UCLA • UC Berkeley • Stanford • UCSD • UNCC • HP Labs
The Second U.S.-Korea Forum on Nanotechnology:
Nanomanufacturing Research and Education
Nano-Scale Manufacturing:
Top-down, Bottom-up and System Engineering
Cheng Sun, Xiang Zhang
Center of Scalable and Integrated Nanomanufacturing (SINAM)
University of California, Berkeley
Los Angeles, CA
February 17-18, 2005
NSF Nanoscale Science and Engineering Center (NSEC)
Future Integrated Nano-Systems
3D Terabit
Memory
Ultra Compact light
source & integrated
photonics
Nano Fluidic Circuits
Ultra Sensitive
Bio-sensor
UCLA • UC Berkeley • Stanford • UCSD • UNCC • HP Labs
Nano-Manufacturing Grand Challenges
State of Art
‰ Prohibitive cost (EUV>$25M/tool), low speed (EBL)
‰ Not suitable for 3D (nanoimprint, soft lithography)
‰ Prone to defects (self-assembly)
Technological Barriers
‰ Dimension below 20 nm → High density devices
‰ 3D complex nanostructures → Low power, high speed (Rent’s
law)
‰ Heterogeneous integration → Multiple functionality
UCLA • UC Berkeley • Stanford • UCSD • UNCC • HP Labs
Center of Scalable & Integrated Nanomanufacturing
Vision: To Develop A New Nano-Manufacturing Paradigm that Enables
the Quantum Leap from Lab Science to Industry floor
System Focus
Design for NanoMfg
Top-Down
Societal
Societal
Impact
Impact
Hybrid
Top-Down/
Bottom-up
Nano-Mfg
Tools
Industrial
Consortium
Product
Product
Development
Development
Education
Education&&Outreach
Outreach
Workforce
WorkforceTraining
Training
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Core Research Competence
Materials
Materials
Physical
PhysicalScience
Science
Stoddart,
Stoddart,Osher
Osher
Hahn,
Hahn,Chen,
Chen,
Frechet,
Frechet,Maynard
Maynard
Manufacturing
Manufacturing
Dornfeld,
Dornfeld,Prinz,
Prinz,Hocken,
Hocken,
Tsao,
Tsao,Lavine,
Lavine,Zhang
Zhang
Design
Design&&Modeling
Modeling
Devices
Devices
Grigoropoulos,
Grigoropoulos,
Caflisch,
Caflisch,Goodson
Goodson
Heller,
Heller,Majumdar,
Majumdar,
Ho,
Ho,Yablonovitch
Yablonovitch
1+1>2!
1+1>2!
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IRG I. Top-Down Nano-manufacturing
Participants: Zhang (lead), Yablonovitch, Frechet, Goodson, Osher, Grigoropoulos
Critical Challenges
Semiconductor Manufacturing at a crossroads
• 50 nm resolution limit
• Lacking 3D capability
Goal
3D nano-manufacturing with 1-20 nm resolution
Approaches:
•
•
Plasmonic Imaging Lithography (PIL)
Ultra Mold Imprinting Lithography (UMIL)
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Plasmonic Imaging lithography
Surface plasmon: Optical wave frequencies, with X-ray wavelengths!
Mask fabricated by FIB
ε2>0
dielectric
E
kz
− − −+ + + − − −+ + + − − −
ε1<0
ω
Hy
metal
kx
light
Vacuum wavelength
ω=ckx
Surface Plasmons
90nm features
170 nm
Higher resolution
ksp = 2π
λ
√
Wave Vector
εdεm
εd+εm
90 nm
kx
(Illumination at 365 nm)
UCLA • UC Berkeley • Stanford • UCSD • UNCC • HP Labs
Characterization, Modeling and Material Engineering
Nanolitho Characterization Platform
Materials issues at very small dimensions:
Dendrimer molecules as “molecular pixels”
~10 nm
Silicon and
carbon for
etch resistance
0
0.4
Si
Si
O
O
Si
Si
O
O
O
O
O
O
O
O
O
Si
O
1.2
O
Si
O
O
0.8
Si
Si
O
μm
[Grigoropoulos, UCB]
Cl
Si
Chemical
linker
Process Modeling
[Grigoropoulos, Zhang, UCB ; Hahn, UCLA]
[Frechet, Grigoropoulos, UCB]
UCLA • UC Berkeley • Stanford • UCSD • UNCC • HP Labs
Ultra Molding Imprint Lithography
Ultra Molding Imprint Lithography
Conventional Nanoimprint Lithography
Press mold into
polymer
Sub-10 nm mold fabricated using Superlattice of
alternating SiGe and Si multilayers.
