Technical Sessions
* INDUSTRY PAPER ** STUDENT PAPER
TUESDAY MORNING
10:30 AM - 12:00 PM
TU-AM-1 EMC MANAGEMENT
Grand Ballroom A
Chair: Kimball Williams, Dearborn, MI, USA
10:30 AM
China CCC Implementation Rules
Grace Lin, Crestron Electronics, Inc., Rockleigh,
NJ, USA
11:00 AM
Using Joint Time-Frequency Domain Analysis to
Evaluate Absorber/Lossy Material Performance in
Resonant Cavities*
Bruce Archambeault1, Michael Varner2, and
Samuel Connor3, (1) Missouri University of
Science and Technology, Four Oaks, NC, USA, (2)
Rose Hulman Institute of Technology, Terre Haute,
IN, USA, (3) IBM Corporation, Research Triangle
Park, NC, USA
11:30 AM
Suppression of Cavity Resonant Edge Effects and
PDN Impedance using Absorbing Materials
Shaowu Huang1, Gary Charles1, Kai Xiao1,
Beomtaek Lee2, Gong Ouyang1, and Hanqiao
Zhang1, (1) Intel Corporation, DuPont, WA, USA,
(2) Intel Corporation, Santa Clara, CA, USA
11:00 AM
A New Framework for the EU EMC Directive
Mark Maynard, SIEMIC, Inc., Milpitas, CA, USA
10:30 AM - 12:00 PM
TU-AM-2 PASSIVE COMPONENT
MODELING AND MEASUREMENT
Grand Ballroom B
Chair: Jim Nadolny1 and Zhichao Zhang2, (1)
Samtec, Inc., New Albany, IN, USA, (2) Intel Corp.,
Chandler, AZ, USA
10:30 AM
Effects of Temperature and Humidity Variation
on Electrical Performance of High Speed Data
Cables*
Joseph Diepenbrock1, Patrick Casher1, Xin Wu1,
Alan Benner2, and Sheng Xu3, (1) Lorom America,
Morrisville, NC, USA, (2) IBM Corporation,
Poughkeepsie, NY, USA, (3) Lorom Industrial
Group, Hangzhou, China
48
10:30 AM - 12:00 PM
TU-AM-3 JITTER/NOISE MODELING
AND ANALYSIS
Grand Ballroom C
Chairs: Brice Achkir1 and Fangyi Rao2, (1) Cisco
Systems, Inc., San Jose, CA, USA, (2) Agilent
Technologies, Santa Clara, CA, USA
10:30 AM
Reducing Power-Supply and Ground Noise
Induced Timing Jitter in Short Pulse Generation
Circuits
Jiwei Sun1, Hanqiao Zhang2, and Pingshan
Wang1, (1) Clemson University, Clemson, SC, USA,
(2) Intel Corporation, DuPont, WA, USA
11:00 AM BEST SIPI PAPER FINALIST
On-Chip Linear Voltage Regulator Module (VRM)
Effect on Power Distribution Network (PDN) Noise
and Jitter at High-Speed Output Buffer
Heegon Kim1, Sukjin Kim1, Changwook Yoon2,
Jingook Kim3, Brice Achkir4, Joungho Kim1, and
Jun Fan5, (1) Korean Advanced Institute of Science
and Technology (KAIST), Daejeon, South Korea,
(2) Altera Corporation, San Jose, CA, USA, (3)
Ulsan National Institute of Science and Technology,
Ulsan, South Korea, (4) Cisco Systems, Inc., San
Jose, CA, USA, (5) Missouri University of Science
and Technology, Rolla, MO, USA
2015 IEEE Symposium on Electromagnetic Compatibility & Signal Integrity Final Program
Technical Sessions
* INDUSTRY PAPER ** STUDENT PAPER
11:30 AM
10:30 AM - 12:00 PM
TU-AM-4 NUMERICAL MODELING
AND SIMULATION TECHNIQUES I
Grand Ballroom D
Chair: Dan Jiao1, and Qinghua Bill Chen2,
(1) Purdue University, West Lafayette, IN, USA,
(2) Yangtze Delta Region Institute of Tsinghua
University, Jiaxing, Zhejiang, China
10:30 AM
Physical Interpretation of Radiation and Transfer
Characterization Based on the PEEC Method**
Ying S. Cao1, Li Jun Jiang1, and Albert E. Ruehli2,
(1) The University of Hong Kong, Hong Kong,
Hong Kong, (2) Missouri University of Science and
Technology, Rolla, MO, USA
11:00 AM
Full-wave Simulation of an Imbalanced
Differential Mircostrip Line with Conductor
Surface Roughness
Marina Koledintseva1, Tracey Vincent2, and Sergiu
Radu3, (1) Oracle, Menlo Park, CA, USA, (2) CST
of America, Framingham, MA, USA, (3) Oracle,
Menlo Park, CA, USA
11:30 AM BEST SIPI PAPER FINALIST
Quality Assurance of S-parameters and Rational
Function Models for Transient Simulations
Sanghoek Kim, Gerardo Romo Luevano, Kevin
Roselle, and Tim Michalka, Qualcomm Inc., San
Diego, CA, USA
10:30 AM - 12:00 PM
TU-AM-5 ELECTROMAGNETIC
ENVIRONMENT AND ESD
Grand Ballroom E
Chair: William Radasky, Metatech Corporation,
Goleta, CA, USA
10:30 AM BEST EMC PAPER FINALIST
Modal Expansion Basis for Statistical Estimation of
Maximum Expected Field Strength in Enclosures
Paul Bremner, Robust Physics, Del Mar, CA, USA
Technical Program
Analysis and Comparison of DDR3/DDR4 Clock
Duty-Cycle-Distortion (DCD) for UDIMM and
Discrete SDRAM Component Configurations*
GaWon Kim, June Feng, Marjan Mokhtaari, David
Lieby, Janmejay Adhyaru, Raheel Shaikh, Balaji
Natarajan, and Dan Oh, Altera Corporation, San
Jose, CA, USA
11:00 AM
Modeling Atmospheric Turbulence and Noise as
Electromagnetic Interference
Robert McMillan1 and Ira Kohlberg2, (1) Retired
US Army Civilian, St George Island, FL, USA, (2)
Kohlberg Associates, Reston, VA, USA
11:30 AM BEST STUDENT PAPER FINALIST
Electrostatic Charging Caused by Standing up
from a Chair and by Garment Removal**
Atieh Talebzadeh1, Mahdi Moradian1,
Yunan Han1, David E. Swenson2, and David
Pommerenke1, (1) Missouri University of Science
and Technology, Rolla, MO, USA, (2) Affinity Static
Control Consulting, L.L.C
Round Rock, TX, USA
ABOUT
SANTA
CLARA
At 3,486 ft, Mt. Umunhum is the
fourth-highest peak in the Santa
Cruz Mountains in California.
