22nd International Symposium on Plasma Chemistry July 5-10, 2015; Antwerp, Belgium Novel reaction path in discharge induced reduction of oxidized metal catalyst D.H. Lee1, T. Kim2, S. Jo2, S.H. Pyun2, K.-T. Kim2 and Y.-H. Song2 1 2 KIMM Industrial Plasma Laboratory, Daejeon, South Korea Chosun University Department of Aerospace Engineering, Gwangju, South Korea Abstract: Reduction of metal oxide catalyst under discharge condition is compared to that of typical thermal reduction process. Discharge produces reactive primary radicals that are crucial in forming excited intermediate species by Eely-Rideal type reaction path. This kind of excited species easily desorbs without further reaction with surface hydrogen and this process is essential in avoiding rate determining step (water desorption) in thermal reduction. Emission spectroscopy reveals the evidence of this novel reaction path. Resultantly, plasma reduction process can much lower the active temperature window and rate of the reduction process compared to typical thermal reduction process. Keywords: discharge, reduction, metal oxide, catalyst, reaction path 1. Introduction Plasma catalysis has been drawing attention for the reason of possible synergistic effect of low temperature activation by plasma and high selectivity of catalyst. However, most of the previous works are focused on the oxidation process such as plasma catalysis for the removal of VOC and fluoro-compound [1-6]. Oxidation by plasma catalysis is mainly a process that utilize discharge generated oxygen species or ozone. But the processes using ozone are limited in their use because of the temperature condition of ozone decomposition. This work introduces reduction process of metal oxide. Oxidation is one of the reasons for catalyst deactivation and typically the oxygen is removed by hydrogen stream in high temperature condition. Lowering the temperature of reduction and reducing time required for the reduction is essential in protecting a catalyst from sintering or permanent deactivation. This work probes reaction mechanism of accelerated reduction by plasma. 2. Experiment Cu/ZnO/γ-Al 2 O 3 catalyst was prepared for the experiment by wet impregnation process. ZnO was used as a stabilizer for Cu (Cu:Zn = 3:7) after sintering at 350 °C for 3 hrs. Cu was fully oxidized to CuO at 300 °C for 2 hrs. Catalysts are coated on 1 mm alumina bead. Using the prepared catalyst, pack-bed reactor configuration as shown in Fig. 1 was constructed for the experiment. AC high voltage transformer delivers peak voltage of 7 kV with frequency of 1 kHz. Spectral measurement was done with the monochromator with resolution of 0.045 nm and grating of 1200 lines/nm. The temperature rise inside the pack bed reactor was measured by inserting thermocouple into the catalyst soon after the discharge was finished and showed about 3 degrees and the temperature rise by discharge itself did not affect the overall reaction. P-II-8-16 Fig. 1. Schematic of overall experimental apparatus including optical emission spectroscopy. 3. Results The effect of plasma reduction was evaluated based on the comparison with that of thermal reduction. Firstly, physical aspects of results from both the methods were compared. Possible structural modification such as lattice structure or pore configuration were evaluated. XRD results after reduction showed the same pattern of Cu peak that means both the method produces the same Cu phase. BET results for both the catalysts reduced thermally and under discharge showed almost the same value for surface area and pore volume (Table 1). Pore size and distribution also showed the same physical configuration in the two conditions. All of the results mean plasma reduction does not induce any structural and morphological change of catalyst during the reduction process. 