PRODUCT / PROCESS CHANGE NOTIFICATION (PCN) PCN

PRODUCT / PROCESS CHANGE NOTIFICATION (PCN)
PCN Number:
SC163003A (Revised 09/20/16)
Notification Subject:
Final Notice: Implement Microchip Part Aging Policy,
Label and Packing Changes for Atmel Products.
PCN Issue Date:
September 5, 2016
Change Category:
Logistics
PCN Status:
Final notification
Microchip/Atmel Parts
Affected:
This change applies to virtually all Atmel products.
Description of Change:
Implement Microchip Part Aging Policy, Label and
Packing Changes for Atmel Products.
Change to Part Aging
Change to Combination Rules
Change to Packing Method
Change to Shipping Boxes
Change to Inner/Outer Shipping Labels
Change to MSL 1 Packing Procedure (tube and tape and
reel packages only)
Pre Change:
Using Atmel’s packing process.
Post Change:
Using Microchip’s packing process.
Pre and Post Change
Summary:
Part Aging
Policy
Lot
Combination
Rules
PRE CHANGE
(Atmel)
Ship parts up to 36
months (3 years)
for commercial
products and 12
months (1 year) for
automotive
products
No recertification.
POST CHANGE
(Microchip)
Microchip may ship
parts up to 48
months (4 years).
Various
combination rules
Consistent
combination rules
Recertification
completed on parts
older than 24
months (2 years).
ATMEL San Jose  1600 Technology Dr, San Jose  CA 95110 USA
QF-8004 Rev. 18
07/21/16
Page 1 of 3
PCN Ref. Number [SC163003A]
Desiccants
Humidity
Indicator Card
(HIC)
MSL Caution
Label
Shipping Boxes
Inner/Outer
Shipping Label
MSL 1 Packing
Procedure
(tube and tape
and reel
packages only)
Clay or Silica Gel
Desiccants
Clay desiccants only
Only Cobalt
Dichloride Free
Free of all Cobalt
compounds
Atmel standard
MSL caution label
information
Calculated shelf life
in shield bag is 12
months
MCHP standard
MSL caution label
information
Calculated shelf life
in shield bag is 24
months
Includes the Atmel
Logo
Includes Microchip
Logo
No ‘DO NOT
DROP’ print/stamp
in all boxes
With ‘DO NOT
DROP’ print/stamp
in all boxes
Atmel branded
labels
Microchip branded
labels
Without 2D bar
code
With 2D barcode
With Inner box and
existing outer box
dimensions.
Without inner box
and new box
dimensions that
support the inner
box removal.
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve productivity and on time delivery performance
as part of the integration of Atmel and Microchip
Change Implementation
Status:
In progress
Estimated Implementation November 1, 2016
Date:
NOTE: The earliest implementation date is the earliest
date that we may implement any combination of the
changes listed in this PCN as we will not implement any
of the proposed changes prior to this date. After the
earliest implementation date these changes may occur to
any product over the course of many months depending
on inventory levels and business conditions.
ATMEL San Jose  1600 Technology Dr, San Jose  CA 95110 USA
QF-8004 Rev. 18
07/21/16
Page 2 of 3
PCN Ref. Number [SC163003A]
Time Table Summary:
September 2016
Workweek
36
Final PCN Issue Date
37
38
39
->
November 2016
45
46
47
Estimated
Implementation Date
X
Method to Identify Change:
Traceability, label, inner and outer boxes
Qualification Report:
Solderability Assessment
Data Sheet:
To view the applicable data sheet please go to the
document library found on atmel.com
Revision History:
48
X
September 5, 2016: Issued final notification.
September 20, 2016: Added changes to the MSL caution
label and updated shipping boxes changes to add ‘DO
NOT DROP’ print/stamp in all boxes. Added new box
dimensions that replace the inner box removal.
Please contact your local Microchip or Atmel Sales Office or Distributor with
questions or concerns regarding this notification.
ATMEL San Jose  1600 Technology Dr, San Jose  CA 95110 USA
QF-8004 Rev. 18
07/21/16
Page 3 of 3
PCN Ref. Number [SC163003A]
PCN # SC163003A
CCB # 2733
Atmel Products Packing
Pre and Post Changes
Rev. A
Summary of Changes
Items Changing
Earliest
Implementation Date
Slide No/s.