Deposition
Etching
Imprinting
SiGe
Cure polymer
Si
Remove mold
4
8
10
20
40 nm
Etch underlying
layer
L.J. Gou, J. Phys. D, 2004
4nm imprinted features
[Chen, Hahn, Tsao, UCLA; Wang, HP; Hocken, UNCC]
UCLA • UC Berkeley • Stanford • UCSD • UNCC • HP Labs
IRG II. Hybrid Top-down and Bottom-up Nanomanufacturing
Participants: Ho (lead), Chen, Majumdar, Caflisch, Stoddart, Heller, Maynard
Critical Challenges
Self-assembly CANNOT:
• Heterogeneously assemble pattern for devices
• Avoid “defects” due to thermodynamic nature
Goal
Massive and parallel integration of heterogeneous nano-LEGOs
into devices
Approaches
•
Hybrid Top-down and Bottom-up technologies
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Field-Assisted Parallel Nano-Assembly (FAPNA)
Electronic
“Pick and Place”
Nano-LEGOs
0 0 1 1 0 0 0 0
0
0
1
1
0
0
0
0
A
A
1µm
Nano-LEGOs: DNA/RNA, Proteins,
cells, nanoparticles, molecules
[Chen, Ho, Maynard, UCLA; Heller, UCSD]
UCLA • UC Berkeley • Stanford • UCSD • UNCC • HP Labs
Hybrid Top-down and Bottom-up Nanomanufacturing
100 µm
100 nm
Bio-Flu
idic
100 mm
Micro p
ump
filter
Micro/nano Fluidics
Micro
senso
r
Outlet
Bio-Chip
Addressing &
Data acquisition
Assembly Motherboard
Integrated assembler system will bridge the
multifunctional nano-LEGOs onto bio-MEMS
devices and lead to scalable and cost
effective manufacturing at macro-world.
UCLA • UC Berkeley • Stanford • UCSD • UNCC • HP Labs
IRG III Manufacturing System Engineering
Participants: Tsao and Prinz (lead), Dornfeld, Hocken, Hahn, Caflisch, Lavine
Critical Challenge
•
Scaled-up nano-manufacturing for high throughput and high yield
Goal
Develop Nano-manufacturing cluster tool
Approaches
•
•
•
Design for nano-manufacturing
Tooling and metrology
Reliability and scalability
UCLA • UC Berkeley • Stanford • UCSD • UNCC • HP Labs
NanoManufacturing Platform - UMIL
UNCC 3D Sub-atomic
Measuring Machine
0.3nm step
X (nm)
0.9
0.6
0.3
0
-0.3
Multiscale Alignment and Positioning System
(MAPS)
0
1
2
Time (s)
3
4
[Hocken, UNCC]
5
[Hocken]
Imprinting Module
Dynamic Positioning Control
The
The Ultimate
Ultimate Imprint
Imprint Machine
Machine
11 nm
nm Alignment
Alignment Precision
Precision
Sub
Sub –– 55 nm
nm Imprinting
Imprinting Precision
Precision
[Tsao, UCLA]
[Chen, UCLA]
UCLA • UC Berkeley • Stanford • UCSD • UNCC • HP Labs
SINAM NanoMFG Technologies and Tools
Top-down NanoMfg
Hybrid Top-down
& Bottom-up
Plasmonic Imaging
Lithography
Ultra Mold Imprint
Lithography
System Level Focus and Testbed
Design for Nanomanufacturing
Metrology
3D nano-CAD
UCLA • UC Berkeley • Stanford • UCSD • UNCC • HP Labs
Integrated Educational Program
Graduate Young Investigator Program
GR
• Enhancing interdisciplinarity and connections between faculty
Interdisciplinary Curricula
UG
• Five interdisciplinary, research-integration courses developed by SINAM
faculty
Nano-Manufacturing Summer Academy/REU
HS
MS
• Six undergrad and Three high school students into faculty labs,
integrating research into their education
Discover Nanotechnology (Grades 7-12)
• SINAM is developing an education module using Nano- manipulator
UCLA • UC Berkeley • Stanford • UCSD • UNCC • HP Labs
SINAM Collaborative Network
SINAM Industrial Collaborations
‰ HP Lab
‰ RAND Corporation
‰ Boeing Company
‰ Northrop Grumman
Establishing Broad Collaborative Network
‰ National Institute of Health
Focus: Muscle Molecule assembly
‰
Semiconductor Industrial Association
Focus: Nanoelectronic Research Initiative and collaboration with SIA members
‰
Center for Nanoscale Mechatronics and Manufacturing
Focus: International collaboration in the Nanomanufacturing
UCLA • UC Berkeley • Stanford • UCSD • UNCC • HP Labs