Date of download: 7/28/2017
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From: Correlation of Thermal Conduction Properties With Mechanical Deformation Characteristics of a Set of
SiC–Si3N4 Nanocomposites
J. Eng. Mater. Technol. 2010;133(1):011013-011013-7. doi:10.1115/1.4002646
Figure Legend:
Phonon density of states of (a) Si–Si (in Si3N4) bonds in microstructure S1 and S2 at 300 K, (b) Si–Si (in Si3N4) bonds (normalized)
and combined C–C, N–N, Si–Si (in SiC) bonds in microstructures S1, S2, and S4 at 300 K, and (c) Si–Si (in Si3N4) bonds (normalized)
and combined C–C, N–N, Si–Si (in SiC) bonds in microstructures S12, S22, and S42 at 300 K