22nd International Symposium on Plasma Chemistry July 5-10, 2015; Antwerp, Belgium Development of atmospheric pressure plasma polymerized nitrogen-rich (PPC:H:N) thin films K. Fricke, M. Levien, K.-D. Weltmann and M. Polak Leibniz Institute for Plasma Science and Technology (INP Greifswald e.V.), Greifswald, Germany Abstract: Polymer thin films, rich in functional moieties, were deposited from different nitrogen (N 2 ) and ethylene (C 2 H 4 ) gas mixtures using non-thermal atmospheric pressure jet plasmas. The obtained coatings were characterized by profilometry, X-ray photoelectron spectroscopy (XPS), and atomic force microscopy (AFM). Results revealed dense and uniform coatings with good stability in water. Keywords: atmospheric pressure, plasma jet, coating, surface analysis 1. Introduction Adjustable surface properties are essential for materials which are in contact with biological systems. Biological response depends on a large variety of parameters with the surface chemistry being considered as one of the most determining factor. In order to introduce a desired surface chemistry and morphology plasma-deposited functionalized organic layers are favoured for providing biocompatible surfaces. Especially, nitrogen-rich films are of interest in cell culture and tissue engineering. Atmospheric pressure plasma treatments with nitrogencontaining gases are successfully applied for surface functionalization and thin film deposition of cellcontacting materials [1-3]. In this study a non-thermal atmospheric pressure plasma jet was used for thin film deposition. This plasma jet allows gentle and local surface treatment of microstructures, including cavities, and complex three dimensional shapes. Gas mixtures of nitrogen and hydrogenous gases (e.g., acetylene and ethylene) enable the generation of nitrogen-functionalities into plasma-polymerized films [4-5]. Therefore, the objective of this paper was the development and characterization of nitrogen-bearing plasma polymerized hydrocarbon coatings (PPC:H:N) intended for biological applications. 2. Experimental The atmospheric pressure plasma jet used in this study consists of two ring electrodes around a quartz capillary (Fig. 1.). The upper electrode is capacitively coupled to the RF power generator (27.12 MHz) through a matching network while the bottom electrode is connected to the ground potential [6]. A ceramic capillary is placed in the centre of the quartz capillary which enabled the introduction of N 2 and C 2 H 4 in the discharge region. The process gas Argon (Ar) is flowing in the quartz capillary with a flow rate of 5 slm. Unless otherwise stated, coatings were prepared from mixtures of 500 sccm N 2 and 50 sccm C 2 H 4 at 30 W. The applied process parameters ensure surface temperatures below 100 °C P-III-6-17 (Fig. 1) which allows the treatment of heat-sensitive materials, too. Fig. 1. Left: Scheme of the plasma jet (flow of Ar through outer capillary, flow of C 2 H 4 /N 2 gas mixtures through inner capillary). Right: top) thermographic measurement of specimen during plasma treatment; bottom) PPC:H:N deposition pattern on silicon wafer after 180 s. Elemental compositions and chemical binding properties of deposited coatings were analysed by XPS (Axis Ultra, DLD detector, Kratos) using a monochromatic Al Kα source at 1486.6 eV (150 W). Chemical binding components were calculated by peak fit procedures of high-resolution C 1s spectra using Gaussian-Lorentzian distribution, Shirley baseline, and a FWHM of maximal 1.3 eV. For the determination of primary amino group density chemical derivatization with 4-trifluoromethyl-benzaldehyde (TFBA) in a saturated gas phase at 40°C for 2 h, accompanied by XPS quantification, was implemented. Surface topography 1 was examined with a scanning probe microscope diCP-II (Veeco, USA) in the non-contact mode. Five AFM-images with a scanning region of 10 x 10 µm2 were recorded on each sample to evaluate the averaged roughness R a of PPC:H:N coatings (SPMLab Ver. 6.0.2.,Veeco). Surface profiles were measured by using a surface profiler (Dektak 3ST, Veeco). 3. Results and Discussion Process parameters such as RF power, jet-nozzle to substrate distance, and gas flow rate affect the coating thickness and hence, the deposition rate. For instance, film thickness was found to be dependent on precursor flow rate. Fig. 2 shows the evolution of the coating thickness as a function of C 2 H 4 flow rate. Fig. 2. Coating thickness as a function of C 2 H 4 flow rate (n = 8, deposition time: 10 min). The results revealed an increase in film thickness with rising precursor flow rate. Deposition rates were calculated by measuring surface profiles of the deposits by profilometry. The ring shaped deposition pattern results in a parabolic profile peaking at the centre. Deduced from the surface profiles, deposition rates of 0.2 nm s-1 for a precursor flow rate of 10 sccm up to 3.8 nm s-1 for 50 sccm C 2 H 4 were obtained. However, representative AFM images and height profiles of the films deposited on silicon wafers as a function of treatment time are presented in Fig. 3. After 3 min a smooth and dense film can be observed. Distinct changes in surface topography appeared after 5 min. The AFM micrograph displays the formation of randomly distributed particles of up to 75 nm in height and 600 nm in width (see height profile in Fig. 3). Further plasma processing resulted in the formation of clusters with a typical size between 100 and 1000 nm. Hence, the number and dimension of spherical particles formed on the films surface is strongly related to the deposition time. A consequence of these surface features is the alteration in surface roughness. 