22nd International Symposium on Plasma Chemistry July 5-10, 2015; Antwerp, Belgium Growth of functional plasma polymers influenced by reactor geometry in capacitively coupled discharges D. Hegemann1, U. Schütz1, D. Lohmann1,2 and M. Drabik1 1 2 Empa, Swiss Federal Laboratories for Materials Science and Technology, St.Gallen, Switzerland Ruhr University Bochum, Institute for Electrical Engineering and Plasma Technology, Bochum, Germany Abstract: The deposition of functional plasma polymers such as a-C:H:O films is mainly influenced by fragmentation of the parent molecules in the gas phase as well as by the energetic conditions during film growth at the surface. The control of both deposition conditions enables permanent functional plasma polymer films within different reactor geometries (symmetric vs. asymmetric at driven electrode and at grounded electrode). Keywords: Plasma polymer, functional groups, ion bombardment, cross-linking, aging. 1. Introduction Capacitively coupled discharges, e.g. by using a plane parallel electrode set-up, are of high interest (also for industry), since they allow uniform treatment of largearea surfaces such as wafers and web materials. Difficulties related to this discharge type, however, involve the actual reactor geometry (degree of asymmetry), power coupling, gas flow pattern, plasma expansion, and substrate location. A recently conducted round-robin study thus revealed a poor comparability of functional plasma polymer films (using acrylic acid discharges) deposited within different reactor systems [1]. Functional plasma polymers, mainly comprising oxygen- or nitrogen-containing groups, are of increasing importance for biomedical applications [2], but also as adhesion-promoting layers [3]. Therefore, their stability in ambient air and in aqueous environments is crucial for many applications. Enhanced stability can be achieved by cross-linking of the plasma polymer film which requires sufficient energy during deposition for bond opening. Hence, the energetic conditions during film growth need to be controlled which are strongly related to the reactor geometry in a capacitively coupled plasma (CCP). To gain a better control over gas phase and surface processes, i.e. to control both radical and ion fluxes, e.g., dualfrequency operation is investigated [4]. For simplicity, however, a better understanding of plasma polymer deposition in radiofrequency-driven (RF, 13.56 MHz) CCP reactors is still required. For this purpose, the deposition of a-C:H:O films in CO 2 /C 2 H 4 discharges is performed within a symmetric and a slightly asymmetric reactor set-up, enabling three different geometries (symmetric, driven and grounded electrode). While the plasma chemical reaction pathway is maintained, the influence of the different growth conditions at the surface can be examined. Both the conditions in the symmetric as well as in the asymmetric set-up at the RF electrode were found to be useful for the deposition of functional plasma polymer films. O-13-6 2. Experimental The cylindrical, symmetric plasma reactor consists of two plane parallel electrodes separated by a glass ring. The upper electrode contains a gas shower, while the chamber is pumped through the lower electrode which is coupled to a RF generator (Fig. 1a). For the asymmetric set-up, a slightly smaller electrode is mounted inside the same plasma chamber adjacent to the gas shower at the top plate (Fig. 1b). As deposition conditions, CO 2 and C 2 H 4 flow rates of 8 and 4 sccm, respectively (gas ratio 2:1), a working gas pressure of 10 Pa, and a power range of 10-250 W were selected. Fig. 1. Schematic drawing of the used reactor geometries, a) symmetric set-up, b) asymmetric set-up. 1 A V/I probe (mounted as close as possible to the driven electrode) was used for the measurement of the electrical conditions (voltage and power absorption) and microwave interferometry (MWI) to measure the electron densities. Mean ion energies and ion flux can thus be calculated [5]. As a measure of the deposited energy (per atom), the energy density during film growth can be calculated from the energy flux (mean ion energy multiplied by ion flux) per deposition rate and, likewise, the momentum transfer using the square root of the ion energies [6, 7]. electrode, since the deposition area is smaller (490 cm2 vs. 690 cm2) [8]. 3. Results and discussion Mass deposition rates of the CO 2 /C 2 H 4 -derived plasma polymers at three different positions (symmetric at bottom RF electrode, asymmetric at top RF electrode and at bottom grounded electrode) have been measured with varying power input. Using an Arrhenius-like plot (with power input per monomer flow rate, W/F m , instead of temperature), a possible activation barrier for the plasma chemical reaction pathway can be examined (Fig. 2). Fig. 3. Velocity field of the gas flow pattern in the a) symmetric and b) asymmetric set-up (calculated using COMSOL Multiphysics®). The (inner) dashed line indicates the expansion of the plasma zone. Fig. 2. Arrhenius-like plot of mass deposition rate (per monomer flow rate) vs. the inverse energy input using the nominal power input. For all three configurations an Arrhenius regime as indicated by straight lines in Fig. 2 can be identified, however, with different slopes. In order to relate the reaction parameter W/F m to the energy invested per molecule in the gas phase, power absorption (85% for symmetric and 45% for asymmetric set-up), plasma expansion and gas flow pattern have to be taken into account. While there is a well-defined vertical gas flow in the symmetric set-up (Fig. 3a), the gas inlet is constrained by the RF electrode in the asymmetric set-up influencing the residence time in the plasma zone (Fig. 3b). Moreover, the plasma is more intense in front of the driven electrode. Considering these effects, the power input per monomer flow rate can be related to the plasma zone, (W/F m | pl ) [8]. As it can be seen from Fig. 4, all deposition rates follow the same slope indicative of the same plasma chemical reaction pathway. The deposition rate is higher for the deposition at the asymmetric RF 2 Fig. 4. Arrhenius-like plot of mass deposition rate (per monomer flow rate) vs. the inverse energy input related to the plasma zone. At enhanced energy input, the deposition rates start to deviate from the Arrhenius line, which has been ascribed to a change in the chemical reaction pathway, i.e., increasing