The area covers 11,646-acres of
the Santa Clara County.
www.emc2015usa.emcss.org
49
Technical Sessions
* INDUSTRY PAPER ** STUDENT PAPER
TUESDAY AFTERNOON
1:30 PM - 5:30 PM
TU-PM-1 SPECIAL SESSION:
RADIO-FREQUENCY INTERFERENCE
AND WIRELESS EMC
Grand Ballroom A
Chairs: Harry Skinner1, David Pommerenke2, and
Perry Wilson3, (1) Intel Corporation, Hillsboro,
OR, USA, (2) Missouri University of Science and
Technology, Rolla, MO, USA, (3) National Institute of
Standards and Technology (NIST), Boulder, CO, USA
1:30 PM
Measuring a Device’s Susceptibility to LTE:
Preliminary Approaches
Jason Coder, John Ladbury, and William Young,
National Institute of Standards and Technology
(NIST), Boulder, CO, USA
4:00 PM
PC Client Platform RFI Risks and Mitigation
Methodologies
Dongho Han, Hao-Han Hsu, Joseph Chen, Mike
Schaffer, Chi M. Cheung, and Pujitha Davuluri,
Intel, Hillsboro, OR, USA
Ask the Experts
TUESDAY, MARCH 17
3:30-4:30 PM Rear of the Exhibit Hall
We will again hold the popular ‘Ask the Experts’
panel discussion.
2:00 PM
A Review of Wireless Coexistence Test
Methodologies
William Young1, Jason Coder1, and Luis
Gonzalez2 (1) National Institute of Standards
and Technology (NIST), Boulder, CO, USA, (2)
University of Colorado, Boulder, CO, USA
Bring your questions concerning all aspect of
EMC and SI/PI. Panelist will be from a wide
range of EMC, SI and PI related disciplines and
will provide answers to any/all questions from
the audience. This is a unique opportunity to
have so many experts in one place!
2:30 PM
Wearables/IOT Devices: Challenges and
Solutions to Integration of Miniature Antennas in
Close Proximity to the Human Body
Soji Sajuyigbe1 and Kevin J. Daniel2, (1) Intel
Corporation, Santa Clara, CA, USA, (2) Intel
Corporation, Hillsboro, OR, USA
Panel Participants:
3:00 PM
BREAK
50
3:30 PM
Gb/s USB: RFI Risk Analysis and Test
Methodologies
Pujitha Davuluri, Chung-Hao (Joseph)
Chen, Kuan-Yu Chen, and Eric Gantner, Intel
Corporation, Hillsboro, OR, USA
•
•
•
•
•
•
•
Bruce Archambeault (moderator)
Jun Fan
Mark Steffka
Dan Hoolihan
Don Heirman
Dale Becker
Brice Achkir
Please make it a point to attend!
2015 IEEE Symposium on Electromagnetic Compatibility & Signal Integrity Final Program
Technical Sessions
* INDUSTRY PAPER ** STUDENT PAPER
1:30 PM - 5:30 PM
TU-PM-2 ELECTROMAGNETIC
INTERFERENCE CONTROL
TU-PM-3 HIGH SPEED LINK DESIGN I
Grand Ballroom B
Chairs: John Kraemar1 and Ross Carlton2, (1)
Rockwell Collins, Inc., Cedar Rapids, IA, USA, (2)
National Instruments, Austin, TX, USA
1:30 PM
Miniaturization Approach for EBG-Based
Common Mode Filter and Interference Analysis
Carlo Olivieri1, Francesco de Paulis1, Antonio
Orlandi1, Bruce Archambeault2,3, and Samuel
Connor3, (1) University of L’Aquila, L’Aquila, Italy,
(2) IBM Corporation, Research Triangle Park (RTP),
NC, USA, (3) Archambeault EMI/EMC Enterprises,
Four Oaks, NC, USA
2:00 PM
A Study of EMI from Patterned Ground Structures
Albert Wallash and Jack Nguyen, HGST, a
Western Digital Company, San Jose, CA, USA
2:30 PM
A Comparison of Relative Shielding Provided by
Stitching Vias and Edge Plating
Jim Chiappe, Juniper Networks, Sunnyvale, CA, USA
3:00 PM
BREAK
BEST EMC PAPER FINALIST and BEST
STUDENT PAPER FINALIST
3:30 PM
2D Imaging System With Optical Tracking for EMI
Source Localization**
Hui He, Victor Khilkevich, and David
Pommerenke, Missouri University of Science and
Technology, Rolla, MO, USA
4:00 PM
Frequency Selective Surfaces for EMI/Thermal
Applications*
Paul Dixon1, Mohammad Ali Khorrami1, Yoeri Arien2,
John Song3, and Keith Johnson4, (1) Laird, Randolph,
MA, USA, (2) Laird, Geel, Belgium, (3) Laird,
Schaumburg, IL, USA, (4) Laird, Cleveland, OH, USA
Grand Ballroom C
Chairs: Joy Li1 and Chunfei Ye2, (1) Cadence
Design Systems, San Jose, CA, USA, (2) Intel Co.,
DuPont, WA, USA
1:30 PM
Design of Package BGA Pin-out for >25Gb/s
High Speed SerDes Considering PCB Via
Crosstalk
Wei Yao, Jane Lim, Ji Zhang, Kenneth Tseng,
Kelvin Qiu, and Rick Brooks, Cisco Systems, Inc,
San Jose, CA, USA
Technical Program
1:30 PM - 5:30 PM
2:00 PM BEST SIPI PAPER FINALIST
Effective Equalization of a High Speed Differential
Channel with Re-driver - Screening and RSM
DOE Method Applied to a Real System**
Maria Garcia1, Raul Enriquez2, and Jose A.
