PRODUCT / PROCESS CHANGE NOTIFICATION (PCN) PCN Number: SC163003A (Revised 09/20/16) Notification Subject: Final Notice: Implement Microchip Part Aging Policy, Label and Packing Changes for Atmel Products. PCN Issue Date: September 5, 2016 Change Category: Logistics PCN Status: Final notification Microchip/Atmel Parts Affected: This change applies to virtually all Atmel products. Description of Change: Implement Microchip Part Aging Policy, Label and Packing Changes for Atmel Products. Change to Part Aging Change to Combination Rules Change to Packing Method Change to Shipping Boxes Change to Inner/Outer Shipping Labels Change to MSL 1 Packing Procedure (tube and tape and reel packages only) Pre Change: Using Atmel’s packing process. Post Change: Using Microchip’s packing process. Pre and Post Change Summary: Part Aging Policy Lot Combination Rules PRE CHANGE (Atmel) Ship parts up to 36 months (3 years) for commercial products and 12 months (1 year) for automotive products No recertification. POST CHANGE (Microchip) Microchip may ship parts up to 48 months (4 years). Various combination rules Consistent combination rules Recertification completed on parts older than 24 months (2 years). ATMEL San Jose 1600 Technology Dr, San Jose CA 95110 USA QF-8004 Rev. 18 07/21/16 Page 1 of 3 PCN Ref. Number [SC163003A] Desiccants Humidity Indicator Card (HIC) MSL Caution Label Shipping Boxes Inner/Outer Shipping Label MSL 1 Packing Procedure (tube and tape and reel packages only) Clay or Silica Gel Desiccants Clay desiccants only Only Cobalt Dichloride Free Free of all Cobalt compounds Atmel standard MSL caution label information Calculated shelf life in shield bag is 12 months MCHP standard MSL caution label information Calculated shelf life in shield bag is 24 months Includes the Atmel Logo Includes Microchip Logo No ‘DO NOT DROP’ print/stamp in all boxes With ‘DO NOT DROP’ print/stamp in all boxes Atmel branded labels Microchip branded labels Without 2D bar code With 2D barcode With Inner box and existing outer box dimensions. Without inner box and new box dimensions that support the inner box removal. Impacts to Data Sheet: None Change Impact: None Reason for Change: To improve productivity and on time delivery performance as part of the integration of Atmel and Microchip Change Implementation Status: In progress Estimated Implementation November 1, 2016 Date: NOTE: The earliest implementation date is the earliest date that we may implement any combination of the changes listed in this PCN as we will not implement any of the proposed changes prior to this date. After the earliest implementation date these changes may occur to any product over the course of many months depending on inventory levels and business conditions. ATMEL San Jose 1600 Technology Dr, San Jose CA 95110 USA QF-8004 Rev. 18 07/21/16 Page 2 of 3 PCN Ref. Number [SC163003A] Time Table Summary: September 2016 Workweek 36 Final PCN Issue Date 37 38 39 -> November 2016 45 46 47 Estimated Implementation Date X Method to Identify Change: Traceability, label, inner and outer boxes Qualification Report: Solderability Assessment Data Sheet: To view the applicable data sheet please go to the document library found on atmel.com Revision