Preparation of n/p Tandem Type Dye Sensitized Solar Cell Utilizing Plasma Sputtering Method Kazuya Yamamoto, Ryo Fukuda, Takayuki Yamamoto, Tatsuhiko Sonoda, and Kenji Yamada Department of Materials Science and Chemical Engineering, Kitakyusyu National College of Technology, Fukuoka, Japan. Abstract: Dye sensitized solar cell (DSC) having high efficiency with low cost was first reported by Grätzel et al and a lot of papers about various type of DSC were reported. The authors tried to prepare n/p tandem type composed with titanium dioxide as n type semiconductor and p type semiconductor for high conversion efficiency. This type DSC would be absorbed the long wavelength region of sunlight and taken high open circuit voltage by introducing p type semiconductor electrode. The p type semiconductor electrode was prepared by the plasma sputtering method using magnetron type plasma system to be covered with p type semiconductor (CuO, CuxBiyOz, etc.) on Pt sputtered FTO glass substrate. Keywords: n/p tandem type DSC, plasma sputtering, p type semiconductor 1. Introduction Dye sensitized solar cell (DSC) having high efficiency with low cost was first reported by Grätzel et al. [1]. DSC is The semiconductor materials such as titanium dioxide (TiO2) were used for the electrode of DSC, and the property of DSC would be depended on this semiconductor electrode. Several different types of DSC have been reported to get good performance until first paper. One of them is tandem type DSC composed of n type and p type semiconductor electrode was reported to improve the photovoltaic property of DSC [2]. In our previous work, n/p tandem type DSC assembled with n and p type semiconductor electrode was reported [3]. Cathode was prepared by plasma sputtering method of CuBi2O4 for coating of p type semiconductor on Pt sputtered FTO glass substrate. This system was expected to be achieved high performance of conversion efficiency by utilizing long wavelength light that the sensitized dye could not absorb the wavelength region. However The cell did not show the improvement for conversion efficiency. In this paper, n/p tandem type DSC was also tried to be prepared using plasma sputtering method. As p type semiconductor, CuO and CuxBiyOz with differencial composition ratio was used. The optimum plasma sputtering conditions were investigated for the better photovoltaic property of DSC. 2. Experiments 2-1 Sample Preparation TiO2 nanoparticles (called P25, Degussa Co., Dusseldorf, Germany) and CuxBiyOz were used as n or p type semiconductor respectively. CuxBiyOz powder was prepared following the previous report [4] by the powder of CuO and Bi2O3 pounded in mortar with molar ratio 95:5 and 90:10. The grained powder was calcined in a furnace at 973 K for 24 hours. 2-2 Preparation of p type semiconductor electrode by plasma sputtering of CuxBiyOz or Cu. CuxBiyOz thin film on Pt sputtered FTO glass plate was prepared by plasma sputtering method. Figure 1 shows the schematic illustration of Substrate Gas inlet Exhaust P type semiconductor High frequency power source (13.56 MHz) Figure 1. Schematic illustration of magnetron type plasma reactor. magnetron type plasma reactor for p type semiconductor sputtering in this paper. The plasma sputtering was treated by Argon plasma with 200 W of discharge power, at 15 Pa of argon gas pressure, for 5-20 min. To compare the property of electrode deposited with CuxBiyOz. Another electrode including copper oxide was also prepared by plasma sputtering method using Cu. These substrates annealed at 723 K for 30 min in air were used as p type semiconductor electrode. 2-3 Preparation of n/p tandem type DSC using CuxBiyOz sputtered electrode The thin film of semiconductor electrode for DSC was prepared by spin-coat method on FTO glass plate using the TiO2 paste concocted by blending of TiO2 particles with certain concentrations and poly (ethylene glycol): PEG which has 20,000 molecular weight in 1 mol/L acetic acid aqueous solution. TiO2 casting substrate was annealed in air at 723 K for 30 min to prepare the n type semiconductor electrode with porous TiO2. This electrode was immersed into ethanol solution with 0.3 M ruthenium dye (N719) for a day and rinsed by acetonitrile. The n/p tandem type DSC was Cu 2p3/2 assembled using n and p type semiconductor electrode prepared above, and the electrolyte solution composed with I2 (0.04M), LiI (0.5M) and 4-t-butylpyrdine (0.58M) in acetnitrile was filled between these electrodes. 