Ramos2, (1) CINVESTAV Guadalajara, Zapopan,
Mexico, (2) Intel Tecnologia de Mexico, Zapopan,
Mexico
2:30 PM BEST SIPI PAPER FINALIST
Method for Accurate and Efficient Signaling
Analysis of Nonlinear Circuits
Dan Jiao1 and Jianfang Zhu2, (1) Purdue
University, West Lafayette, IN, USA, (2) Intel,
Hillsboro, OR, USA
3:00 PM
BREAK
3:30 PM
DDR4 Address Bus Interconnect Optimization*
Syed Bokhari, Fidus Systems Inc., Ottawa, ON,
Canada
4:00 PM
Aggressive Dual Stripline Design for Single Ended
Signaling*
Gong Ouyang and Kai Xiao, Intel Corp, Dupont,
WA, USA
4:30 PM
Signal Integrity Qualification and Optimization
for High Speed Tester*
Tao Wang, Benjamin Harding, Brian Brecht, and
Ray Mirkhani, Teradyne, Agoura Hills, CA, USA
www.emc2015usa.emcss.org
51
Technical Sessions
Technical Program
* INDUSTRY PAPER ** STUDENT PAPER
5:00 PM BEST INDUSTRY PAPER FINALIST
System Level Modeling of Supply Noise Induced
Jitter for High Speed Clock Forwarding Interface*
Yujeong Shim and Dan Oh, Altera Corporation,
San Jose, CA, USA
1:30 PM - 5:30 PM
TU-PM-4 SI/PI/EMC COSIMULATION AND CO-DESIGN
Grand Ballroom D
Chairs: Olena Zhu and Duo Chen, Intel
Corporation, Santa Clara, CA, USA
1:30 PM
Signal Integrity and EMI Evaluations of An RFIDSensor Tag for Internet-of-Things Applications**
Abdulhadi E. Abdulhadi1, Svetoslav Mandev2, and
Ramesh Abhari2, (1) McGill University, Montreal,
QC, Canada, (2) Santa Clara University, Santa
Clara, CA, USA
2:00 PM
Analytical PDN Voltage Ripple Calculation Using
Simplified Equivalent Circuit Model of PCB PDN**
Biyao Zhao1, Chenxi Huang1,2, Ketan
Shringarpure1, Jun Fan1, Bruce Archambeault1,
Brice Achkir3, Samuel Connor4, Michael Cracraft5,
Matteo Cocchini5, Albert Ruehli6, and James
Drewniak1, (1) Missouri University of Science
and Technology, Rolla, MO, USA, (2) Huazhong
University of Science and Technology, Wuhan,
China, (3) Cisco Systems, Inc., San Jose, CA, USA,
(4) IBM Corporation, Research Triangle Park,
NC, USA, (5) IBM Corporation, Poughkeepsie,
NY, USA, (6) Missouri University of Science and
Technology, Windham, NH, USA
2:30 PM BEST INDUSTRY PAPER FINALIST
Using Co-Design Techniques to Minimize
IC Package Cost without Compromising
Performance: Simulation and Measurement
Validation*
Jie Chen, Robert DeMoor, Minhong Mi, and Rajen
Murugan, Texas Instruments, Inc., Dallas, TX, USA
3:30 PM
Optimization of MIM Cap Layout for
Simultaneous Switching Noise Reduction*
Guang Chen and Dan Oh, Altera Corporation,
San Jose, CA, USA
4:00 PM
Signal and Power Integrity Challenges in Small
Form Factor Mobile Devices*
Duo Chen and Fan Yu, Intel Corporation, Santa
Clara, CA, USA
4:30 PM
ISI and Crosstalk Challenges in FPGA Memory
I/O Design*
Janani Chandrasekhar, Hui Liu, and Dan Oh,
Altera Corporation, San Jose, CA, USA
WEDNESDAY MORNING
8:30 AM - 10:00 AM
WED-AM-1 AUTOMOTIVE EMC
MEASUREMENTS
Grand Ballroom A
Chair: Craig Fanning, Elite Electronic Engineering
Inc., Downers Grove, IL, USA
8:30 AM
On the Interplay Between the Engine Cooling Fan
and Heat Exchanger for Automotive AM Band
Radiated Emission Measurement
Cyrous Rostamzadeh1, Kimball Williams2, Dennis