History: 48 X September 5, 2016: Issued final notification. September 20, 2016: Added changes to the MSL caution label and updated shipping boxes changes to add ‘DO NOT DROP’ print/stamp in all boxes. Added new box dimensions that replace the inner box removal. Please contact your local Microchip or Atmel Sales Office or Distributor with questions or concerns regarding this notification. ATMEL San Jose 1600 Technology Dr, San Jose CA 95110 USA QF-8004 Rev. 18 07/21/16 Page 3 of 3 PCN Ref. Number [SC163003A] PCN # SC163003A CCB # 2733 Atmel Products Packing Pre and Post Changes Rev. A Summary of Changes Items Changing Earliest Implementation Date Slide No/s. Part Aging November 1, 2016 3 Combination Rules November 1, 2016 4-6 Desiccant November 1, 2016 7 Humidity Indicator Card (HIC) November 1, 2016 8 MSL Caution Label November 1, 2016 9 Shipping Boxes November 1, 2016 10 Inner Label November 1, 2016 11 Outer Label November 1, 2016 12 MSL 1 packing procedure (tube and tape and reel only) November 1, 2016 NA Box dimensions for TUBE MSL-1 Packing November 1, 2016 13 Box dimensions for REEL MSL-1 Packing November 1, 2016 14 2 Part Aging PRE CHANGE Atmel may ship parts to customer as following • Commercial: 36 months (3 years) old. • Automotive: 12 months (1 year) old. POST CHANGE Microchip may ship parts up to 48 months (4 years). Parts older than 24 months (2 years) old will be recertified prior to shipment. The requirement will be applied for both automotive and commercial. Reason: Material sets used to manufacture integrated circuits have shown no degradation in solderability, moisture sensitivity or reliability of products after 48 months. For more information related to Microchip’s part aging strategy, please visit the following link on our website: Component Age Policy 3 Combination Rules Packing Media PRE CHANGE PRE CHANGE PRE CHANGE (Memory) (MCU) (RFA) • 1 Device. • 1 Device. • 1 Device. • 1 Date code. • MSL1: • Single Chip. • 1 Lot. • 1 Date code. • 2 Date code. • 1 Assembly Site. • 1 Lot. • 5 Lots. • 1 Test Site. • MSL3: • Multi Chips. • 1 Fab Revision. • 2 Date code. • 2 Date code. • Same • 2 Lot. • No limit to number Material/BOM ID. • 1 Assembly site. of production lots follow date code • Same Process • No restriction on test Tube Flow. sites. • 1 Fab Revision. • 1 Die Revision. • 1 Die ID. • Same Material/BOM ID. • Same Process Flow. • Different D/C combined within 52 weeks. combination rule. • No restriction on Assembly site. • No restriction on test sites. • 1 Fab Revision. • 1 Die ID. • Different D/C combined within 52 weeks. POST CHANGE • 1 Device. • 1 Date code. • No limit to number of production lots follow date code combination rule. • 1 Assembly Site. • 1 Test Site. • 1 Wire Material. • No limit for Die Revision, Die ID, Fab Revision, and test flow. 4 Combination Rules Packing Media PRE CHANGE PRE CHANGE PRE CHANGE (Memory) (MCU) (RFA) • 1 Device. • 1 Device. • 1 Device. • 1 Date code. • MSL1: • Single Chip. • 1 Lot. • 1 Date code. • 2 Date code. • 1 Assembly Site. • 1 Lot. • 5 Lots. • 1 Test Site. • MSL3: • Multi Chips. • 1 Fab Revision. • 2 Date code. • 2 Date code. • Same • 2 Lot. • No limit to number Material/BOM ID. • 1 Assembly site. of production lots