Highly oriented GaN films grown on ZnO buffer layer over quartz substrates by reactive sputtering of GaAs target Brajesh S. Yadav a, Sukhvinder Singh a, Tapas Ganguli b, Ravi Kumar b, S.S. Major a,⁎, R.S. Srinivasa c a b c Department of Physics, Indian Institute of Technology Bombay, Mumbai-400076, India Semiconductor Laser Section, RRCAT, Indore-452013, India Department of Metallurgical Engineering & Materials Science, Indian Institute of Technology Bombay, Mumbai-400076, India A B S T R A C T Keywords: Gallium nitride (GaN) Reactive sputtering ZnO buffer layer Microstructure X-ray diffraction Polycrystalline GaN films were deposited on quartz and ZnO buffer layers over quartz by reactive sputtering of a GaAs target in 100% nitrogen at 550 °C and 700 °C. Micro-structural investigations of the films were carried out using high resolution X-ray diffraction, atomic force microscopy and Raman spectroscopy. GaN films deposited on ZnO buffer layers exhibit strongly preferred (0002) orientation of crystallites. In particular, the film deposited at 700 °C on ZnO buffer layer over amorphous quartz substrate showed large crystallite size, both along and perpendicular to growth direction, strong and nearly complete c-axis orientation of crystallites with tilt of ~ 2.5° and low value of micro-strain ~ 2 × 10− 3. The significant improvement in crystallinity and orientation of crystallites in the GaN film is attributed to the presence of the ZnO buffer layer on quartz substrate and its small lattice mismatch (1.8%) with GaN. 1. Introduction The development of GaN based high brightness light emitting diodes and laser diodes has been followed by the realization of high frequency power transistors, solar blind photodiodes, ultra-violet light emitting diodes and detectors, high electron mobility transistors and several other electronic devices [1–3]. GaN has received enormous attention due to its applications in white light sources [4] and spintronic devices [5]. Piezoelectric properties of GaN and its negative electron affinity have also opened avenues of research, with promising applications [1,6,7]. Device quality epitaxial GaN films have usually been grown using metal organic chemical vapour deposition (MOCVD) or molecular beam epitaxy (MBE) techniques [6,7]. However, owing to its versatile properties and enormous application potential, there has been a growing interest in polycrystalline GaN films deposited by various versions of MBE [8–12] and MOCVD [13–17] and sputtering [18–31]. Light emitting diodes [32–33] and field electron emitters [14,34] based on polycrystalline GaN films have been demonstrated. Potential applications of polycrystalline GaN in thin film transistors, white lighting and electroluminescent devices for flat panel displays, photovoltaics and photonic devices have driven the search for alternative low cost deposition processes and substrates. It is also desirable to explore low temperature processes for integration with liquid crystal and photovoltaic device technologies. The inherent ability of sputtering to deposit large area thin films on a variety of substrates at relatively lower temperatures, opens up enormous opportunities, not only for a robust semiconductor like GaN, but in general, for III-nitrides. There have been several early reports on the growth of GaN films by reactive sputtering of Ga target with nitrogen or nitrogen–argon mixture [35–37], though problems of reproducibility arising out of the low melting temperature of gallium have been reported [38]. However, during the last few years, GaN films have been deposited using both Ga [18–22] or GaN [23–28] targets. The growth of GaN films has also been reported [29,39] by reactive sputtering of a GaAs target with 100% nitrogen. Magnetron sputtering has also been utilized to deposit epitaxial GaN films on sapphire substrates [40–42]. In an interesting approach, polycrystalline GaN films with improved structural quality have been deposited over ZnO buffer layers on silicon substrates, using MBE [43], MOCVD [44,45] and pulsed laser deposition (PLD) [46,47] techniques. High quality epilayers of GaN have also been deposited on ZnO buffer layer over sapphire substrates, using this approach [44,48,49]. There are also a few reports on the use of ZnO as a buffer layer in the growth of GaN films by sputtering, using GaN [50] and Ga2O3 [51] targets. ZnO has a hexagonal wurtzite structure with lattice constants close to those of GaN (lattice mismatch ~ 1.8%) and polycrystalline ZnO films are known to exhibit strong c-axis orientation of crystallites [52]. Hence, this approach has resulted in very encouraging results. In a recent work [53] on the growth and structure of hexagonal GaN films deposited on quartz substrates by sputtering of a GaAs target in 100% nitrogen, it has been shown that the tendency of (0002) 489 preferred orientation (c-axis orientation) of crystallites is significantly enhanced at substrate temperatures above 500 °C, due to the dominance of surface diffusion among grains [54]. It was also shown that the films deposited above 500 °C possess ~1 at.% arsenic as impurity, and those deposited at ~ 700 °C, possess practically negligible arsenic. Hence, in order to explore the growth of highly caxis oriented GaN films with improved crystalline quality, a ZnO buffer layer on amorphous quartz substrates has been used in this work. Based on the results presented in Ref. [53], GaN films have been deposited at two substrate temperatures, namely, 550 °C and 700 °C, on quartz substrates, with and without the ZnO buffer layer. A detailed micro-structural characterization of these films has been carried out by high resolution X-ray diffraction (HRXRD) and atomic force microscopy (AFM). Additional information about the crystallinity of the films has been obtained from Raman spectroscopy. These studies have shown that highly c-axis oriented, polycrystalline GaN films with large crystallite size, small crystallite tilt and low micro-strain values can be deposited on ZnO buffer layer over amorphous quartz substrates by reactive sputtering of a GaAs target. 2. Experimental details GaN films were deposited by 13.56 MHz, radio frequency (rf) magnetron reactive sputtering of a 3 inch GaAs target with 100% nitrogen as sputtering-cum-reactive gas, as described in detail, elsewhere [42]. An rf shielded heater was used to control substrate temperature up to (700 ± 10) °C. Films were deposited at a nitrogen pressure of 8 × 10− 1 Pa and flow rate of 25 SCCM (SCCM denotes cubic centimeter per minute at STP). The thickness of the films was measured by Ambios XP-2 surface profilometer. All the films were in the thickness range of 500–600 nm. The ZnO buffer layer was deposited on quartz substrates by reactive sputtering of a zinc target. The thickness of the buffer layer was in the range of 100–200 nm and in this thickness range, the effect of buffer layer on the structure of GaN films was found to be reproducible. The structure of the films was studied using PANalytical X'Pert PRO powder diffractometer using Cu Kα radiation. HRXRD measurements were carried out in omega (ω) and ω–2θ scan geometries using PANalytical X'Pert MRD system. The incident beam optics had a 4-bounce hybrid monochromator, which ensured Cu Kα1 (1.54056 Å) output collimated to about 20″ in the plane of scattering. A 1/2° slit was placed at the output before the detector. AFM studies were carried out in contact mode with silicon nitride probes using Digital Instruments Nanoscope IV multimode SPM. Raman spectra of the films were recorded at room temperature in back scattering geometry, using JOBIN YVON HORIBA HR-800 confocal micro-Raman spectrometer equipped with a 20 mW Ar+ laser (514.5 nm). 