®
Packaging Solutions
Advanced Packaging Solutions for High-Density PLDs
June 1998
• package options
• pin compatibility
Advanced
• design flexibility
Packaging
Solutions
FineLine BGA
• vertical migration
• space efficiency
• cost-effectiveness
SameFrame pin-out
Table of Contents
Advanced Packaging Solutions . . . . . . . . . . . . . . . . . . . . . .2
Altera Package Migration . . . . . . . . . . . . . . . . . . . . . . . . .4
FineLine Ball-Grid Array
100-Pin FineLine BGA . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
256-Pin FineLine BGA . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
484-Pin FineLine BGA . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
672-Pin FineLine BGA . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Ball-Grid Array
225-Pin BGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
256-Pin BGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
356-Pin BGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
600-Pin BGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Thin Quad Flat Pack
32-Pin TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
44-Pin TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
100-Pin TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
144-Pin TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Quad Flat Pack
100-Pin PQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
160-Pin PQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
208-Pin PQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
208-Pin RQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
240-Pin PQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
240-Pin RQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
304-Pin RQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Plastic J-Lead Chip Carrier
20-Pin PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
44-Pin PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
84-Pin PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Plastic Dual In-Line Package
8-Pin PDIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Pin-Grid Array
403-Pin PGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
503-Pin PGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
599-Pin PGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Supported Devices for Other Altera Packages . . . . . . . . . .32
Device Package Dimension Formats . . . . . . . . . . . . . . . . .32
Device Package Guide . . . . . . . . . . . . . . . . . . . . back cover
Altera Corporation
Advanced Packaging Solutions
With an increasing trend toward systems on a chip,
The popularity of ball-grid array (BGA) packages, along
programmable logic device (PLD) vendors must supply
with chip scale packages (CSP) and Flip Chip packages, is
increasingly complex products that meet new levels of
on the rise because they offer higher pin counts in sig-
I/O density and performance. To address these needs, PLD
nificantly less board area than QFP packages. Also, BGA
technology is advancing rapidly, allowing for more com-
packages are robust, provide improved manufacturability,
plex logic to be placed in an ever smaller die area. Today,
and have better thermal characteristics than most QFP
entire digital subsystems can be implemented on a single
packages.
PLD. As this trend toward system integration continues
Figure 2. IC Package Type Usage
to drive the need for higher I/O counts in less board area,
space-saving packaging technology is becoming a more
120
critical factor. With an offering of complex, high-performance device families based on its high-density FLEX®
Number of ICs (Billions)
100
and MAX® architectures, Altera has taken a leadership
role in packaging innovation for users of high-density
PLDs. These packaging solutions allow designers to fully
harness the power of programmable logic devices for
complex system integration.
80
60
40
20
Need for New Packaging Technologies
0
1980
As increased system integration continues to drive the
1985
1990
1995
2000
2005
trend toward higher pin counts, traditional packages such
BGA, Chip Scale Package
Plastic QFP
as quad flat pack (QFP) packages can no longer provide
Chip On Board
Pin-Grid Array
the required board area efficiency for devices requiring
Tape Automated Bonding
Dual In-Line Package
greater than 240 pins. As shown in Figure 1, almost
Surface Mount Technology
Source: Anam
50% of designs require more than 240 pins. The trend
toward higher pin count has led to
the emergence of new packages.
Figure 2 shows the growth and
Figure 1. Percentage of ASIC Design Starts by Pin Count
decline of various package types.
20
1996
1997
% of Designs
15
10
5
0
<4
4
45
-8
4
Source: Dataquest
2
85
-1
32
13
3-
19
19
5
6-
24
24
4
5-
30
30
4
5-
38
38
8
9-
45
45
6
7-
50
50
3
4-
59
59
6
7-
>7
73
1
31
Package Pins
Altera Corporation
Altera has taken a leadership position in providing
Emergence of BGA Packages
advanced BGA packaging solutions. With the FineLine
At the forefront of packaging technologies, BGA pack-
BGA™ package, Altera offers the most space-efficient and
ages have a distinct advantage in cost and ease of pro-
cost-effective packaging for high-pin-count devices in
duction (Figure 3). They are inexpensive and do not
the PLD industry. Figure 4 shows the various package
require any specialized manufacturing equipment. BGA
types with respect to package area and pin count.
packages are quickly becoming the most preferred packages for high-density PLD designs because they support
FineLine BGA Packaging
high pin counts, easy handling, and volume manufacturing. As a result, Altera has introduced numerous devices
Altera’s FineLine BGA strategy will provide a path for
in this package type.
support of future PLDs with pin counts in excess of
1,000 pins. FineLine BGA packages currently are available in 1.0-mm ball pitch, and in the future will be
Figure 3. Comparison of Packaging Solutions
offered in 0.8-mm and 0.5-mm ball pitch, supporting I/O
count and board area requirements for system-level inte-
Requires Specialized
Manufacturing Equipment
gration and the next generation of high-density PLDs.
Expensive
Number
of Pins
Altera’s Commitment
PGA
240
Altera is committed to offering its customers program-
Flip
Chip
CSP
BGA
mable logic solutions that are at the forefront of
technology. At Altera, one of our goals is to improve
QFP
your time-to-market with the latest technologies and
TQFP
PLCC
package options so that our devices can meet your
needs today and in the future.
Lead Density (Pins per Inch2)
Figure 4. FineLine BGA Package Efficiency
Thermally
Enhanced BGA
1.27-mm Pitch
2,250
Package Area (mm2)
2,000
600
(45 mm)
1,750
1,500
Thermally
Enhanced BGA
1.0-mm Pitch
660
(40 mm)
1,250
PQFP 240
1,000
250
480
(35 mm)
256
750
500
356
(35 mm)
208
484
(27 mm)
TQFP 144
256
100
(17 mm)
44
100
200
(27 mm)
300
FineLine BGA
0.8-mm Pitch
FineLine BGA
1.0-mm Pitch
1,225
(23 mm)
(27 mm)
729
(23 mm)
(21 mm)
400
(29 mm)
1,024
625
100 (11 mm) 289 (15 mm)
0
672
(17 mm)
400
500
600
700
800
900
1000
1100
1200
1300
Pin Count
Altera Corporation
3
Altera Package Migration
Figure 5 illustrates a cross-package migration example in
Vertical Migration Capability
Altera devices have been developed to offer maximum
design flexibility and ease of use. Package migration,
available in Altera’s MAX and FLEX product families,
allows users to move freely from one device to another
without the need to change board layout. This flexibility
enhances both ease of use and time-to-market. Vertical
which you start your design in a 100-pin FineLine BGA
and want the flexibility to move to a 256-pin FineLine
BGA for a higher I/O count in the future. Similarly, you
could start your design in the 256-pin FineLine BGA for
maximum prototyping flexibility and then choose to
migrate to the 100-pin FineLine BGA for lower cost.
