Plastic Packages for Integrated Circuits
Package Outline Drawing
W5x7.35C
35 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.5mm PITCH)
Rev 0, 12/16
X
Y
2.551 ±0.030
0.500
35x 0.320 ±0.03
G
F
E
3.670 ±0.030
D
C
B
A
(4X)
0.10
PIN 1
(A1 CORNER)
2
1
3
0.335
5
4
0.276
0.500
TOP VIEW
BOTTOM VIEW
Z
0.300
0.05 Z
PACKAGE
OUTLINE
SEATING PLANE
3
0.500
4
0.320 ±0.030
0.10
Z X Y
0.05
Z
5
0.250
0.240 ±0.030
6
RECOMMENDED LAND PATTERN
0.600 ±0.060
SIDE VIEW
NOTES:
1. All dimensions are in millimeters.
2. Dimensions and tolerance per ASME Y14.5 - 1994.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Dimension is measured at the maximum bump diameter parallel to primary datum Z .
5. Bump position designation per JESD 95-1, SPP-010.
6. NSMD refers to non-solder mask defined pad design per Intersil Techbrief TB451.
1