FYS4260/FYS9260:
Microsystems and Electronics
Packaging and Interconnect
Course Introduction
Lecture topics
• Learning objectives from FYS4260
• Definitions of some basic terms
• Course administrative details
FYS4260/FYS9260
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About the lecturer and SINTEF
• Siv.ing. (1994) and dr.ing (1998) in
experimental material physics, NTNU
• Employed at SINTEF ICT, Instrumentation
Department since 1998
• Research
– Packaging of MEMS sensors for high
temperature applications
– Research manager for the biomedical
instrumentation group where we do research on
wearable sensor devices and medical
diagnostics devices.
• Second time I teach FYS4260
– Started as associate professor II at UiO on Jan
1st 2015.
FYS4260/FYS9260
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Advanced electronic packaging
and interconnects at SINTEF
• Packaging - instrumentation in harsh
environments
–
–
–
–
–
SmartWear -Packaging
of a sensor on a jacket
High temperatures (175-500°C)
High pressures (1000 bar)
Corrosive environment
Large acceleration forces (60 000 g)
Vibrations
• Packaging - miniaturized systems
– 3D integration of MEMS and electronics
• In close cooperation with SINTEF MiNaLab
Packaging of a MEMS
fuze for 30 mm
ammunition
Packaging of a SiC transistor for high
temperature application
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SINTEF MiNaLab
From idea to manufacturing
Provides services in silicon processing and device (sensor and
microsystems) fabrication
• Research and development
•
Feasibility studies, Simulation, Device design,
Functional materials, Process development,
Process integration, Prototyping
• Commercialisation (Small scale production/
pre-series production)
•
Production of components for both national and
international customers based on either
• Proprietary technologies (patented)
• Custom designs
Other
(consulting,
assistance…)
2%
Project portfolio
Research
38 %
Production
33 %
Development
27 %
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What you will learn from FYS4260
• Packaging and interconnection deals with the
physical (hardware) realization of electronic
systems – from schematics/diagram to finished
product.
• You will become aware of important concerns in
design, manufacturing and use of electronics
• You will learn how to build your own electronics
circuit board
• The course takes a practical engineering
approach to the subject:
– Will not demand extensive theory
– Will not go into finer detail on e.g. integrated circuit
design
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What are the packaging and
interconnection challenges in order to
realize a modern mobile phone?
Packaging&interconnection tends to attract less attention than
component developments and software apps, but is still important!
Packaging&interconnection represents crucial engineering discipline
in electronics development:
• Key cost factor
• Packaging/interconnection is the main source of failures in
electronic systems
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Examples of packaging and interconnection challenges
High definition display
Marketed feature:
• Retina HD display
• 4.7-inch (diagonal)
LED-backlit widescreen
Multi-Touch display with
IPS technology
• 1334-by-750-pixel
resolution at 326 ppi
FYS4260/FYS9260
Packaging and interconnection
challenges:
•
•
•
How do you connect 326
conductor lines per inch (13 per
mm) for display control and
additional ones for touch display
sensing?
On a minimal frame around a
large display?
While ensuring that nothing
breaks?
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Examples of packaging and interconnection challenges
Processing capability
Marketed feature:
• A8 chip with 64-bit
architecture
• 20-nanometer process
• Two billion
transistors strong
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Packaging and interconnection
challenges:
• How do you package and
connect a highly complex
chip with a large number of
I/O's (input/outputs) on a
small area?
• How do you ensure that two
billion transistors do not
overheat?
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Examples of packaging and interconnection challenges
Sensors capability
Marketed feature:
•
•
•
•
•
•
Touch ID
Barometer
Three-axis gyro
Accelerometer
Proximity sensor
Ambient light
sensor
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Packaging and
interconnection challenges:
• How do you package
highly complex and
miniaturized
microelectromechanical
components?
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Examples of packaging and interconnection challenges
Camera capability
Marketed feature:
• New 8-megapixel
iSight camera with
1.5µ pixels
• 1080p HD video
recording (30 fps or
60 fps)
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Packaging and
interconnection challenges:
• How do you connect to
the imaging CMOS chip
(with 8 million pixels
each 1.5µ x 1.5µ
dimension)?
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Examples of packaging and interconnection challenges
Connectivity capability
Marketed features:
• GSM model:
GSM/EDGE
• UMTS/HSPA+
• DC-HSDPA
• CDMA model: CDMA
EV-DO Rev. A and Rev.
B
• LTE
• 802.11a/b/g/n/ac Wi-Fi
• Bluetooth 4.0
• NFC
• GPS and GLONASS
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Packaging and interconnection
challenges:
• How do you integrate a wide
range of GHz wireless
antennas while limiting crosstalk?
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Examples of packaging and interconnection challenges
Size and dimensions
Marketed features:
• 138 mm high
• 67 mm wide
• 6.9 mm thick
• 129 grams
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Packaging and
interconnection
challenges:
• How do you find
place for everything,
and ensure that
everything works
reliably ?