3. Results and discussion The XRD patterns of GaN films deposited at substrate temperatures of 550 °C and 700 °C on quartz and ZnO buffer layer over quartz are presented in Fig. 1. XRD pattern of the ZnO buffer layer on quartz is also shown in the same figure, for comparison. The pattern of the film deposited at 550 °C on quartz shows several peaks corresponding to hexagonal GaN, among ̄ and (0002) are the most prominent. In comparison, the film which (1011) deposited on quartz at 700 °C shows a strong (0002) peak, along with a ̄ shoulder, clearly showing the tendency towards c-axis orientation (1011) of crystallites, with increase in substrate temperature. The film deposited on ZnO buffer layer at 550 °C shows a strong (0002) peak, though a small ̄ plane is also present. In comparison, the peak corresponding to (1011) films deposited at 700 °C on ZnO buffer layer shows a single and strong low order peak due to (0002) reflection, along with a (0004) peak, indicating a nearly complete c-axis orientation. It is also seen from Fig. 1 that the intensity of (0002) peak in the films deposited on ZnO buffer layer (d and e) are significantly enhanced, as compared to the corresponding films on quartz substrate (a and b). Fig. 1. XRD patterns of GaN films deposited on quartz at (a) 550 °C and (b) 700 °C. The XRD patterns of (c) ZnO buffer layer on quartz and GaN films over ZnO buffer layers deposited at (d) 550 °C and (e) 700 °C are also shown. In order to assess the crystalline quality of highly c-axis oriented GaN films deposited at 700 °C on quartz and ZnO buffer layer, high resolution X-ray diffraction measurements were carried out to study the microstructure of these films. These studies are discussed below. A strongly oriented polycrystalline film on amorphous substrates can be considered to consist of crystallites, with certain mean vertical and lateral dimensions. For materials having hexagonal structure, usually the crystallites are oriented with their b0002N axis along the growth direction and are rotated randomly about this direction. Information about lateral and vertical coherence lengths (crystallite sizes), crystallite tilt and micro-strain (non-uniform strain) can be obtained from full width at half maximum (FWHM) of the omega (ω) and ω–2θ scans of (000l) reflections, using Williamson–Hall plots [55]. The terms vertical and lateral refer respectively, to the growth direction and a direction perpendicular to it, in the plane of the film. The finite crystallite size, tilt and micro-strain cause the broadening of reciprocal space points [56]. The broadening due to finite size is invariant in reciprocal space with higher orders of reflection (increasing scattering vector, q), but the broadening due to both tilt and micro-strain increase with increasing magnitude of q [56]. The finite vertical coherence length and microstrain cause the broadening, Δqz of (000l) reflections in ω–2θ scans, which can be estimated respectively, from the intercept and slope of the 490 linear Williamson–Hall plots of Δqz (FWHM along qz direction) vs. q. Here, q is the magnitude of the position of (000l) point in the reciprocal space. Similarly, the finite lateral coherence length and tilt cause broadening, Δqx in qx–qy plane, which can be measured by the spread of (000l) reflections in ω scan. Lateral coherence length and tilt can be Fig. 2. ω–2θ scans for GaN films deposited at substrate temperature of 700 °C on quartz (———) and ZnO buffer layer over quartz (———) for (a) (0002), (b) (0004) and (c) (0006) reflections. The broadening in the reciprocal space as obtained from the symmetric scans along ω–2θ-axis (qz) for (0002), (0004) and (0006) reflections are shown in (d) for the two films. Table 1 Micro-structural parameters of GaN films deposited on quartz and ZnO buffer layer