AMBFTK
Report 01.06.2010
AMBFTK: problems to solve
• Power distribution: Crates – compatibility with CDF
crates?
• Thermal dissipation: Cooling
• Signals I/O: high input/output traffic and frequency
(connectors)
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Power (1)
•
•
•
For the actual AMchip is estimated (but we need a better measure) a
power consumption of 1,8W (1 A @ 1,8V)
For the new AMchip (under design) a similar power is estimated
In the first version of the AMBFTK we are going to use the actual AMchip
• Actual AMchip: 1 A @ 1,8 V
• LAMB (Local Associative Memory Board)
32 AMchip
• AMBFTK: 4 LAMBS
=> 128 AMchip => 128 A @ 1,8 V !
new AMchip: 230 A @ 1V !!!
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Power (2)
First version of AMBFTK (with actual AMchips):
• 128 A @ 1,8V only for the AMchips !
• We think that the real consumption is less (100 A ?)
• We are going to make some measure soon
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Power (3)
• Problem: how we can obtain the current we need?
• Up to now, we found that the better solution ( in terms
of efficiency and physical space on the AMBFTK board
for the DC-DC converter) is to obtain the current we
need starting from 12 V
• 24 A @ 12 V is the power that we have estimated we
need for the entire AMBFTK board (AMchips plus other
logic)
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Power (4)
•
Example of the DC-DC converter to obtatin 1,8V (AMchip core voltage) starting from 12V
DC-DC converter
12V  1,8V
-Delivers up to 30A of output current
-High efficiency: 92.9% @ 3.3V full load (V IN=12Vdc)
-Input voltage range from 6 to 14Vdc
-Output voltage programmable from 0.8 to 3.63Vdc
- Small size and low profile: 33.0 mm x 13.46 mm x 10.00 mm
(1.30 in. x 0.53 in. x 0.39 in.)
•
We need 4 of this DC-DC coverter to obtain the current we need for the AMchip
(100 A or more)
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Power (5)
• It is not simple to find the right placement on the
board for these DC-DC converters
• 2 options:
– Using a custom AMBFTK layout (is it possible? problems?)
– Using a standard AMBFTK layout maybe with compact
connector to make space. But we are not sure we have the
space we need for all the components.
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= DC-DC converter
Front
panel
Backplane Front
panel
side
Option 1
lamb
= other components
Backplane
side
Option 2
lamb
P1
P1
lamb
lamb
P1
P1
lamb
lamb
lamb
lamb
P3
P3
Enough space for DC-DC converter
Very difficult to find space for DC-DC converter
Is it possible?
Problems?
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Front side
Option 1: custom layout – IS IT POSSIBLE?
Backplane side
Dc-dc 1,8V
Dc-dc
1,8 V
1
3
other dc-dc
(1,2V)
4
2
Lamb power
connector
Little
“balcony”
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Lamb signal
connector
Marco Piendibene
Fifos (spartan6)
serdes
9
Option 1: example of current distribution on a board plane
12V
1,8V
Lamb power
connector
Little
“balcony”
1,8V
1,8V
dc-dc
1,8V
dc-dc
dc-dc
dc-dc
12V
12V
Option 2: standard layout
Front side
Backplane side
Dc-dc 1,8V
1
2
Do we have
space for this
configuration?
other dc-dc
(1,2V)
Lamb power
connector
3
4
Lamb signal
connector
Dc-dc 1,8V
“short” P3
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Marco Piendibene
Fifos (spartan6)
serdes
11
Option 2: example of current distribution on a board plane
Too high current?
Actual AMchip: 128 A (100 A)
New AMchip: 230 A ?
1,8V
dc-dc
1,8V
1,8V
dc-dc
1,8V
1,8V
dc-dc
dc-dc
1,8V
Too far from the source?
01/06/2010
dc-dc
12V
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Power (6)
• Problem: how to bring 24 A @ 12 V to each AMboard?
• We don’t want to use the J0 connector because we need that
space (see slide 9 and 11).
• OPTIONS:
1 - Bring power direct to the AMBFTK (see slide 14)
2 - Bring power through the AuxBoard (see slide 15)
3 - Bring power through backplane (standard J1 – J2 connector)
(see slide 16)
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Front
panel
Option 1 - Bring power direct to the AMBFTK
AMBFTK
AUX card
P1
P2
P3
Power connector
Mechanical problems?
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12V cable
Unfriendly to plug/unplug ?
