3N Gold Wire for Excellent Ball Bond Reliability
6.25 µm
168 hrs / 175°C
Time to First Ball Lift [hrs]
First Bond Reliability
Ultimate Intermetallic Stability
for Enhanced Reliability
Optimised composition for ultimate
intermetallic stability
Superior reliability on a wide range of
aluminum bond pad composition and
thickness
Applicable in a wide range of diameters
including use in high-power applications
Low hardness FAB (free-air-ball) allows
bonding on sensitive bond structures
Uncompromised low electrical resistivity
1500
1000
500
Conventional
Wire
0
Pitch [µm]
Ball dia. [µm]
35
28
40
45
36
50
55
60
50
Reliability Comparison
Pull Stress / MPa
250
Pull Stress / MPa
250
6.25 µm
246 hrs / 175°C
200
150
100
200
150
100
50
50
Conventional Wire
0
0
24
48
96
200
500
0
1000
Isothermal Aging @ 175°C in Air
6.25 µm
500 hrs / 175°C
0
24
48
96
200
500
Bonding Condition: Metallization: 0.5% Cu, 99.5% Al . Bond pad pitch: 35 µm . Bonded ball diameter: 28 µm Wire diameter: 15 µm
Bonding temperature: 170°C . Capillary: K&S M14CJ-2010-Z33-KSS Atlas
Recommended Technical Data of
Diameter
1000
Isothermal Aging @ 175°C in Air
Microns
15
18
20
23
25
28
30
32
33
35
38
50
Mils
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.25
1.3
1.4
1.5
2.0
Elongation (%)
2–6
2–6
2–7
2–7
2–7
2–7
2–7
2–7
2–7
2–7
2–7
4 – 12
Breaking Load (g)
2–5
3–7
4–8
7 – 12
8 – 13
10 – 15
12 – 17
13 – 21
14 – 22
16 – 23
20 – 28
32 – 46
Recommended Specs
for Ball Bonding
For other diameters, please contact Heraeus Bonding Wires sales representative.
N, Layout: HET14023-0516-1
Characteristics for 25 µm diameter
Non-Gold Elements
< 0.1%
Elastic Modulus
ⵑ 75 GPa
Heat Affected Zone (HAZ)
50 – 170 µm
Melting Point
1063 °C
Density
Heat Conductivity
19.32 g/cm3
3.17 W/cm.K
Electrical Resistivity
2.3 µ⍀-cm
Coeff. of Linear Expansion (20 – 100°C)
14.2 ppm/K
Fusing Current for 25 µm, dia 10 mm length (in air)
0.37 A
FAB Hardness
55 – 65 HV (0.01 N/5 s)
High Reliability
5.0
5.0
5.0
4.0
4.0
4.0
3.0
3.0
3.0
2.0
35 µm BPP
Ball dia: 28 µm
1.0
1.0
0
2.0
45 µm BPP
Ball dia: 36 µm
0
24
48
96
200
500
Bake Time in Air @ 175°C [hrs]
1000
0
60 µm BPP
Ball dia: 50 µm
1.0
0
24
48
96
200
500
0
1000
Bake Time in Air @ 175°C [hrs]
0
24
48
96
200
500
1000
Bake Time in Air @ 175°C [hrs]
Gold Wire Segmentation by Properties
Superior Reliability
Superior Reliability
Superior Reliability
High
oop
hL
Sen
si
str tive p
uct
ure ad
Hig
oop
wL
/ Lo
Widest Bonding
Window
Highest Looping
Performance
Heraeus Electronics
Heraeus Deutschland GmbH & Co. KG
Heraeusstraße 12-14
63450 Hanau, Germany
www.heraeus-electronics.com
Electrical Performance
Widest Bonding
Highest Looping
Window
Performance
Widest Bonding
Window
Highest Looping
Performance
Average
Americas
Phone +1 610 825 6050
[email protected]
China
Phone +86 21 3357 5457
[email protected]
Asia Pacific
Phone +65 6571 7677
[email protected]
Europe, Middle East and Africa
Phone +49 6181 35 3069
+49 6181 35 3627
[email protected]
The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our
possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or
any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.
The data given here is valid. We reserve the right to make technical alterations.
2.0