Proceedings Proceedings of the ASME 2009 International Mechanical Engineering Congressof & IMECE2009 Exposition ASME International Mechanical Engineering Congress & Expositions IMECE2009 November Lake Buena Florida November 13-19,13-19, Lake Buena Vista, Vista, Florida, USA IMECE2009-12047 atural Patterns Applied to the Design of Microchannel Heat Sinks Carlos Alberto Rubio-Jimenez [email protected] Department of Mechanical Engineering Universidad de Guanajuato Road Salamanca-Valle de Santiago km. 3.5+1.8 km. Community of Palo Blanco, Zip Code 36885 Salamanca, Guanajuato, México Abel Hernandez-Guerrero [email protected] Department of Mechanical Engineering Universidad de Guanajuato Road Salamanca-Valle de Santiago km. 3.5+1.8 km. Community of Palo Blanco, Zip Code 36885 Salamanca, Guanajuato, México Jose Cuauhtemoc Rubio-Arana [email protected] Department of Mechanical Engineering Universidad de Guanajuato Road Salamanca-Valle de Santiago km. 3.5+1.8 km. Community of Palo Blanco, Zip Code 36885 Salamanca, Guanajuato, México Satish Kandlikar [email protected] Rochester Institute of Technology 76 Lomb Memorial Drive Rochester NY 14623 Rochester, New York, United States alternative to dissipate the large generated heat fluxes inside electronic devices, mainly computational processors. Many studies about this kind of heat sinks have been developed. A large part of studies had used traditional arrangements (heat sinks formed by a specific number of microchannels placed in a parallel way.) These channels typically present a specific and constant cross section area (rectangular form is the most used.) Studies developed previously had demonstrated that this kind of heat sinks is able to dissipate high heat fluxes, using water in the laminar regime and single phase [1-5]. One important contribution of these studies is to demonstrate that the convective coefficient present in these micro arrangements in laminar regime has the same order of magnitude to those coefficients present in turbulent regimen in convectional channels [6]. Thus, in a theoretical way, the heat flux generated by the current computational processors can be easily dissipated using these devices. These computational processors have a maximum design temperature around 70°C [7,8]. Some studies had demonstrated that microchannel heat sinks with rectangular and constant cross section area can dissipate heat fluxes near 700 W/cm2 [2, 3]. However, in many of those works the temperature profile in the electronic devices to cool presents a non-uniform behavior [9-11]. That behavior shows a specific pattern: a low temperature at the zone where the fluid is entering the heat sink, increasing along the channel longitudinal direction until reaching a maximum temperature at the outlet zone of the channel. Typically, microchannel heat sinks are built from a square base of 1 cm2. Thus, the phenomenon happens around a length of 1 cm with the single inlet/outlet header arrangement. Therefore, this ABSTRACT The present work shows a study developed of the thermal and hydrodynamic behaviors present in microchannel heat sinks formed by non-conventional arrangements. These arrangements are based on patterns that nature presents. There are two postulates that model natural forms in a mathematical way: the Allometric Law and the Biomimetic Tendency. Both theories have been applied in the last few years in different fields of science and technology. Using both theories, six models were analyzed (there are three cases proposed and both theories are applied to each case). Microchannel heat sinks with split channels are obtained as a result of applying these theories. Water is the cooling fluid of the system. The inlet hydraulic diameter is kept in each model in order to have a reference for comparison. The Reynolds number inside the heat sink remains below the transition Reynolds number value published by several researchers for this channel dimensions. The inlet Reynolds number of the fluid at the channel inlet is the same for each model. A heat flux is supplied to the bottom wall of the heat sink. The magnitude of this heat flux is 150 W/cm2. The temperature fields and velocity profiles are obtained for each case and compared. KEYWORDS Branched Microchannel Heat Sinks, Allometric Law, Biomimetic Tendency. ITRODUCTIO In the last century