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Definition of
ELECTRONIC PACKAGING AND
INTERCONNECTION TECHNOLOGY
(Halbo/Ohlckers)
• The realization of the physical, electronic
system, starting from a block-/circuit diagram
level
• Involves choice of technology for
implementation, choice of materials, detailed
design in chosen technology, analysis of
electrical and thermal properties, reliability et
cetera.
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Packaging requires multiple skills:
–Electronics
–Materials properties and materials compatibility
–Mechanics
–Chemistry
–Metallurgy
–Production technology
–Reliability, etc.
• Product development should involve experts from the
various fields, and the interdependence of the fields may
be the most important to make a good product.
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MEMS - Micro-Electro-Mechanical
Systems (Microsystems)
MEMS can be defined
as miniaturized
mechanical and
electro-mechanical
elements (i.e., devices
and structures) that
are made using the
techniques of
microfabrication.
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Interior chip assembly of the SA30 Crash Sensor, a
microsystem from SensoNor, Norway
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MEMS in automotive applications
The cost of instrumentation in cars amounts to
approximately half the price.
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MEMS in autonomous systems
PD-100 BLACK HORNET PRS
Personal Reconnaissance System
• Rotor span 120 mm
• Mass 18 g including cameras
• Maximum speed 5 m/s
• Endurance up to 25 minutes
• Digital data link beyond 1500 m line-ofsight
• GPS navigation or visual navigation
through video
• Autopilot with autonomous and
directed modes
• Hover & Stare, preplanned routes
• Steerable EO cameras (pan/yaw and
tilt)
• Live video and snapshot images
Manufactured by Prox Dynamics, Asker, Norway
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Where is the MEMS component
closest to you right now?
Step counter
Pressure sensor
(baro-/altimeter)
Image stabilizer in
camera lenses
Microphone,
acellerometer,
gyroscope,
magnetormeter, finger
print sensor
Digital Mirror Device
in projectors
NEMS – Nano-Electro-Mechanical Systems
Nanoelectromechanical
systems (NEMS) are a class
of devices integrating
electrical and mechanical
functionality on the nanoscale.
NEMS form the logical next
miniaturization step from
MEMS devices. NEMS
typically integrate transistorlike nanoelectronics with
mechanical actuators, pumps,
or motors, and may thereby
form physical, biological, and
chemical sensors.
FYS4260/FYS9260
IBM research test circuit: ring oscillator out of
field-effect transistors (FETs) based on
nanowires with diameters as small as 3
nanometers. The oscillator is composed of 25
inverters using negative- and positive-channel
FETs
http://spectrum.ieee.org/semiconductors/devices/ibmmakes-3nanometer-nanowire-silicon-circuits
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Packaging and interconnection hierarchy
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0th level packaging:
Wafer/chip level packaging
The significant for 0th level is
that packaging starts on wafer
level and not after the wafer is
cut into circuits (dice). This
includes for example
• Wafer level metallization and
coating systems
• Wafer-to-wafer joining
• Flip chip or stud bumping
preparation
Flip chip soldered chip
http://www.advotech.com/uimages/servic
es/die-attach/die-attach-flip-chip.jpg
1st level packaging:
Chip package and hybrid circuits
MEMS + ASIC on leadframe (SA80 from
Sensonor)
Multichip module illustration from
http://www.goldenaltos.com/packages.html
3D System in Package
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2nd level packaging:
Components on printed circuit boards
Illustration: http://en.wikipedia.org/wiki/Printed_circuit_board#mediaviewer/File:Testpad.JPG
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3rd level packaging
Stacking circuit boards on a back plane
A single board computer installed into a passive backplane.
http://upload.wikimedia.org/wikipedia/commons/5/5b/SBC-Backplane.jpg
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Moore's law: Doubling of
transistor count every second
year
http://en.wikipedia.org/wiki/Moore%27s_law
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More on Moore's law
"Moore's law" is the observation that, over the history of computing hardware, the
number of transistors in a dense integrated circuit doubles approximately every two
years. The observation is named after Gordon E. Moore, co-founder of the Intel
Corporation, who described the trend in his 1965 paper. His prediction has proven to
be accurate, in part because the law now is used in the semiconductor industry to
guide long-term planning and to set targets for research and development.[ The
capabilities of many digital electronic devices are strongly linked to Moore's law:
quality-adjusted microprocessor prices, memory capacity, sensors and even the
number and size of pixels in digital cameras. All of these are improving at roughly
exponential rates as well.
This exponential improvement has dramatically enhanced the effect of digital
electronics in nearly every segment of the world economy. Moore's law describes a
driving force of technological and social change, productivity, and economic growth in
the late twentieth and early twenty-first centuries.
The period is often quoted as 18 months because of Intel executive David House, who
predicted that chip performance would double every 18 months (being a combination
of the effect of more transistors and their being faster).
Although this trend has continued for more than half a century, "Moore's law" should
be considered an observation or conjecture and not a physical or natural law. Sources
in 2005 expected it to continue until at least 2015 or 2020. The 2010 update to the
International Technology Roadmap for Semiconductors predicted that growth will slow
at the end of 2013, however, when transistor counts and densities are to double only
every three years.
