Key Technologies
Contact Technologies
Key Technologies
Contact Technologies
Proprietary MEMS technologies for
ultrafine designs and fabrication
Developing materials for today and
tomorrow
Because LSI continues to become finer and finer, today
contact with input-output terminal ends must take place
on the micron level (one thousandth of a millimeter).
MJC has used a proprietary method to develop MEMS
technologies and now develops unique probes and probe
card products utilizing these technologies.
Ultrafine fabrication and metal fabrication technologies
alone will not make it possible to ensure consistent
contact during measurements. MJC engages in R&D
on metallic materials through demonstration testing
on electrical properties, stress, and expandability. We
also focus on basic research for the future through
collaborative research with universities on new alloys and
other materials.
Image of a micro cantilever
Pinpoint LiPS image of
a probe unit taken with
a scanning electron
microscope (SEM)
Pinpoint probe image of a cantilever probe card
MJC’s core contact technologies have been
constantly refined for almost five decades.
The common denominator in MJC’s mainstay products comprises electronic measurement technologies known
as contact technologies.
These technologies make it possible to contact the fine terminal ends on semiconductor and FPD devices as
well as receive and return test signals from a measurement device.
These contact technologies, which have supported this series of processes after almost five decades of
refinement, stand at the heart of MJC’s superior performance.
Combining technologies with a strong
background in manufacturing
Structural designs underpinned by
simulation assessments
While pursuing precision equipment fabrication
technologies required for manufacturing, MJC has also
refined the expertise of its highly experienced engineers.
MJC’s short lead times for delivering narrow pitch and
larger current capacity probe cards has been made
possible by the perfect combination of precision machining
fabrication and engineering expertise during assembly.
Probe and probe card structures are one of the most
important elements in determining the accuracy of
electronic measurements. MJC assesses design
structures using computer simulations and makes
modifications based on these findings before completing
the finished product.
Stress simulation
example:
Micro cantilever
Stress simulation example:
Probe card overview
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MICRONICS JAPAN CO., LTD.
Corporate Profile
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