Chip-to-Atmosphere
Data Center Cooling Solutions
TM
STULZ and CoolIT Systems have partnered to deliver innovative cooling solutions to the data
center industry. Chip-to-Atmosphere Cooling Solutions allow customers to capture dense heat
loads at the source (inside the servers) and efficiently move it to the outside atmosphere.
Standard DC Precision Cooling
In a typical data center application, standard row mounted air
conditioners provide 100% rack cooling efficiently and reliably.
STULZ row cooling is ideal for low to medium density loads.
Hybrid Chip-to-Atmosphere
TM
In hybrid configurations of typical air cooled servers and liquid
cooled servers, the heat load requiring removal by room air
conditioning is reduced significantly. With Direct Chip Level
Cooling (DCLC) solutions, approximately 70% of the heat load of
the server is cooled at the chip level. The 30% of the rack heat load
not captured by DCLC and the remaining room load is conditioned
by a reduced quantity of room air conditioners. This allows for more
internal rack usage, while using less white space and fewer room
air conditioners to efficiently cool higher density applications.
Micro-DC
STULZ Micro Data Center (Micro DC) offers further reduction in
size for highly dense heat load applications and where space is at
a premium. Micro DC’s provide a completely enclosed, high density
computing environment that is suitable for applications beyond
the typical white space. 70% of the entire server load will be liquid
cooled and only the remaining 30% discharged into the Micro DC
environment will be cooled by an integral precision cooling unit.
Configurations can be purpose built to include various options for
heat rejection.
High
Density
Chip-to-Atmosphere
High
Density
Chip-to-Atmosphere
Data Center Cooling Solutions
High
Density
Chip-to-Atmosphere
Data
DataCenter
CenterCooling
CoolingSolutions
Solutions
TM
CoolIT Systems and STULZ have partnered to offer a full range of data center cooling solutions that actively transport heat from
Chip-to-Atmosphere. STULZ is world-renowned for its precision cooling products which can now be combined with CoolIT’s
industry leading Direct Contact Liquid Cooling (DCLC™) systems. The result is ultra-efficient total thermal solutions that support
CoolIT Systems and STULZ have partnered to offer a full range of data center cooling solutions that actively transport heat from Chip-toany OEM server at even the highest density configurations.
Atmosphere.
STULZand
is world-renowned
for its precision
which
can now
be combined
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CoolIT’s industry
CoolIT Systems
STULZ have partnered
to offer aAir
fullCooling
range ofproducts
data center
cooling
solutions
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heat fromleading
Chip-toDirect
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Cooling
(DCLC™) systems.
result is
total thermal
solutions
support any
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serverindustry
at evenleading
the
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with
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When
integrated,
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DCLC
solutionThe
can
capture
60-80% total
of the
servers’
heat directly
into liquid.
To server
compliment
highest
density
configurations.
Direct
Contact
Liquid
Cooling
(DCLC™)
systems.
result
is ultra-efficient
thermal
solutions
that support
any OEM
at even the
this,
STULZ
precision
cooling products capture the balance of the lower density heat efficiently. A considerable benefit forms
highest
density
configurations.
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CoolIT
Systems’
system can
capture 60-80%
of the servers’
heat and
directly
into
liquid. To compliment
this,for
STULZ
whenintegrated,
the total heat
energy
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both systems
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then
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benefit
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total
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and
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recaptured
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Cooling
products capture
the balance
of the
lower
heator
efficiently.
A considerable
formsbuildings,
when the for
total
heat energy from both
systems
is consolidated,
transportedapproach
outside and
then dissipated
or recaptured
for reuse,
to heat
nearby buildings, for
example.cooling
The
modular
Chip-to-Atmosphere
combines
CoolIT’s
DCLC solutions
with
STULZ-engineered
precision
The modular Chip-to-Atmosphere approach combines CoolIT’s DCLC solutions with STULZ-engineered precision cooling systems to address
systems
to server
address
high densityforserver
for today and tomorrow.
high
density
configurations
today configurations
andcombines
tomorrow.CoolIT’s
The
modular
Chip-to-Atmosphere
approach
DCLC solutions with STULZ-engineered precision cooling systems to address
high density server configurations for today and tomorrow.