Schwaiger3, David Maciejewski4, and Mark
Steffka5, (1) Bosch, Plymouth, MI, USA, (2) Retired,
Dearborn, MI, USA, (3) Retired, Plymouth, MI,
USA, (4) ASEE, Plymouth, MI, USA, (5) General
Motors, Milford, MI, USA
3:00 PM
BREAK
52
2015 IEEE Symposium on Electromagnetic Compatibility & Signal Integrity Final Program
Technical Sessions
* INDUSTRY PAPER ** STUDENT PAPER
9:30 AM
Impact of Mismatch Loss on Mobile Phone
Simulation for Automotive Testing
Keith Frazier1 and Peng Peng2, (1) Ford Motor
Company, Dearborn, MI, USA, (2) Ford Motor
Company (Asia Pacific and Africa), Nanjing, China
8:30 AM - 10:00 AM
WED-AM-2 PASSIVE COMPONENT
MODELING AND MEASUREMENT II
Grand Ballroom B
Chair: Antonio Ciccomancini1 and Shaowei
Deng2, (1) Apple Inc., Cupertino, CA, USA, (2) F5
Networks, San Jose, CA, USA
8:30 AM
Comparison of TRL Calibration vs. 2x Thru Deembedding Methods
Se-Jung Moon1, Xiaoning Ye1, and Rex Smith2, (1)
Intel, Hillsboro, OR, USA, (2) Intel, Dupont, WA, USA
9:00 AM
Investigation of S21 Magnitude Extraction
Methodologies by Using a Pattern Generator and
Sampling Oscilloscope**
Xinyun Guo1, Ketan Shringarpure1, Fadi Daou2,
and Jun Fan1, (1) Missouri University of Science
and Technology, Rolla, MO, USA, (2) MultiLane
SAL, Santa Clara, CA, USA
9:30 AM
Investigation of Signal Integrity Issues in Multipath Electrostatic Discharge Protection Device
Yang-Chih Huang1, Chung-Hao Chen2, and TzongLin Wu1, (1) National Taiwan University, Taipei,
Taiwan, (2) Intel Corporation, Portland, OR, USA
8:30 AM - 10:00 AM
WED-AM-3 JITTER/NOISE
MODELING AND ANALYSIS II
Grand Ballroom C
Chairs: Zhiping Yang and Jihong Ren, Altera, San
Jose, CA, USA
Technical Program
9:00 AM
Electromagnetic Susceptibility Testing on Vehicles
– Effects of Testing in the Near-Field with Cavity
Measurements on a Slotted Circular Cylinder*
Marsellas Waller1, Thomas Shumpert2, Robert
Scharstein3, and Steve Wong4, (1) US Army
Redstone Test Center, Redstone Arsenal, AL, USA,
(2) Auburn University – Retired, Auburn, AL, USA,
(3) University of Alabama, Tuscaloosa, AL, USA,
(4) AFRL/RCM (Engility Corporation), WrightPatterson AFB, OH, USA
8:30 AM
A Methodical Approach to DDR Clock Jitter
Analysis*
Anita Ekren and Steve Stefek, Avago
Technologies, Fort Collins, CO, USA
9:00 AM
Duty Cycle Distortion Amplification in High Speed
Data Channels*
Yan Duan1,2, Wenyi Jin2, and Jihong Ren2, (1)
Iowa State University, Ames, IA, USA, (2) Altera
Inc., San Jose, CA, USA
9:30 AM
A Slope and Amplitude controllable TriangularCurrent Generator for the Injection of a Broadband PDN Noise*
Changwook Yoon1, Sukjin Kim2, Kiyeong Kim2,
Heegon Kim2, Jingook Kim3, Joungho Kim2, and
Jun Fan4, (1) Altera Corporation, San Jose, CA,
USA, (2) Korean Advanced Institute of Science and
Technology (KAIST), Daejeon, South Korea, (3)
Ulsan National Institute of Science and Technology,
Ulsan, South Korea, (4) Missouri University of
Science and Technology, Rolla, MO, USA
ABOUT
SILICON
VALLEY
The Silicon Valley newspaper,
“San Jose Mercury News” is
named for the fact that nearby New Almaden used to be a
mercury mine.