follow date code • Same Process • No restriction on test Tray Flow sites. • 1 Fab Revision. • 1 Die Revision. • 1 Die ID. • Same Material/BOM ID. • Same Process Flow. • Different D/C combined within 52 weeks. combination rule. • No restriction on Assembly site. • No restriction on test sites. • 1 Fab Revision. • 1 Die ID. • Different D/C combined within 52 weeks. POST CHANGE • 1 Device. • 3 Date codes. • No limit to number of production lots follow date code combination rule. • 1 Assembly Site • 1 Test Site. • 1 Wire Material. • No limit for Die Revision, Die ID, Fab Revision, Different D/C, and test flow. 5 Combination Rules Packing Media Tape and Reel PRE CHANGE PRE CHANGE PRE CHANGE (Memory) (MCU) (RFA) • 1 Device. • 1 Device. • MSL1,3: • Single Chip. • 2 Date code. • 2 Date code. code. • 2 Lots. • 5 Lots. • 2 Lots. • 1 Assembly site. • Multi Chips. • 1 Assembly site. • No restriction on test • 2 Date code. • No restriction on sites. • No limit to number test sites. of production lots • 1 Fab Revision. follow date code • 1 Fab Revision. • 1 Die Revision. combination rule. • 1 Die Revision. • 1 Die ID. • Same • Same • No restriction on POST CHANGE • 1 Device. • MSL1,2,3: • 2 Date • 1 Device. • 3 Date codes. • No limit to Material/BOM ID. • Same Process Flow. • Different D/C combined within 52 weeks. number of production lots follow date code combination rule. • 1 Assembly Site. • 1 Test Site. • 1 Wire Material. • No limit for Die Revision, Die ID, Fab Revision, Different D/C, and test flow. Material/BOM ID. • Same Process Flow. • Different D/C combined within 52 weeks. Assembly site. • No restriction on test sites. • 1 Fab Revision. • 1 Die ID. • Different D/C combined within 52 weeks. 6 Desiccant PRE CHANGE Clay or Silica Gel desiccants POST CHANGE Clay desiccants only Clay Silica Gel 7 Humidity Indicator Card (HIC) PRE CHANGE HIC: 3 dots, and Cobalt Dichloride Free Only POST CHANGE HIC: 3 dots, and Free of all Cobalt Compounds 8 MSL Label PRE CHANGE POST CHANGE ATMEL MSL Label MCHP MSL Label Sample Only Sample Only Atmel standard MSL caution label information. Calculated shelf life in shield bag is 12 months. MCHP standard MSL caution label information. Calculated shelf life in shield bag is 24 months. 9 Shipping Boxes PRE CHANGE ATMEL Logo POST CHANGE MCHP Logo and ‘DO NOT DROP’ print Sample Only Sample Only 10 Inner Label PRE CHANGE ATMEL Label POST CHANGE MCHP Label 11 Outer Label PRE CHANGE ATMEL Label POST CHANGE MCHP Label 12 Box dimensions for TUBE MSL-1 Packing POST change (Without inner box) Shipping Carton Inner box Dimension W x L x H (cm) 15.0 x 71.5 x 5.0 Dimension W x L x H (cm) Number of BAG per carton 1 Full bag 17.0 x 65.0 x 8.0 1 Full bag 15.5 x 62.0 x 14.0 2 Full bags 22.5 x 63.0 x 16.5 3 Full bags 32.0 x 63.0 x 15.5 4 Full bags 36.0 x 63.0 x 16.5 5 Full bags 15.0 x 64.0 x 5.5 1 Full bag 15.0 x 64.0 x 10.0 2 Full bags 15.0 x 64.0 x 14.0 No Inner box 3 Full bags 28.0 x 63.0 x 11.0 4 Full bags 28.0 x 63.0 x 15.5 6 Full bags 28.0 x 63.0 x 20.0 8 Full bags 18.0 x 37.5 x 4.4 1 Partial bag 18.0 x 37.5 x 7.0 1 Full bag 18.0 x 37.0 x 16.0 3 Full bags 35.5 x 35.5 x 16.5 4 Full bags 1 Partial bag with Small volume 8.0 x 65.0 x 5.0 13 Box dimensions for REEL MSL-1 Packing