1. Server Module
1. Server Module
2. Manifold Module
3. Heat Exchange Module
2. Manifold Module
3. Heat Exchange Module
4. Precision Air Conditioner
4. Precision Air Conditioner
5. Heat Rejection System
5. Heat Rejection System
Optimize Data
Potential
Optimize
DataCenter
Center
Potential
Optimize
Centertechnical
Potential
Work
withthe
theData
STULZ-CoolIT
technical
teams
during
planning
to strategize
unique Chip-to-Atmosphere
solutions
Work
with
STULZ-CoolIT
teams
during
planning
stagesstages
to strategize
unique Chip-to-Atmosphere
solutions that
can be
optimized
for the
efficiency
while minimizing
capital
cost. Once
installed,
feel Once
confident
that
the
complete
solution
is supported
by be
that
canwith
be
optimized
for
the highest
efficiency
while planning
minimizing
capital
installed,
feel
confident
that
the
complete
Work
thehighest
STULZ-CoolIT
technical
teams during
stages
to cost.
strategize
unique
Chip-to-Atmosphere
solutions
that can
the
STULZisworldwide
service
organization
forminimizing
years of
trouble-free
dataoperation.
center
cooling
solutions
will enable by
optimized
for the highest
efficiency
capitalorganization
cost.operation.
Once installed,
confident that
the
complete
solution
is supported
solution
supported
by the
STULZwhile
worldwide
service
forChip-to-Atmosphere
yearsfeel
of trouble-free
Chip-to-Atmosphere
customers
to benefit
from
immediate
OPEX results
with minimal
footprint,
even
in the
most
compute-heavy
environments.
thecenter
STULZ
worldwide
service
organization
for years
oftotrouble-free
operation.
Chip-to-Atmosphere
dataminimal
center cooling
solutions
enable
data
cooling
solutions
will
enable
customers
benefit
from
immediate
OPEX
results with
footprint,
even inwillthe
customers to benefit from immediate OPEX results with minimal footprint, even in the most compute-heavy environments.
most compute-heavy environments.
Performance
Facilitate
peak performance
Performance
for Facilitate
higher powered
or
peak performance
overclocked
for higher processors
powered or
overclocked processors
Efficiency
Benefit
from a significant
Efficiency
reduction
totala data
center
Benefitinfrom
significant
energy
consumed
reduction
in total data center
energy consumed
Density
Enable
100% utilization of
Density
rackEnable
and data
center
spaces
100%
utilization
of
rack and data center spaces
Modular
Customized
Modular module
configurations
fit any unique
Customizedtomodule
application
or environment
configurations
to fit any unique
application or environment
Scalability
Meet
fluctuating demands
Scalability
through
ability todemands
modify
Meet the
fluctuating
data
center the
capacity
through
ability to modify
data center capacity
Savings
Generate
immediate and
Savings
measurable
benefits
GenerateOPEX
immediate
and
andmeasurable
reduce overall
TCO
OPEX
benefits
and reduce overall TCO
Those interested in incorporating Chip-to-Atmosphere solutions into their projects should contact their local CoolIT Systems or STULZ sales
representative.
Alternatively,
visit www.coolitsystems.com
www.stulz-usa.com
for more
information.
Those interested
in incorporating
Chip-to-Atmosphere or
solutions
into their projects
should
contact their local CoolIT Systems or STULZ sales
CoolIT
STULZ
Air Technology
Systems,
Inc. (STULZ USA)
representative.
Alternatively,
visit www.coolitsystems.com
or www.stulz-usa.com
forSystems
more information.
1572 Tilco Drive | Frederick, MD 21704
Tel.: 301.620.2033 | Fax: 301.662.5487
2928 Sunridge Way NE #10 | Calgary, Alberta T1Y 7H9
Tel: 403.235.4895 | Fax: 403.770.8306
[email protected] | www.stulz-usa.com
[email protected] | www.coolitsystems.com
Technical documentation subject to change without notice QC-CTA0102