over quartz at a substrate temperature of 700 °C Substrate Lateral crystallite size (nm) Crystallite Vertical Microtilt (°) crystallite strain size (nm) Quartz 10 5.4 40 ZnO/ quartz N limit of 2.5 measurement 200 Lateral size Surface of surface roughness, features rms (nm) from AFM (nm) 5.9 × 10− 3 40–50 and 80–120 2.3 × 10− 3 100–200 7 11 estimated respectively, from the intercept and slope of the linear Williamson–Hall plots of Δqx (FWHM along qx direction) vs. q. ω–2θ scans for the symmetric (0002), (0004) and (0006) reflections for GaN films deposited at 700 °C on quartz and ZnO buffer layer over quartz are shown respectively, in Fig. 2(a–c). For all the cases, the FWHM in reciprocal space (Δqz) are also indicated. The (0006) reflection for GaN film on quartz substrate could not be recorded due to very low signal intensity. As discussed above, the vertical crystallite size and micro-strain were calculated from Williamson–Hall plots (Δqz vs. q), shown in Fig. 2(d). The values of these parameters are listed in Table 1. It may be noted that the vertical crystallite size of the film deposited on ZnO buffer layer is ~200 nm as compared to the size of ~40 nm for the film deposited on quartz substrate. The micro-strain is found to be 2.3 × 10− 3 in the film deposited on ZnO buffer layer, which is nearly one third of the value of 5.9 × 10− 3, found in the film deposited on quartz substrate. These results show that the presence of ZnO buffer layer results in a drastic increase in the crystallite size (along growth direction) of GaN film to a large value ~ 200 nm and a significant reduction in the micro-strain to a value ~ 2 × 10− 3. There are no reported values of micro-strain in polycrystalline GaN films deposited by MBE, MOCVD, PLD or sputtering, over any substrate. Micro-strain values of (2–4) × 10− 4 have been reported for epitaxial GaN films on sapphire substrates, grown by MOCVD [55]. Considering the polycrystalline nature of sputtered GaN films deposited in the present work, the micro-strain value of ~2 × 10− 3 is quite low. It indicates the high crystalline quality of the GaN film on ZnO buffer layer, which is attributed to the large crystallite size and limited presence of point defects in the film. Fig. 3(a–e) shows the ω scans for the symmetric (0002), (0004) and (0006) reflections for the GaN films deposited at 700 °C on quartz and ZnO buffer layer over quartz. For all the cases, the FWHM in reciprocal space (Δqx) are also indicated. The ω scans of the film deposited on quartz were found to be much broader (FWHM of (0002) ~6.76°) compared to the film deposited on ZnO buffer layer (FWHM of (0002) ~2.60°). The corresponding Williamson–Hall plots of Δqx vs. q are shown in Fig. 3(d), for both the films. The linear fits for the two films show significantly different slopes, from which the values of crystallite tilt have been estimated and listed in Table 1. The film deposited on ZnO buffer layer exhibits a much lower slope as compared to the film deposited on quartz. The corresponding value of tilt ~2.5° for the film on ZnO buffer layer is significantly smaller than the value of ~5.4° for the film deposited on quartz. The intercept of the Δqx vs. q plot for the film deposited on quartz was found to be much higher compared to the film deposited on ZnO buffer layer. This indicates that the lateral crystallite size of the film on quartz is much smaller compared to that of the film on ZnO buffer layer. The value of ~10 nm for the lateral crystallite size in GaN film deposited on quartz agrees well with the value obtained by transmission electron microscopy and reported earlier [53]. The nearly zero intercept seen in the case of the GaN film deposited on ZnO buffer layer shows that the lateral crystallite size in this case is larger than the limit of measurements. The crystallite tilt of ~2.5° in