POST change (Without inner box) Shipping Carton Dimension W x L x H (cm) Inner box Dimension WxLxH (cm) Number of Reel Dia. BAG per carton 21.0 x 21.0 x 5.5 7” 3 bags 21.0 x 21.0 x 8.0 7” 5 bags 16.0 x 21.5 x 21.0 7” 10 bags 21.0 x 31.0 x 21.0 7” 20 bags 7” 52 bags 13” 6 – 18 bags 35.5 x 35.5 x 2.8 13” 1 bag 35.5 x 35.5 x 4.0 13” 1 – 3 bags 35.5 x 35.5 x 6.0 13” 1 – 4 bags 35.5 x 35.5 x 16.5 13” 2 – 10 bags 32.0 x 63.0 x 15.5 36.5 x 38.0 x 39.5 No Inner box 14 FrequentlyAskedQuestions(FAQ) ContactingMicrochip:MicrochiphasSalesOfficesWorldwide.Tofindyourlocaloffice, pleasevisitourwebsiteat:MicrochipSalesandDistribution.Alsonotethatyourcurrent AtmelcontactswillbemovingtotheMicrochipemailsystemoverthecomingweeks thereforetheiremailaddresswillchangetofirstname.lastname@microchip.com Youmayalsocontactthefollowingindividualswithinyourgeography: Americas:SoniaMunoz([email protected]) Europe:InaZeeck([email protected]) Asia:KritaNelapudi([email protected]) GreaterChina:ElaineShen([email protected]) Distribution:JenniferInnella([email protected]) OpenDirectOrderswithAtmel:OpenOrderswillbetransferredtotheMicrochip SystemsonoraboutJanuary01,2017.Customerswillbecontactedbylocalsales officespriortothetransfertoensureasmoothtransition.Allorderswillbetransferred inUS$currency.ThedetailsofthecurrencyconversionwillbeoutlinedbyyourlocalISR contactsclosertothetransferdate. MOQ:Ordersmustbeplacedinmultiplesoftray,tube,bag,orreelsize.Additionally, theremaybeaPurchaseOrder/OrderLineminimum.ExistingAtmelordersbeing convertedtoMicrochiporderswillbesubjecttotheMicrochipbasequantitymultiples andMicrochipPurchaseOrder/OrderLineitemminimum. Shouldchangesberequiredwhenmigratingopenbacklog,eachcustomerwillbe notifiedwithfulldetailsbyyourlocalISRcontact. OrderAcknowledgement:MicrochipprovidesAcknowledgementsforallnewDirect ordersenteredandforeachchangemadetoanexistingDirectorder.Thisdocumentis typicallyprovidedviaemail.OnceanexistingorderistransferredfromtheAtmel systemtotheMicrochipsystemanOrderAcknowledgementwillthenbesent. CustomersorDistributorsthathaveanEDIconnectionwillreceiveeitheran855 acknowledgement(US&Asia)orORDRSPacknowledgement(Europe)viaEDI. Cancel/Reschedule:ThetablebelowprovidesinformationontheMicrochip Cancel/Reschedulepolicy: CatalogPNRestriction Cancellation CRDPushOut CRDPullIn Allowed Standard >30daysPRD >30daysPRD Y Y Custom,NonStandard >60daysPRD >60daysPRD Y Y QS9000 >60daysPRD >60daysPRD Y Y N/A N/A Y N NCNR CRDPush OutAllowed *CRD–CustomerRequestedDeliveryDate *PRD–MicrochipAnticipatedDeliveryDate AdvancedShipNotice(ASN):WhenplacingaDirectOrderwithMicrochip,customers canelecttoreceiveanAdvanceShipNotice.Thisdocumentadvisesthatyourorderis preparedtoshiptothelocationidentifiedonyourPurchaseOrder.Thisoptionwillbe discussedwithyoubyyourlocalMicrochipContactpriortothegolivedateinJanuary. ManagingProductRequirementsduringtheTransition:TheAtmelorderentryand shipmentssystemswilltransitiontoMicrochipsystemsonoraboutJanuary01,2017. Untilthattime,pleasecontinuetomanageyourproductrequirementsasyoudotoday. IfchangeshavebeenmadewithyourlocalRepresentativeSalesOffice,pleaseseethe MicrochipsectionContactingMicrochipfromabove.Microchipwillhavea‘Quiet Period’thatwilloccurforseveraldayspriortothefinalintegrationsothatwecan