TO-220 Heat Sinks
Copper narrow channel style heat sink with integrated clip
80
8
60
6
40
4
Case Temp Rise
Above Ambient—°C
2
0
0
0
1
2
3
Heat Dissipated—Watts
4
16.51
(0.650)
3.05
(0.120)
5.72
(0.225)
5
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Description
7141DG
Narrow channel heat sink with integrated clip
13.21
(0.520)
2.77 (0.109)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Grease
&
Epoxy
page112
Economy, narrow base, low profile channel style heat sink
100
80
16
60
12
40
8
20
4
0
0
0
1
2
3
Heat Dissipated—Watts
4
"X"
19.05
(0.750)
13.34
(0.525)
9.52
CL (0.375)
5
9.65
(0.380)
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
ORDERING INFORMATION
Part Number
Mounting
Kits
page 99
19.05
(0.750)
ø 3.81
(0.150)
THRU
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Air Velocity—Feet Per Minute
400
200
600
800
1000
20
0
Economy, narrow base, low profile
channel style heat sink is perfect for use
on printed circuit boards with 0.500 inch
centering. When mounted horizontally, the
total height of the heat sink is just 0.380.
2.54
(0.100)
MAX
1.27
(0.050)
3.81
(0.150)
13.08
(0.515)
Part Number
5073
20
19.81
(0.780)
Thermal Resistance From
Case to Ambient—°C/Watt
1000
10
0
Copper narrow channel style heat
sink with integrated clip and locking
tab for secure attachment to the device.
Single center tab can be soldered
directly to the PC board.
Top is cut
away to
show detail
Air Velocity—Feet Per Minute
400
200
600
800
100
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
7141
Finish
507302B00000G
Black anodize
507302J00000G
Pre-black anodize*
* Edges cut during the manufacturing process will be unfinished. See page 110 for more information
POPULAR OPTIONS: 507302 _ 000 00G
Base part no.
Position
Code
A
09
A
Description
Stud 4–40 x 0.350 LG
Location
Details
Hole X
Page 96
For additional options see page 82
5041, 5042
Grease
&
Epoxy
page112
Economy, narrow base, low profile channel style heat sink
ø 3.66 THRU
(0.144)
FIGURE A
Mounting
Kits
page 99
ø 3.66 THRU TYP 2
(0.144)
FIGURE B
"X"
17.80
(0.700)
"X"
13.46
(0.530)
"X"
19.81
(0.780)
9.91
(0.390)
13.47
(0.530)
Economy, narrow base, low profile
channel style heat sink is perfect for
use on printed circuit boards with tight
component spacing. Models are available
for single and dual device mounting.
0
100
Economy, narrow base channel style heat sink
A
504222B00000G
For dual devices
B
Mounting Surface Temp
Rise Above Ambient—°C
Figure
504102B00000G
POPULAR OPTIONS: 504_ _2B0 00 00G
Position
Code
A
01
A
Description
6-32 Wave On threaded insert 0.100 stand off
Location
Details
Hole X
Page 89
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
1000
10
80
8
60
6
40
4
20
2
0
0
0
504102
504222
For additional options see page 82
38
Air Velocity—Feet Per Minute
400
200
600
800
2
4
6
Heat Dissipated—Watts
8
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
19.80
(0.780)
Description
Base part no.
21.59
(0.850)
36.83
(1.450)
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
13.47
(0.530)
21.60
(0.850)
10
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]