Part Aging
November 1, 2016
3
Combination Rules
November 1, 2016
4-6
Desiccant
November 1, 2016
7
Humidity Indicator Card (HIC)
November 1, 2016
8
MSL Caution Label
November 1, 2016
9
Shipping Boxes
November 1, 2016
10
Inner Label
November 1, 2016
11
Outer Label
November 1, 2016
12
MSL 1 packing procedure (tube
and tape and reel only)
November 1, 2016
NA
Box dimensions for TUBE
MSL-1 Packing
November 1, 2016
13
Box dimensions for REEL
MSL-1 Packing
November 1, 2016
14
2
Part Aging
PRE CHANGE
Atmel may ship parts to customer as
following
• Commercial: 36 months (3 years) old.
• Automotive: 12 months (1 year) old.
POST CHANGE
Microchip may ship parts up to 48
months (4 years). Parts older than 24
months (2 years) old will be recertified
prior to shipment. The requirement will
be applied for both automotive and
commercial.
Reason: Material sets used to
manufacture integrated circuits have
shown no degradation in solderability,
moisture sensitivity or reliability of
products after 48 months.
For more information related to Microchip’s part aging strategy, please visit the
following link on our website: Component Age Policy
3
Combination Rules
Packing
Media
PRE CHANGE
PRE CHANGE
PRE CHANGE
(Memory)
(MCU)
(RFA)
• 1 Device.
• 1 Device.
• 1 Device.
• 1 Date code.
• MSL1:
• Single Chip.
• 1 Lot.
• 1 Date code.
• 2 Date code.
• 1 Assembly Site.
• 1 Lot.
• 5 Lots.
• 1 Test Site.
• MSL3:
• Multi Chips.
• 1 Fab Revision.
• 2 Date code.
• 2 Date code.
• Same
• 2 Lot.
• No limit to number
Material/BOM ID. • 1 Assembly site.
of production lots
follow date code
• Same Process • No restriction on test
Tube
Flow.
sites.
• 1 Fab Revision.
• 1 Die Revision.
• 1 Die ID.
• Same
Material/BOM ID.
• Same Process
Flow.
• Different D/C
combined within 52
weeks.
combination rule.
• No restriction on
Assembly site.
• No restriction on test
sites.
• 1 Fab Revision.
• 1 Die ID.
• Different D/C combined
within 52 weeks.
POST
CHANGE
• 1 Device.
• 1 Date code.
• No limit to
number of
production lots
follow date code
combination
rule.
• 1 Assembly Site.
• 1 Test Site.
• 1 Wire Material.
• No limit for Die
Revision, Die
ID, Fab
Revision, and
test flow.
4
Combination Rules
Packing
Media
PRE CHANGE
PRE CHANGE
PRE CHANGE
(Memory)
(MCU)
(RFA)
• 1 Device.
• 1 Device.
• 1 Device.
• 1 Date code.
• MSL1:
• Single Chip.
• 1 Lot.
• 1 Date code.
• 2 Date code.
• 1 Assembly Site.
• 1 Lot.
• 5 Lots.
• 1 Test Site.
• MSL3:
• Multi Chips.
• 1 Fab Revision.
• 2 Date code.
• 2 Date code.
• Same
• 2 Lot.
• No limit to number
Material/BOM ID. • 1 Assembly site.
of production lots
follow date code
• Same Process • No restriction on test
Tray
Flow
sites.
• 1 Fab Revision.
• 1 Die Revision.
• 1 Die ID.
• Same
Material/BOM ID.
• Same Process
Flow.
• Different D/C
combined within 52
weeks.
combination rule.
• No restriction on
Assembly site.
• No restriction on test
sites.
• 1 Fab Revision.
• 1 Die ID.
• Different D/C combined
within 52 weeks.
POST
CHANGE
• 1 Device.
• 3 Date codes.
• No limit to
number of
production lots
follow date code
combination
rule.
• 1 Assembly Site
• 1 Test Site.
• 1 Wire Material.
• No limit for Die
Revision, Die
ID, Fab
Revision,
Different D/C,
and test flow.