importallexistingPurchaseOrdersintooursystem.DuringthattimewewillnotAccept NewOrders,Modify/CancelExistingOrders,orShipProduct.Pleasecontactyourlocal salesofficewithanyquestionsorconcerns. ShippingandInvoicingafterthetransition:AfterJanuary1,2017,allproductswillbe shippedandinvoicedfromMicrochip.PleasealertyourReceivingandAccounts Payabledepartmentsofthischange;inourexperience,someclientsmustcancel existingbacklogandthenre-issueanewP.O.toMicrochip.Overthecomingweeks Microchipwillcontactyoutodiscussallyourneedstoinsurethereisnointerruptionin yoursupplychain. Vendor/SupplierCode:Ifyoursystemrequiresanewcodetosupportorderplacement toMicrochipandreceiveinMicrochipshipments,pleasearrangeasneeded. ShippingLabels,BoxesandPackingMethods:Labels,BoxesandPackingmethodswill bestandardizedtoMicrochip’scurrentprocesses.Specialshippinglabelsforspecial productssuchasprogramingproducts,specialtesting,etc.willadheretothestandard Microchipprocessovertime. Lots,TraceCodes,DateCodes,PartAging,andShelfLife:StandardMicrochipmethods forcombiningproductionlots,tracecodesanddatecodesintotubes,trays,andreel mediawillapplyaswellasstandardMicrochipPartAgingandShelfLifePolicies. Microchipqualitydocumentsandpoliciesincludingpartagingpolicyarefoundonour website.QualityDocumentsandPolicies PaymentTerms:StandardpaymenttermsareN30 Terms&Conditions:MicrochipSalesaresubjecttothecompany’sTermsand Conditions(“T&C”).MicrochipT&Cdoesdifferslightlydependingonwhetherthe customerisintheEuropeanUnionorelsewhereintheworldandwhethertheyare purchasingDirectorthroughmicrochipDIRECT.MicrochipTermsandConditionsare locatedonourwebsite.MicrochipTermsandConditionsofSaleandattachedin attachments;A,B,C. Product/ProcessChangeNotification(PCN)afterthetransition:ShortlyafterJanuary 1,2017standardMicrochipmethodsfornotifyingcustomersaboutprocessorproduct changesandendoflifeproducts(EOL)willapply.Partofthestandardmethodincludes aPCNemailservicethatweexpecttobeavailabletoAtmelcustomersinearlyin2017. Onceavailable,customerswhowishtoreceivePCN’sviaemailareexpectedtoregister forPCNemailserviceonourPCNwebpage.Informationabouthowandwhento registerwillbeprovidedinAtmelintegrationPCNs.TheAtmelPCNsystemwillcontinue tobeusedinconjunctionwithapartialMicrochipPCNsystemuntilthefullMicrochip systemcansupportAtmelproductsinDecemberorJanuary(reviewhowintheAtmel IntegrationPCN’sbelow).TheAtmelPCNsystemwillbeterminatedafterthetransition toMicrochipsystemsiscomplete.InformationaboutMicrochip’sPCNsystemcanbe foundonthislink:MicrochipPCNWebsite AtmelIntegrationPCN’s:UntilfullintegrationtoMicrochip’sPCNsystemallPCN’s relatedtotheintegrationwillbeprovidedusingtheAtmelPCNsystemandcanalsobe foundatthisMicrochipwebsite:ProductChangeNotifications.IntegrationPCNsfor Atmelproductsmaybeissuedforthefollowingchanges;orderingpartnumbering convention,shippinglabels,shippingboxes,packingmethods,partaging/shelflife,top marking,manufacturingsite,BillofMaterial(BOM),Silicon,andEOLamongothers. RoHSInformation:CanbefoundontheMicrochipWebsiteunderRoHSPBFree,RoHS DeviceSearch.Anemailwillbegeneratedfromthesystemwithallofthepertinent informationregardingthedevicesearch. http://www.microchip.com/wwwproducts/Rohs/
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