www.emc2015usa.emcss.org
53
Technical Sessions
* INDUSTRY PAPER ** STUDENT PAPER
Technical Program
8:30 AM - 10:00 AM
WED-AM-4 POWER INTEGRITY AND
POWER DELIVERY NETWORK I
Grand Ballroom D
Chairs: Dale Becker1 and Guang Chen2, (1) IBM,
Poughkeepsie, NY, USA, (2) Altera Corporation, San
Jose, CA, USA
8:30 AM BEST INDUSTRY PAPER FINALIST
Challenges and Solutions for Core Power
Distribution Network Designs*
Dan Oh and Guang Chen, Altera Corporation,
San Jose, CA, USA
9:00 AM
Power Archipelago for GHz Power Filtering on
Printed Circuit Boards**
Christopher Ferguson and A. Ege Engin, San
Diego State University, San Diego, CA, USA
9:30 AM
A Multistage “Power Integrity Surgery” for
Designing Complex Automotive Electronic
Control Units*
Ralf Bruening1, Torsten Wagner2, and Ralf
Kakerow2, (1) EMC Technology Center, ZUKEN,
Paderborn, Germany, (2) Division Interior,
Continental Automotive GmbH, Wetzlar, Germany
BEST EMC PAPER FINALIST and BEST
STUDENT PAPER FINALIST
9:30 AM
An Augmented Electric Field Integral Equation
Formulation for Dielectrics and Conductors at
Low Frequencies**
Tian Xia1, Hui Gan1, Michael Wei1, Weng Chew1,
Henning Braunisch2, Zhiguo Qian2, Kemal
Aygun2,and Alaeddin Aydiner3, (1) University of
Illinois, Urbana-Champaign, Urbana, IL, USA, (2)
Intel Corporation, Chandler, AZ, USA, (3) Intel
Corporation, Hillsboro, OR, USA
10:30 AM - 12:00 PM
POSTER SESSION
Grand Ballroom A-D Foyer
Chairs: Jingook Kim1 and Alpesh Bhobe2, (1) Ulsan
National Institute of Science and Technology, Ulsan,
South Korea, (2) Cisco Systems, Inc., San Jose, CA, USA
8:30 AM - 10:00 AM
Modeling of SOL Calibration Standards for PCB
Channel Probing*
Juyoung Lee, Oracle Corporation, Santa Clara, CA, USA
WED-AM-5 APPLICATIONS OF
NUMERICAL MODELING
Handling PDN Resonance Modes*
Sherman Chen1, Greg Fu2, and Tao Hu3, (1) EMC
Corp., Shanghai, China, (2) Molex Corp., Shanghai,
China, (3) LUXSHARE-ICT, Inc, Milpitas, CA, USA
Grand Ballroom E
Chairs: Vignesh Rajamani and James West,
Oklahoma State University, Stillwater, OK, USA
8:30 AM
Analysis of Field Probe Perturbation in a Mode
Stirred Reverberation Chamber
Luca Bastianelli, Valter Mariani Primiani, and
Franco Moglie, Università Politecnica delle
Marche, Ancona, Italy
54
9:00 AM BEST EMC PAPER FINALIST
Robust and Efficient RLGC Extraction for
Transmission Line Structures with Periodic ThreeDimensional Geometries
Yunhui Chu1, Jason Zhenwei Yu2, and Zhiguo
Qian3, (1) Intel Corp, Hillsboro, OR, USA, (2)
Intel, Seattle, WA, USA, (3) Intel Corporation,
Chandler, AZ, USA
Experimental Characterization of Supply Induced
Jitter in High Speed Serial Links*
Yujeong Shim and Dan Oh, Altera Corporation,
San Jose, CA, USA
An Improved Multiple Edge Responses Method for
Memory Simulation Considering Worst Case and
Nonlinear Crosstalk
Shiji Pan1, and Jiangyuan Qian2, (1) Inphi
Corporation, Santa Clara, CA, USA, (2) Qualcomm
Technologies, Inc., San Diego, CA, USA
2015 IEEE Symposium on Electromagnetic Compatibility & Signal Integrity Final Program
Technical Sessions
* INDUSTRY PAPER ** STUDENT PAPER
Common-Mode Noise Reduction on BroadsideCoupled Delay Line
Ding-Bin Lin1, Chung-Pin Huang1, Hsin-Nan Ke2,
and Wen-Sheng Liu3, (1) National Taipei University
of Technology, Taipei City, Taiwan, (2) PEGATRON
Corporation, Taipei City, Taiwan, (3) WIESON
Technologies Co., Ltd., New Taipei City, Taiwan
Design of a 20 GHz Bandwidth Dual-stage DualFIR Channel Emulator
Wei Qian1, David Pommerenke1, Atieh Talebzadeh1,
Guanghua Li1, Chong Ding2, Stephen Scearce2,
Yaochao Yang3, Douglas White2, and Jianchi Zhou4,
(1) Missouri University of Science and Technology,
Rolla, MO, USA, (2) Cisco Systems, Inc., San Jose,
CA, USA, (3) Cisco Systems, Inc., San Jose, CA, USA,
(4) Huazhong University of Science and Technology,
Wuhan, China
Reconstruction of Currents from EMC Near-Field
Measurements by Means of Continuity Equation
Constraints
Martin Schmidt and Manfred Albach, FriedrichAlexander-University Erlangen-Nuremberg,
Erlangen, Germany
BEST STUDENT PAPER FINALIST
Radiation Physics from Two-Wire Transmission
Lines**
Jing Li1, YaoJiang Zhang1, Dazhao Liu1, Alpesh
Bhobe2, James Drewniak1, and Jun Fan1, (1) Missouri
University of Science and Technology, Rolla, MO,
USA, (2) Cisco Systems, Inc., San Jose, CA, USA
THURSDAY MORNING
8:30 AM - 12:00 PM
TH-AM-1 EMC MEASUREMENTS
AND CALIBRATION
Grand Ballroom A
Chair: Dave Arnett, Hewlett Packard, Vancouver, WA, USA
8:30 AM
Characterization and Correction of Calibration
