Activities in electromagnetic track
Progress report, year 2015
Presented by: Dmitri Moltchanov
Tampere University of Technology
Department of Electronics and
Communications Engineering
Personnel
 Local TUT team
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Dr. D. Moltchanov
PhD student V. Petrov
MSc. student M. Komar
 Current collaborators
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Department of Electronics and
Communications Engineering
CPU: Dr. P. Kustarev, ITMO, Russia
CPU: Dr. R. Shaloo, NYU
B2B: Dr. J. Lehtomaki, Oulu, Finland
THz propagation: Dr. G. Molis, Teravil, Lithuania
Active topics
 Dense THz random deployments
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Interference, SINR, connectivity, spectral efficiency
Methods: stochastic geometry
 Wireless THz CPU design
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Feasibility, traffic modeling, design
Methods: measurements, simulations
 B2B communications
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Department of Electronics and
Communications Engineering
Cooling/transmission pipes
Methods: THz-TDS measurements, COMSOL
1. Dense THz networks
 Questions of interest
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Interference, SIR, optimal communications distance
 What is the difference?
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Received signal strength
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Noise at the receiver
 What has been done this year:
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Department of Electronics and
Communications Engineering
Interference: VTC’15, opt. distance: Globecom’15
THz booth 802.15.3d scenario for ICC’16
2. Joint cooling/transmission system
 Board-to-board communications in THz
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One of the killer app in IEEE 802.15.3d
 Principle: waveguide with coolant inside
 What has been done this year:
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Department of Electronics and
Communications Engineering
ACM Nanocomm’15 + journal under preparation
3. Wireless CPU design
 Wireless cores-LLC interface in CPUs
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Communications subsystem: bottleneck
How to efficiently connect e.g. 50 cores to LLC?
 Existing architecture
 Step-by-step: terahertz-traffic-feasibility-design
Department of Electronics and
Communications Engineering
3. Feasibility of THz
 Methodology: measurements, extrapolation
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Department of Electronics and
Communications Engineering
8-cores Intel Core i7 Haswell-E 5980X, 20Mb LLC
Intel PCM (counters available since SandyBridge)
3. Wireless CPU design
 Proposed 3D-stacked design
 Current questions:
 Propagation inside compartment and materials
 MAC design for intra-CPU traffic
Department of Electronics and
Communications Engineering
3. Current research focus
 Propagation and materials
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Ray-launcher is being developed
Measurement by Teravil
 Traffic nature and MAC
 CPU modeling (gem5, ITMO)
 Measurements using Intel PCM
 What has been done this year
 Two journal papers + conference paper
Department of Electronics and
Communications Engineering
3. Example of L2-L3 traffic
 Traffc at L2-L3
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Stochastic even for a single core and simple app!
Far from Poisson assumption
Has clearly distinguishable batch behavior
Reading
Department of Electronics and
Communications Engineering
Encryption