5
Combination Rules
Packing
Media
Tape and
Reel
PRE CHANGE
PRE CHANGE
PRE CHANGE
(Memory)
(MCU)
(RFA)
• 1 Device.
• 1 Device.
• MSL1,3:
• Single Chip.
• 2 Date code.
• 2 Date code.
code.
• 2 Lots.
• 5 Lots.
• 2 Lots.
• 1 Assembly site.
• Multi Chips.
• 1 Assembly site. • No restriction on test
• 2 Date code.
• No restriction on sites.
• No limit to number
test sites.
of production lots
• 1 Fab Revision.
follow date code
• 1 Fab Revision. • 1 Die Revision.
combination rule.
• 1 Die Revision. • 1 Die ID.
• Same
• Same
• No restriction on
POST
CHANGE
• 1 Device.
• MSL1,2,3:
• 2 Date
• 1 Device.
• 3 Date codes.
• No limit to
Material/BOM ID.
• Same Process
Flow.
• Different D/C
combined within
52 weeks.
number of
production lots
follow date code
combination
rule.
• 1 Assembly Site.
• 1 Test Site.
• 1 Wire Material.
• No limit for Die
Revision, Die
ID, Fab
Revision,
Different D/C,
and test flow.
Material/BOM ID.
• Same Process
Flow.
• Different D/C
combined within 52
weeks.
Assembly site.
• No restriction on test
sites.
• 1 Fab Revision.
• 1 Die ID.
• Different D/C combined
within 52 weeks.
6
Desiccant
PRE CHANGE
Clay or Silica Gel desiccants
POST CHANGE
Clay desiccants only
Clay
Silica Gel
7
Humidity Indicator Card
(HIC)
PRE CHANGE
HIC: 3 dots, and Cobalt
Dichloride Free Only
POST CHANGE
HIC: 3 dots, and Free of
all Cobalt Compounds
8
MSL Label
PRE CHANGE
POST CHANGE
ATMEL MSL Label
MCHP MSL Label
Sample Only
Sample Only
Atmel standard MSL caution label information.
Calculated shelf life in shield bag is 12 months.
MCHP standard MSL caution label information.
Calculated shelf life in shield bag is 24 months.
9
Shipping Boxes
PRE CHANGE
ATMEL Logo
POST CHANGE
MCHP Logo and ‘DO NOT
DROP’ print
Sample Only
Sample Only
10
Inner Label
PRE CHANGE
ATMEL Label
POST CHANGE
MCHP Label
11
Outer Label
PRE CHANGE
ATMEL Label
POST CHANGE
MCHP Label
12
Box dimensions for TUBE
MSL-1 Packing
POST change (Without inner box)
Shipping Carton
Inner box
Dimension
W x L x H (cm)
15.0 x 71.5 x 5.0
Dimension
W x L x H (cm)
Number of
BAG per carton
1 Full bag
17.0 x 65.0 x 8.0
1 Full bag
15.5 x 62.0 x 14.0
2 Full bags
22.5 x 63.0 x 16.5
3 Full bags
32.0 x 63.0 x 15.5
4 Full bags
36.0 x 63.0 x 16.5
5 Full bags
15.0 x 64.0 x 5.5
1 Full bag
15.0 x 64.0 x 10.0
2 Full bags
15.0 x 64.0 x 14.0
No Inner box
3 Full bags
28.0 x 63.0 x 11.0
4 Full bags
28.0 x 63.0 x 15.5
6 Full bags
28.0 x 63.0 x 20.0
8 Full bags
18.0 x 37.5 x 4.4
1 Partial bag
18.0 x 37.5 x 7.0
1 Full bag
18.0 x 37.0 x 16.0
3 Full bags
35.5 x 35.5 x 16.5
4 Full bags
1 Partial bag with
Small volume
8.0 x 65.0 x 5.0
13
Box dimensions for REEL
MSL-1 Packing
POST change (Without inner box)
Shipping Carton
Dimension
W x L x H (cm)
Inner box
Dimension
WxLxH
(cm)
Number of
Reel Dia.