sputtered GaN film on ZnO buffer layer over quartz substrate, is comparable to the reported value of ~2° for GaN films sputter deposited on ZnO/Si substrates from a Ga2O3 target [51]. The 491 constant at all values of ϕ. This indicates the absence of any in-plane orientation of crystallites in these films, which is attributed to the amorphous nature of quartz substrate and the absence of in-plane orientation in ZnO buffer layer, which was also independently checked. The surface morphology of GaN films deposited at 700 °C on quartz and ZnO buffer layer was investigated by atomic force microscopy and the results are shown in Fig. 4. The corresponding values of lateral size of surface features and surface roughness are also included in Table 1. The GaN film deposited on ZnO buffer layer exhibits significantly different surface features compared to the film deposited on bare quartz substrate. It shows very large lateral surface features ~100–200 nm, which are distinctly different from the mixture of small (~40–50 nm) and large (~80–120 nm) sized surface features, seen in the GaN film on quartz substrate. It may be pointed out that the surface features may not necessarily represent single crystallites, but the larger size seen in case of GaN film on ZnO buffer layer is indicative of the increase in crystallite size, associated with the strong c-axis orientated growth. This result corroborates well with the ω-scan measurements, which also indicated a large increase in lateral crystallite size of the GaN film deposited on ZnO buffer layer. The film deposited on ZnO buffer layer also has a larger surface roughness of ~11 nm, which is somewhat higher than the films grown on quartz substrate (~7 nm). The increase in surface roughness appears to be associated with the enhancement of c-axis orientation of crystallites. Fig. 5 shows a comparison of Raman spectra of GaN films deposited at 700 °C on quartz and ZnO buffer layer over quartz. The Raman spectrum of bare quartz substrate has also been shown as reference. The spectrum of GaN film deposited on quartz substrate is dominated by the peak centred at ~ 728 cm− 1 along with a broad peak ~560 cm− 1. The peaks ~560 cm− 1 and ~ 728 cm− 1 are attributed to E2 (high) and A1 (LO) modes (LO denotes longitudinal optical), which are reported at 567.6 cm− 1 and 734 cm− 1 for epitaxially grown GaN films [58], Fig. 3. ω-scans for GaN films deposited at substrate temperature of 700 °C on quartz (———) and ZnO buffer layer over quartz (———) for (a) (0002), (b) (0004) and (c) (0006) reflections. The broadening in the reciprocal space as obtained from the symmetric scans along ω-axis (qx) for (0002), (0004) and (0006) reflections are shown in (d) for the two films. measured value of tilt is about an order of magnitude higher than the reported values (from (0002) rocking curve measurements) for epitaxial GaN films grown over ZnO buffer layers on sapphire substrates by MBE [48], MOCVD [44] and PLD [50,57] techniques. Phi (ϕ) scans of asymmetric (101̄1) reflections were also carried out on both the films. But the intensity of these scans was found to be Fig. 4. AFM images of GaN films deposited at substrate temperature of 700 °C on (a) quartz and (b) ZnO buffer layer over quartz. 492 hexagonal systems such as polycrystalline ZnO films [52], has not been frequently observed in sputtered GaN films, though it may be mentioned that the data available on sputtered/polycrystalline GaN films is rather limited. The c-axis orientation in ZnO films is believed to originate from preferential (0002) nucleation [52,54,62], driven by minimization of surface energy. It has been recently shown [53] that sputtered GaN films exhibit (0002) preferential orientation of crystallites in early stages of ̄ and growth, though crystallites with other orientations, such as, (1010) ̄ (1011)are also