novel techniques for cooling electronic devices have been proposed. Microchannel heat sinks are an 1 Copyright © 2009 by ASME temperature field may produce thermo-mechanical stresses which could reduce the lifetime of the system [12]. Based on these antecedents, a question arises: is it possible to have homogeneous temperature profiles in the electronic device to cool, using this kind of arrangements in a laminar regime and single phase? In a theoretical way, the convective coefficient is inversely proportional to the channel hydraulic diameter. Based on this principle, if the channel hydraulic diameter is decreasing the convective coefficient is improved as a result. Therefore, the temperature field could be made more uniform. But, under what criterion could the hydraulic diameter of microchannel heat sinks be decreased? One source of inspiration to achieve this criterion for decreasing the hydraulic diameter can be obtained from natural forms. Those forms present a general appearance: a main channel which decreases its hydraulic diameter and branches out at a specific position into two or more channels with smaller hydraulic diameter. This behavior is repeated a specific number of times. Figure 1 sketches the way it occurs. Thus, it is possible to imagine that there is a ratio which is capable to describe those natural forms. Large edge = 1.6180... Small edge (1) Inlet hydraulic diameter, Dinlet = 1.6180... Outlet hydraulic diameter, Doutlet (2) ϕ= ϕ= Another way to obtain a ratio to decrease the hydraulic diameter can be taken from measurements of branching systems (i.e. the human circulatory system.) The Allometric Law is the result obtained to develop a mathematical model of those measurements (statistical model) [17-19]. This law presents a ratio capable to express the decrement of ratio that branching systems present. Equation (3) shows this ratio. Therefore, it is possible to use this ratio in order to get microchannel heat sinks with outlet hydraulic diameters smaller than inlet hydraulic diameters, in the same way that nature presents. Allometriclaw = Inlet hydraulic diameter, Dinlet = 21 / 3 Outlet hydraulic diameter, Doutlet (3) Based on both tendencies (and their respective ratios), it is possible to create different structure similar to natural forms. These structures can be manufactured on a silicon substrate in order to create channel with specific dimensions which can distribute a specific working fluid in all the substrate. Theoretically, this way to create microchannel heat sink could increase the fluid velocity, specifically at the last section of the channel. With this, it is expected to improve the overall convective coefficient, distributing more evenly the temperature profile on the device to cool. Clearly, the most important generated problem is an increment in the mechanical power to be supplied into the system in order to move the working fluid inside the heat sink. PROBLEM DESCRIPTIO Figure 2 shows the natural structures considered. This figure shows a core channel branching out into some small channels. These channels structures present a specific form. This general form can be adjusted in order to obtain arrangements which can be used as microchannel heat sinks. In this work, three structures are studied. The patter is similar in all the cases (a main channel which is bifurcated at a specific position in two or more channel with smaller hydraulic diameter.) The inlet flow is considered to be at the largest hydraulic diameter (main channel.) In Figure 2 a) the structure is formed by the main channel and one bifurcation at its last third section. In Figure 2 b) the structure presents a configuration based on the main channel and two bifurcations. One bifurcation is placed at its last zone and the other one at a position before (it is placed inside the last third section of the main channel.) In Figure 2 c) the structure presents a configuration similar to Figure 2 b). In this configuration a second bifurcation is added in bifurcated channel placed firstly from the inlet flow position of the main channel. Figure 3 shows the heat sink arrangements built under the natural forms presented in Figure 2. Figure 1. Typical arrangement of nature forms. In the last years, some areas of investigation have tried to imitate natural forms. Some parameters