22nd International Symposium on Plasma Chemistry July 5-10, 2015; Antwerp, Belgium Synthesis of TiO 2 porous films by atmospheric dielectric barrier discharge plasma at room temperature Q. Chen1, J. Mertens1, J. Hubert1, J. Baneton1, Q.R. Liu1, G. Wallaert2, M.-P. Delplancke2 and F. Reniers1 1 Analytical and Interfacial Chemistry (CHANI), Faculty of Sciences, Université Libre de Bruxelles, Avenue F.D. Roosevelt 50, 1050 Brussels, Belgium 2 4MAT, Faculty of Applied Sciences, Université Libre de Bruxelles, Avenue F.D. Roosevelt 50, 1050 Brussels, Belgium Abstract: TiO 2 films were synthesized by atmospheric dielectric barrier discharge (DBD) plasma at room temperature. The morphology and chemical composition of TiO 2 films were studied by scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). Effect of the oxygen ratio and deposition time was investigated. It is showed that the content of O 2 is an important parameter in the formation of a porous structure. The study of the deposition time could lead to the understanding of the mechanisms of nucleation and growth of TiO 2 nanoparticles in the plasma and formation of films on the substrate. Keywords: atmospheric plasma, dielectric barrier discharge, TiO 2 porous films 1. Introduction Titanium oxide (TiO 2 ) thin films are one of the most important materials in optical, electronic and chemical fields for various applications like photo-anode layers, antireflection coatings, hydrophilic films and photocatalytic materials [1–3]. Plasma enhanced chemical vapor deposition (PECVD) is a highly efficient method for TiO 2 films synthesis but often requires sophisticated discharge, high temperature and vacuum conditions [2]. In order to mitigate the drawbacks, atmospheric plasmas have been investigated as an alternative approach and interesting results have been achieved in synthesizing and functionalizing specific nanomaterials [4–7]. Atmospheric plasma such as dielectric barrier discharge (DBD) plasma has become one of the most promising “next generation” candidate systems for replacing high temperature vacuum CVD or wet chemical processes [5, 6]. In this study, TiO 2 porous film was synthesized by using atmospheric DBD plasma at room temperature. 2. Experimental A scheme of the DBD device for TiO 2 films synthesis used in this work is shown in Figure 1. It consists of two flat circular copper electrodes both covered by alumina as dielectrics. The distance between both dielectrics is kept constant at 3 mm for all the experiments. The plasma is generated by an AC power supply (AFS G10S-V), connected to a high voltage transformer (AFS GT10S-V1K) operating at 2700 Hz. In order to prevent air contamination, the reactor is pumped down to a pressure of 0.05 Torr before and after each deposition. The reactor is then filled up with argon until atmospheric pressure is reached. A continuous gas flow is maintained into the reactor during the experiments. The TTIP precursor, heated at 373K, is evaporated by a 0.3 slm argon flow and then mixed with argon and oxygen to obtain a total flow P-III-6-10 of 2.5 slm. The vaporized TTIP is then carried into the discharge through a stainless steel wire heated at 333K in order to prevent any condensation inside the tube. The mass flow rate of the evaporated precursor is 19.5 mg/min which is calculated by weighing of the TTIP in the bubbler before and after the deposition. Influence of oxygen content is studied by changing the O 2 flow while keeping the total flow rate at 2.5 slm. The ratio between carrier gas and O 2 flows is marked as R Ar/O2 . The morphology and the chemical composition of TiO 2 films are investigated by scanning electron microscopy (SEM) and X-Ray photoelectron spectroscopy (XPS) respectively. Flow controllers O2 Ar TTIP bubbler Power supply & transformer Heated wire Oil bath (373 K) Grounded electrode Figure 1. Scheme of the DBD deposition setup. 