Jigs for LISN Impedance Measurements
Alexander Kriz, Seibersdorf Laboratories,
Seibersdorf, Austria
9:00 AM
A proposal of Substitution Method for Antenna
Calibrations by the Use of Absorbers on the
Ground Plane at Frequencies from 1 to 18 GHz
Mitsunobu Samoto, Nobuhito Samoto, and Ikuo
Makino, Liberty Labs Asia, Inc., Yokohama, Japan
9:30 AM
Innovative Field Receiver Based on a New Type of
Active Rod Antenna*
Domenico Festa1, Alessandro Gandolfo2, and
Renzo Azaro3, (1) IBD International Business
Development S.a.s., CHIARI (BS), Italy, (2) Narda
Safety Test Solutions S.r.l., Cisano sul Neva (SV),
Italy, (3) EMC S.r.l., Genova, Italy
EMC in the Canadian Army
10:00 AM
BREAK
WEDNESDAY, MARCH 18
10:30 AM
Extension and Verification of Absorbing Material
Effectiveness on Reducing Electromagnetic
Emissions from Cavities Measured Using a
Nested Reverberation Chamber Approach
Eric Drake1, Vignesh Rajamani2, Chuck Bunting1,
James West1, Bruce Archambeault2, and Samuel
Connor2, (1) Oklahoma State University, Stillwater,
OK, USA, (2) IBM Corporation, Research Triangle
Park, NC, USA
11:00 AM - NOON Rear of the Exhibit Hall
Military application require very specialized
EMC considerations. Kris Hatashita is the
Canadian Army subject matter expert for all
matters of Electromagnetic Environmental
Effects (E3) and has a perspective on
the topic that will be of interest to EMC
engineers and specialists
www.emc2015usa.emcss.org
55
Technical Sessions
Technical Program
* INDUSTRY PAPER ** STUDENT PAPER
11:00 AM
Received Power and Ambient Electric Field from
Broadband Emissions in Reverberant Spaces
Gregory Tait, Carl Hager, IV, Timothy Baseler, and
Michael Slocum, NSWC Dahlgren, Dahlgren, VA, USA
11:30 AM BEST EMC PAPER FINALIST
Maximum Received Power Statistics within RF
Reflective Enclosures for HERO/EMV Testing
Carl Hager, IV and Gregory Tait, NSWC
Dahlgren, Dahlgren, VA, USA
8:30 AM - 12:00 PM
TH-AM-2 HIGH SPEED LINK
DESIGN II
Grand Ballroom B
Chairs: Dan Oh1 and Shaowu Huang2, (1)
Altera Corporation, San Jose, CA, USA, (2) Intel
Corporation, DuPont, WA, USA
8:30 AM
Effective Methodology for Correlating
Measurement to Simulation for IBIS-AMI Models*
Seungyong Baek, Mike Sapozhnikov, and
Amendra Koul, Cisco Systems, San Jose, CA, USA
9:00 AM
Signal Integrity Considerations in Implementing
USB On-The-Go for Mobile Designs*
Sudeep Puligundla1, Khang Choong Yong2,
Wil Choon Song2, Vijay Kasturi1, Steven Ji3, and
Xiaoning Qi3, (1) Intel Corporation, Hillsboro, OR,
USA, (2) Intel Corporation, Penang, Malaysia, (3)
Intel Corporation, Santa Clara, CA, USA
9:30 AM
Design of Very Low Distortion Dense Routings
for Skew Compensation in High Speed
Interconnects*
Raul Enriquez-Shibayama, Benjamin LopezGarcia, Luis Nathan Perez-Acosta, Ana SanchezGranados, Intel, Zapopan, Mexico
10:30 AM BEST INDUSTRY PAPER FINALIST
A Novel Approach to Evaluate Link Performance
Using IBIS-AMI Model with Measured Waveform*
Weifeng Shu1, Chunfei Ye2, and Xiaoning Ye3, (1)
Intel Asia Pacific Research and Development Ltd,
Shanghai, China, (2) Intel Co., DuPont, WA, USA,
(3) Intel Corporation, Hillsboro, OR, USA
11:00 AM
A Study of Trace to Via Coupling Effect in Highspeed Differential Interconnects*
Kai Xiao1 and Xiaoning Ye2, (1) Intel Corp, Dupont,
WA, USA, (2) Intel Corporation, Hillsboro, OR, USA
11:30 AM
QSFP28 Connector Footprint Optimization
of Crosstalk and ILD_rms_dB for 25+ Gpbs
Signaling
Il-Young Park1,Minh Quach2, and Michael
Rowlands3, (1) Cisco Systems, San Jose, CA, USA,
(2) Avago Technologies,San Jose, CA, USA, (3)
Molex, Inc., Lisle, IL, USA
8:30 AM - 12:00 PM
TH-AM-3 MODELING AND
SIMULATION FOR LARGE-SCALE AND
MULTI-SCALE POWER DELIVERY
NETWORK
Grand Ballroom C
Chairs: Qing He1 and Xiaoning Ye2, (1) Oracle
Corporation USA, Santa Clara, CA, USA, (2) Intel
Corporation, Hillsboro, OR, USA
8:30 AM
Dynamic Analysis of Power Delivery Network with
Nonlinear Components Using Matrix Exponential
Method
Hao Zhuang, Ilgweon Kang, Xinan Wang, JengHau Lin, and Chung-Kuan Cheng, University of
California - San Diego, La Jolla, CA, USA
10:00 AM
BREAK
56
2015 IEEE Symposium on Electromagnetic Compatibility & Signal Integrity Final Program
Technical Sessions
* INDUSTRY PAPER ** STUDENT PAPER
8:30 AM
Technique to Improve the Accuracy of Mixedmode S-parameters Derived from Single-Ended
Results and Application to Shorter Test Coupon
Design
Shaowu Huang, Intel Corporation, DuPont, WA, USA
9:30 AM BEST SIPI PAPER FINALIST
Fast Structure-Aware Direct Time-Domain Finite