have been used in order to achieve this target. These can reproduce in an exact way natural forms. This way to reproduce natural forms is called Biomimetic Tendency. As well as the π number (3.1416…) and the e number (2.7182…), the φ number (1.6180…) is a parameter which has been used along the history. It had a great impact since the Greek culture down to the Renaissance age. This number is able to describe some ratios present in natural forms (i.e. it can describe perfectly a nautilius spiral) [13-16]. Equation (1) expresses the ratio under this number between two edges of a natural structure (one edge larger than the other.) Therefore, if this number is used to get a channel decrement in heat sinks, it will lead to an outlet hydraulic diameter smaller than the inlet hydraulic diameter, increasing the fluid velocity in this last section. Equation (2) shows the ratio to apply in the models to analyze. 2 Copyright © 2009 by ASME a) b) c) Figure 2. Natural configurations taken to design and built the microchannel heat sinks. for all the arrangements are shown in Tables 1 and 2. The angles of bifurcation are 37° (most recurrent angle in natural forms) and 31.71° (value calculated using the Phi number) for the Allometric Law and the Biomimetic Tendency, respectively. The level of bifurcation is referred to the position where the channel is bifurcated i.e. the level of bifurcation B 1 is referred at the first bifurcation that the main channel presents. Based on the Allometric Law, this position occurs at 9.5344 mm from the inlet flow position. The channel at this point has a hydraulic diameter of 150.74 µm (width 128.4 µm and height 207.8 µm.) The level of bifurcation is increased with each ramification that the channel presents. a) Table 1. Dimension of each level of bifurcation based on the Allometric Law. Bifurcation level, B 1 2 3 4 b) Hydraulic diameter [µm] 158.74 125.99 99.99 79.36 Channel width [µm] 128.4 101.4 80.89 64.2 Channel height [µm] 207.8 164.9 130.9 103.9 Bifurcation long [mm] 9.5344 1.9648 0.3974 --- Table 2. Dimension of each level of bifurcation based on the Biomimetic Tendency. Bifurcation level, B 1 2 3 4 c) Figure 3. Arrangements of microchannel heat sinks based on natural structures. a) Case 1, b) Case 2, c) Case 3. The dimensions used in each structure are taken from the two previously mentioned tendencies. The Allometric Law and the Biomimetic Tendency can be expressed by means of Equations (2) and (3), respectively. Thus, in the present study six models of heat sinks are analyzed (three based on the Allometric Law and other three on the Biomimetic Tendency.) The inlet hydraulic diameter is similar for all the cases (200 µm) in order to have a point for comparison. The dimensions Hydraulic diameter [µm] 123.60 76.39 47.27 26.12 Channel width [µm] 100.00 61.80 38.24 21.13 Channel height [µm] 161.80 100.00 61.88 34.19 Bifurcation long [mm] 7.4166 2.8328 1.0819 ---- The base material to build each arrangement is a silicon substrate with a thickness of 361.8 µm and a length of 12 mm. The bottom wall area is larger than 144 mm2. This area is taken from the area available for the computational processor, considering a perfect contact between the heat sink and the Advanced Smart Cache [7] (commonly these cores are covered by a plate which increases the heat transfer area, making the 3 Copyright © 2009 by ASME computational processor larger.) The heat sink arrangement is formed by a specific number of structures. These are placed counterflow wise in order to use the largest area as possible in the heat sink (Figure 3.) The number of full structures in each arrangement is varied since the opening angle at each ramification for each tendency is different. The models have six structures in the heat sink arrangement when the Allometric Law is used and four structures for the Biomimetic Tendency. Thus, the bottom wall area of the heat sink is varied. It is 156 mm2 (12 x 13 mm) using the Allometric Law and 162 mm2 (12 x 13.5 mm) when the Biomimetic Tendency is used. Due to the symmetry that each arrangement presents, it is possible to use only a cell of analysis in order to reduce the computational time to approach the numerical solution. Figure 4 presents one of the cells built and analyzed under the numerical model. Governing Equations The solution of