Either way, the SameFrame pin-out provides a new level
migration allows you to move your design from one
of package migration flexibility.
density device to another density device in the same
package and pin count, enabling you to maintain the
same pin assignments while adding or removing logic
Figure 5. SameFrame Pin-out Example
requirements. The following pages contain actual-size
photographs with dimensions for each package, as well
as information on vertical migration. Table 1 below
shows sample information on vertical migration; all
devices that support vertical migration are highlighted
in a common color.
Printed Circuit Board
Designed for 256-Pin BGA Package
Cross-Package Migration with
SameFrame Pin-out
In addition to vertical migration, Altera’s FineLine BGA
100-Pin
FineLine
BGA
256-Pin
FineLine
BGA
100-Pin FineLine BGA Package
(Reduced I/O Count or
Logic Requirements)
256-Pin FineLine BGA Package
(Increased I/O Count or
Logic Requirements)
packages offer migration capability between packages
with different ball counts. Altera’s innovative
SameFrame™ pin-out makes this flexibility possible. With
SameFrame pin-out, the layout of balls is such that the
smaller ball-count packages form a footprint-compatible
subset of the larger packages. This layout of balls gives
you the benefit of migrating from one FineLine BGA
package to another without having to re-layout your
board. By laying out the board for the “worst case”
FineLine BGA ball count, the designer maintains the
flexibility to choose from any density or FineLine BGA
ball count before the design is finalized.
Table 1. Sample Vertical Migration Table
Package Type
MAX 7000A
FLEX 6000
FLEX 10KA
FLEX 10KE
256-Pin
FineLine BGA
EPM7128A
EPF6010A
EPF10K10A
EPF10K30E
EPM7256A
EPF6016A
EPF10K30A
EPF10K50E
EPM7384AE
EPF6024A
Vertical Migration
4
EPF10K100B
EPF10K100E
EPM7512AE
Vertical Migration
Vertical Migration
Altera Corporation
Faster Time-to-Market
Figure 6. Cross-Package Migration Example
Because the SameFrame pin-out allows a single PCB
layout to support multiple device density/package
combinations, you can now layout your board prior to
Power & Ground Pins
(256-Pin BGA Package)
final device selection. This increased flexibility allows
I/O & Configuration Pins
(256-Pin BGA Package)
you to concentrate on your design functionality rather
Common I/O & Configuration Pins
(100-Pin & 256-Pin BGA Packages)
than focus on fitting your design in a particular device
or package.
Common Power & Ground Pins
(All FineLine BGA Packages)
Dual Cost Savings
SameFrame pin-out allows you to start with a larger
device for prototyping flexibility and migrate to a lowerdensity, lower-cost device for volume production. You
Figure 6 illustrates how the innovative concentric ball
also have the option to migrate from a higher pin-count
layout is achieved with the new packaging. The power
package to a lower pin-count package to save even more.
and ground pins in yellow are common to all FineLine
BGA packages. With higher ball-count packages, more
Table 2 shows devices offered in FineLine BGA packages.
power and ground pins are present, these pins are located
Devices in the same color support cross-package
in each corner and are shown in green.
migration.
Design Migration Flexibility
You can increase device den-
Table 2. Altera Devices with SameFrame Pin-out
Devices
sity and/or I/O count without
re-laying out your board. This
density and I/O pin migration
capability gives you additional design flexibility beyond
what you can achieve with
vertical migration.
100-Pin
FineLine BGA
256-Pin
FineLine BGA
EPF10K10A
✔
EPF10K30A
✔
672-Pin
FineLine BGA
✔
EPF10K50A
✔
EPF10K100A
✔
EPF10K30E
✔
✔
EPF10K50E
✔
✔
EPF10K100B
✔
EPF10K100E
✔
✔
✔
EPF10K130E
✔
EPF10K200E
✔
EPF10K250E
✔
EPF6010A
✔
✔
EPF6016A
✔
✔
✔
EPF6024A
Altera Corporation
484-Pin
FineLine BGA
EPM7064A
✔
EPM7128A
✔
✔
EPM7256A
✔
✔
EPM7384A
✔
EPM7512A
✔
5
100-Pin FineLine BGA, 1.0-mm Ball Pitch
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale (Preliminary)
A1 Ball
Pad Corner
0.040
Typ.
(1.00)
0.425 (10.80)
Sq.
0.441 (11.20)
0.040
Typ.
(1.00)
Indicates
location of
Ball A1
0.040
Typ.
(1.00)
0.031
Typ.
(0.785)
A
B
0.019
(0.48)
C
Typ.
0.040
Typ.
(1.00)
D
E
F
G
H
J
K
10
9
8
7
6
5
4
3
2
1
0.073
(1.1)
Typ.
Note: Controlling measurement is in millimeters, shown in parentheses. Inch measurements are for reference only.
Supported Devices
Package Type
MAX 7000A
FLEX 6000
100-Pin
FineLine BGA
EPM7064AE
EPF6010A
EPM7128A
EPF6016A
EPM7256A
Note: Common color indicates pin migration. Within a given architecture, package migration across different FineLine BGA pin counts is also available.
6
Altera Corporation
256-Pin FineLine BGA, 1.0-mm Ball Pitch
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale (Preliminary)
A1 Ball
Pad Corner
0.661 (16.80)
Sq.
0.667 (17.20)
0.040
Typ.
(1.00)
0.040
Typ.
(1.00)
0.040
Typ.
(1.00)
0.031
Typ.
(0.785)
A
Indicates
location of
Ball A1
B
0.019
(0.48)
Typ.
0.073
(1.1)
Typ.
C
D
E
F
G
H
J
0.040
Typ.
(1.00)
K
L
M
N
P
R
T
16
15 14 13
12 11 10
9
8
7
6
5
4
3
2
1
Note: Controlling measurement is in millimeters, shown in parentheses. Inch measurements are for reference only.
Supported Devices
Package Type
MAX 7000A
FLEX 6000
FLEX 10KA
FLEX 10KE
256-Pin
FineLine BGA
EPM7128A
EPF6010A
EPF10K10A
EPF10K30E
EPM7256A
EPF6016A
EPF10K30A
EPF10K50E
EPM7384AE
EPF6024A
EPM7512AE
EPF10K100B
EPF10K100E
Note: Common color indicates pin migration. Within a given architecture, package migration across different FineLine BGA pin counts is also available.
