Date of download: 7/31/2017
Copyright © ASME. All rights reserved.
From: Quantification of Thermal Resistance of Transient-Liquid-Phase Bonded Cu/Al/Cu Interfaces for
Assembly of Cu-Based Microchannel Heat Exchangers
J. Micro Nano-Manuf. 2013;1(3):031001-031001-10. doi:10.1115/1.4024683
Figure Legend:
(a) A schematic of the transient flash measurement and (b) a typical raw flash data set obtained from a homogeneous Cu disc. The
single-headed arrow denotes the instant the light pulse is incident on the disc front surface.