Introduction of IWAKI Products for Semiconductor Manufacturing

Introduction of IWAKI
Products for Semiconductor
Manufacturing Process
Iwaki's greatest advantage as a chemical pump
manufacturer is the breath of its product line.
Iwaki delivers the best solutions to every pump
requirement in semiconductor manufacturing
processes including chemical distribution and
point-of-use dispensing, recirculation and
filtration, photoresist application and CMP delivery.
Wafer cleaning chemistry delivery
Unique operating method substantially reduces discharge flow
pulsation while keeping laminar suction flow.
Pneumatic drive low pulsation bellows pumps
PULSERASER FLP-60
New
Low pulsation
Reduced installation area
Low cost
• Displacement sensors monitor the
bellows location to offset and reduce
pulsation.
• Suction flow pulsation stays at the same
level as standard pumps such as the FS60HT.
• By employing unique operating method,
discharge pulsation is dramatically
reduced without dampener..
• Both installation space and a total cost
are reduced.
Specifications
Supply air pressure: 0.2 - 0.5 MPa
Max. liquid temperature: 5 - 180˚C
Stroke speed: Max. 120 spm
Pump connection size: ø25×ø22 PFA Tube
Pneumatic drive low pulsation bellows pumps FLP-60
Pneumatic drive bellows pumps FS-60HT
0.35
Supply air connection size: Rc 3/8
Allowable ambient temperature: 0 - 40˚C
Discharge pressure waveform
0.30
Pressure (MPa)
0.25
0.20
0.15
0.10
0.05
Suction pressure waveform
0.00
-0.05
0
1
2
3
4
5
Time (sec)
Sharp drops of discharge pressure are minimized, reducing the pulsation compared to
existing pumps. Suction pressure drops are at the same level as existing pumps, but the
pulsation width has been reduced.
1
6
CMP slurry and wafer cleaning chemistry delivery
High temperature liquid delivery at 100L/min
enhances cleaning efficiency.
Pneumatic drive bellows pumps
FS-100HT2
New
Enhanced cleaning efficiency
Reduced installation area
Low cost
Cleaning efficiency such as the removal
of particles and metal contamination on
wafers is improved as the circulation flow
rate is increased. Cleaning times resulting
from increased number of processing
lines will also be reduced due to higher
circulation rate.
In addition to the use of fluoroplastic wet
ends (PTFE and PFA), a fluorine coating on
the pump’s outer surfaces offers the best
resistance to vapors from acid, alkali and
hydrogen peroxide chemistries used in
semiconductor manufacturing.
Optimization of design has resultind
in re duce d weight of ab out 15% of
our existing 80 -100L models making
installation and replacement work easier.
Specifications
Max. discharge capacity: 100 L/min
Pump connection size: 1 1/4” PFA Tube
Supply air pressure: 0.15 - 0.5 MPa
Supply air connection size: Rc 1/2
Liquid temp. range: 10 - 180 ºC
Allowable ambient temperature: 0 - 60˚C
Stroke speed: Max. 120 spm
2
CMP slurry and wafer cleaning chemistry delivery
Max. 100 L/min.
A high flow model for chemical supply process.
Pneumatic drive bellows pumps
FS-N SERIES
High flow & pressure capabilities
The maximum supply air pressure of
0.7MPa meets not only the demand
for high flow & pressure capabilities
in chemical supply processes but also
requirements in cleaning/CMP processes.
High stroke speed
Contamination-free
The pump’s fast stroke speed (Max.200spm:
FS-80N) allows compactness, light weight
and low cost while enabling high flow &
pressure capabilities.
All wet ends are made of fluororesin to
give contamination-free construction.
Our unique shaft seal also dramatically
reduces par ticle generation (Patentprotected: FS-80N).
Specifications
Max. discharge capacity: 100 L/min
Supply air pressure: 0.2 - 0.7 MPa
Liquid temp. range: 5 - 60˚C
Stroke speed: Max. 200 spm
Photoresist dispensing
Capable of dispensing highly-viscous
photoresist in LED or MEMS manufacturing.
Photoresist dispensing pumps
PDS-H115
• Suitable for highly-viscous
photoresist in LED and MEMS
production.
• Safety design with a built-in
pressure sensor.
Specifications
3
High accuracy,
Compact size, Low cost.
New
Photoresist dispensing pumps
PDS-105R
• Repeatability of ±0.3%(F.S.) is obtained
thanks to a stepping motor drive design.
• The Increased number of molded plastic
parts results in a reduced production cost.
Specifications
Max. discharge capacity: 12.0 mL/shot
Max. discharge capacity: 5.0 mL/shot
Max. discharge pressure: 0.8 MPa
Max. discharge pressure: 0.15 MPa
Repeatability: ±0.3% or below (F.S.)
Repeatability: ±0.3% or below (F.S.)
Viscosity range: 100 - 10,000 mPa•s
Max. allowable viscosity: 200 mPa•s
New
Wide range of liquid temperatures/ For ultrapure chemical delivery
High-pressure discharge.
in semiconductor processing
Pneumatic drive bellows pumps
FS SERIES
FW/FF SERIES
An increase in the speed of pump
strokes (240 spm maximum) resulted
in a reduction of size, weight and costs
involved in the manufacture of the pump
as well as a decrease in pulsation.