Altera Corporation
7
484-Pin FineLine BGA, 1.0-mm Ball Pitch
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale (Preliminary)
A1 Ball
Pad Corner
0.898 (22.80)
Sq.
0.913 (23.20)
0.040
Typ.
(1.00)
Indicates
location of
Ball A1
0.040
Typ.
(1.00)
0.040
Typ.
(1.00)
0.031
Typ.
(0.785)
A
B
0.019
Typ.
(0.48)
C
D
E
F
G
H
J
K
L
M
N
P
0.040
Typ.
(1.00)
R
T
U
V
W
Y
AA
AB
22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7 6
5
4
3
2 1
0.073
Typ.
(1.86)
Note: Controlling measurement is in millimeters, shown in parentheses. Inch measurements are for reference only.
Supported Devices
Package Type
FLEX 10KA
FLEX 10KE
484-Pin
FineLine BGA
EPF10K30A
EPF10K30E
EPF10K50V
EPF10K50E
EPF10K100A
EPF10K100E
EPF10K130E
Note: Common color indicates pin migration. Within a given architecture, package migration across different FineLine BGA pin counts is also available.
8
Altera Corporation
672-Pin FineLine BGA, 1.0-mm Ball Pitch
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale (Preliminary)
1.056 (26.80)
Sq.
1.071 (27.20)
0.040
Typ.
(1.00)
0.080
Typ.
(2.00)
0.080
Typ.
(2.00)
A1 Ball
Pad Corner
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
Indicates
location of
Ball A1
0.060
(1.50)
Typ.
0.019
Typ.
(0.48)
0.040
Typ.
(1.00)
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0.073
Typ.
(1.86)
Note: Controlling measurement is in millimeters, shown in parentheses. Inch measurements are for reference only.
Supported Devices
Package Type
FLEX 10KE
672-Pin
FineLine BGA
EPF10K130E
EPF10K200E
EPF10K250E
Note: Common color indicates pin migration. Within a given architecture, package migration across different FineLine BGA pin counts is also available.
Altera Corporation
9
225-Pin BGA, 1.5-mm Ball Pitch
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
1.056 (26.80)
Sq.
1.071 (27.20)
0.94 (24.00)
0.97 (24.70)
0.118
Ref.
(3.00)
Sq.
0.0591
(1.50)
A
Indicates location
of Pin A1
B
0.024 (0.60)
0.035 (0.90)
C
D
E
F
G
H
J
K
L
M
N
P
R
15 14 13 12 11 10
0.32
Ref.
(8.05)
45° Chamfer
(4 Places)
9 8 7 6 5 4
3 2 1
0.039
Ref.
(1.0)
0.020 (0.50)
0.028 (0.70)
0.079 (2.00)
0.091 (2.30)
0.045 (1.15)
0.049 (1.25)
0.012 (0.31)
0.016 (0.41)
Note: Controlling measurement is in millimeters, shown in parentheses. Inch measurements are for reference only.
Supported Devices
Package Type
FLEX 8000
225-Pin BGA
EPF8820A
Note: Common color indicates pin migration.
10
Altera Corporation
256-Pin BGA, 1.27-mm Ball Pitch
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
1.056 (26.80)
Sq.
1.071 (27.20)
A1 Ball
Pad Corner
0.94 (24.00)
Sq.
0.97 (24.70)
0.32 Ref.
(8.05)
0.024 (0.60)
0.035 (0.90)
20
18
16
19
17
14
15
12
13
10
11
8
9
6
7
4
5
A1 Ball
Pad Corner
2
3
1
A
B
Indicates
location of
Pin A1
C
D
E
F
G
H
J
K
L
0.05
(1.27)
M
N
P
R
T
45º Chamfer
(all 4 corners)
0.057
Ref.
(1.44)
U
V
W
Y
0.057
Ref.
(1.44)
0.079 (2.00) 0.020 (0.50)
0.091 (2.30) 0.028 (0.70)
0.012 (0.31)
0.016 (0.41)
0.019
R.
(0.50)
(for 3 corners)
0.045 (1.15)
0.049 (1.25)
Note: Controlling measurement is in millimeters, shown in parentheses. Inch measurements are for reference only.
Supported Devices
Package Type
FLEX 6000
256-Pin BGA
EPF6016
EPF6024A
Note: Common color indicates pin migration.
Altera Corporation
11
356-Pin BGA, 1.27-mm Ball Pitch
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
1.38 ± 0.0039
(35.00 ± 0.10)
1.25 ± 0.0039
Sq.
(31.75 ± 0.10)
Sq.
26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9
8
7 6
5 4
3
2 1
A
B
C
D
E
F
G
0.030 ± 0.0059
Indicates
location
of pin A1
(0.75 ± 0.15)
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
0.034 ± 0.0024
0.059 ± 0.0051
(0.87 ± 0.06)
(1.50 ± 0.13)
0.050
(1.27)
0.025 ± 0.0028
(0.63 ± 0.07)
Note: Controlling measurement is in millimeters, shown in parentheses. Inch measurements are for reference only.
Supported Devices
Package Type
MAX 9000
FLEX 10K
FLEX 10KA
FLEX 10KE
356-Pin BGA
EPM9320
EPF10K30
EPF10K30A
EPF10K100E
EPM9320A
EPF10K50
EPF10K50V
EPM9560
EPF10K100A
EPM9560A
Note: Common color indicates pin migration.
12
Altera Corporation
600-Pin BGA, 1.27-mm Ball Pitch
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
1.768 (44.90)
Sq.
1.776 (45.10)
Ball Corner
35
Indicates
location of
Pin A1
34 32 30 28 26 24 22 20 18 16 14 12 10
8
33 31 29 27 25
23 21 19 17 15 13
11 9
0.024 (0.60)
0.035 (0.90)
0.065 (1.65)
0.076 (1.93)
0.043 (1.09)
0.048 (1.23)
6
7
4
5
A1 Ball
Pad Corner
2
3
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
1.696 (43.08)
Sq.
1.704 (43.28)
0.05 (1.27)
0.0220 (0.56)
0.0276 (0.70)
Seating Plane
Note: Controlling measurement is in millimeters, shown in parentheses. Inch measurements are for reference only.
Supported Devices
Package Type
FLEX 10KA
FLEX 10KE
600-Pin BGA
EPF10K100A
EPF10K200E
EPF10K130V
EPF10K250A
Note: Common color indicates pin migration.
