Meister Abrasives AG
Industriestrasse 10
CH-8450 Andelfingen / Switzerland
Carmine Sileno
Tel.
+41 52 304 22 41
Fax
+41 52 304 22 12
E-Mail [email protected]
SEMICONDUCTOR APPLICATION FORM
 Copyright Meiste Abrsives AG
Company
Contact name
Adress
E-Mail
City, State, ZIP
Telephone
Country
Fax
APPLICATION
CONDITIONS
Wafer/Substrate Material and Size
Prime/Test wafer grinding
Backgrinding of wafer
Wafer reclaim grinding
other please describe:
50mm
Material
76.2mm
100mm
150mm
200mm
300mm
Tool Type
Grinding application
Surface finish [µm]
Geometrical wafer values [µm]
Rough grinding
Fine grinding
Ra:
Rz:
TTV
Manufacturer:
TIR
Warp:
Specification Z1 wheel:
Specification Z2 wheel:
Wheel manufacturer / spec
Wheel shape and size [mm]
Wheel OD x Thickness x ID :
Bow:
Rim OD:
# of Wafers/Wheel:
LTV
Rim width
Cost of Z1 wheel:
Cost of Z2 wheel:
Wheel consumption and costs
GRINDING CONDITIONS
Rt:
[USD]
[USD]
ROUGH grinding spindle Z1
Rim height:
Width of slots:
[mm]
FINE grinding spindle Z2
Wheel specification
Initial thickness [µm]
Total stock removal [µm]
Step 1
Step 2
Step 3
Step 1
Step 2
Step 3
Grinding wheel speed RPM
Wafer chuck RPM
Stock removal [µm]
Feed rate step [µm/s]
Dwell or spark out [s]
Coolant flow rate [l/min]
Coolant pressure [bar]
Coolant Type
DRESSING / TRUING
Vitrified bond
Resin bond
Grit size:
Vitrified bond
Resin bond
Dressing Parameters
Wafer chuck RPM
Wafer chuck RPM
Wheel speed RPM
Wheel speed RPM
In feed rate [µm/s]
In feed rate [µm/s]
Dressing amount [µm]
Dressing amount [µm]
Grit size:
Other dressing process descr.
Truing device specification
Truing process
ADDITIONAL
REQUIREMENTS OR
COMMENTS
Meister Abrasives AG Confidential
Erst./Verw.:
csi
Abl.: D:\81916543.doc
First edition
Actual Edition
15.11.2005
31.07.2017
Page: 1 of 1
Zugriff:Alle