present. This result indicates that (0002) plane in the GaN system may also possess the lowest surface energy. However, the limited data [63,64] for GaN indicate, nearly equal values of surface energy of different crystallographic planes [63], which possibly results in the preferred orientation of crystallites in thicker GaN films to be strongly influenced at the growth stage by factors, such as, surface diffusion and sticking. It has been shown for sputtered GaN films [53] that, governed ̄ or essentially by substrate temperature, crystallites with either (1011) (0002) plane grow, depending upon, whether surface diffusion takes place between planes within the crystallites or between the crystallites. This is also evident from the XRD patterns of GaN films in Fig. 1, which show that even at relatively higher substrate temperatures of 700 °C, the (0002) preferred orientation of GaN films on bare quartz substrates is ̄ orientation remain present not facile enough and crystallites with (1011) in the film. However, the presence of a ZnO buffer layer with (0002) oriented crystallites clearly makes a major difference to this situation. Being lattice matched and aligned with the growing GaN film, the buffer layer prevents the formation of mis-oriented nuclei and crystallites of GaN and thus limits the influence of factors, such as, surface diffusion and possibly sticking, which become increasingly important at the growth stage. The presence of ZnO buffer layer clearly has a very strong influence and is effective in reducing the dislocation density of the growing GaN film, resulting in the formation of large and c-axis oriented GaN crystallites with small tilt. It is also clear that the ZnO buffer layer absorbs significant part of the strain due to the amorphous nature of quartz substrate and the much smaller lattice mismatch between GaN and ZnO (1.8%) results in the reduction in micro-strain and thus the density of point defects in the GaN film. 4. Conclusions Fig. 5. Raman spectra of (a) quartz substrate, (b) GaN film deposited on quartz, (c) ZnO buffer layer over quartz and (d) GaN film deposited on ZnO buffer layer over quartz. The GaN films in both cases were deposited at 700 °C. respectively. Two humps were also observed at ~260 cm− 1 and ~ 320 cm− 1, with the latter being identified as acoustic overtone [59]. The small low frequency peak ~ 260 cm− 1 has been attributed to As clusters [60] or a zone boundary phonon mode [61] in GaN. The Raman spectrum of the film deposited on ZnO buffer layer has all the features similar to those described above, including a relatively intense A1 (LO) mode peak and two very small peaks at ~258 and ~ 320 cm− 1, but most interestingly, it is dominated by a strong and sharp E2 (high) mode at ~560 cm− 1. It is known that in the z(x,y)z̄ geometry, with z-axis along the c-axis of the hexagonal structure, the Raman spectrum of GaN is expected to show only the E2 (high) and A1 (LO) modes [59]. This result is thus in tune with the micro-structural studies of GaN film deposited on ZnO buffer layer, and confirms the significant improvement in its crystalline quality, particularly c-axis orientation of crystallites. The above results can be summarized and explained as follows. The significant increase in crystallite size (both lateral and along growth direction) and the small values of tilt (~2.5°) and micro-strain (~2 × 10− 3) seen in GaN film deposited at 700 °C on ZnO buffer layer over amorphous quartz substrate show that this film possesses high crystalline quality, in terms of crystallite size and orientation as well as absence of point defects, in comparison to the film deposited on quartz substrate. The strong c-axis or (0002) preferred orientation commonly reported in GaN films were deposited on quartz and ZnO buffer layer on quartz by reactive sputtering of GaAs