HQ Report to RSCs and ISC December 2016 v3 SEMI Standards Program • Established in 1973 • 950+ published Standards • 4,500+ volunteer experts • 1,800+ companies • 21 global technical committees • Experts from the semiconductor, PV, LED, MEMS & Display industries • International presence – United States | Japan | Europe | Taiwan | Korea | China Exchange ideas and develop globally-accepted technical Standards Global Program Members Q4-2016 Membership by Category Other 12% Global Program Members: Global TC Members: Affiliates (Participating Organizations): Indirect Supplier 23% End User 15% 5003 1413 2007 Service Provider 14% Membership by Region Direct Supplier 24% Consultant 12% Singapore 1% Taiwan 13% Korea India 5% 1% North America 32% China 10% Japan 25% Europe 13% Global TC Members by Committee Q4-2016 4 SEMI Standards Publications Cycle New Revised Reapproved Withdrawn August 2016 0 7 3 0 September 2016 0 1 0 0 October 2016 1 7 3 0 November 2016 5 9 0 0 • Total SEMI Standards in portfolio: 970 – Includes 165 Inactive Standards HQ Report – December 2016 SEMI Standards Publications New Standards Cycle Designation Title Committee Region SEMI 3D16 Specification for Glass Base Material for Semiconductor Packaging 3DS-IC NA November 2016 SEMI E54.24 Specification for Sensor/Actuator Network Specific Device Model of a Generic Equipment Networked Sensor (GENSen) Information & Control NA November 2016 SEMI E174 Specification for Wafer Job Management (WJM) Information & Control JA November 2016 SEMI E175 Specification for Subsystem Energy Saving Mode Communication (SESMC) Information & Control NA November 2016 SEMI F113 Test Method of Pressure Transducers in Gas Delivery Systems Gases NA November 2016 SEMI Standards Publications Inactive Standards Committee Number of Inactive Standards Assembly & Packaging 25 Automated Test Equipment 2 Compound Semiconductor Materials 6 Environmental Health & Safety 2 Facilities 8 FPD – Equipment 5 FPD – Factory Automation 1 FPD – Materials & Components 5 FPD – Substrate 1 HQ Report – December 2016 SEMI Standards Publications Inactive Standards Cont. Committee Number of Inactive Standards Gases 3 Information & Control 36 Liquid Chemicals 6 MEMS 2 Metrics 6 Micropatterning 30 Physical Interfaces & Carriers 7 Silicon Wafer 4 Traceability 10 HQ Report – December 2016 Strategic Association Partnerships • MEMS & Sensors Industry Group (MSIG) – convergence of IC technology, flexible hybrid electronics (FHE), and MEMS and sensors for consumer electronics and IoT applications makes this partnership a clear win for the combined membership. The synergies between our associations will result in increased member value, a unified voice for the MEMS and sensors sector, and a strong platform for global industry collaboration • Fab Owners Association (FOA) – international nonprofit trade association of semiconductor and MEMS fab owners and industry suppliers, who meet regularly to discuss and act on common manufacturing issues, combining strengths and resources to increase semiconductor manufacturing efficiencies to become more competitive • Members include companies like Freescale, Infineon, TowerJazz, Western Digital 9 SEMI SCIS Special Interest Group (Semiconductor Components, Instruments, and Subsystems) • SCIS provides a forum that fosters discussion and aligns stakeholders on pre-competitive industry-critical issues. • Objectives – Establish a framework that will enable industry partners to define: • Measurable defects for different components specific to intended process applications • Standardized test methods to measure the defects • Consistent methods for reporting the results – Implement an industry standard parts traceability process • Define standardized formats and protocols • Facilitate communication among suppliers, OEMs, and IDMs. • Enable efficient problem diagnosis and resolution • Next Meeting: December 15 at Intel (Santa Clara) • More information: Paul Trio ([email protected]) 10 SEMI SCIS Special Interest Group (Semiconductor Components, Instruments, and Subsystems) • 9 Working Groups chartered under SCIS – including seals, valves, pumps, liquid delivery systems, critical chamber components, and RF • Gas Delivery Group has been working on test methods for metals and hydrocarbon contamination in gas delivery systems. – recently completed the framework of these methods – now ready to transition these into SEMI Standards. • Materials of Construction TF (Gases TC) • Seals Group – Developing guidance for seal cleaning and packaging – To be incorporated into revision to SEMI F51, Guide for Elastometric Sealing Technology • RF Group – Proposals by Q1 2017 for revisions to E113 and E135 (RF Generators), possibly new standards 11 CEO Retirement • October 12, 2016 – SEMI today announced the retirement of Dennis (Denny) McGuirk, SEMI’s president and CEO. • McGuirk has served on the board of directors and has led SEMI, the global industry association representing more than 2,000 companies in the electronics manufacturing supply chain, since November 2011. • McGuirk will continue to lead SEMI in his current capacity until a successor is appointed. 12 New President of SEMI Americas • David Anderson • Past experience at Fairchild Semiconductor, National Semiconductor, the Semiconductor Industry Suppliers Association, and SEMATECH – At SEMATECH, helped launch the global ISMI (International SEMATECH Manufacturing Initiative) effort to improve the productivity and cost performance of semiconductor manufacturing equipment and operations. 13 HQ Office Relocation • SEMI HQ will be departing the Zanker Road office at the end of 2016 • New office will be in Milpitas, CA – NA Spring 2017 meetings (April 3 – 6) will be held at new office 14 Staff Update (1/2) • Inna Skvortsova – – – – – NA Automated Test Equipment NA Information and Control NA Liquid Chemicals NA Metrics NA Traceability • Sophia Huang – China HB-LED – China Photovoltaic 15 Staff Update (2/2) • Laura Nguyen – – – – – – NA 3DS-IC NA HB-LED NA Facilities NA Gases NA MEMS / NEMS NA Physical Interfaces and Carriers 16 Thank you! • Comments / questions: [email protected] 17
© Copyright 2026 Paperzz