BAG
per carton
21.0 x 21.0 x 5.5
7”
3 bags
21.0 x 21.0 x 8.0
7”
5 bags
16.0 x 21.5 x 21.0
7”
10 bags
21.0 x 31.0 x 21.0
7”
20 bags
7”
52 bags
13”
6 – 18 bags
35.5 x 35.5 x 2.8
13”
1 bag
35.5 x 35.5 x 4.0
13”
1 – 3 bags
35.5 x 35.5 x 6.0
13”
1 – 4 bags
35.5 x 35.5 x 16.5
13”
2 – 10 bags
32.0 x 63.0 x 15.5
36.5 x 38.0 x 39.5
No Inner
box
14
FrequentlyAskedQuestions(FAQ)
ContactingMicrochip:MicrochiphasSalesOfficesWorldwide.Tofindyourlocaloffice,
pleasevisitourwebsiteat:MicrochipSalesandDistribution.Alsonotethatyourcurrent
AtmelcontactswillbemovingtotheMicrochipemailsystemoverthecomingweeks
thereforetheiremailaddresswillchangetofirstname.lastname@microchip.com
Youmayalsocontactthefollowingindividualswithinyourgeography:
Americas:SoniaMunoz([email protected])
Europe:InaZeeck([email protected])
Asia:KritaNelapudi([email protected])
GreaterChina:ElaineShen([email protected])
Distribution:JenniferInnella([email protected])
OpenDirectOrderswithAtmel:OpenOrderswillbetransferredtotheMicrochip
SystemsonoraboutJanuary01,2017.Customerswillbecontactedbylocalsales
officespriortothetransfertoensureasmoothtransition.Allorderswillbetransferred
inUS$currency.ThedetailsofthecurrencyconversionwillbeoutlinedbyyourlocalISR
contactsclosertothetransferdate.
MOQ:Ordersmustbeplacedinmultiplesoftray,tube,bag,orreelsize.Additionally,
theremaybeaPurchaseOrder/OrderLineminimum.ExistingAtmelordersbeing
convertedtoMicrochiporderswillbesubjecttotheMicrochipbasequantitymultiples
andMicrochipPurchaseOrder/OrderLineitemminimum.
Shouldchangesberequiredwhenmigratingopenbacklog,eachcustomerwillbe
notifiedwithfulldetailsbyyourlocalISRcontact.
OrderAcknowledgement:MicrochipprovidesAcknowledgementsforallnewDirect
ordersenteredandforeachchangemadetoanexistingDirectorder.Thisdocumentis
typicallyprovidedviaemail.OnceanexistingorderistransferredfromtheAtmel
systemtotheMicrochipsystemanOrderAcknowledgementwillthenbesent.
CustomersorDistributorsthathaveanEDIconnectionwillreceiveeitheran855
acknowledgement(US&Asia)orORDRSPacknowledgement(Europe)viaEDI.
Cancel/Reschedule:ThetablebelowprovidesinformationontheMicrochip
Cancel/Reschedulepolicy:
CatalogPNRestriction
Cancellation
CRDPushOut
CRDPullIn
Allowed
Standard
>30daysPRD
>30daysPRD
Y
Y
Custom,NonStandard
>60daysPRD
>60daysPRD
Y
Y
QS9000
>60daysPRD
>60daysPRD
Y
Y
N/A
N/A
Y
N
NCNR
CRDPush
OutAllowed
*CRD–CustomerRequestedDeliveryDate
*PRD–MicrochipAnticipatedDeliveryDate
AdvancedShipNotice(ASN):WhenplacingaDirectOrderwithMicrochip,customers
canelecttoreceiveanAdvanceShipNotice.Thisdocumentadvisesthatyourorderis
preparedtoshiptothelocationidentifiedonyourPurchaseOrder.Thisoptionwillbe
discussedwithyoubyyourlocalMicrochipContactpriortothegolivedateinJanuary.
ManagingProductRequirementsduringtheTransition:TheAtmelorderentryand
shipmentssystemswilltransitiontoMicrochipsystemsonoraboutJanuary01,2017.
Untilthattime,pleasecontinuetomanageyourproductrequirementsasyoudotoday.