1 Table 1. BET results of oxidized and reduced (by thermal and plasma) state catalyst. Surface area (m2∙g−1) Pore volume (cm3∙g−1) Pore diameter (nm) CuO Cu (Thermal) Cu (Plasma) 122.5475 138.2244 135.7695 0.30303 0.356134 0.354411 9.89102 10.30597 10.44157 The rate of hydrogen consumption and time required for the full reduction in thermal and plasma reduction are compared in Fig. 2. Reduction under discharge showed much lowered temperature window of reduction and much faster conversion of hydrogen. Lower limit of reduction is lowered about 50 degree and time for total reduction is reduced about half of that in thermal reduction. Fig. 2. Comparison of hydrogen conversion rate and time for full reduction in thermal and plasma reduction. Discharge in oxidized state and reduced state showed much different behaviour. In reduced state, the catalyst particles are not interconnected and do not show bulk electrical conductivity. However, once discharge is hosted, dispersed metal particles (catalyst) on the alumina bead rapidly re-distribute the accumulated surface charge around a streamer preventing generation of strong streamers. Meanwhile, oxidized state of catalyst forms dielectric layer and the discharge on oxidized state of catalyst becomes similar to typical dielectric barrier discharge [7, 8]. The catalyst contributes accumulation of surface charge and following generation of strong streamers. As a result, discharge fluorescence in reduced and oxidized states showed much different appearance as shown in Fig. 3. Strong fluorescence around the catalyst bead implies active generation of collision generated species. In this case of reduction process, the discharge around the bead was revealed to be effective in generating hydrogen radical that is crucial in subsequent reduction process [9]. Optical emission spectroscopy (OES) results clearly 2 showed the existence of hydrogen radicals (Fig. 4) [10, 11]. Fig. 3. Comparison of fluorescence in oxidized state (left) and reduced state (right) in the single bead discharge experiment. Fig. 4. Hα and Hβ line in OES data showing existence of gas phase H radicals. What is interest in OES results was the existence of OH band (OH [AX]). In comparison of OES data for oxidized state and reduced state, only in the result of oxidized state showed the clear existence of OH radical as shown in Fig. 4 [12, 13]. Only the source of ‘O’ in this reaction system is lattice O in oxidized catalyst. The result implies that OH is produced by lattice O and H radical. In typical adsorption process, adsorbed species lose their excessive energy in the course of adsorption and rapidly governed by surface equilibrium condition. Under the equilibrium condition, adsorbed H does not have enough energy to desorb but reacts with lattice O that also does not have enough energy for desorption and follows successive surface reaction to form adsorbed state of H 2 O. Because of this, the result that gas phase OH was detected by OES (Fig. 5) implies that surface OH is not formed by typical adsorption process (Langmuir-Hinshelwood reaction) but by Eley-Rideal type reaction. In the case of E-R type reaction, especially where energetic hydrogen radical is involved, reaction product can temporarily have energy enough to desorb from the surface. In this case, formation P-II-8-16 Intensity (a.u.) of water should be in the form of gas phase reaction between the OH and H radical. OH [A X] CuO Cu 290 300 310 Time (ns) 320 330 Fig. 5. OES data showing OH in gas phase or desorbed OH in the case of oxidized state. Based on the above information, novel reaction path for the reduction under discharge can be proposed. Typical thermal reduction process follows the process (1)-(7) below. Here, Eqn. (4) and (5) are