the model requires solving the continuity, energy and Navier-Stokes equations, to obtain the temperature distribution at the bottom wall of the heat sink. Under these model considerations and taking into consideration thermal properties variations, the governing equations are: Continuity equation: ∂u ∂v ∂w + + =0 ∂x ∂y ∂z (4) Momentum equation for the fluid: ∂u ∂u ∂u ρ f u + v + w = ∂y ∂z ∂x − dP ∂ ∂u ∂ ∂v ∂u ∂ ∂w ∂u + 2µ + µ + + µ + dx ∂x ∂x ∂y ∂x ∂y ∂z ∂x ∂z ∂u ∂u ∂u +v + w = ∂y ∂z ∂x ρ f u − dP ∂ ∂v ∂ ∂v ∂u ∂ ∂w ∂v + 2µ + µ + + µ + dy ∂y ∂y ∂x ∂x ∂y ∂z ∂y ∂z (5) ∂u ∂u ∂u + v + w = ∂y ∂z ∂x ρ f u Figure 4. Sketch of a typical cell to analyze of the heat sink. − AALYSIS Considerations Several authors have demonstrated the large spatial variation of temperature and velocity along the microchannel, making it necessary to considerate 3-D variations in the analysis. Water is the cooling fluid. The conditions assumed for this model are steady state, laminar incompressible flow, inlet temperature of the working fluid of 293 K, negligible radiation heat transfer as well as thermal resistance between the electronic device and the microchannel heat sink. The fluid is kept in a laminar regime through the length of the heat sink. Energy equation for the solid: ∂ ∂T ∂ ∂T ∂ ∂T + ks ks + ks =0 ∂x ∂x ∂y ∂y ∂z ∂z Viscosity, µ Thermal conductivity, kf Density, ρf Specific heat, cpf Value or function Water -1.717x10-9T3+1.815x10-6T2 -6.4442x10-4T+0.077189 ∂ 2T ∂ 2T ∂ 2T ∂T ∂T ∂T +v + w = k f 2 + 2 + 2 ∂x ∂y ∂z ∂y ∂z ∂x ρ f cp f u 2 ∂u 2 ∂v 2 ∂w + 2µ + + ∂x ∂y ∂z 2 2 2 ∂u ∂v ∂u ∂w ∂v ∂w + µ + + + + + ∂y ∂x ∂z ∂x ∂z ∂y Units N s/m2 0.6 W/m K 998.3 4.183 kg/m3 kJ/kg K 0.003345T2-2.8325T+696.7 W/m K 2330 0.712 Kg/m3 kJ/kg K (7) Boundary Conditions The boundary conditions for the model are taken in such a way that the flow interacts with its surroundings. At the inlet zone of the main channel a constant fluid inlet velocity is used (a velocity profile is not assumed.) This parameter is adjusted to have a specific Reynolds number. A constant heat flux is supplied by the electronic device at around the surface of the bottom wall of the heat sink (a thermal resistance at this zone is not considered.) The outlet zones are adjusted to a zero static pressure in order to observe the water pressure drop. The walls at the half-cut of the cell also present symmetry conditions. The walls which are interacting between both mediums are adjusted as interfaces. The rest of the walls are adjusted as adiabatic, since they do not present a high temperature gradient. Silicon Thermal conductivity, ks Density, ρs Specific heat, cps (6) Energy equation for the fluid: Table 3. Thermophysical properties for water and silicon. Property dP ∂ ∂w ∂ ∂w ∂u ∂ ∂w ∂v + 2µ + µ + + µ + dz ∂z ∂z ∂x ∂x ∂z ∂y ∂y ∂z One important point of this kind of analysis is the behavior that the water and silicon properties have with temperature. Table 3 shows the thermophysical properties for water and silicon. Some properties are constant while others are expressed as a function of temperature since they present a large variation with temperature. 4 Copyright © 2009 by ASME improves. This is mainly due to the fact that there are more channels, increasing the used heat transfer area. Also, the zones of turbulence generation and stagnation points are increased. The area not used is similar to Cases 1-A and 2-A. A decrement of this area is achieved in Case 2-B due to the ramifications in the main channel. Figures 9 and 10 present the temperature profiles obtained in Cases 3-A and 3-B, respectively. The behavior in both cases is similar to the behavior found in the last two cases. A better temperature distribution is not obtained for these cases. The most important result is that the temperature profile at the inlet-outlet zones is more homogeneous. Operational Parameters The target of this kind of heat sinks is to cool electronic devices which present large heat generation. This means that it is necessary to keep their temperature below the design temperature. For the case of computational processors, the heat sinks must keep them with a maximum temperature of 343 K. Experimental results from the companies that manufacture these processors had found that current processors can generate up to 150 W/cm2. Therefore, this value of heat flux