2-4 Characterization of p type semiconductor electrode. X-ray photoelectron spectroscopy (XPS) measurement was carried out with a Shimadzu ESCA750 X-ray photoelectron spectrometer (Shimadzu Co., Kyoto, Japan). XPS spectra were collected by exciting the particles without pretreatment with a Mg Kα X-ray source. Mg Kα radiation was generated with a voltage of 8 kV and current of 30 mA. The spectrometer was calibrated using the Ag3d5/2 core line. An UV-vis diffuse reflectance spectra of p type semiconductor were measured with a JASCO V-500 UV-vis spectrophotometer (JASCO International Co., Tokyo, Japan) equipped with an integral-sphere attachment. 2-5 Measurement of photovoltaic properties of n/p tandem type DSC. Photovoltaic properties of assembled solar cell were investigated by current-voltage characteristics measurement under irradiation with simulated solar light under AM1.5G, 100 mW/cm2. (PEC-L11, Peccell Technologies, Inc., Yokohama, Japan) 3. Results and discussions 3-1 Confirmation of sputtered CuxBiyOz by plasma treatment on the electrode. Figure 2 shows Cu2p3/2 and Bi4f XPS spectra of FTO glass substrate after CuxBiyOz sputtering 1 Bi 4f 4. Absorbance 0.8 5. 2. 0.6 1. 2. 3. 4. 5. 0.4 0.2 0 200 300 400 500 3. Bi2O CuO CuBi2O4 CuxBiyOz(95:5) CuxBiyOz(90:10) 1. 600 700 800 900 Wavelength / nm Figure 2. Cu2p3/2 and Bi4f XPS spectra of FTO glass substrate after CuxBiyOz sputtering process. Figure 3. Photo absorption property of p type semiconductor electrode prepared by plasma sputtering method. -2 Photocurrent Density / mA・cm 8 1. 2. 3. 4. 5. 6 2. Original 200W 5min 200W 10min 200W 15min 200W 20min 4 1. 2 4. 3. 5. 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Voltage / V Photocurrent Density / mA・cm -2 Figure 4. I-V curves of n/p tandem type DSC prepared by plasma sputtering using CuxBiyOz (90:10) 12 1. 2. 3. 4. 5. 10 8 4. 6 Original 200W 5min 200W 10min 200W 15min 200W 20min 3. 5. 4 1. 2 0 2. 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Voltage / V Figure 5. I-V curves of n/p tandem type DSC prepared by plasma sputtering using CuxBiyOz (95:5) process at 200W discharge powers of irradiation. The peaks related Cu molecules around 933 eV, and Bi molecules around 160 eV appeared in the spectra of each sample. It was confirmed that CuxBiyOz could be sputtered on FTO substrate by plasma irradiation. 3-2 Photo absorption spectra of p type semiconductor. Figure 3 shows UV-Vis spectra of p type semiconductor electrode prepared by plasma sputtering method. Photo absorption property of CuxBiyOz (95:5 and 90:10) was better than that of CuBi2O4 in visible light region. DSC using the electrode including CuxBiyOz will be expected to show good photo conversion efficiency compared with using CuBi2O4 due to the absorption of visible light. 3-3 Photovoltaic property of n/p tandem type DSC using p type semiconductor with CuxBiyOz Table 1 and 2 show photovoltaic property of n/p tandem type DSC using electrode depended on the discharge power, irradiation time, and component ratio (CuO:Bi2O3) for plasma sputtering. Table content shows short-circuit current density Jsc, open circuit voltage Voc fill factor ff, and photo conversion efficiency Figure 4 and 5 shows current-voltage (I-V) curves of n/p tandem type DSC samples by plasma treatment with 200W discharge power. Original in table and graph legends means results of normal type DSC assembled by Pt sputtered FTO glass substrate as cathode and TiO2 films with 2m thickness on FTO substrate as anode. From the results of DSC with CuxBiyOz (90:10) sputtered substrate as p type semiconductor electrode, sample treated by 300W discharge power for 10 min only represented the improvement of short-circuit current density and photo conversion efficiency compared with original