IfchangeshavebeenmadewithyourlocalRepresentativeSalesOffice,pleaseseethe
MicrochipsectionContactingMicrochipfromabove.Microchipwillhavea‘Quiet
Period’thatwilloccurforseveraldayspriortothefinalintegrationsothatwecan
importallexistingPurchaseOrdersintooursystem.DuringthattimewewillnotAccept
NewOrders,Modify/CancelExistingOrders,orShipProduct.Pleasecontactyourlocal
salesofficewithanyquestionsorconcerns.
ShippingandInvoicingafterthetransition:AfterJanuary1,2017,allproductswillbe
shippedandinvoicedfromMicrochip.PleasealertyourReceivingandAccounts
Payabledepartmentsofthischange;inourexperience,someclientsmustcancel
existingbacklogandthenre-issueanewP.O.toMicrochip.Overthecomingweeks
Microchipwillcontactyoutodiscussallyourneedstoinsurethereisnointerruptionin
yoursupplychain.
Vendor/SupplierCode:Ifyoursystemrequiresanewcodetosupportorderplacement
toMicrochipandreceiveinMicrochipshipments,pleasearrangeasneeded.
ShippingLabels,BoxesandPackingMethods:Labels,BoxesandPackingmethodswill
bestandardizedtoMicrochip’scurrentprocesses.Specialshippinglabelsforspecial
productssuchasprogramingproducts,specialtesting,etc.willadheretothestandard
Microchipprocessovertime.
Lots,TraceCodes,DateCodes,PartAging,andShelfLife:StandardMicrochipmethods
forcombiningproductionlots,tracecodesanddatecodesintotubes,trays,andreel
mediawillapplyaswellasstandardMicrochipPartAgingandShelfLifePolicies.
Microchipqualitydocumentsandpoliciesincludingpartagingpolicyarefoundonour
website.QualityDocumentsandPolicies
PaymentTerms:StandardpaymenttermsareN30
Terms&Conditions:MicrochipSalesaresubjecttothecompany’sTermsand
Conditions(“T&C”).MicrochipT&Cdoesdifferslightlydependingonwhetherthe
customerisintheEuropeanUnionorelsewhereintheworldandwhethertheyare
purchasingDirectorthroughmicrochipDIRECT.MicrochipTermsandConditionsare
locatedonourwebsite.MicrochipTermsandConditionsofSaleandattachedin
attachments;A,B,C.
Product/ProcessChangeNotification(PCN)afterthetransition:ShortlyafterJanuary
1,2017standardMicrochipmethodsfornotifyingcustomersaboutprocessorproduct
changesandendoflifeproducts(EOL)willapply.Partofthestandardmethodincludes
aPCNemailservicethatweexpecttobeavailabletoAtmelcustomersinearlyin2017.
Onceavailable,customerswhowishtoreceivePCN’sviaemailareexpectedtoregister
forPCNemailserviceonourPCNwebpage.Informationabouthowandwhento
registerwillbeprovidedinAtmelintegrationPCNs.TheAtmelPCNsystemwillcontinue
tobeusedinconjunctionwithapartialMicrochipPCNsystemuntilthefullMicrochip
systemcansupportAtmelproductsinDecemberorJanuary(reviewhowintheAtmel
IntegrationPCN’sbelow).TheAtmelPCNsystemwillbeterminatedafterthetransition
toMicrochipsystemsiscomplete.InformationaboutMicrochip’sPCNsystemcanbe
foundonthislink:MicrochipPCNWebsite
AtmelIntegrationPCN’s:UntilfullintegrationtoMicrochip’sPCNsystemallPCN’s
relatedtotheintegrationwillbeprovidedusingtheAtmelPCNsystemandcanalsobe
foundatthisMicrochipwebsite:ProductChangeNotifications.IntegrationPCNsfor
Atmelproductsmaybeissuedforthefollowingchanges;orderingpartnumbering
convention,shippinglabels,shippingboxes,packingmethods,partaging/shelflife,top
marking,manufacturingsite,BillofMaterial(BOM),Silicon,andEOLamongothers.
RoHSInformation:CanbefoundontheMicrochipWebsiteunderRoHSPBFree,RoHS
DeviceSearch.Anemailwillbegeneratedfromthesystemwithallofthepertinent
informationregardingthedevicesearch.
http://www.microchip.com/wwwproducts/Rohs/