Altera Corporation
13
32-Pin TQFP
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
Pin 1
0.012 (0.30)
0.018 (0.45)
0.002 (0.05)
0.006 (0.15)
Detail A
0.05
Max.
(1.2)
0.005 (0.135)
0.007 (0.180)
See Detail A
0.031
BSC
(0.80)
0.275
Sq.
(7.00)
0° – 7°
0.018 (0.45)
0.029 (0.75)
0.396
Ref.
(1.00)
0.354
Sq.
(9.00)
Note: Controlling measurement is in millimeters, shown in parentheses. Inch measurements are for reference only.
Supported Devices
Package Type
Configuration EPROM
32-Pin TQFP
EPC1064
EPC1064V
EPC1441
EPC2
Note: Common color indicates pin migration.
14
Altera Corporation
44-Pin TQFP
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
Pin 1
0.00197
Min.
(0.05)
0.0118 (0.30)
0.0158 (0.40)
0.05
Max.
(1.2)
Detail A
See Detail A
0.0035 (0.09)
0.0079 (0.20)
0.0315
BSC
(0.80)
0° – 7°
0.0180 (0.45)
0.0295 (0.75)
0.039
Ref.
(1.00)
0.390 (9.90)
Sq.
0.398 (10.10)
0.462 (11.75)
Sq.
0.482 (12.25)
Note: Controlling measurement is in millimeters, shown in parentheses. Inch measurements are for reference only.
Supported Devices
Package Type
MAX 7000
MAX 7000S
MAX 7000A
44-Pin TQFP
EPM7032
EPM7032S
EPM7032AE
EPM7032V
EPM7064S
EPM7064AE
EPM7064
Note: Common color indicates pin migration.
Altera Corporation
15
100-Pin TQFP
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
Indicates location
of Pin 1
0.0020 (0.05)
0.0059 (0.15)
Pin 1
0.050
Max.
(1.2)
0.0067 (0.17)
0.0106 (0.27)
Detail A
See Detail A
0.0035 (0.09)
0.0079 (0.20)
0° – 7°
0.0177 (0.45)
0.0295 (0.75)
0.0197
BSC
(0.50)
0.039
Ref.
(1.00)
0.531 (13.50)
0.571 (14.50) BSC Sq.
0.622 (15.80)
0.638 (16.20) BSC Sq.
Note: Controlling measurement is in millimeters, shown in parentheses. Inch measurements are for reference only.
Supported Devices
Package Type
MAX 7000S
MAX 7000A
FLEX 6000
FLEX 8000
FLEX 10KA
100-Pin TQFP
EPM7064S
EPM7064AE
EPF6010A
EPF8282A*
EPF10K10A
EPM7128S
EPM7128A
EPF6016A
EPF8282AV*
EPM7160S
EPM7256A
EPF8452A*
Note: Common color indicates pin migration.
* No vertical migration.
16
Altera Corporation
144-Pin TQFP
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
Indicates location
of Pin 1
0.0020 (0.05)
0.0059 (0.15)
Pin 1
0.063
Max.
(1.60)
0.0067 (0.17)
0.0106 (0.27)
Detail A
See Detail A
0.0035 (0.09)
0.0079 (0.20)
0° – 7°
0.0177 (0.45)
0.0295 (0.75)
0.0197
BSC
(0.50)
0.039
Ref.
(1.00)
0.787
BSC Sq.
(20.00)
0.866
BSC Sq.
(22.00)
Note: Controlling measurement is in millimeters, shown in parentheses. Inch measurements are for reference only.
Supported Devices
Package Type
MAX 7000A
FLEX 6000
FLEX 8000
FLEX 10K
FLEX 10KA
FLEX 10KE
144-Pin TQFP
EPM7128A
EPF6010A
EPF8820A
EPF10K10
EPF10K10A
EPF10K30E
EPM7256A
EPF6016
EPF10K20
EPF10K30A
EPF10K50E
EPM7384AE
EPF6016A
EPM7512AE
EPF6024A
Note: Common color indicates pin migration.
Altera Corporation
17
100-Pin PQFP
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
0.134
Max.
(3.40)
0.667 (16.95)
0.687 (17.44)
Pin 1
0.0098
Min.
(0.25)
See Detail A
Indicates location
of Pin 1
0.904 (22.95)
0.923 (23.45)
0.0087 (0.22)
0.0150 (0.38)
0.0256
BSC
(0.65)
0.783 (19.90)
0.791 (20.10)
Detail A
0° – 7°
0.0256 (0.65)
0.0374 (0.95)
0.547 (13.90)
0.555 (14.10)
Note: Controlling measurement is in millimeters, shown in parentheses. Inch measurements are for reference only.
Supported Devices
Package Type
MAX 7000
MAX 7000S
100-Pin PQFP
EPM7064
EPM7128S
EPM7096
EPM7160S
EPM7128E
EPM7160E
Note: Common color indicates pin migration.
18
Altera Corporation
160-Pin PQFP
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
0.160
Max.
(4.07)
Indicates location
of Pin 1
0.060
× 45°
(1.52)
0.010
Min.
(0.25)
0.0150
× 45° Chamfer
(0.38)
Typ. (3 Places)
Pin 1
See Detail A
0.009 (0.22)
0.015 (0.38)
Detail A
0.998
Ref.
(25.35)
0.0045
(0.1143)
0° – 8°
0.0250
Min.
(0.635)
0.020 (0.508)
0.030 (0.762)
0.0256
BSC
(0.65)
0.125 (3.17)
0.144 (3.67)
1.098 (27.90)
Sq.
1.106 (28.10)
1.219 (30.95)
Sq.
1.238 (31.45)
Note: Controlling measurement is in millimeters, shown in parentheses. Inch measurements are for reference only.
Supported Devices
Package Type
MAX 7000
MAX 7000S
FLEX 8000
160-Pin PQFP
EPM7128E
EPM7128S
EPF8452A*
EPM7160E
EPM7160S
EPF8636A*
EPM7192E
EPM7192S
EPF8820A*
EPM7256E
Note: Common color indicates pin migration.
* No pin migration.
Altera Corporation
19
208-Pin PQFP
Package Views at Actual Size
Top
Bottom
Package Dimensions at Scale
1.195 (30.35)
Sq.
1.215 (30.85)
0.060 × 45°
(1.52)
Pin 1
1.098 (27.90)
Sq.
1.106 (28.10)
Indicates location
of Pin 1
Side
0.161
(4.10) Max.
0.126 (3.20)
0.142 (3.60)
0.010
Min.