2 Fig. 3. Surface topography of deposited PPC:H:N films after 3, 5, and 10 min (10 x 10 µm2). White dashed lines indicate the position where height profiles were extracted. The calculated averaged roughness of PPC:H:N films deposited after 3, 5, and 10 min was 2 nm, 15 nm, and 122 nm, respectively. The corresponding surface profiles yielded film thicknesses of 0.4 µm, 0.7 µm, and 2.3 µm. In summary, coatings with a thickness above 1 µm were found to exhibit a strongly featured surface with large clusters (micrometre sized). Chemical composition of PPC:H:N coatings was examined by XPS. The relative atomic concentration (at.%) of the elements detected is listed in Table 1. Results revealed a nitrogen-rich carbon film with a small amount of oxygen. The presence of oxygen on the P-III-6-17 surface is inherently due to operation in ambient air and post-oxidation of residual free radicals on the surface [7]. (USB) in Milli-Q water for 5 min. Inset figure: C 1s peak fit of a freshly deposited PPC:H:N film. Table 1. Elemental surface composition (in at.%) of PPC:H:N as deposited and after ultrasonic agitation (USB) in Milli-Q water for 5 min. Amino group density (NH 2 /C) in % was calculated after derivatization. (n = 5). In particular, component C1 which is assigned to C–C and various C–H bonds, C2 corresponding to amines (C-N), C3 which is attributed to imines/nitriles/hydroxyl groups (C=N, C≡N, C-O), and C4 indicating the presence of imide/ketones/aldehydes (N-C=O, C=O). Fig. 4 shows the relative contributions of each bond type determined for a freshly deposited film and after 5 min ultrasonic treatment. It was found that component C1 was increased while components C3 and C4 were decreased. The contribution of C-N bonds (C2) remained unchanged. As deposited After USB for 5 min C 73 ± 2 76 ± 1 N 18 ± 2 16 ± 1 O NH 2 /C 9 ± 1 3.5 ± 0.2 8 ± 1 3.1 ± 0.1 Bonding components in C 1s / % Furthermore, XPS elemental analyses showed closed pinhole-free films since no Si signal of the subsurface was detected in any case. Stability and solubility of PPC:H:N coating on Si wafer was examined by ultrasonic agitation in Milli-Q water for 5 min. Corresponding XPS-data are listed in Table 1. Comparing XPS spectra before and after ultrasonic bath showed only slight alterations, namely N and O portions were reduced by 2 at.% and 1 at.%, respectively. The most likely explanation is the removal of weakly bonded molecules by washing. Accompanied analysis of surface profile revealed a thickness of 450 ± 30 nm for the freshly deposited film and 430 ± 20 nm after ultrasonic treatment. Please note: the difference of 20 nm is within the error margin of 10%. Hence, no delamination of the studied coatings was observed. Also summarized in Table 1 is the relative concentration of primary amino groups based on derivatization reactions. According to the decreased N portion, a slight reduction in primary amino groups occurred after ultrasonic bath. Additionally, there was little or no apparent change in the concentrations after immersion of the coatings for 24 h (data not shown). High-resolution XPS C1s spectra verify the existence of different bonding components (inset Fig. 4). As deposited 60 After USB for 5 min 50 40 30 20 10 0 C1 C2 C3 C4 Fig. 4. Comparison of carbon-based functional chemical groups determined by peak fitting of high-resolution C 1s spectra after film deposition and after ultrasonic agitation P-III-6-17 4. Summary Polymer-like coatings were deposited from ethylene/nitrogen mixtures by using an atmospheric pressure plasma jet. Depending on the precursor flow rate, deposition rates of up to ~ 4 nm s-1 were achieved. Surface roughness of the deposits is determined by the treatment time and thus, film thickness. Prolonged plasma treatment (> 3 min) led to particle formation on the surface. The elemental surface composition of PPC:H:N coatings, analysed by XPS, revealed high portion of nitrogen as well as small amounts of oxygen. Water solubility and wash stability was evaluated by ultrasonic treatment. PPC:H:N films were found to be largely resistant against agitation. Overall, neither hydrolysis (no uptake of oxygen) nor delamination was observed. In a nutshell, the PPC:H:N coatings presented here might be highly suitable for biomedical applications. 5. Acknowledgments This work was supported by the Ministry of Economics of the Federal State Mecklenburg Vorpommern (grant no. V-630-00INP-20144/018). 6. References [1] C.P. Klages and A. Grishin. Plasma Process. Polymers, 5, 4 (2008) [2] C. Sarra-Bournet, S. Turgeon, D. Mantovani and G. Laroche. J. Phys. D-Appl. Phys., 39, 16 (2006) [3] M. Thomas, M. Eichler, K. Lachmann, J. Borris, A. Hinze and C.-P. Klages. in: Atmospheric Pressure Plasma Treatment of Polymers: Relevance to Adhesion. (M. Thomas and K.L. Mittal; Eds.) (Chichester: John Wiley & Sons) doi: 10.1002/9781118747308.ch9 (2013) [4] P. Heyse, R. Dams, S. Paulussen, K. Houthoofd, K. Janssen, P.A. Jacobs and B.F. Sels. Plasma Process. Polymers, 4, 2 (2007) [5] P.L. Girard-Lauriault, P. Desjardins, W.E.S. Unger, A. Lippitz and M.R. Wertheimer. Plasma Process. Polymers, 5, 7 (2008) [6] J. Schäfer, R. Foest, A. Quade, A. Ohl and K.D. Weltmann. J. Phys. D-Appl. Phys., 41, 19 (2008) 3 [7] 4 J. Friedrich The Plasma Chemistry of Polymer Surfaces - Advanced Techniques for Surface Design. (Weinheim: Wiley-VCH Verlag GmbH) (2012) P-III-6-17
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