineer
for Fico Saw Singulation. He
joined Fico early 2008.
Inspection
Since the products are so small, the conventional background cannot be used to
provide optimal contrast during inspection. The solution is a suction cup with an
integrated background so the cup itself acts as background. The size and color of
the background can be optimized to serve the customer’s requirements.
Spotlights 2010-01 // 17
INSIDE BESI
Formally entering into a close collaboration: Johann Weber, CEO Zoller (left) and Richard W. Blickman, CEO & President Besi (right). (Photography by Zollner, 2010)
Expanding Production Capacity
in Asia with Zollner
In its efforts to improve customer
satisfaction and service, Besi is gradually expanding its production capacity
in Asia. Through increased staffing at
its Malaysian plant during 2011, time
to market will gradually be reduced
and lead times shortened. Another
key factor in achieving this goal is the
development of reliable, Asia-based
supply chain partners. Besi found one
such partner in Zollner and recently
signed a supply agreement with them
for joint business in Asia.
Author // Frida C. Hirt
18 // Spotlights 2010-01
“We are in a highly volatile industry. Therefore, being agile and flexible in responding quickly to changing customer requests, is a key success factor”, comments
Richard W. Blickman, Besi CEO. “We need to be where the customer operates our
systems and requests our support services. Consequently, it’s sensible to transfer
the production and the supply chain network closer to the customer, which in our
case is Asia” he continues.
By continuing to expand Besi’s production capacity in the Asian region, the
Company will be better positioned to meet accelerated market demand and
elevated backlog levels. While existing engineering skills in Besi’s production site
in Malaysia are continuously strengthened, a network of experienced and reliable
Asian-based suppliers is also being built up. In Zollner, Besi has found a reliable
partner committed to its exacting quality standards. Since 2006, Zollner has been
manufacturing highly complex basic assembly and other modules, including Esec’s
latest Die Bonder 2100 platform. Zollner is also able to provide ideal logistics
conditions from its plant in Taicang (China), to meet Besi’s requirements.
The agreement for a close collaboration in Asia was formally signed by the CEOs
of the two companies, Richard W. Blickman (Besi) and Johann Weber (Zollner),
as well as by Besi Supply Chain Director Michael Leu and Zollner Deputy Director
of the Electronics Division, Konrad Kick. Johann Weber commented on the new
collaboration as follows: “The frequency of industry cycles, especially in the
semiconductor market, will speed up even more in the future, which makes it ever
so important to cement a continuously growing and evolving collaboration at the
process and planning stage.”
INSIDE BESI
Shaping the Technological Future
Within the Besi Group, quality is top priority not only at product level, but
also in the training of future engineers. The extraordinarily good results, which
the Esec apprentices are regularly achieving, are evidence that training is
conducted at the highest level.
Author // Ruedi Knuesel
Again this year, all seven apprentices completed
their final year training successfully. On average they
obtained a mark of 5.04 (the highest possible mark
being 6). The best final grade of 5.4 was achieved by
Sven Körner, an electronics engineer.
Ruedi Knuesel
is Software Project Manager
and working at Esec in
Cham since 1991. In March
2009 he also took over the
management responsibility
for professional training. His
many years of experience as
a professional computer engineer trainer are ensuring the
continuity and high quality of
the apprenticeship training
programme at new generation
Esec.
Professional training at Esec is based on the proven
practical and customer-orientated concept. Right from
the start, the apprentices get involved in real projects.
On the one hand they can therefore put their theories
into practice, and on the other, their new ideas stream
into the projects. Over the last five years, the Esec
apprentices have demonstrated the programme’s
success beyond any doubt with their above-average
grades and realized projects that are now in place
either within Esec or at customer locations.
We should like to extend our hearty congratulations
to this year’s graduates of the Esec professional
training program:
• Buck Kilian, electronics engineer
• Sven Körner, electronics engineer
• Fidan Bajrami, computer scientist
• Marc Frauenfelder, computer scientist
• Pascal Röösli, design engineer
• Jessica Bieri, business assistant
• Chantal Sapin, business assistant
Esec has been organising professional training for
more than 20 years. From the beginning, emphasis was placed on a varied and interdisciplinary
professional training with a high practical content.