(0.25)
See Detail A
0.0067 (0.17)
0.0106 (0.27)
Detail A
0.0045
(0.1143)
0° – 7°
0.020 (0.50)
0.030 (0.75)
0.0197
BSC
(0.50)
0.016
(0.40) Min.
0.015 × 45° Chamfer
(0.38)
Typ. (3 Places)
Note: Controlling measurement is in millimeters, shown in parentheses. Inch measurements are for reference only.
Supported Devices
Package Type
MAX 7000S
MAX 7000A
FLEX 6000
FLEX 8000
FLEX 10K
FLEX 10KA
FLEX 10KE
208-Pin PQFP**
EPM7256S
EPM7256A
EPF6016
EPF8636A*
EPF10K10
EPF10K10A
EPF10K30E
EPM7384AE
EPF6016A
EPF8820A*
EPF10K30A
EPF10K50E
EPM7512AE
EPF6024A
EPF81188A*
EPF10K100B
EPF10K100E
Note: Common color indicates pin migration.
* No pin migration.
** Pin migration available with 208-Pin RQFP package. See page 21.
20
Altera Corporation
208-Pin RQFP
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
0.161 Max.
(4.10)
1.195 (30.35)
Sq.
1.215 (30.85)
1.098 (27.90)
Sq.
1.106 (28.10)
0.126 (3.20)
0.142 (3.60)
0.060
× 45°
(1.52)
Pin 1
0.010
Min.
(0.25)
See Detail A
Indicates location
of Pin 1
0.0067 (0.17)
0.0106 (0.27)
Detail A
Metal
Heat Sink
0.0045
(0.1143)
0.0197
BSC
(0.50)
0° – 8°
0.018 (0.46)
0.026 (0.66)
0.025
Min.
(0.635)
0.015 × 45° Chamfer
(0.38)
Typ. (3 Places)
Note: Controlling measurement is in millimeters, shown in parentheses. Inch measurements are for reference only.
Supported Devices
Package Type
MAX 7000E
MAX 7000S
MAX 9000
FLEX 8000
FLEX 10K
208-Pin RQFP**
EPM7256E
EPM7256S
EPM9320
EPF8820A
EPF10K20
EPM9320A
EPF10K30
EPM9400
EPF10K40
EPM9480
EPM9480A
EPM9560
EPM9560A
Note: Common color indicates pin migration.
** Pin migration available with 208-Pin PQFP package. See page 20.
Altera Corporation
21
240-Pin PQFP
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
0.161
Max.
(4.10)
1.352 (34.35)
Sq.
1.372 (34.85)
0.060 × 45°
(1.52)
0.130 (3.30)
0.138 (3.50)
1.256 (31.90)
Sq.
1.264 (32.10)
6.010
Min.
(0.25)
Pin 1
See Detail A
Indicates location
of Pin 1
0.0067 (0.17)
0.0106 (0.27)
Detail A
0° – 7°
0.0045
(0.1143)
0.0197
BSC
(0.50)
0.018 (0.46)
0.026 (0.66)
0.016
Min.
(0.40)
0.015 × 45° Chamber
(0.38)
Typ. (3 Places)
Note: Controlling measurement is in millimeters, shown in parentheses. Inch measurements are for reference only.
Supported Devices
Package Type
FLEX 6000
FLEX 8000
FLEX 10KA
FLEX 10KE
240-Pin PQFP**
EPF6016
EPF81188A
EPF10K30A
EPF10K50E
EPF6024A
EPF81500A
EPF10K100B
EPF10K100E
EPF10K130E
Note: Common color indicates pin migration.
** Pin migration available with 240-Pin RQFP package. See page 23.
22
Altera Corporation
240-Pin RQFP
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
0.161
Max.
(4.10)
1.352 (34.35)
Sq.
1.372 (34.85)
0.130 (3.30)
0.138 (3.50)
1.256 (31.90)
Sq.
1.264 (32.10)
0.060 × 45°
(1.52)
0.010
Min.
(0.25)
Indicates location
of Pin 1
Pin 1
See Detail A
0.0067 (0.17)
0.0106 (0.27)
Detail A
Metal
Heat Sink
0° – 8°
0.0045
(0.1143)
0.0197
BSC
(0.50)
0.018 (0.46)
0.026 (0.66)
0.016
Min.
(0.40)
0.015 × 45° Chamfer
(0.38)
Typ. (3 Places)
Note: Controlling measurement is in millimeters, shown in parentheses. Inch measurements are for reference only.
Supported Devices
Package Type
MAX 9000
FLEX 8000
FLEX 10K
FLEX 10KA
FLEX 10KE
240-Pin RQFP**
EPM9400
EPF81188A
EPF10K20
EPF10K50V
EPF10K200E
EPM9480
EPF81500A
EPF10K30
EPF10K100A
EPF10K250E
EPM9480A
EPF10K40
EPM9560
EPF10K50
EPM9560A
EPF10K70
Note: Common color indicates pin migration.
** Pin migration available with 240-Pin PQFP package. See page 22.
Altera Corporation
23
304-Pin RQFP
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
1.667 (42.35)
Sq.
1.687 (42.85)
1.571 (39.90)
Sq.
1.579 (40.10)
0.177
Max.
(4.50)
0.146 (3.70)
0.154 (3.90)
0.010
Min.
(0.25)
Indicates location
of Pin 1
Pin 1
See Detail A
0.0067 (0.17)
0.0106 (0.27)
Detail A
Metal
Heat Sink
0° – 7°
0.004 (0.09)
0.008 (0.20)
0.051
Ref.
(1.30)
0.0197
BSC
(0.50)
0.016
Min.
(0.40)
0.016 (0.40)
0.024 (0.60)
Note: Controlling measurement is in millimeters, shown in parentheses. Inch measurements are for reference only.
Supported Devices
Package Type
MAX 9000
FLEX 8000
304-Pin RQFP
EPM9560
EPF81500A
Note: Common color indicates pin migration.
24
Altera Corporation
20-Pin PLCC
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
Pin 1
0.045
× 45°
(1.14)
See Detail A
Detail A
0.042 (1.07)
0.048 (1.22)
0.013 (0.33)
0.021 (0.53)
0.026 (0.66)
0.032 (0.81)
0.350 (8.89)
Sq.
0.356 (9.04)
0.050
BSC
(1.27)
0.385 (9.78)
Sq.
0.395 (10.03)
0.010
Max.
(0.254)
0.290 (7.37)
0.320 (8.13)
0.090 (2.29)
0.120 (3.04)
0.020
Min.