is used in the analysis. It is important to mention that the heat flux supplied at each cell is an exact proportion of the total heat flux supplied at the bottom surface of the total heat sink. The inlet Reynolds number is adjusted at 500. This value is the average value taken by many researchers previously. Also, the velocity obtained with this Reynolds number allows having a fluid laminar regime throughout the system. RESULTS The temperature profiles for the bottom wall of the heat sink for the six cases under the specified conditions and operational parameters are shown in Figures 5 to 10. Each figure presents 3D plots for the temperature profile (x and y axis vs temperature.) Figures 5 and 6 present the temperature profile for Case 1 based on the Allometric Law (Case 1-A) and Biomimetic Tendency (Case 1-B), respectively. It is possible to observe a non-uniform behavior in both figures. The temperature at the midpoint is larger than at the edge where the working fluid is entering and exiting. For Case 1-B, the temperature at the midpoint (365 K) is larger than the other case (338 K.) This indicates that the arrangement for Case 1-B cannot dissipate the heat flux required to keep the electronic device temperature inside the safe design range. The other case is able to keep the electronic device temperature inside the range, but it is very near the limit. One point to take into consideration is the temperature gradient present in both cases. Results show that these gradients are extremely large (i.e. Case 1-A presents a surface temperature variation of around 14 K between the inlet-outlet zone and the midpoint, this is 6.5 mm.) Thus, thermal stresses could appear which could affect seriously the electronic device and the heat sink, reducing their lifetime. The largest heat dissipation in the heat sink is located at the zones where bifurcations are found. This is expected since in these zones many phenomena are present which affect the heat dissipation. Some of those effects are turbulence generation, stagnation points, flow acceleration, etc. In the figures, it is also possible to observe the amount of area which is useless for the heat transfer process. In Case 1-A, this area not used is concentrated in the middle of the heat sink. For the other case, this area is distributed in the entire surface. This is an important reason explaining why the temperature gradients are larger in Case 1-B than in Case 1-A. Figures 7 and 8 present the temperature profiles obtained in Cases 2-A and 2-B, respectively. In an overall observation, the behavior is similar to the previous cases. The temperature gradients present a light decrement with respect to Cases 1-A and 1-B, especially at the zones where the number of bifurcation was increased. This can be better observed in Figure 8. The temperature profile at the zones where the channel branches out is more homogeneous than in the previous case. Therefore, it is important to note that by increasing the number of bifurcations, the heat dissipation Figure 5. Temperature contour for Case 1-A, Allometric Law. Figure 6. Temperature contour for Case 1-B, Biomimetic Tendency. Unfortunately, the thermal results obtained in the six cases under considerations do not present advances in the heat dissipation compared with the traditional arrangements. In fact, the temperature gradients obtained in these cases are larger than the traditional microchannel heat sinks. This behavior is mainly due to the fact that the effective heat transfer area was reduced (the natural structures did not allow to use the most amount of heat transfer area of the channel walls.) Figures 11 to 16 present the fluid velocity profiles along the channels. Also, each figure presents a sketch of the zones where the channels are bifurcated and the inlet and outlet zones. As it was previously mentioned, one aim of this work is to increase the fluid velocity while this is passing through the channels. In the figures, it can be observed that the fluid is accelerated from the section where the channel starts, to the 5 Copyright © 2009 by ASME ending section. Unfortunately, this acceleration is not so large to improve the heat dissipation. Figure 10. Temperature contour for the Case 3-B, Biomimetic Tendency. Figure 7. Temperature contour for Case 2-A, Allometric Law. Figure 