3. Results Figure 2 shows SEM images of the product collected on the silicon wafer for different R Ar/O2 . When the R Ar/O2 is 3, a smooth film of TiO 2 homogeneous nanoparticles with an average size of 20 nm is obtained. As the R Ar/O2 decreases from 3 to 1, some porosity appears without any change in the morphology of the nanoparticles. These observations suggest that the addition of oxygen in the plasma has an impact on the organization of the film. 1 Same results have been noticed by A. Shelemin [8] with N 2 /O 2 system where oxygen may act as a scavenger to remove a part of the organic phase. Besides, the presence of O 2 induces the formation of a filamentary discharge, which will be enhanced as O 2 increased. The strong effect among the filamentary and nanoparticles may be an explanation for the formation of porous structural TiO 2 film. time is increasing could be explained by electrostatic repulsions between nanoparticles [5]. Figure 2. SEM images of TiO 2 films prepared by atmospheric pressure DBD with different ratios of Ar/O 2 : (a) R Ar/O2 = 3, (b) R Ar/O2 = 2 and (c) R Ar/O2 = 1. Discharge power 40 W, t = 5 min. Figure 4. XPS spectra of TiO 2 film prepared by atmospheric pressure DBD. Discharge power 40 W, R Ar/O2 = 2, t = 5 min. Figure 3. SEM images of TiO 2 films prepared by atmospheric pressure DBD with different deposition times: (a) t = 10 min and (b) t = 15 min. Discharge power 40 W, R Ar/O2 = 2. The effect of deposition time on the morphology of the film is shown on the SEM images in Figure 3. In contrast with Figure 2(b), we can see that when increasing deposition duration, the film growth from several layers of particles to a porous structure. This finding suggests that the nanoparticles of TiO 2 rather appear in the discharge volume and then deposit onto the substrates as ready-made granules. This process could be dependent of the ratio between TTIP/O 2 /electrons in the plasma [6, 9]. Once in the plasma, the TTIP precursor is excited by the highly energetic species like electrons and metastables species. This could lead to the formation of radicals or ions. When the active species collide and react with each other, some homogeneous reactions such as nucleaction of Ti(O) 4 happen in the bulk of the plasma [8], then they will transform to the TiO 2 nanoparticles and accumulate on the coating. The formation of a porous structure as the 2 TiO 2 synthesized films have also been characterized by XPS. Results are presented in Figure 4. The peaks positions are referenced with respect to carbon (C 1s) at 285.0 eV. As it can be seen on the XPS survey scan (Figure 4a), it is confirmed that the deposited films are only composed of Ti, O, and residual C. The high resolution XPS spectra of Ti 2p, O 1s, and C 1s are shown in Figures 4b–d. The Ti 2p 3/2 peak at 458.3 eV and Ti 2p 1/2 peak at 464.0 eV present a energy gap of 5.7 eV which can be attributed to Ti4+ from TiO 2 [4, 10]. The O 1s spectrum (Figure 4c) is deconvoluted into three peaks. The peak at 529.8 eV is assigned to the lattice oxygen (O2-) of TiO 2 . The two other O 1s peaks correspond to OH surface groups (531.5 eV) and C-O bonded species (532.6 eV) [10]. The C 1s signal (Figure 4d) is deconvoluted into four components, which corresponds to C-C/C-H, C-O, C=O and O-C=O, respectively [8]. 4. Acknowledgements The authors would like to thank the China Scholarship P-III-6-10 Council (CSC, Grant no. 201407040053) for a PhD scholarship and the Belgian Federal Government IAP PSI (physical chemistry of plasma surface interactions) P6-08 network for their financial support. 5. References [1] X. Chen, A. Selloni, Chemical Review, 114 (19), 9281–9282 (2014) [2] A. Zhu, L. Nie, Q. Wu, X. Zhang, X. Yang, Y. Xu, C. Shi, Chemical Vapor Deposition, 13(4), 141–144 (2007) [3] W. Liu, Y. Lai, Surface and Coatings Technology 206(5), 959–962 (2011) [4] H. K. Seo, C. Elliott, H. Shin. ACS Applied Materials and Interfaces, 2(12), 3397–3400 (2010) [5] P. Attri, B. Arora, E. Choi, RSC Advances, 3(31), 12540–12567 (2013) [6] J. Zheng, R. Yang, L. Xie, J. Qu, Y. Liu, X. Li, Advanced Materials, 22(13), 1451–1473 (2010) [7] D. Merche, N. Vandencasteele, F. Reniers, Thin Solid Films, 520, 4219–4236 (2012) [8] A. Shelemin, A. Choukourov, J. Kousal, D. Slav, H. 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