(0.508)
0.025 (0.64)
R
0.040 (1.14)
0.165 (4.19)
0.180 (4.57)
Note: Controlling measurement is in inches. Millimeter measurements (shown in parentheses) are for reference only.
Supported Devices
Package Type
Configuration EPROM
20-Pin PLCC
EPC1064
EPC1064V
EPC1213
EPC1441
EPC1
EPC2
Note: Common color indicates pin migration.
Altera Corporation
25
44-Pin PLCC
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
Pin 1
0.045
× 45°
(1.14)
See Detail A
0.500
Ref.
(12.7)
Detail A
0.042 (1.07)
0.048 (1.22)
0.590 (14.99)
0.630 (16.00)
0.010
Max.
(0.254)
0.020
Min.
(0.508)
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
R
0.045 (1.14)
0.650 (16.51)
Sq.
0.656 (16.66)
0.050
BSC
(1.27)
0.026 (0.66)
0.032 (0.81)
0.020
Min.
(0.508)
0.090 (2.29)
0.120 (3.05)
0.685 (17.39)
Sq.
0.695 (17.65)
0.165 (4.19)
0.180 (4.57)
Note: Controlling measurement is in inches. Millimeter measurements (shown in parentheses) are for reference only.
Supported Devices
Package Type
MAX 7000
MAX 7000S
MAX 7000A
44-Pin PLCC
EPM7032
EPM7032S
EPM7032AE
EPM7032V
EPM7064S
EPM7064AE
EPM7064
Note: Common color indicates pin migration.
26
Altera Corporation
84-Pin PLCC
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
0.042 (1.07)
0.056 (1.42)
0.045
× 45°
(1.143)
See Detail A
0.042 (1.07)
0.048 (1.22)
Pin 1
Indicates relative
location of Pin 1
Detail A
1.090 (27.69)
1.130 (28.70)
0.010
Max.
(0.254)
0.020
Min.
(0.508)
0.025 (0.64)
R
0.045 (1.14)
0.013 (0.33)
0.021 (0.53)
0.050
BSC
(1.27)
1.150 (29.20)
Sq.
1.158 (29.41)
0.026 (0.660)
0.032 (0.813)
0.090 (2.29)
0.130 (3.30)
1.00
Ref.
(25.4)
1.185 (30.09)
Sq.
1.195 (30.35)
0.020
Min.
(0.508)
0.165 (4.19)
0.200 (5.08)
Note: Controlling measurement is in inches. Millimeter measurements (shown in parentheses) are for reference only.
Supported Devices
Package Type
MAX 7000
MAX 7000S
MAX 7000A
MAX 9000
FLEX 8000
FLEX 10K
84-Pin PLCC
EPM7064
EPM7064S
EPM7064AE
EPM9320
EPF8282A
EPF10K10
EPM7096
EPM7128S
EPM7128A
EPM9320A
EPF8452A
EPM7128E
EPM7160S
EPM9400*
EPF8636A
EPM7160E
Note: Common color indicates pin migration.
* No vertical migration.
Altera Corporation
27
8-Pin PDIP
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
0.300 (7.62)
0.325 (8.26)
0.360 (9.14)
0.380 (9.65)
0.100
BSC
(2.54)
0.130
(3.30)
0.170
Max.
(4.32)
0.240 (6.10)
0.260 (6.60)
Pin 1
0.027 (0.686)
0.037 (0.940)
0.015
Min.
(0.381)
0.055 (1.40)
0.065 (1.65)
0.016 (0.406)
0.020 (0.508)
0.125 (3.18)
0.135 (3.43)
0.008 (0.20)
0.012 (0.30)
0° – 15°
0.300
BSC
(7.62)
Note: Controlling measurement is in inches. Millimeter measurements (shown in parentheses) are for reference only.
Supported Devices
Package Type
Configuration EPROM
8-Pin PDIP
EPC1064
EPC1064V
EPC1213
EPC1441
EPC1
Note: Common color indicates pin migration.
28
Altera Corporation
403-Pin PGA
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
1.960 ± 0.019 Sq.
(49.78 ± 0.48)
1.800
(45.72)
AT
AP
AM
AK
AH
AF
AD
AB
Y
V
T
P
M
K
H
F
D
B
Indicates location
of Pin A1
Sq.
0.100
BSC
(2.54)
AU
AR
AN
AL
AJ
AG
AE
AC
AA
W
U
R
N
L
J
G
E
C
A
Indicates location
of Pin A1 (not a pin)
0.050 ± 0.005
(1.27 ± 0.127)
0.008 Typ.
(0.20)
0.050 Dia. Typ.
(1.27)
0.050
BSC
(1.27)
0.018 ± 0.002
Dia.
(0.46 ± 0.05)
Standoff
(4 Places)
0.090 ± 0.009
(2.29 ± 0.229)
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36
0.020 Rad. Typ.
(0.51)
(4 Places)
0.180 ± 0.010
(4.572 ± 0.254)
Note: Controlling measurement is in inches. Millimeter measurements (shown in parentheses) are for reference only.
Supported Devices
Package Type
FLEX 10K
403-Pin PGA
EPF10K50
Note: Common color indicates pin migration.
Altera Corporation
29
503-Pin PGA
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
2.260 ± 0.015
Sq.
(57.40 ± 0.381)
1.600 ± 0.012
Sq.
(40.64 ± 0.304)
2.100
Sq.
(53.34)
1.500 ± 0.010
Sq.
(38.10 ± 0.254)
1.095 ± 0.011
(27.81 ± 0.279)
Indicates location
of Pin A1 (not a pin)
0.180 ± 0.010
(4.572 ± 0.254)
BSC
0.050
(1.27)
BSC
0.145
Max.
(3.68)
0.050
Dia. Typ.
(1.27)
BC
BB
BA
AY
AW
AV
AU
AT
AR
AP
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
Indicates location
of Pin A1
0.100
(2.54)
0.018 ± 0.002
Dia.
(0.46 ± 0.051)
1.334 ± 0.014
(33.88 ± 3.56)
Standoff
(4 Places)
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42
0.020
Rad. Typ.
(0.51)
(4 Places)
0.038 (0.966)
0.048 (1.22)
0.050 ± 0.005
(1.27 ± 0.127)
0.008 ± 0.005
(0.20 ± 0.127)
Note: Controlling measurement is in inches. Millimeter measurements (shown in parentheses) are for reference only.
Supported Devices
Package Type
FLEX 10K
503-Pin PGA
EPF10K70
EPF10K100
Note: Common color indicates pin migration.
30
Altera Corporation
599-Pin PGA
Package Views at Actual Size
Top
Bottom
Side
Package Dimensions at Scale
2.46 ± 0.015
Sq.