8. Temperature contour for the Case 2-B, Biomimetic Tendency. Figure 11. Fluid velocity profiles along the branched channel for Case 1-A. Figure 9. Temperature contour for the Case 3-A, Allometric Law. The fluid velocity profiles at the midpoint of the channel for Cases 1-A and 1-B are provided in Figures 11 and 12, respectively. At the main channel inlet zone, the fluid presents a constant velocity profile (such as it was assumed in the considerations.) After this zone, the fluid develops, reaching “full developed profile” fast (at around a tenth of the length of the main channel.) It is important to mention that the fluid velocity profile continues changing due to the fluid acceleration. Figure 12. Fluid velocity profiles along the branched channel for Case 1-B. For Case 1-A, the fluid velocity at the midpoint of the channel is larger than for Case 1-B. This is an expected result since the first case has a more considerable hydraulic diameter decrement than the second case. At the bifurcation zone, stagnations points can be observed. This is mainly due to the bifurcations angles used which are so large that the fluid suffers large energy losses. That is, the fluid has a large velocity when is going through the main channel, then having 6 Copyright © 2009 by ASME a drastic variation when it arrives to the bifurcation zone. Here its mass is divided in three flows. One flow keeps a large part of the velocity because the channel continues in a right direction. The other two flows loose energy because they crash with the channel walls. This generates an increment in the fluid pressure and a drastic reduction in the fluid velocity. Fluid instability is another phenomenon occurring at this bifurcation zone. The addition of these phenomena produce better heat dissipation in these zones as it is shown in Figures 5 to 10. and channel length.) Figures 15 and 16 present the velocity profile at the same mid plane. The behavior is similar in these last two cases. The most important detail is that in the second bifurcation of the first branched channel one channel bifurcates only in two channels. The fluid velocity is almost kept constant in the right channel, presenting only a minimum stagnation point. This is caused by the fluid division. This phenomenon helps the heat dissipation as well as does the other bifurcations zones. Figure 15. Fluid velocity profiles along the branched channel for Case 3-A. Figure 13. Fluid velocity profiles along the branched channel for Case 2-A. Figure 16. Fluid velocity profiles along the branched channel for Case 3-B. Figure 14. Fluid velocity profiles along the branched channel for Case 2-B. At the fluid outlet zone both in the main channel as well as in the branched channels, the fluid presents a fully developed velocity profile. This is also due to decreasing the channel hydraulic diameter. Figures 13 and 14 present the velocity profiles for Cases 2A and 2-B. The fluid behavior is similar to the previous two cases (a constant velocity at the inlet zone, fluid velocity increments along the channel, stagnation point at the bifurcation zones, increment of the fluid pressure, etc.) For these cases, the fluid has an important increment in its velocity although the channel section length is very short. This is due to the fact that in the last sections, the hydraulic diameter decrement is more drastic than in the other sections, mainly in Case B-1. Unfortunately, for this specific case, the length is larger than for the other case. Therefore, it is important to balance these two parameters (hydraulic diameter decrement 7 COCLUSIOS The thermal and hydrodynamic results obtained in this study for the proposed microchannel heat sinks based on natural structures shown that is possible to cool electronic devices that generate heat fluxes around 150 W/cm2. Temperature profile obtained on the bottom wall of the heat sink for all models presented a non-homogeneous distribution. It is observed a large temperature at midpoint of the surface, decreasing at the channel edges where are distributed the fluid inlet/outlet zones. For some cases (Cases 1-A and 1-B) the temperature at this position was larger than the computational processor design temperature. For the rest of the cases, the temperature was below this design parameter. This behavior was mainly due to the