QXF Instrumentation Trace Update
D. Cheng
Feb 11, 2014
Design Status
• OL SQXF trace is ~80% complete
– Design elements in place; spacing and locations to be
finalized
• IL SQXF trace is ~15% complete
• Schedule estimate
– Week of 2/17: Negative mask order to be placed
– Week of 2/24: Negative mask received
– Week of 3/10: Receive traces
• (HQ trace fab. may possibly bump this date)
– Week of 3/17: QA’d traces ready for use
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Material Status
• LARP order has not been placed
– Material requires 10 week lead time for order
– May 2014 delivery, at the earliest, if ordered this
month
• CERN has sent us 5m (600 mm wide) of their
material for at least 3 sets of traces to start
with
– GTS #DEVL-178-13 (same as one of LARP’s
options)
– 304L + Adhesive AS1084 + Apical AV
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D. Cheng
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Outer Layer Lead End
VTB02
VTB04
VTB05a
VTB03
VTB07a
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D. Cheng
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Outer Layer Return End
VTB05b
VTB07b
VTB06
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Production Status
• Practice SQXF traces can be fabricated normal
– But LBNL trace fabrication expert will be retiring
3/31
• Options for the future (production)
– LBNL tech training (on-going)
– Possible return of expert (after mandatory
separation)
– Outside vendor qualifications*
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Additional Slides
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Coil IL
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Reference: LARP Coil Instrumentation Traces
Stainless
Laminate
Adhesive*
Polyimide
(Apical AV)
Additional
Kapton**
TQ/LQ
304 / 25 µm
15 µm
25 µm
-
HQ Coils 1-10
304 / 25 µm
15 µm
25 µm
-
HQ Coils 11-14
304 / 25 µm
15 µm
25 µm
25 µm
HQ Coils 15-21
304 / 25 µm
15 µm
25 µm
50 µm
HQ Coils 22-26
304 / 25 µm
15 µm
25 µm
25 µm
LHQ
304 / 25 µm
15 µm
25 µm
50 µm
*Modified cross-linked epoxy system, AS 1084
** Joined by single strip of 3M VHB F-9460PC
(More info in 9/23/13 presentation)
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D. Cheng
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QXF Coil Instrumentation Trace Options
Stainless
Laminate
Adhesive*
Polyimide
Thickness
Notes
Apical AV
304 / 25 µm
15 µm
50 µm
Currently used in LARP
coils; extensive 4 K data
Apical NP
304 / 25 µm
15 µm
50 µm
Higher strength version of
AV; not as much published
data for use @ 4 K;
currently what vendor has
quoted
Kapton MT
304 / 25 µm
15 µm
50 µm
High thermal conductivity
polyimide, ~3x that of
Kapton HN-equivalent at
RT; 20% more expensive;
only available in large
quantities ($45k min. order)
*Modified cross-linked epoxy system, AS 1084
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Instrumentation Trace Fabrication Process
•
•
•
•
•
•
Design and print artwork (negative mask)
Cut trace laminated material to length
Cover conductive laminate with resist
Expose resist under negative mask with UV light
Wash the uncured resist from laminate
Etch laminated material with cured resist pattern
– Conductive layer covered by resist remains
• Remaining resist washed off by stripping agent
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Instrumentation Trace Impreg. Preparations
• Electrical QA
• Perforate polyimide layers
• Install during coil impregnation
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Coil Processing: Impregnation
• Does CTD 101K epoxy exhibit acceptable
radiation hardness?
– What are the requirements?
– What is the real data?
• Technical challenges for impregnation
using Cyanate Ester blends (or other
materials) must be overcome for long
coils
• Instrumentation traces
Inside bore of HQ02a during
assembly (Coil 15 was previously
tested in HQ mirror)
– Do laminated polyimide trace materials
pose problems for impregnation?
– Trace behavior (bubbles) on inside bore
after testing cycle have continued
Bubbles on inside bore of
LQS03 after magnet test
D.W. Cheng - LARP CM20/HiLumi,
Napa, CA
April 9, 2013
13
D.W. Cheng - LARP CM20/HiLumi,
Napa, CA
April 9, 2013
14