(62.484 ± 0.381)
2.30
Sq.
(58.42)
1.6 ± 0.012
Sq.
(40.64 ± 0.3048)
1.5 ± 0.01
(38.1 ± 0.254)
1.015 ± 0.01
(25.781 ± 0.254)
Sq.
BG
BE
BC
BA
AW
AU
AR
AN
AL
AJ
AG
AE
AC
AA
W
U
R
N
L
J
G
E
C
A
Indicates
location of A1
(not a pin)
BF
BD
BB
AY
AV
AT
AP
AM
AK
AH
AF
AD
AB
Y
V
T
P
M
K
H
F
D
B
0.1
(2.54)
BSC
0.05
(1.27)
0.18 ± 0.01
(4.572 ± 0.254)
BSC
0.145
Max.
(3.683)
0.05
Dia. Typ.
(1.27)
0.018 ± 0.002
Dia.
(0.4572 ± 0.0508)
1.45 ± 0.015
(36.83 ± 0.381)
Standoff
(4 Places)
2
1
4
3
6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46
5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47
Indicates quadrant
containing location A1
0.04
BSC
(1.016)
0.05 ± 0.005
(1.27 ± 0.127)
0.008 ± 0.005
(0.2032 ± 0.127)
Note: Controlling measurement is in inches. Millimeter measurements (shown in parentheses) are for reference only.
Supported Devices
Package Type
FLEX 10KA
FLEX 10KE
599-Pin PGA
EPF10K130V
EPF10K200E
EPF10K250A
EPF10K250E
Note: Common color indicates pin migration.
Altera Corporation
31
Supported Devices for Other Altera Packages
PQFP
PGA
Package Type
MAX 7000A
Package Type
MAX 7000E
FLEX 8000
44-Pin PQFP
EPM7032AE
160-Pin PGA
EPM7192E
EPF8452A
Package Type
MAX 7000E
FLEX 8000
192-Pin PGA
EPM7256E
EPF8636A
PLCC
Package Type
MAX 7000
MAX 7000A
68-Pin PLCC
EPM7096
EPM7064AE
EPF8820A
Package Type
FLEX 8000
232-Pin PGA
EPF81188A
Package Type
MAX 9000
FLEX 8000
280-Pin PGA
EPM9320
EPF81500A
EPM9560
Note: Common color indicates pin migration.
Device Package Dimension Formats
Formats Used for Package Outline Dimensions
min. inches (min. millimeters)
max. inches (max. millimeters)
or
nominal inches ± tolerance
(nominal millimeters ± tolerance)
Abbreviations Used for Package Outline Dimensions
BSC
Basic. Represents theoretical exact dimensions or dimension target.
Min.
Minimum dimension specified.
Max.
Maximum dimension specified.
Ref.
Reference. Represents dimension for reference use only. This value
is not a device specification.
Typ.
Typical. Provided as a general value. This value is not a device
specification.
R
Radius. Represents curve dimension.
Dia.
Diameter. Represents curve dimension.
Sq.
Square. Indicates a square feature for a package with equal length
and width dimensions.
or
inches
BSC, Min., Max., Ref., Typ., R, Dia., Sq.
(millimeters)
Device Package Type
P:
L:
T:
Q:
R:
G:
B:
F:
32
Plastic dual in-line (PDIP)
Plastic J-lead chip carrier (PLCC)
Thin plastic quad flat pack (TQFP)
Plastic quad flat pack (PQFP)
Power quad flat pack (RQFP)
Ceramic pin-grid array (PGA)
Ball-grid array (BGA)
FineLine ball-grid array (FineLine BGA)
Altera Corporation
Device Package Guide
MAX 7000 Family
EPM7032/V/S/AE
EPM7032/V/S/AE
EPM7032AE
EPM7064/S/AE
EPM7064/S/AE
EPM7064AE
EPM7064/S/AE
EPM7064
EPM7064S/AE
EPM7064AE
EPM7096
EPM7096
EPM7096
EPM7128E/S/A
EPM7128E/S
EPM7128S/A
EPM7128A
EPM7128A
EPM7128E/S
EPM7128A
EPM7160E/S
EPM7160E/S
EPM7160S
EPM7160E/S
EPM7192E/S
EPM7192E
EPM7256A
EPM7256A
EPM7256E
EPM7256E
EPM7256S/A
EPM7256E/S
EPM7256A
EPM7256A
EPM7384AE
EPM7384AE
EPM7384AE
EPM7512AE
EPM7512AE
EPM7512AE
44-Pin PLCC
44-Pin TQFP
44-Pin PQFP
44-Pin PLCC
44-Pin TQFP
68-Pin PLCC
84-Pin PLCC
100-Pin PQFP
100-Pin TQFP
100-Pin FineLine
68-Pin PLCC
84-Pin PLCC
100-Pin PQFP
84-Pin PLCC
100-Pin PQFP
100-Pin TQFP
100-Pin FineLine
144-Pin TQFP
160-Pin PQFP
256-Pin FineLine
84-Pin PLCC
100-Pin PQFP
100-Pin TQFP
160-Pin PQFP
160-Pin PQFP
160-Pin PGA
100-Pin TQFP
144-Pin TQFP
160-Pin PQFP
192-Pin PGA
208-Pin PQFP
208-Pin RQFP
100-Pin FineLine
256-Pin FineLine
144-Pin TQFP
208-Pin PQFP
256-Pin FineLine
144-Pin TQFP
208-Pin PQFP
256-Pin FineLine
Page
BGA
BGA
BGA
BGA
BGA
BGA
BGA
26
15
32
26
15
32
27
18
16
6
32
27
18
27
18
16
6
17
19
7
27
18
16
19
19
32
16
17
19
32
20
21
6
7
17
20
7
17
20
7
MAX 9000 Family
EPM9320/A
EPM9320/A
EPM9320
EPM9320/A
EPM9400
EPM9400
EPM9400
EPM9480/A
EPM9480/A
EPM9560/A
EPM9560/A
EPM9560
EPM9560
EPM9560/A
84-Pin PLCC
208-Pin RQFP
280-Pin PGA
356-Pin BGA
84-Pin PLCC
208-Pin RQFP
240-Pin RQFP