Element Solver for Large-Scale On-Die Power
Grid Simulation**
Woochan Lee and Dan Jiao, Purdue University,
West Lafayette, IN, USA
9:00 AM
USB3.1 Silicon and Channel Design Optimization
using Artificial Neural Network Modeling
Mo Liu and Jennifer Tsai, Intel Corporation, Santa
Clara, CA, USA
10:00 AM
BREAK
10:30 AM
System Power Noise Analysis Using Modulated
CPM
Di Hu1, Yongxue Yu1, Antonio Ferrario2, Olivier
Bayet3, Lin Shen1, Ravi Nimmagadda1, Felice
Bonardi1, and Francis Matus1, (1) Cisco Systems,
San Jose, CA, USA, (2) STMicroelectronics,
Cornaredo - MI, Italy, (3) STMicroelectronics,
Grenoble, France
11:00 AM BEST SIPI PAPER FINALIST
Vectorless Transient Power Grid Verification: A
Case Study with IBM Benchmarks
Xuanxing Xiong1 and Jia Wang2, (1) Synopsys,
Inc., Mountain View, CA, USA, (2) Illinois Institute
of Technology, Chicago, IL, USA
11:30 AM
Impulse Response Generation from S-Parameters
for Power Delivery Network Simulation
Ilgweon Kang, Xinan Wang, Jeng-Hau Lin, Ryan
Coutts, and Chung-Kuan Cheng, University of
California - San Diego, La Jolla, CA, USA
8:30 AM - 12:00 PM
Technical Program
9:00 AM
Fast Transient Simulation of Multilayered Power
Delivery Network by Using the Stabilized Explicit
Method
Tadatoshi Sekine and Hideki Asai, Shizuoka
University, Hamamatsu-shi, Japan n
9:30 AM
Modeling of Mutual Coupling between Inductors
Gundars Asmanis, Deniss Stepins, Leonids
Ribickis, and Aivis Asmanis, Riga Technical
University, Riga, Latvia
10:00 AM
BREAK
10:30 AM
Rigorous One-Port Measurement Method for the
Characterization of On-chip Pad Response
Shaowu Huang1, Beomtaek Lee2, Xiaoning Ye3,
and Kai Xiao1, (1) Intel Corporation, DuPont, WA,
USA, (2) Intel Corporation, Santa Clara, CA, USA,
(3) Intel Corporation, Hillsboro, OR, USA
11:00 AM
Software-related EMI Test Pattern Autogeneration for 2-stage Pipeline Microcontroller
Yung-Chi Tang1, Cheng-Chang Chen1, and ShihYi Yuan2, (1) Bureau of Standards, Metrology and
Inspection (BSMI), New Taipei, Taiwan, R.O.C. (2)
Feng Chia University, Taichung, Taiwan, R.O.C.
11:30 AM
EMC Simulations of Aircraft with Composite
Materials*
Martin Vogel and C. J. Reddy, Altair Engineering,
Hampton, VA, USA
TH-AM-4 NUMERICAL MODELING
APPROACHES
Grand Ballroom D
Chairs: Jianmin Zhang1 and Kai Xiao2, (1) Apple Inc.,
Cupertino, CA, USA, (2) Intel Corp, Dupont, WA, USA
www.emc2015usa.emcss.org
57
Technical Sessions
* INDUSTRY PAPER ** STUDENT PAPER
THURSDAY AFTERNOON
1:30 PM - 5:30 PM
TH-PM-1 WIRELESS TESTING AND
RF INTERFERENCE
Grand Ballroom A
Chairs: Yihong Qi1 and William Young2, (1) DBJ
Technologies, Zhuhai, China, (2) National Institute
of Standards and Technology, Boulder, CO, USA
1:30 PM
An Effective Receiver Sensitivity Measurement**
Zixin Liu1, Fuhai Li1, Yihong Qi2, and Ji Chen3,
(1) Hunan University, Changsha, China, (2) DBJ
Technologies, Zhuhai, China, (3) University of
Houston, Houston, TX, USA
2:00 PM
BEST STUDENT PAPER FINALIST
Conducted-Emission Modeling for a SwitchedMode Power Supply (SMPS)**
Yansheng Wang1, Siqi Bai1, Xinyun Guo1, Shuai
Jin1, Yaojiang Zhang1, Joakim Eriksson2, Lijuan
Qu2, Jingyu Huang3, and Jun Fan1, (1) Missouri
University of Science and Technology, Rolla, MO,
USA, (2) Microsoft Mobile (China) Investment Co.
Ltd., Beijing, China, (3) Microsoft Device Group,
San Diego, CA, USA
2:30 PM BEST EMC PAPER FINALIST
A Planar Low-Profile Meander Antenna Design
for Wireless Terminal Achieving Low SelfInterference
Yihong Qi1, Jun Fan2, Ye-Hai Bi3, Wei Yu1, and
James Drewniak2, (1) DBJ Technologies, Zhuhai,
China, (2) Missouri University of Science and
Technology, Rolla, MO, USA, (3) Shenzhen
Sunway Communication Co.,Ltd, ShenZhen, China
3:30 PM BEST EMC PAPER FINALIST and BEST
STUDENT PAPER FINALIST
Near-field Coupling Estimation by Source
Reconstruction and Huygens’s Equivalence
Principle**
Liang Li1, Jingnan Pan1, Chulsoon Hwang3,
Gyuyeong Cho2, Harkbyeong Park2, Yaojiang
Zhang1, and Jun Fan1, (1) Missouri Science
and Technology, Rolla, MO, USA, (2) Samsung
Electronics, Suwon, South Korea, (3) Samsung
Electronics, Suwon GyengGi-Do, South Korea
4:00 PM BEST STUDENT PAPER FINALIST
Eliminating Non-Linear RSS Reporting Error in a
Radiated RSS-Based TIS Testing Method**
Penghui Shen1, Yihong Qi2, Wei Yu2, Fuhai Li1, and
Jun Fan3, (1) Hunan University, Changsha, China,
(2) DBJ Technologies, Zhuhai, China, (3) Missouri
University of Science and Technology, Rolla, MO, USA
1:30 PM - 5:30 PM
TH-PM-2 NUMERICAL MODELING
AND SIMULATION TECHNIQUES II
Grand Ballroom B