active in high temperature condition of above 300 °C with sufficiently supplied hydrogen [14, 15]: H 2(g) H 2(ad) H 2(ad) H (ad) + H (ad) CuO + H (ad) Cu + OH (ad) Cu + CuO Cu 2 O Cu 2 O + H (ad) 2Cu + OH (ad) OH (ad) + H (ad) H 2 O (ad) H 2 O (ad) H 2 O (g) (7) (1) (2) (3) (4) (5) (6) What is different under the discharge environment is 1) primary radicals before molecular adsorption, 2) Formation of intermediate OH, 3) desorption of surface OH, and 4) gas phase reaction of HO and H with the condition 1), H 2(g) + e H (g) + H (g) + e (8) H 2(g) + e H2∗ (g) + e R (9) Actually, the H radicals participate Eley-Rideal type reaction with surface O as in Eqn. (10) and (11) (condition 2) CuO + H (g) Cu + OH (ad) (10) Cu 2 O + H (g) 2Cu + OH (ad) (11) Desorption and gas phase reaction of OH can be expressed as in Eqn. (12) and (13) P-II-8-16 (12) OH (ad) OH (g) (13) OH (g) + H (g) H 2 O (g) Generation of hydrogen radical is not governed by thermal equilibrium but depends on the energy of the electron. And because the desorption of surface water by reaction in Eqn. (7) is rate determining step in typical thermal reduction, removal of reaction (7) by gas phase water formation can clearly accelerate the overall reduction process as shown in Fig. 2 [16, 17]. 4. Conclusion Reduction process for oxidized metal catalyst was investigated. Reduction was done both thermally and under discharge. A reduction process under discharge showed much accelerated reduction rate and lowered temperature of active reduction. This work introduced the mechanism to explain the accelerated reduction by presence of discharge. Discharge generates novel reaction path that includes 1) production of hydrogen radical before adsorption of hydrogen molecule, 2) increased Eley-Rideal type reaction for the generation of surface OH, 3) desorption of intermediate HO, and 4) subsequent gas phase reaction of OH and H to produce H 2 O. The role of discharge is essential in accelerating and activating the process. The results prove that a plasma catalysis can be a powerful tool that can overcome the equilibrium condition or limitation of thermally driven reaction. 5.References [1] J. Van Durme, J. Dewulf, C. Leys and H. Van Langenhove. Appl. Catal. B, 78, 324-333 (2008) [2] H.L. Chen, H.M. Lee, S.H. Chen, Y. Chao and M.B. Chang. Appl. Catal. B, 85, 1-9 (2008) [3] J.C. Whitehead. Pure Appl. Chem., 82, 1329-1336 (2010) [4] W.H. Weinberg. Acc. Chem. Res., 29, 479-487 (1996) [5] H.-H. Kim, Y.-H. Lee, A. Ogata and S. Futamura. Catal. Commun., 4, 347-351 (2003) [6] U. Roland, F. Holzer and F.D. Kopinke. Appl. Catal. B, 58, 217-226 (2005) [7] S. Jo, T. Kim, D.H. Lee, W.S. Kang and Y.-H. Song. Plasma Chem. Plasma Process., 34, 175-186 (2014) [8] C. Hudon, R. Bartnikas and M.R. Wertheimer. IEEE Trans. Electr. Insul., 28, 1-8 (1993) [9] H. Inui, K. Takeda, H. Kondo, K. Ishikawa, M. Sekine, H. Kano, N. Yoshida and M. Hori. Appl. Phys. Express, 3, 126101 (2010) [10] F. Bourg, S. Pellerin, D. Morvan, J. Amourouxand J. Chapelle. J. Phys. D: Appl. Phys., 35, 2281-2290 (2002) [11] T. Vandevelde, T.D. Wu, C. Quaeyhaegens, J. Vlekken, M. D'Olieslaeger and L. Stals. Thin Solid Films, 340, 159-163 (1999) 3 [12] S. Pellerin, J.M. Cormier, F. Richard, K. Musiol and J. Chapelle. J. Phys. D: Appl Phys., 29, 726-739 (1996) [13] A. Sarani, A.Y. Nikiforov and C. Leys. Phys. Plasma, 17, 063504-063512 (2010) [14] J.A. Rodrigues, J.Y. Kim, J.C. Hanson, M. Perez and A.I. Frenkel. Catal. Lett., 85, 247-254 (2003) [15] J.Y. Kim, J.A. Rodrigues, J.C. Hanson, A.I. Frenkel and P.L. Lee. J. Am. Chem. Soc., 125, 10684-10692 (2003) [16] D. Ciuparu, E. Altman and L. Pfefferle. J. Catal., 203, 64-74 (2001) [17] X.P. Dai, R.J. Li, C.C. Yu and Z.P. Hao. J. Phys. Chem. B, 110, 25856-258562 (2006) 4 P-II-8-16
© Copyright 2025 Paperzz