208-Pin RQFP
240-Pin RQFP
208-Pin RQFP
240-Pin RQFP
280-Pin PGA
304-Pin RQFP
356-Pin BGA
Altera Offices
Altera Corporation
101 Innovation Drive
San Jose, CA 95134
Telephone: (408) 544-7000
http://www.altera.com
27
21
32
12
27
21
23
21
23
21
23
32
24
12
FLEX 6000 Family
EPF6010A
EPF6010A
EPF6010A
EPF6010A
EPF6016A
EPF6016A
EPF6016/A
EPF6016/A
EPF6016
EPF6016
EPF6016A
EPF6024A
EPF6024A
EPF6024A
EPF6024A
EPF6024A
Page
100-Pin
144-Pin
100-Pin
256-Pin
100-Pin
100-Pin
144-Pin
208-Pin
240-Pin
256-Pin
256-Pin
144-Pin
208-Pin
240-Pin
256-Pin
256-Pin
TQFP
TQFP
FineLine
FineLine
TQFP
FineLine
TQFP
PQFP
PQFP
BGA
FineLine
TQFP
PQFP
PQFP
BGA
FineLine
BGA
BGA
BGA
BGA
BGA
16
17
6
7
16
6
17
20
22
11
7
17
20
22
11
7
FLEX 8000 Family
EPF8282A
EPF8282A/AV
EPF8452A
EPF8452A
EPF8452A
EPF8452A
EPF8636A
EPF8636A
EPF8636A
EPF8636A
EPF8820A
EPF8820A
EPF8820A
EPF8820A
EPF8820A
EPF8820A
EPF81188A
EPF81188A
EPF81188A
EPF81188A
EPF81500A
EPF81500A
EPF81500A
EPF81500A
84-Pin PLCC
100-Pin TQFP
84-Pin PLCC
100-Pin TQFP
160-Pin PQFP
160-Pin PGA
84-Pin PLCC
160-Pin PQFP
192-Pin PGA
208-Pin PQFP
144-Pin TQFP
160-Pin PQFP
192-Pin PGA
208-Pin PQFP
208-Pin RQFP
225-Pin BGA
208-Pin PQFP
232-Pin PGA
240-Pin PQFP
240-Pin RQFP
240-Pin PQFP
240-Pin RQFP
280-Pin PGA
304-Pin RQFP
27
16
27
16
19
32
27
19
32
20
17
19
32
20
21
10
20
32
22
23
22
23
32
24
84-Pin PLCC
100-Pin TQFP
144-Pin TQFP
208-Pin PQFP
256-Pin FineLine BGA
144-Pin TQFP
208-Pin RQFP
240-Pin RQFP
144-Pin TQFP
208-Pin RQFP
208-Pin PQFP
27
16
17
20
7
17
21
23
17
21
20
FLEX10K Family
EPF10K10
EPF10K10A
EPF10K10/A
EPF10K10/A
EPF10K10A
EPF10K20
EPF10K20
EPF10K20
EPF10K30A/E
EPF10K30
EPF10K30A/E
Altera European Headquarters
Holmers Farm Way
High Wycombe
Buckinghamshire
HP12 4XF
United Kingdom
Telephone: (44) 1 494 602 000
Page
EPF10K30
EPF10K30A
EPF10K30A/E
EPF10K30/A
EPF10K30A/E
EPF10K40
EPF10K40
EPF10K50E
EPF10K50E
EPF10K50E
EPF10K50/V
EPF10K50E
EPF10K50/V
EPF10K50
EPF10K50V/E
EPF10K70
EPF10K70
EPF10K100B/E
EPF10K100B/E
EPF10K100A
EPF10K100B/E
EPF10K100A/E
EPF10K100A/E
EPF10K100
EPF10K100A
EPF10K130E
EPF10K130E
EPF10K130V
EPF10K130V
EPF10K130E
EPF10K200E
EPF10K200E
EPF10K200E
EPF10K200E
EPF10K250E
EPF10K250A/E
EPF10K250A
EPF10K250E
240-Pin
240-Pin
256-Pin
356-Pin
484-Pin
208-Pin
240-Pin
144-Pin
208-Pin
240-Pin
240-Pin
256-Pin
356-Pin
403-Pin
484-Pin
240-Pin
503-Pin
208-Pin
240-Pin
240-Pin
256-Pin
356-Pin
484-Pin
503-Pin
600-Pin
240-Pin
484-Pin
599-Pin
600-Pin
672-Pin
240-Pin
599-Pin
600-Pin
672-Pin
240-Pin
599-Pin
600-Pin
672-Pin
RQFP
PQFP
FineLine
BGA
FineLine
RQFP
RQFP
TQFP
PQFP
PQFP
RQFP
FineLine
BGA
PGA
FineLine
RQFP
PGA
PQFP
PQFP
RQFP
FineLine
BGA
FineLine
PGA
BGA
PQFP
FineLine
PGA
BGA
FineLine
RQFP
PGA
BGA
FineLine
RQFP
PGA
BGA
FineLine
BGA
BGA
BGA
BGA
BGA
BGA
BGA
BGA
BGA
BGA
23
22
7
12
8
21
23
17
20
22
23
7
12
29
8
23
30
20
22
23
7
12
8
30
13
22
8
31
13
9
23
31
13
9
23
31
13
9
Configuration EPROM Family
EPC1064/V
EPC1064/V
EPC1064/V
EPC1213
EPC1213
EPC1441
EPC1441
EPC1441
EPC1
EPC1
EPC2
EPC2
Altera Japan Ltd.
Shinjuku Mitsui Bldg. 36F
1-1, Nishi-Shinjuku, 2 Chome
Shinjuku-ku, Tokyo 163-0436
Japan
Telephone: (81) 3 3340 9480
http://www.altera.com/Japan
8-Pin PDIP
20-Pin PLCC
32-Pin TQFP
8-Pin PDIP
20-Pin PLCC
8-Pin PDIP
20-Pin PLCC
32-Pin TQFP
8-Pin PDIP
20-Pin PLCC
20-Pin PLCC
32-Pin TQFP
28
25
14
28
25
28
25
14
28
25
25
14
Altera International Ltd.
Suites 908-920, Tower 1
MetroPlaza
223 Hing Fong Road
Kwai Fong, New Territories
Hong Kong
Telephone: (852) 2487 2030
Copyright © 1998 Altera Corporation. Altera, FLEX, FLEX 10K, FLEX 10KA, FLEX 10KE, FLEX 8000, FLEX 6000, MAX, MAX 9000, MAX 9000A, MAX 7000, MAX 7000A, MAX 7000S,
FineLine BGA, SameFrame, and specific device designations are trademarks and/or service marks of Altera Corporation in the United States and other countries. Other brands or products are
trademarks of their respective holders. The specifications contained herein are subject to change without notice. All rights reserved.
M-GB-ALTERAPKG-01