sample. On the other hands, DSC sputtered with CuxBiyOz (95:5) with 200 W discharge power showed good property like the samples with CuxBiyOz (90:10) treated with 300W. However the cells plasma treated with 300W did not show the improvement. The effects for shortcircuit current density after plasma sputtered of CuxBiyOz to cathode electrode would be related with the thickness of sputtered films. In this n/p tandem type DSC system, we need to match the excitation electron amount from sensitized dye adsorbed on TiO2 particles and p type semiconductor for the improvement of current density. Because the hole generated after light absorption in p type Table 1. Photovoltaic property of n/p tandem type DSC prepared by plasma sputtering using CuxBiyOz (90:10) Discharge power (W) 200 300 Treatment time (min) Jsc (mA/cm2) Voc (V) ff (%) (%) 5 10 15 20 5 10 4.70 4.94 6.93 6.86 4.75 4.56 0.67 0.67 0.71 0.72 0.68 0.65 43.9 57.6 54.3 51.0 41.6 21.2 1.38 1.91 2.70 2.53 1.35 0.63 Table 2. Photovoltaic property of n/p tandem type DSC prepared by plasma sputtering using CuxBiyOz (95:5) Discharge power (W) Treatment time (min) Jsc (mA/cm2) Voc (V) ff (%) (%) 5 10 15 20 5 10 3.26 4.62 3.42 2.53 3.65 4.46 5.31 0.68 0.67 0.71 0.67 0.68 0.67 0.68 63.4 42.4 54.1 43.5 37.6 41.1 56.1 1.45 1.31 1.32 0.74 0.94 1.23 2.04 Original 200 300 Table 3. Photovoltaic property of n/p tandem type DSC prepared by plasma sputtering using Cu. Discharge power (W) Treatment times (n) Jsc (mA/cm2) Voc (V) ff (%) (%) 300 1 2 3 2.85 1.94 1.9 0.81 0.79 0.78 58.7 56.3 56.3 1.68 1.15 1.05 semiconductor have to receive the excited electron from sensitized dye passing though the external circuit. If the hole did not generate enough in p type semiconductor, the excited electron from dye would be trapped and disappeared. The factor for the amount of generated holes was the amount of sputtered CuxBiyOz, that is the thickness of CuxBiyOz adsorbed on the electrode. In this study, the thickness of CuxBiyOz films in these plasma sputtered conditions did not investigate in detail, but the thickness of CuxBiyOz sputtered with these conditions was expected to be adequate for the balance of electron transaction in the circuit. 3-4 Photovoltaic property of n/p tandem type DSC using p type semiconductor with CuO Comparison of the effect for n/p tandem type DSC using another kind of p type semiconductor electrode was carried out. Table 3 shows photovoltaic property of n/p tandem type DSC using cathode of CuO sputtered with 300W discharge power for 5 min depended on plasma treatment times. From the results, as the plasma treatment times, the photo conversion efficiency was decreasing. This treatment given the photovoltaic property worse would be due to the film thickness of CuO on cathode substrate. The reason why was suggested that the hole generated in CuO films was more difficult to move in CuO matrix and catch the excited electrons passing though the external circuit by large resistance from thick sputtered films. 4. Conclusions The n/p tandem type DSC was composed with titanium dioxide as n type semiconductor and p type semiconductor prepared by the plasma sputtering method using magnetron type plasma system to be covered with CuxBiyOz or CuO on Pt sputtered FTO glass substrate. The plasma treated substrate by CuxBiyOz or CuO as p type conductor showed wide absorption in visible light region. The photovoltaic property of the n/p tandem type DSC was improved by some plasma sputtering condition using p type semiconductor. This results suggested that the good effect for photovoltaic property depended on the film thickness of plasma sputtered components. References [1] B. O. Regan, M. Grätzel, Nature 353, 737, (1991). [2] J. He, H. Lindstrom, A. Hagfeldt, S.-E. Lindquist, Solar Energy Materials Solar Cell, 62, 272 (2000). [3] K. Yamamoto, K. Matsuki, T. Yamamoto, Y. Maitoko, T. Sonoda, H. Yamane, S. Matsushima, H. Nakamura, K. Yamada, ISPC-19 Proceedings, P3-7 (2009). [4] T. Arai, M. Yanagida, Y. Konishi, Y. Iwasaki, H. Sugihara, K. Sayama, J. Phys. Chem. C, 111, 7574, (2007).
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