The pump is driven by a built in stroke
sensor located away from the liquid
path. The operation is reliable and the
pumps function with stability even at
low stroke rates.
Specifications
Specifications
Max. discharge capacity: 55 L/min
Max. discharge capacity: 80 L/min
Supply air pressure: 0.15 - 0.5 MPa
Supply air pressure: 0.2 - 0.5 MPa
Liquid temp. range: 5 - 180˚C
Liquid temp. range: 5 - 180˚C
Stroke speed: Max. 240 spm
Stroke speed: Max. 150 spm
Chemical replenishing
High-precision chemical replenishment
pump systems.
Semiconductor process pump
Pneumatic drive bellows pumps
Chemical replenishing pumps
CFD SERIES
• The minimum flow of 1mL/shot offers greater
accuracy in chemical condensation control that
is required in the wafer cleaning process.
• The CFD-1T-B always feeds the correct quantity of
chemical without overshoot, eliminating excess
liquid wastage.
Specifications
Capacity range: 1 - 8 mL/shot
Max. discharge pressure: 0.05 MPa
Liquid temperature range: 20 - 60˚C
Stroke speed: Max. 30 spm
4
Non contact system (PAT.)
MDM
Rear thrust
AMP
Bearing
Process magnetic drive pumps
Process magnetic drive pumps
Max. discharge capacity: 1.4 m3/min
Max. discharge capacity: 1000 L/min
Max. head: 74/107 m (50/60Hz)
Max. head: 36/49 m (50/60Hz)
Main materials: CFRETFE, PFA
Main materials: CFRPP
MDM SERIES
AMP SERIES
MDM25 (PFA type)
AMP40
Compact and simple with a seal-less structure
Direct drive pumps
Magnetic drive pumps
Max. discharge capacity: 70 L/min
Max. discharge capacity: 125/135 L/min (50/60Hz)
Max. head: 15 m
Max. head: 10.5/11.5 m (50/60Hz)
Main materials: GFRPPE, GFRPP
Main materials: CFRETFE
RD SERIES
RD-40X
5
Rear ring
Magnetic drive process pump resistant to
Chiller coolant
circulation pumps
LCD panel manufacturing process pumps
The pump design features a mechanism to
withstand dry running. High magnet power of
the rare earth magnets prevents the magnet
capsule coming into contact with the thrust
ring of the rear casing, thus preventing
melting of fluororesin components due
to heat generation. This greatly improves
resistance against dry running in comparison
with conventional magnetic drive pumps
made of fluororesin.
MD-F SERIES
RD-12
MD-100F
MD-30F
Bearing
Rear thrust
Self-radiating structure (PAT.)
Through heat-dispersion holes provided
in the fixed portions of the impeller and
the magnet capsule, the liquid around
the spindle and the bearing is forced
to circulate so that heat generated
by sliding can be reduced effectively.
Thus, thermal deformation and melt are
prevented.
MXM
SMX-F
MX-F
Self-radiating structure
dry run damage
Process magnetic drive pumps
Self-priming magnetic drive pumps Process magnetic drive pumps
SMX-F SERIES
MX-F SERIES
Max. discharge capacity: 600L/min
Max. discharge capacity: 440/520 L/min (50/60Hz)
Max. discharge capacity: 510 L/min
Max. head: 30/42 m (50/60Hz)
Max. head: 24/35 m (50/60Hz)
Max. head: 29/27 m (50/60Hz)
Main materials: CFRETFE
Main materials: CFRETFE
Main materials: CFRETFE
MXM SERIES
MXM545
SMX-F543
MDG SERIES
Max. discharge capacity: 14/17 L/min (50/60Hz)
Max. discharge pressure: 0.6 MPa
Main materials: SUS316, CFRPEEK, PPS
MDG-R2
MDG-R2 (DC24V type)
Highly accurate
feed pumps
Magnetic drive gear pumps
MX-F401
Valveless plunger pumps
Hicera pumps
V SERIES
Max. discharge capacity: 0.3/0.4 - 1400/1682 mL/min (50/60Hz)
Max. discharge pressure: 0.7 MPa
Main materials: Al2O3, SiC, SUS
V-05
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IWAKI Saitama plant
w w w.iwak ipumps.jp
IWAKI Miharu plant
IWAKI CO.,LTD. 6-6 Kanda-Sudacho 2-chome Chiyoda-ku Tokyo 101-8558 Japan TEL : (81)3 3254 2935 FAX : 3 3252 8892
Caution for safety use: Before use of pump, read instruction manual carefully to use the product correctly.
Actual pumps may differ from the photos. Specifications and dimensions are subject to change without prior notice. For further details please contact us.
Legal attention related to export.
Our products and/or parts of products fall in the category of goods contained in control list of international regime for export control.
Please be reminded that export license could be required when products are exported due to export control regulations of countries.
CAT-W 0004-16
2012.11.2000.THN