Currently over 20 apprentices are in training
in professions which have priority within Esec:
electrical engineers, computer scientists, design
engineers, business assistants. A future-orientated
and modern professional apprenticeship is, as
always, the most important source of new blood for
a technology-based company. Only with first-class,
trained professionals can leading products emerge,
guaranteeing success on the market. On 9 August
2010, six new youngsters began their professional
apprenticeship with Esec in Cham.
Esec apprentices regularly achieve above average results proving the effectiveness of Esec’s training program.
Spotlights 2010-01 // 19
www.newfsl.com
GLOBAL HEADQUARTERS
YOUR GLOBAL NETWORK
Besi
South East Asia
Esec (Shanghai)
South Korea
Fico B.V.
BE Semiconductor
Esec (Singapore) Pte. Ltd.
Trading Co. Ltd.
Besi Korea Ltd.
Ratio 6
Industries N.V.
1, Science Park Road
1A0706, Singa Plaza Tower
#1204 Downtown Building
6921 RW Duiven
Ratio 6
Singapore Science Park 2
8 Jin Ji Hu Road
22-3 Sunae-dong
The Netherlands
6921 RW Duiven
#03-10, Capricorn Building
Industrial Park
Bundang-gu, Sungnam-si,
Tel. +31 26 319 6100
The Netherlands
Singapore 117528
Suzhou 215021
Gyeonggi-do
Fax +31 26 319 6200
Tel. +31 26 319 45 00
Tel. + 65 6303 7000
P. R. China
Korea 463-825
Fax +31 26 319 45 50
Fax + 65 6873 1133
Tel. +86 512 6767 1037
Tel. +82 31 718 9002
Meco Equipment
Fax +86 512 6767 1022
Fax +82 31 718 9003
Engineers B.V.
(Far East) Pte. Ltd.
Esec (Shanghai)
Taiwan
5151 DR Drunen
40, Jalan Pemimpin #04-06A
Trading Co. Ltd.
Besi Singapore Pte. Ltd.
The Netherlands
Tat Ann Building
Suite 801, Galaxy Center
Taiwan Branch
Tel. +31 416 384 384
Singapore 577185
Building
8F, 276 Minsheng Road
Fax +31 416 384 300
Tel. +65 6255 2722
Caitian Road, Futian District
Hsinchu 30043
Fax +65 6255 6766
Shenzhen 518026
Taiwan
Americas
Guangdong Province
Tel. +886 3 515 3488
Besi North America, Inc.
Besi APac Sdn. Bhd.
P. R. China
Fax +886 3 515 2253
33 East Comstock Drive,
3 Jalan 26/7
Tel. +86 755 8826 4058
Section 26
Fax +86 755 8826 4067
Meco Equipment Engineers
Marconilaan 2
40000 Shah Alam
Suite 7
Europe
Chandler, AZ 85225
Esec Ltd.
USA
Selangor Darul Ehsan
Esec (Shanghai)
Hinterbergstrasse 32
Tel. +1 480 497 6404
Malaysia
Trading Co. Ltd.
6330 Cham
Fax +1 480 497 9104
Tel. +603 5191 1719
Suite 316, Building 2,
Switzerland
Fax +603 5192 9416
No. 8 KeXin Road
Tel. + 41 41 749 5111
Online
West Park of Chengdu
Fax + 41 41 749 5440
[email protected]
China
Hightech Zone
Esec (Shanghai)
Chengdu 610731,
Datacon Technology GmbH
Trading Co. Ltd.
Sichuan Province
Innstrasse 16
2/F (east), No. 32
P. R. China
6240 Radfeld
Standard Building
Tel. +86 28 879 581 59
Austria
No. 76 Fu Te Dong San Lu
Fax +86 28 879 581 59
Tel. +43 5337 6000
Road
www.besi.com
Fax +43 5337 600 66
Waigaoqiao Free Trade Zone
Fico Tooling Leshan Co. Ltd.
Shanghai 200131
High Tech Zone
P. R. China
Leshan 614012, Sichuan
Tel. +86 21 6093 0588
P. R. China
Fax +86 21 6093 0577
Tel. +86 833 259 6385
Fax +86 833 259 6368