Richard Hansen
Micro-electro-mechanical
Systems (MEMS)
Motivation
CNT-M
CVI Process
CVI
Challenges
Materials
Properties
Conclusion
MEMS Fabrication Processes
Motivation
CNT-M
CVI Process
CVI
Challenges
Materials
Properties
Conclusion
DRIE
LIGA
Deep reactive-ion etching
Lithographie, Galvanoformung,
Abformung (Lithography,
Electroplating, and Molding)
Carbon-Nanotube-Templated
Microfabrication
Motivation
CNT-M
CVI Process
CVI
Challenges
Materials
Properties
Conclusion
Carbon-Nanotube-Templated
Microfabrication
Motivation
CNT-M
CVI Process
CVI
Challenges
Materials
Properties
Conclusion
CVI Using Metal Carbonyl
Precursors
Motivation
Heating
Electrodes
CNT Sample
Cartridge Heater
CNT-M
CVI Process
Gas
CVI
Challenges
Materials
Properties
Conclusion
Metal Carbonyl
High Tensile Stress in
Deposited Metal Film
Motivation
CNT-M
CVI Process
CVI
Challenges
Materials
Properties
Conclusion
1 mm
Extent of Infiltration
Motivation
200 μm
1 μm
200 μm
1 μm
200 μm
1 μm
CNT-M
CVI Process
CVI
Challenges
Materials
Properties
Conclusion
Structure of Metal film in
CNT composite materials
Powder Diffraction
Intensity (counts)
TEM Analysis
3000
Motivation
2000
CNT-M
CVI Process
CVI
Challenges
Materials
Properties
Conclusion
1000
0
30
35
40
45
50
55
60
65
70
75
80
85
2Theta (°)
The metal oxycarbide puts metal atoms in an FCC structure
with C or O at their octahedral sites (Lattice constant of about 4.16 Å)
Materials Properties of CNT
composite materials
Cantilever Setup
4-Point Probe Setup via the
Van der Pauw Method
Motivation
CNT-M
CVI Process
CVI
Challenges
Materials
Properties
Conclusion
Young’s Modulus on the order of
10 GPa
Resistivity on the order of
100 μΩm
Conclusion
Motivation
CNT-M
CVI Process
CVI
Challenges
Materials
Properties
Conclusion

Versatile Process

High-Aspect-Ratio

Materials Properties Dominated By
Filler Material