large heat transfer area that was not used really in the process. The velocity profiles obtained in all the cases have an expected behavior. The fluid presents a non-fully developed behavior at the fluid inlet zones. While the fluid is passing through the channels, the velocity profile is developing, researching zones where it may consider as fully developed. Copyright © 2009 by ASME [12] Kandlinkar, S., High Flux Heat Removal with Microchannels – A Roadmap of Challenges and Opportunities, 3rd International Conference on Microchannels and Minichannels, June 12-15, 2005. [13] Ghyka, M., Aesthetic of Proportions in ature and Art, Poseidon Editorial, Buenos Aires, 1953. [14] Luca, P., The Divine Proportion, Akal Editions, 1991, ISBN 978-84-7600-787-7. [15] Livio, M., The Golden Ratio, Broodway Books, New York, 2002, ISBN 0-7679-0816-3. [16] Martin, K., Leonardo Da Vinci: The Marvellous Works of ature and Man, Oxford University Press, ISBN 01928-0725-0. [17] Thompson, D’A., On Growth and Form, Cambridge University Press, Cambridge UK, 1942. [18] Kassab, G. S., Design of Coronary Circulation: A Minimum Energy Hypothesis, Computer Methods in Applied Mechanics and Engineering, Vol. 196, 2007. [19] Painter, P. R., Edén, P., Bengtsson, H., Pulsatile Blood Flow, Shear Force, Energy Dissipation and Murray’s Law, Theoretical Biology and Medical Modeling, August 2006. Fluid instabilities and velocity losses are presented at the bifurcation zones, helping to the heat dissipation. These were expected results. In an overall observation, Case 2-A presents the best behavior. This has good heat dissipation, mainly in the fluid inlet/outlet zones. The temperature at the midpoint on the heat sink bottom wall is below the design temperature. Also, this temperature is lower than Cases 1-A, 1-B, 2-B and 3-B and almost near Case 3-A. For this last case, the fluid has larger lost energy, requiring more mechanical energy in order to move the working fluid in the system. This can be observed in the velocity profiles generated along the channels. In these, there are zone where the fluid velocity is nearer zero. The most important observation in these results is that the fluid velocity can be increased only decreasing the hydraulic diameter. For this kind of heat sinks, this decrement can improve the heat dissipation. Therefore, arrangements of microchannel heat sinks that could generate these phenomena and use all the available heat transfer area may produce a better heat dissipation. REFERECES [1] Tuckerman, D. B., Pease, R. F., High Performance Heat Sinking for VLSI, IEEE Electronic Device Letters, EDL2, 1985. [2] Samalam, V. K., Convective Heat Transfer en Microchannels, J. Electron Master, Vol 18, 1989. [3] Peng, X. F., Wang, B. X., Peterson, G. P., Ma, B., Experimental Investigation of Heat Transfer in Flat Plates with Rectangular Microchannels, International Journal of Heat and Mass Transfer, Vol. 38, 1995. [4] Peterson, G. P., Ortega, A., Thermal Control of Electronic Equipment and Device, In Advances in Heat Transfer, 1990. [5] Peng, X. F., Peterson, G. P., Convective Heat Transfer and Flow Friction for Water Flow in Microchannels Structures, International Journal of Heat and Mass Transfer, Vol. 39. 1996. [6] Phillips. R. Micro-Channel Heat sink in: Advances in Thermal Modeling of Electronic Components, ASME, New York, 2, 1990. [7] AMD PT Family 0Fh Desktop Processors Power and Thermal Date Sheet, Publication # 33954, Revision: 3.00, Issue Date: February 2007, Advanced Micro Devices. [8] Azar, K., The History of Power Dissipation, Lucent Technologies, Electronics Cooling Applications, 2000. This reference is listed in the manuscript. [9] Toh, K. C., Chen, X. Y., Chai, J. C., umerical Computation of Fluid Flow and Heat Transfer in Microchannels, International Journal of Heat and Mass Transfer, Vol. 45, 2002. [10] Li, J. Peterson, G. P., Cheng, P., Three-dimensional Analysis of Heat Transfer on a Micro-Heat Sink with Single Phase Flow, International Journal of Heat and Mass Transfer, Vol. 47, 2004. [11] Rubio-Jiménez, C.A. García-González, J., HérnandezGuerrero, A., Popescu, A., Single Phase Flow Parameterization of Heat Transfer Dissipation for Different Microchannels Geometries, ECOS2007, Padova, Italy, Vol. 2. 8 Copyright © 2009 by ASME
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