Slides - Purdue Engineering

ECE 477 Design Review
Team 07 – Spring 2017
Guangwei Chen, Shihong Fan, Yuanyu Huang, Siqing Wei
• Two Major Pieces: Cover Lid & Base Case
Attach together with screws at Final
• Materials: PVC Resin Plastic
• Workshop: AFL
• Packaging Dimension:
Cover Lid: 80 x 20 x 1 cm
Base Case: 80 x 20 x 9 cm
• Main PCB Dimension: 18 x 18 cm
Inside Preview
IR sensor
Ultrasonic sensor
Tested model
GP2D12
HC-SR04
Distance Range
6-80cm
2-260cm, unstable above 70cm
Sensible radius
5cm
7cm
Noise Level
Low
median
Average Current
33mA
33mA
Resolution
Depend on ADC setting, could be as small as
possible
0.3 cm
Data Type
Analog
Digital
What’s done:
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Laser diode test
IR sensor test
LCD display
PCB footprint library
Microcontroller Dev Board – printing
General PCB design
What’s in process:
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Removing noise of audio amplifier
Gathering battery monitor information
MIDI synthesis test
LCD Display
Battery monitor test
IR sensor test
Audio Amplifier