© Mircea Stan, Kevin Skadron, David Brooks, 2002
Thermal Issues References
• “Thermal considerations in cooling large scale high
compute density data centers” Patel, C.D.; Sharma, R.;
Bash, C.E.; Beitelmal, A. Termal and Thermomechanical
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microprocessors”, Dickinson, R.D.; Novotny, S.; Vogel, M.;
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A.; Yusuf, I.; Cherukuri, N.; Brandenburger, P.; Kay, A.;
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Thermal Issues References
• “The IA-64 Itanium processor cartridge”, Samaras, W.A.;
Cherukuri, N.; Venkataraman, S. IEEE Micro , Volume: 21
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“Study of heatsink grounding schemes for GHz microprocessors”
Radhakrishnan, K.; Wittwer, D.; Yuan-Liang Li Electrical
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“Cartridge thermal design of Pentium/sup (R)/ III processor for
workstation: giga hertz technology envelope extension
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Clustering References
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Clustering References
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Clustering References
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E. Grochowski, D. Ayers, and V. Tiwari. “Microarchitectural
simulation and control of di/dt-induced power supply voltage
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EliminateVoltage Emergencies in High Performance Processors,”
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Microarchitectural Technique to Reduce Inductive Noise in
Supply Voltage”, ISCA30, June 2003
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Reduce Inductive Noise,” ISCA2004.
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