From: http://en.wikipedia.org/wiki/Moore's_law
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Development of typical
transistor feature size as a
function of time
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Electronics packaging must also develop
FYS4260/FYS9260
Frode Strisland
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TYPES OF ELECTRONICS AND
DEMANDS ON THEM - EXAMPLES
• Satellite electronics
Production volume: one unit, 20
years life required, no repair, very
low weight and power, very high
development cost acceptable
Kongsberg Norspace
Oven Controlled X-tal Oscillators
(OCXO)
• Medical device electronics
Similar reliability/power demand, may
be in harsh environment (body
fluids), medium production volume.
FYS4260/FYS9260
Axis-Shield
Afinon Analyzer blood
sample analyzer
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Examples, cont
• Military electronics
Very high reliability
demands, in very rough
environments (vibrations,
shock, humidity, wide
temperature range). High
development cost (and
production cost)
acceptable
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Examples, cont
• Computers
High performance and reliability
required. Very short product life,
high production volume for some,
small volume for some products
• Consumer products
Extreme price pressure, very short
product life, low weight, power,
very big market. No repair.
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Idea stage
Market research
Electronics Development
Pre-project
Development Phases
Product idea defined
Pre-study
Product
recommmendation
Requirements
Specification
Mock-up Lab model
Development Project
Development of
main principles
Reduction of
development risk
Look-like prototype
Detailed design
Work-like prototype
Pre-production,
industrialization,
marketing
Made-like prototype
Production, sale,
service
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Idea stage
Market research
Electronics Development
Market research
Pre-project
Development Phases
Product idea defined
Gives product idea
Mock-up Lab model
Gives product suggestion
Prototypes
Main principles analyzed, important
parts implemented, technology
chosen.
Proof-of-concept verification of critical
features
FYS4260/FYS9260
Development of
main principles
Reduction of
development risk
Development Project
Gives definition of product,
simulation/lab model of critical parts
Product
recommmendation
Requirements
Specification
Pre-study
Defining overall requirements
specifications
Pre-study
Look-like prototype
Detailed design
Work-like prototype
Pre-production,
industrialization,
marketing
Made-like prototype
Production, sale,
service
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DEVELOPMENT PHASES, continued
• Market research
– Gives product idea
• Pre-study
– Gives product suggestion
• Defining overall requirements specifications
– Gives definition of product, simulation/lab model of
critical parts
• Prototype A
– Main principles analyzed, important parts implemented,
technology chosen.
– Proof-of-concept verification of critical features
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DEVELOPMENT PHASES, continued
• Work-like, look-like, made-like prototypes
– Verify functionality
– Look like – test of appearance and acceptance
– Made like – verify manufactuing: Detailed design, correct
form and components. Ready for industrialization.
• Industrialization
– Prototype adapted to producability in available production
equipment. New production line built if needed, pilot series
made.
– Marketing started, service planned
– Full scale production
– Product sale, maintenance, service
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Development principles
• Know the end user needs
• Define accurate requirements (in engineering
terms)
• Do not overdo it (keep it simple stupid)
FYS4260/FYS9260
Frode Strisland
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System requirements engineering
• A System Requirements Specification is a structured
collection of information that embodies the
requirements of a system.
• A "target system requirements specification" (also
known as "design goal specification") is an essential
description of what you want to make.
• System requirements should be SMART
–
–
–
–
–
Specific
Measurable
Achievable
Relevant
Time-limited
FYS4260/FYS9260
Frode Strisland
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FYS4260/FYS9260 administrative
issues
• FYS4260: Master level course
• FYS9260: Ph.D. level course
• Responsible for laboratory project work:
ELAB
• Common e-mail address for all involved in
teaching: [email protected]
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Teaching material
• New lecture notes under development, based
on the structure of Halbo & Ohlckers:
Electronics Components, Packaging and
Production (1995 - ISBN 82-992193-2-9)
• The Halbo & Ohlckers book is available for pdf
download (chapter by chapter), see link below
• Other valuable material can also be found here,
including past exams and presentations:
• And the link is: http://tid.uio.no/kurs/fys4260/
• THIS YEAR: Documents will be found on
course home page
FYS4260/FYS9260
Frode Strisland
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Outline of teaching schedule
• See handout paper
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Course curriculum
Required course reading (preliminary)
• Lecture notes (based on Halbo and Ohlckers: Electronic
components, packaging and production 1995
– The book could be more updated, but basic content is still valid. First
of all get the overview understanding, then dive into the details, which
sometimes are too much, for instance tables on material properties.
• Lecture presentations (uploaded on semester page)
• Handouts – to be specified:
• Laboratory project (FYS4260 and FYS9260 students):
– Design, assembly and testing of a surface mount printed circuit board.
Graded with 20% weight based upon written report and oral
presentation.
• Revised list will follow later
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List of students enrolled
• Will be collected
• Feedback requested throughout the
semester: You help me teach well, and I will
help you learn!
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END OF LECTURE
Any questions?
This presentation is made for FYS4260/FYS9260 teaching
purposes, and is not intended for publication elsewhere.