ECE 477 Design Review Team 07 – Spring 2017 Guangwei Chen, Shihong Fan, Yuanyu Huang, Siqing Wei • Two Major Pieces: Cover Lid & Base Case Attach together with screws at Final • Materials: PVC Resin Plastic • Workshop: AFL • Packaging Dimension: Cover Lid: 80 x 20 x 1 cm Base Case: 80 x 20 x 9 cm • Main PCB Dimension: 18 x 18 cm Inside Preview IR sensor Ultrasonic sensor Tested model GP2D12 HC-SR04 Distance Range 6-80cm 2-260cm, unstable above 70cm Sensible radius 5cm 7cm Noise Level Low median Average Current 33mA 33mA Resolution Depend on ADC setting, could be as small as possible 0.3 cm Data Type Analog Digital What’s done: • • • • • • Laser diode test IR sensor test LCD display PCB footprint library Microcontroller Dev Board – printing General PCB design What’s in process: • • • Removing noise of audio amplifier Gathering battery monitor information MIDI synthesis test LCD Display Battery monitor test IR sensor test Audio Amplifier
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