target in 100% nitrogen at 550 °C and 700 °C. HRXRD, AFM and Raman spectroscopy studies together show that the GaN film deposited at 700 °C on ZnO buffer layer possesses a much improved crystallinity. In particular, it showed the presence of large crystallites (~ 200 nm) along, as well as, perpendicular to growth direction, strong and nearly complete c-axis orientation of crystallites, with average tilt of ~ 2.5°. The micro-strain of ~2 × 10− 3 present in the film deposited on ZnO buffer layer at 700 °C was nearly one third of the corresponding value for the GaN film deposited on bare quartz substrate. The significant improvement in crystallite size and orientation, and the reduction of micro-strain in this film are attributed to the presence of the ZnO buffer layer on quartz substrate and its small lattice mismatch (1.8%) with GaN. The buffer thus prevents the formation of mis-oriented nuclei or crystallites of GaN and does not allow factors like surface diffusion and sticking to change the nature of preferred orientation during growth stage, as observed in the case of GaN films grown on bare quartz substrates. Acknowledgements The financial support for this work received from the Board of Research in Nuclear Sciences, Department of Atomic Energy (GoI) is gratefully acknowledged. Tapas Ganguli and Ravi Kumar are thankful to Dr. S. M. Oak for his support and encouragement. FIST (PHYSICS)-IRCC SPM Facility and CRNTS of IIT Bombay are respectively, acknowledged for providing the facilities for AFM and Raman studies. 493 References [1] [2] [3] [4] [5] [6] [7] [8] [9] [10] [11] [12] [13] [14] [15] [16] [17] [18] [19] [20] [21] [22] [23] [24] [25] [26] [27] [28] [29] [30] [31] [32] B. Monemar, G. Pozina, Prog. Quantum Electron. 24 (2000) 239. H. Morkoc, A.D. Carlo, R. Cingolani, Solid State Electron. 46 (2002) 157. H. Okumura, Jpn. J. Appl. Phys. 45 (2006) 7565. J.K. Park, M.A. Lim, C.H. Kim, H.D. Park, J.T. Park, S.Y. Choi, Appl. Phys. Lett. 82 (2003) 683. S.J. Pearton, C.R. Abernathy, D.P. Norton, A.F. Hebard, Y.D. Park, L.A. Boatner, J.D. Budai, Mater. Sci. Eng. R 40 (2003) 137. S. Nakamura, G. Fasol, The Blue Laser Diode, Springer, Berlin, 1997. M.S. Shur, R.F. Davis, GaN-Based Materials and Devices, World Scientific Publishing, Singapore, 2004. S. Hasegawa, S. Nishida, T. Yamashita, H. Asahi, Thin Solid Films 487 (2005) 260. V.A. Christie, S.I. Liem, R.J. Reeves, V.J. Kennedy, A. Markwitz, S.M. Durbin, Curr. Appl. Phys. 4 (2004) 225. F.R. Hu, K. Ochi, Y. Zhao, B.S. Choi, K. Hane, J. Cryst. Growth 294 (2006) 197. J.-H. Boo, S.A. Ustin, W. Ho, J. Cryst. Growth 189/190 (1998) 183. A. Georgakilas, K. Amimer, P. Tzanetakis, Z. Hatzopoulos, M. Cengher, B. Pecz, Z.S. Czigany, L. Toth, M.V. Baidakova, A.V. Sakharov, V. Yu. Davydov, J. Cryst. Growth 227 (2001) 410. S.-E. Park, D.-J. Kim, O. Byungsung, J. Cryst. Growth 252 (2003) 87. W. Czarczynski, P. Kieszkowski, St. Lasisz, R. Paszkiewicz, M. Tlaczała, Z. Znamirowski, E.Z. Olnierz, J. Vac. Sci. Technol. B 19 (2001) 47. A. Missaoui, M. Saadoun, H. Ezzaouia, B. Bessais, T. Boufaden, A. Rebey, B.E. Jani, Phys. Status Solidi, A 182 (2000) 189. F. Hasegawa, M. Minami, K. Sunaba, T. Suemasu, Phys. Status Solidi, A 176 (1999) 421. M.J. Paterson, E.M. Goldys, H.Y. Zuo, T.L. Tansley, Jpn. J. Appl. Phys. 37 (1998) 426. T. Miyazaki, T. Fujimaki, S. Adachi, K. Ohtsuka, J. Appl. Phys. 89 (2001) 8316. T. Kikuma, K. Tominaga, K. Furutani, K. Kusaka, T. Hanabusa, T. Mukai, Vacuum 66 (2002) 233. Q.X. Guo, W.J. Lu, D. Zhang, T. Tanaka, M. Nishio, H. Ogawa, J. Vac. Sci. Technol., A 22 (2004) 1290. E.C. Knox-Davies, J.M. Shannon, S.R.P. Silva, J. Appl. Phys. 99 (2006) 073503. A. Jagoda, B. Stanczyk, L. Dobrzanski, R. Diduszko, Phys. Status Solidi, C 4 (2007) 1423. R.H. Horng, D.S. Wuu, S.C. Wei, S.H. Chan, C.Y. Kung, Thin Solid Films 343–344 (1999) 642. C.