formation of radicals [9]. In the symmetric and the RF electrode case, the deposition rates are even decreasing showing dominant ion-induced effects. Beyond the Arrhenius regime, the incorporation of oxygen-containing groups into the a-C:H:O films has been found to be reduced ([O]/[C] ratio decreases from 0.3 to 0.2) [6]. Furthermore, film densities have been calculated from mass deposition rates and film thicknesses (measured using profilometry). Film density is closely related to O-13-6 cross-linking and to the density of functional (polar) groups in the a-C:H:O plasma polymers. Fig. 5 shows the dependence of film densities on the momentum transfer during film growth (which is transferred by the interaction with energetic particles from the plasma) for the three different plasma configurations. In addition, static contact angles have been measured (with water) right after deposition and after one month aging in air (23 °C, 65% relative humidity). Fig. 5. Film density of a-C:H:O plasma polymers vs. momentum transfer during film growth. The change in contact angles is given after aging for 1 month in air. For enhanced ion bombardment, the film densities were found to increase linearly with momentum transfer at all three configurations, which agrees well with earlier findings [6]. Hence, the densification is directly related to the actual growth conditions at the substrate surface independent of the reactor geometry. Most of all, the deposition at the RF electrode, both in symmetric and asymmetric set-up, enables a broad variation of deposition conditions. At the grounded electrode, on the other hand, the flux of film-forming species increases in the same degree as the flux of energetic particles resulting in an almost constant momentum transfer. Nevertheless, a slight increase in film density (with W/F m ) can be noticed. An increase in film density at constant momentum transfer indicates increasing importance of fragmentation in the gas phase [7]. Hence, gas phase reactions mainly determine the plasma polymer growth when deposited at the grounded electrode. The control over the film properties, however, is low in this case. Moreover, a-C:H:O films deposited in this regime (corresponding to a deposited energy below 6 eV per atom) were found to be partly soluble in aqueous environments and showed strong aging effects. With respect to stability, moderate ion bombardment is thus required to obtain sufficient cross-linking and stable contact angles around 54°. This result agrees well with recent findings for CO 2 /C 3 H 6 O-derived plasma polymers showing stable contact angles of around 55° (at [O]/[C] O-13-6 ratio of 0.2) thanks to a low amount of rather instable COOR groups [10]. Most of all, the suitability of the aC:H:O films as bioactive surfaces has been demonstrated [11]. Further improvements can be achieved by consequently increasing the ether/hydroxyl part at the expense of ester/carboxyl groups, e.g. by using H 2 O/C 2 H 2 discharges [12]. In terms of power input, a power around 70 W resulted in the deposition of stable a-C:H:O films in the symmetric set-up, while 250 W was required in the asymmetric setup (at fixed gas flow rates) thanks to the superior power coupling in the symmetric reactor. Both energy inputs fall into the regime where the deposition rates starts to deviate from the Arrhenius regime accompanied by a reduced incorporation of oxygen ([O]/[C] ratio of around 0.2). It is noteworthy that the highest deposition rates (around 10 nm·min-1 for the used conditions) can be achieved for such coatings which can be enhanced further by using higher gas flow rates (and in the same degree higher power input). A too strong ion bombardment can then be balanced by increasing the pressure. 4. Conclusions The deposition of CO 2 /C 2 H 4 -derived a-C:H:O films within three different plasma geometries (symmetric CCP, asymmetric CCP at RF electrode and grounded electrode) has been investigated at comparable gas phase conditions, i.e., within the same range of energy invested per particle (W/F m | pl ). Differences in film properties (such as film density and functional group density) are thus related to the actual growth conditions at the substrate surface. As a measure for the densification, the momentum transfer during film growth has been determined showing a linear relationship (above a certain threshold energy). While the conditions for deposition on grounded electrode in the asymmetric set-up have been found to be rather invariable resulting in a poor film quality, deposition on the RF electrode and within the symmetric set-up enables a broad variation (and thus optimization) of film properties. Non-aging functional plasma polymer films with a static contact angle around 54° have been obtained with moderate ion bombardment. The observed stability of the CO 2 /C 2 H 4 -derived aC:H:O films deposited at enhanced ion bombardment agrees well with findings for different starting monomers thanks to a reduction of rather instable COOR groups. Hence, the deposition of permanent functional plasma polymer films is possible using simple gases within different reactor geometries at acceptable deposition rates which also allows further up-scaling. The wettability, however, is limited. To enhance wettability, i.e. to obtain more polar groups at the surface, different concepts such as vertical gradient layers need to be followed. In any case, deeper insights into plasma polymerization processes are gained by the investigation of the flux of film-forming species (via deposition rates) and the flux of energetic particles, also enabling the comparison of different reactor geometries and transfer to industry. For 3 example, the developed highly permanent a-C:H:O films are nowadays in use for blood filtration. 5. References [1] J.D. Whittle, R.D. Short, D.A. Steele, J.W. Bradley, P.M. Bryant, F. Jan, H. Biederman, A.A. Serov, A. Choukurov, A.L. Hook, W.A. Ciridon, G. Ceccone, D. Hegemann, E. Körner and A. Michelmore. Plasma Process. Polym., 10, 767 (2013) [2] K.S. Siow, L. Britcher, S. Kumar and H.J. Griesser. Plasma Process. Polym., 3, 392 (2006) [3] J. Friedrich. The Plasma Chemistry of Polymer Surfaces. (Weinheim: Wiley-VCH) (2012) [4] E. Schüngel, R. Hofmann, S. Mohr, J. Schulze, J. Röpcke and U. Czarnetzki. Thin Solid Films, 575, 60 (2015) [5] J. Trieschmann and D. Hegemann. J. Phys. D: Appl. 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