Chairs: Kai Xiao1 and Gerardo Romo2, (1)
Intel Corp, Dupont, WA, USA, (2) Qualcomm
Technologies, Inc., San Diego, CA, USA
1:30 PM
Frequency Domain Interpolation of Long
Structures for System-level Signal Integrity
Analysis
Mikheil Tsiklauri, Mikhail Zvonkin, Nana
Dikhaminjia, Jun Fan, and James Drewniak,
Missouri University of Science and Technology,
Rolla, MO, USA
2:00 PM
Microstrip Improvement by Using Dielectric Film*
Shaowu Huang1, Olufemi Oluwafemi2, and Gary
Brist2, (1) Intel Corporation, DuPont, WA, USA, (2)
Intel Corporation, Hillsboro, OR, USA
3:00 PM
BREAK
58
2015 IEEE Symposium on Electromagnetic Compatibility & Signal Integrity Final Program
Technical Sessions
* INDUSTRY PAPER ** STUDENT PAPER
3:00 PM
BREAK
3:30 PM BEST INDUSTRY PAPER FINALIST
A Hybrid 3D/Equivalent 2D Finite Element
Analysis for Vias Passing Through a Parallel Plate
Pair Filled with Multilayer Dielectric*
Liehui Ren1, Peng Shao1, Kelvin Qiu1, Jane Lim1,
Rick Brooks1, YaoJiang Zhang2, and Jun Fan2,
(1) Cisco Systems, Inc, San Jose, CA, USA, (2)
Missouri University of Science and Technology,
Rolla, MO, USA
1:30 PM - 5:30 PM
TH-PM-3 POWER INTEGRITY AND
POWER DELIVERY NETWORK II
2:30 PM BEST INDUSTRY PAPER FINALIST
Effective Power Delivery Filtering of Mixed-Signal
Systems with Negligible Radiated Emission*
Mohammad Ali Khorrami1, Paul Dixon1, John
Song2,and Keith Johnson3, (1) Laird, Randolph,
MA, USA, (2) Laird, Schaumburg, IL, USA, (3)
Laird, Cleveland, OH, USA
3:00 PM
BREAK
3:30 PM
Role and Performance of Interposer with
Embedded Capacitors for Maintaining Power
Integrity*
Toshio Sudo1, Daisuke Tanaka2, Kyoshi Mihara2,
Naoyuki Kobayashi2, Sho Kiyoshige1, Wataru
Ichimura1, and Toma Yamaguchi1, (1) Shibaura
Institute of Technology, Tokyo, Japan, (2) Murata
Manufacturing Co., Ltd., Kyoto, Japan
Technical Program
2:30 PM
Application of a Boundary Element Method
Tool in Improving Differential Channel Routing
Design*
Xiao Ren1, Shaowei Deng2, Jayaprakash
Balachandran2, and Bidyut Sen2, (1) Missouri University
of Science and Technology, Rolla, MO, USA, (2) Cisco
Systems, Inc., San Jose, CA, USA
4:00 PM
Real-time Programmable VR for Power Delivery
Efficiency Enhancement
Wei Shen, Weixia Liang, and Herry Hu, Intel
Corporation, Shanghai, China
Grand Ballroom C
Chairs: A. Ege Engin1 and Yujeong Shim2, (1) San
Diego State University, San Diego, CA, USA, (2)
Altera Corporation, San Jose, CA, USA
1:30 PM
Integrated Power Supply Packaging Technique
with Reduced Parasitic Inductance for On-die
Voltage Regulator Design and Application
Boping Wu1 and Shaowu Huang2, (1) Intel
Corporation, Hillsboro, OR, USA, (2) Intel
Corporation, DuPont, WA, USA
2:00 PM
Practical Aspects of Embedded Capacitance
for Printed Circuit Board Power Distribution
Networks*
Scott Piper1 and James Teune2, (1) General
Motors, Milford, MI, USA, (2) Gentex Corporation,
Zeeland, MI, USA
www.emc2015usa.emcss.org
59
Technical Sessions
1:30 PM - 5:30 PM
TH-PM-4 SPECIAL SESSION:
UNCERTAINTY QUANTIFICATION IN
COMPUTATIONAL EM AND SIGNAL/
POWER INTEGRITY VERIFICATION
Grand Ballroom D
Chairs: Branislav Notaros and Sourajeet Roy,
Colorado State University, Fort Collins, CO, USA
1:30 PM
Efficient Multidimensional Statistical Modeling of
High Speed Interconnects in SPICE via Stochastic
Collocation using Stroud Cubature**
Majid Ahadi, Sourajeet Roy, and Mounica Vempa,
Colorado State University, Fort Collins, CO, USA
2:00 PM
A Polynomial Chaos Approach for EM Uncertainty
Propagation in 3D-FDTD Magnetized Cold
Plasma
Bach Nguyen, Alireza Samimi, and Jamesina
Simpson, University of Utah, Salt Lake City, UT,
USA
2:30 PM
Efficient Multi-Parameteric Uncertainty
Quantification Methods for EMC/EMI Applications
Costas Sarris, Zixi Gu, Neeraj Sood, and Xingqi
Zhang, University of Toronto, Toronto, ON,
Canada
3:00 PM
BREAK
3:30 PM
Studying the Effect of Drilling Uncertainty on
Signal Propagation through Vias**
Yansheng Wang1, Srinath Penugonda1, Yaojiang
Zhang1, Ji Chen2, and Jun Fan1, (1) Missouri
University of Science and Technology, Rolla, MO,
USA, (2) University of Houston, Houston, TX, USA
ABOUT
SANTA
CLARA
In 2005 Silicon Valley Power brought online the Donald
Von Raesfeld (DVR) Power Plant, a new combined cycle gas
turbine plant which produces 147 megawatts of electricity,
making electricity in Santa Clara considerably cheaper than
most power plants.
60
2015 IEEE Symposium on Electromagnetic Compatibility & Signal Integrity Final Program
y
Technical Program
* INDUSTRY PAPER ** STUDENT PAPER