-W. Wang, J. Vac. Sci. Technol. B, 20 (2002) 1821. J.H. Kim, M.R. Davidson, P.H. Holloway, Appl. Phys. Lett. 83 (2003) 4746. S. Shirakata, R. Sasaki, T. Kataoka, Appl. Phys. Lett. 85 (2004) 2247. K. Kuska, T. Hanabusa, K. Tominaga, Vacuum 74 (2004) 613. T. Maruyama, H. Miyake, J. Vac. Sci. Technol. A 24 (2006) 1096. N.A. Preschilla, N.M. Elkashef, R.S. Sriniva, sa, S. Major, Surf. Coat. Technol. 108 (1998) 328. H.-L. Ma, Y.-G. Yang, J. Ma, X.-M. Liu, Diamond Relat. Mater. 13 (2004) 1892. Y. Wu, C. Xue, H. Zhuang, D. Tian, Y. Liu, J. He, L. Sun, F. Wang, Y. Ai, Y. Cao, J. Cryst. Growth 292 (2006) 294. D.P. Bour, N.M. Nickel, C.G. Van de Walle, M.S. Kneissl, B.S. Krusor, P. Mei, N.M. Johnson, Appl. Phys. Lett. 76 (2000) 2182. [33] [34] [35] [36] [37] [38] [39] [40] [41] [42] [43] [44] [45] [46] [47] [48] [49] [50] [51] [52] [53] [54] [55] [56] [57] [58] [59] [60] [61] [62] [63] [64] S. Yagi, S. Suzuki, T. Iwanaga, Jpn. J. Appl. Phys. 40 (2001) L1349. S. Hasegawa, S. Nishida, T. Yamashita, H. Asahi, Thin Solid Films 487 (2005) 260. H.J. Hovel, J.J. Cuomo, Appl. Phys. Lett. 20 (1972) 71. E. Lakshmi, B. Mathur, A.B. Bhattacharya, V.P. Bhargava, Thin Solid Films 74 (1980) 77. T.L. Tansley, R.J. Egan, E.C. Horrigan, Thin Solid Films 164 (1988) 441. S. Zembutsu, M. Kobayashi, Thin Solid Films 129 (1985) 289. P.A. Nisha, S. Major, N. Kumar, I. Samajdar, R.S. Srinivasa, Appl. Phys. Lett. 77 (2000) 1861. M. Park, J.-P. Maria, J.J. Cuomo, Y.C. Chang, J.F. Muth, R.M. Kolbas, R.J. Nemanich, E. Carlson, J. Bumgarner, Appl. Phys. Lett. 81 (2002) 1797. K. Kusaka, T. Hanabusa, K. Tominaga, N. Yamauchi, J. Vac. Sci. Technol. A 22 (2004) 1587. Y. Daigo, N. Mutsukura, Thin Solid Films 483 (2005) 38. X. H Luo, R.M. Wang, X.P. Zhang, D.P. Yu, M.C. Luo, Micron, 35 (2004) 475. S. Gu, R. Zhang, J. Sun, L. Zhang, T.F. Kuech, Appl. Phys. Lett. 76 (2000) 3454. A. Strittmatter, A. Krost, V. Turck, M. Straßburg, D. Bimberg, J. Blasing, T. Hempel, J. Christen, B. Neubauer, D. Gerthsen, T. Christmann, B.K. Meyer, Mater. Sci. Eng. B 59 (1999) 29. B.Y. Man, C. Yang, H.Z. Zhuang, M. Liu, X.Q. Wei, H.C. Zhu, C.S. Xue, J. Appl. Phys. 101 (2007) 093519. R.F. Xiao, X.W. Sun, Z.F. Li, N. Cue, H.S. Kwok, Q.Z. Liu, S.S. Lau, J. Vac. Sci. Technol. A 15 (1997) 2207. S.W. Lee, T. Minegishi, W.H. Lee, H. Goto, H.J. Lee, S.H. Lee, Hyo-Jong Lee, J.S. Ha, T. Goto, T. Hanada, M.W. Cho, T. Yao, Appl. Phys. Lett. 90 (2007) 061907. R.P. Wang, H. Muto, Y. Yamada, T. Kusumori, Thin Solid Films, 411 (2002) 69. H.W. Kim, N.H. Kim, Appl. Surf. Sci. 236 (2004) 192. C.G. Zhang, L.F. Bian, W.D. Chen, C.C. Hsu, J. Cryst. Growth, 293 (2006) 258. Y. Kajikawa, J. Cryst. Growth 289 (2006) 387. B.S. Yadav, S.S. Major, R.S. Srinivasa, J. Appl. Phys. 102 (2007) 073516. Y. Kajikawa, S. Noda, H. Komiyama, J. Vac. Sci. Technol. A 21 (2003) 1943. R. Chierchia, T. Böttcher, H. Heinke, S. Einfeldt, S. Figge, D. Hommel, J. Appl. Phys. 93 (2003) 8918. M.E. Vickers, M.J. Kappers, R. Datta, C. McAleese, T.M. Smeeton, F.D.G. Rayment, C.J. Humphreys, J. Phys. D: Appl. Phys. 38 (2005) A99. X.W. Sun, R.F. Xiao, H.S. Kwok, J. Appl. Phys. 84 (1998) 5776. V.Y. Davydov, Y.E. Kitaev, I.N. Goncharuk, A.N. Smirnov, J. Graul, O. Semchinova, D. Uffmann, M.B. Smirnov, A.P. Mirgorodsky, R.A. Evarestov, Phys. Rev. B 58 (1998) 12899. H. Siegle, G. Kaczmarczyk, L. Filippidis, A.P. Litvinchuk, A. Hoffmann, C. Thomsen, Phys. Rev. B 55 (1997) 7000. P.S. Pizani, A. Mlayah, J. Groenen, R. Carles, Appl. Phys. Lett. 66 (1995) 1927. H.-L. Liu, C.-H. Chen, C.-T. China, C.-C. Yeh, C.-H. Chen, M.-Y. Yu, S. Keller, S.P. BenBaars, Chem. Phys. Lett. 345 (2001) 245. N. Fujimura, T. Nishihara, S. Goto, J. Xu, T. Ito, J. Cryst. Growth 130 (1993) 269. J.E. Northrup, J. Neugebauer, Phys. Rev. B 53 (1996) R10477. J. Neugebauer, Phys. Status Solidi, B 227 (2001) 93.
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