SIPLACE Press News
Munich, 25 August 2011
PoP/CSP stacking: SIPLACE machines deliver speed and quality
The space on PCBs gets tighter and tighter, while the number of functions they
have to perform increases continuously. With the package-on-package (PoP) or
CSP stacking process, placement solutions from SIPLACE offer an excellent
solution for mastering this challenge, because stacking components on top of
one another offers many benefits, including extremely short circuit paths and
lots of combination options. On the other hand, it places great demands on the
placement equipment, but SIPLACE machines can handle these with impressive
dexterity. The SIPLACE precedence model makes sure that the two matching
components can be placed on top of one another in only two placement cycles.
At the same time, the SIPLACE placement principle ensures maximum quality on
the production line. Since the height of the component and its placement
position are constantly being monitored, component placements can be
corrected at extremely short notice. Together with the LDU X Linear Dipping
Module for the X-Series, SIPLACE machines thus deliver the speed and precision
needed to process PCBs with PoP designs in high-volume environments.
PoP designs are particularly popular for processor-and-memory-element combinations.
“Stacking”components not only saves space, but shortens the signal paths, minimizes
high-frequency interference and allows the designer to combine processor and memory
chips in a highly flexible manner. The most frequent uses of this technique can be
found in automotive and telecommunication applications.
To be able to handle PoP or CSP stacking, the placement process must meet certain
requirements. On the one hand, the programming system has to be able to place two
or more components on top of one another in the correct order. Unlike the frequently
used level models, SIPLACE Pro with its precedence model offers significant
advantages. Since it specifies the order in which the components will be placed, the
upper component can be positioned on the lower component already during the next
cycle even if not all lower components have been placed at this time, as is often the
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case with PCBs consisting of multiple clusters. This improves the machine’s
performance considerably, because it optimizes the placement head utilization. On the
other hand, PoP placements have to meet the toughest quality requirements. This
means that the height of the component stack must be taken into account at all times.
Here, too, the SIPLACE placement principle demonstrates its superiority, because it
permanently controls the height of the components and the placement position and is
able to make instantaneous changes, for example when the component height
changes because of a new batch.
To reliably process PoP designs, however, placement machines must not only be able
to correctly place the components on top of one another; they also have to be able to
wet the contacts of the upper component with flux in order to form a solid connection
between the two. SIPLACE’s Linear Dipping Module is the ideal way to ensure that this
is done correctly even in high-volume production environments.
LDU X Dipping Module: Reliable linear application
The SIPLACE LDU X for the SIPLACE X-Series allows for the reliable and accurate
application of dipping media. The unit uses a rectangular dipping media container with
an integrated squeegee, which evenly spreads the medium over the dipping plate when
it moves back and forth. The film thickness for small balls can be controlled in the 20
µm to 400 µm range with an accuracy of ± 3 µm. After applying the dipping medium,
the squeegee returns to its starting position. The dipping plate, which was tilted
towards the squeegee, is then raised again so that even the extremely fast and lowtraveling 20-nozzle placement head of the SIPLACE X-Series can pass freely. That
way, the new dipping unit can be used with all SIPLACE placement heads.
The easy integration of the new SIPLACE LDU X Dipping Module into the hardware
and software of SIPLACE placement machines makes the volume production of PCBs
with space-saving PoP designs fast and reliable enough for telecom and automotive
applications.
SIPLACE Press Office
Susanne Oswald
Rupert-Mayer-Strasse 44, D-81350 München
Tel.: +49 89 20800-26439; Fax: -24260
E-mail: [email protected]
Internet: www.siplace.com
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Click here to see a video of CSP stacking with SIPLACE machines:
http://www.siplace.com/11103/Downloads-Support/Download-Area/VideosAnimationen/aud_index.aspx
With the precedence together with the SIPLACE placement principle
SIPLACE placement machines ensure highest speed with maximum
quality on the production line during CSP stacking.
For more information, visit www.siplace.com.
ASM Assembly Systems
Zu Beginn des Kalenderjahres 2011 wurde das SIPLACE Team (ehemals Siemens Electronics
Assembly Systems) Teil von ASM Pacific Technology. Seitdem agiert das SIPLACE Team als
ASM Assembly Systems als eigener Geschäftsbereich von ASM Pacific Technology. ASM
Assembly Systems GmbH & Co. KG ist mit ihren SIPLACE Automaten und Innovativen
Fertigungskonzepten für die Elektronikfertigung weltweit führender Hersteller von Surface
Mount Technology (SMT)-Bestückmaschinen und -lösungen. Insgesamt wurden seit den
Anfängen 1985 bis 2011 weltweit knapp 25.000 SIPLACE Bestückautomaten bei mehr als
2.500 Kunden installiert. Elektronikfertiger aller Branchen, wie z.B. Telekommunikation,
Automotive, IT, Consumer-Elektronik und Automatisierung, nutzen das breite SIPLACE
Angebot.
Mehr Information zu ASM Assembly Systems (SIPLACE): www.siplace.com
ASM Pacific Technology
Als Geschäftsbereich von ASM International mit Hauptsitz in Almere, Niederlande, hat sich
ASM Pacific Technology (ASMPT), Singapur, binnen weniger Jahre zum weltweit führenden
Anbieter von Anlagen und Lösungen für Chip Assembly, Bonding und Packaging entwickelt. Die
ASMPT-Group fertigt und vermarktet Maschinen zur Front-End- und Back-End Chip Assembly
und Semiconductor Packaging. Fertigungsstandorte sind in Hong Kong, China, Singapur,
Malaysien sowie seit 1.1.2011 in Deutschland. Seit 1989 ist ASMPT am Hong Kong Stock
Exchange notiert.
SIPLACE Press Office
Susanne Oswald
Rupert-Mayer-Strasse 44, D-81350 München
Tel.: +49 89 20800-26439; Fax: -24260
E-mail: [email protected]
Internet: www.siplace.com
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ASMPT ist im Hang Seng HK MidCap Index, Hang Seng Composite Index, im Hang Seng
Information Technology Industry Index sowie im Hang Seng Hong Kong 35 Index notiert.
Mehr Information zu ASMPT: www.asmpacific.com
Leseranfragen bitte an:
ASM Assembly Systems GmbH& Co. KG
Susanne Oswald
E-mail: [email protected]
SIPLACE Press Office
Susanne Oswald
Rupert-Mayer-Strasse 44, D-81350 München
Tel.: +49 89 20800-26439; Fax: -24260
E-mail: [email protected]
Internet: www.siplace.com
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