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Option 2 - Bring power through the AuxBoard
Front
panel
AMBFTK
AUX card
P1
Power
connector
12V cable
P2
No problem to
plug/unplug the
cable
P3
This option is possible because we have a lot of pin available on P2
connector (see P2 connector on slide 19)
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Option 3 - Bring power through the CDF backplane
Questions…
Could we use all the power lines available in CDF in J1 and J2 (see next slides)?
Can everything be generated, including 3,3 V, starting from 12 Volts , to reduce the
Ampere we need to transfer?
Do we need a mix of these strategies (cable + J1 – J2)?
Could be enough to bring 25 A to each AMboard and AUX board without needing
cables?
Looking at the next slide, we see that just 3.3 V + V1,V2, +12V, -12V can
deliver 350 Amps (for all the slots)
Could be enough (and is it possible?) to power all the slots in this way?
Can we understand which is the probability we get 5 crates from CDF for start of
FTK run in 2013?
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P2 pin assignment in CDF crates
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Thermal dissipation: cooling
Each board will need to be cooled to bring away 300 W.
The 300 W are distributed on 128 chips so the exchange air-chip surface should be
enough, even if the air is not cooled.
We want to start with AMboards that do not occupy all the slots. We can do this at the
beginning (2013). Tall connectors between the motherboard and the LAMBS will
increase the distance between them.
We will study in the future the possibility to
put the AMboards in all the slots.
We can use metals touching the chips as
shown in the figure on the right to increase
the exchange of heat between air and chips.
We will need thin packages for the AMchips.
Now they are not thin (3 mm) but we can
use 1 mm thick packages.
WE HAVE TO STUDY THE PROBLEM CAREFULLY
6x4+6+5x4
=24+6+20
= 50 rows
Option 1
2 x xxx (25 rows)
2mm Hard Metric
PCB Mount
Connectors
I/O: P3 + LVDS
(Z-PACK 2mm HM)
Road-Lamb3-1 (21b+7b)
Road-Lamb2-2 (21b+7b)
2 Options:
Road-Lamb2-1 (21b+7b)
1. Thinner but taller. Good
if we can put 2 DC – DC
connectors in front of the
board.
5 columns connectors,
50 rows –
2x25 rows connectors.
3ctrl x 4 = 12
3ctrl x 4 + 8 Hold-Hits=20
Road-Lamb1-1 (21b+7b)
Road-Lamb0-2 (21b+7b)
30 rows
Road-Lamb0-1 (21b+7b)
Pix1(14b) + Pix2(14b)
SN65LVDS93A
8.1mm × 14mm
TSSOP 1.2 thick
Pix0(14b) + Pix0d(14b)
2ctrl x 8 + 1b x 4 buses (2 Pix+2ExtSCT)
+ 8 Hold roads
SCT2 (14b) - SCT3 (14b)
SCT0 (14b) - SCT1 (14b)
XC6SLX16 CPG196
8x8 mm2 1,2 thick
20 rows
2. Larger but shorter.
if we are not allowed to
use DC-DC conv. In front
of the board we gain
space with this
connector.
25 rows + 11 rows.
Option 2
SN65LVDS93A
8.1mm × 14mm
TSSOP 1.2 thick
Road-Lamb3-1 (21b+7b)
Road-Lamb2-2 (21b+7b)
Road-Lamb2-1 (21b+7b)
3ctrl x 4 = 12
3ctrl x 4 + 8 Hold-Hits=20
Road-Lamb1-1 (21b+7b)
Road-Lamb0-2 (21b+7b)
Road-Lamb0-1 (21b+7b)
Type E - 25 rows + Type F - 1 1 rows
2mm Hard Metric - 8 columns
PCB Mount
Connectors
(Z-PACK 2mm HM)
FOR THIS OPTION THE LVDS SER/DESER
NEED A SMALLER PACKAGE!
34-36 rows
Pix1(14b) + Pix2(14b)
Pix0(14b) + Pix0d(14b)
2ctrl x 8 + 1b x 4 buses (2 Pix+2ExtSCT)
+ 8 Hold roads
SCT2 (14b) - SCT3 (14b)
SCT0 (14b) - SCT1 (14b)
XC6SLX16 CPG196
8x8 mm2 1,2 thick
AMBFTK
Lamb
Space between pcb
lamb and pcb
motherboard
P1
2,2cm
0,8 cm
3,5cm
3,9cm
5,5cm
(no amchip)
2,2cm
P2
Lamb
3,3cm (with actual long P3)
P3