Cu Core Ball
Cu core ball facilitate 3D packaging and narrow-pitch mounting
Features
● Ensures space to easily realize a highly-reliable
component-built structure
● Enables narrow-pitch mounting that can be performed
through Cu pillar mounting using existing equipment
● Promises high heat dissipation and electromigration
countermeasures
Specifications
● Ensures space through its multilayer ● Characteristics
structure with a Cu core
Electromigration
Cu ball
Ensures space
PKG
Ni plating
Inclination
Heat dissipation
PKG
PKG
Solder ball
Solder plating
PCB
PCB
PCB
Short
PKG
PKG
PKG
PCB
PCB
PCB
Superior electromigration
resistance
Ensures appropriate
space
Cu has good thermal
conductivity
Solder plating
Cu core ball
Cu ball
● Cu core ball facilitate 3D packaging
● Enables narrow-pitch mounting without short circuit
risk with existing equipment
Cu core ball (spacer)
Cu core ball
Solder plating
Cu plating
Cu pillar mounting
Cu core ball mounting
Eliminates the plating processes required in Cu pillar mounting
● Drop test and temperature cycle test
Drop test
The Cu core ball ensure space to easily realize a
highly-reliable component-built structure
NEP14-07E
Temperature cycle test
100
Cumulative Frequency
Cumulative Frequency
100
C-Cu M90
M705
( conventional product )
10
1
1
10
100
1000
C-Cu M90
M705
(conventional product)
10
1
1
10
100
1000
Drop Number
Cycle Number
Realizes good drop resistance
Exhibits a temperature cycle equivalent
to that of a conventional product