st 21 International Symposium on Plasma Chemistry (ISPC 21) Sunday 4 August – Friday 9 August 2013 Cairns Convention Centre, Queensland, Australia Elongation tolerant Multilayer Gas Barrier Coatings for PET films H. Bahre1, K. Bahroun2, H. Behm2, M. Böke1, R. Dahlmann1, T. Schlebrowski1, J. Winter1 2 1 Institute for experimental physics II, Ruhr-Universität Bochum, Bochum, Germany Institute of Plastics Processing (IKV) at RWTH Aachen University, Aachen, Germany Abstract: Polymers gain more and more interest in packaging applications, with increasing demands towards their gas barrier properties. In addition, their tolerance to mechanical stress remains to be improved, especially for glass like SiOx coatings. Alternative approaches are organic coatings and the use of multilayer. However, many of these systems are hardly understood. Here, a multilayer system based on films deposited from C2H2 as well as SiH4 is evaluated to assess their applicability as barrier layers. Inorganic a-Si:H layers alternate with organic a-C:H layers. A capacitively coupled plasma discharge (CCP) driven at 13.56 MHz is used for deposition. We found that the hardness as well as the induced compressive stress in a-C:H coatings are limiting factors in the gas barrier properties in multilayer films. However, soft a-C:H layers deposited at low self-bias voltages and high pressures are tolerant to up to 6 % strain before first cracks occur. Keywords: capacitively coupled plasma, a-C:H, DLC, a-Si:H, gas barrier, multilayer, PET 1. Introduction Polymers progressively substitute glass due to their combination of favourable properties such as low weight, transparency and toughness. This combination makes them suitable for many packaging applications [1]. Nonetheless, raw plastics do not possess sufficient gas barrier functionality. Gas barrier against oxygen and water vapour avoids degradation of packaged goods and is of paramount importance. Thin gas barrier films can be deposited by plasma processes using very few material at low cost, causing less damage to the environment [2, 3, 4]. However, current gas barriers are very brittle and have almost no tolerance to elongation. 2. Experimental Details Deposition Chamber and Processes Both amorphous hydrogenated carbon (a-C:H) as well as amorphous hydrogenated silicon (a-Si:H) films were deposited with a capacitively coupled plasma (CCP) reactor driven at 13.56 MHz. The lower electrode has a diameter of 100 mm and a distance to the upper electrode of 30 mm. A negative self-bias potential builds up at the lower, powered electrode, which holds the samples. It is measured at a low pass filter within a matching network connected to the electrode. This self-bias potential directly influences the energy of the particles which hit the substrate [5]. The substrates were introduced with a transfer rod through a pre-evacuated load lock chamber. Gas is injected into the chamber through a ring-shaped shower head. We deposited a-Si:H layers from ultra-high purity silane (diluted in 10 % argon) and a-C:H layers from acetylene. The layer thickness was determined with silicon wafers that were coated along with the samples and then measured with an ellipsometer (J. A. Woollam Co., Lincoln, USA) at an angle of 75° and wavelengths between 245 and 999 nm. Forming tolerance testing To evaluate strain-tolerance properties of coated films, a motorized microstraining device (Kammrath & Weiß GmbH, Dortmund, Germany), equipped with a load cell and an inductive displacement sensor, was utilized. Coated films with a size of 40 mm × 8 mm were fixed on the micro-straining device, which was then used to impart strain to the film. In this arrangement, the films were strained uniaxially. Under steady-state strain conditions, which were stepwise increased, observations were made using a laser scanning microscope (Keyence VK-X210 from Keyence Deutschland GmbH, Neu-Isenburg, Germany). All measurements were performed imaging an area of 96 μm × 72 μm. The images obtained were visually examined towards crack formation and possible delamination indicating a poor layer adhesion. Polymer Material The polymer film used in this study is Hostaphan RD 23 from Mitsubishi Polyester Films Wiesbaden, Germany. It is a 23 µm thick, coextruded, biaxially oriented polyethylene terephthalate (BOPET) film with two different surface topographies. While one side is standard Hostaphan PET film with a surface roughness of RRMS = 3 nm, the functional side is extremely smooth, with a surface roughness of RRMS = 0.7 nm. The roughness is given as an average for a 5 × 5 µm2 area. This difference in roughness is caused by anti-block st 21 International Symposium on Plasma Chemistry (ISPC 21) Sunday 4 August – Friday 9 August 2013 Cairns Convention Centre, Queensland, Australia particles which are not present on the functional side. For this study, only the smooth side was coated. The film is taken from a roll and inserted directly into the chamber without any rinsing or ultrasonic cleaning to avoid treatment effects that do not originate from the plasma. 3. Results & Discussion Barrier properties depend crucially on the thickness of the deposited layer. Usually, a critical thickness in the range of tens of nm is necessary for a closed layer and gas barrier properties [7]. Similarly, Figure 1 illustrates that our a-Si:H and a-C:H layers possess an oxygen gas barrier at 10 nm and 17 nm respectively. Compared to the reference with no layer deposited, the barrier is improved by a factor of 27. Moreover, increasing the thickness of the a-Si:H layer further improves the OTR to 1.5 cm³/m² day. However, the oxygen transmission of the 85 nm aC:H layer increases as shown in Figure 1. This means that increasing the layer thickness can have a detrimental effect on the oxygen gas barrier. Similarly, the OTR of the double layer, which consists of 10 nm a-Si:H and 17 nm a-C:H, is higher than each layer alone. Micro-straining tests showed that both pressure and applied substrate bias determine the initial cracking of the coatings, as shown in Figure 2. The effect of the bias is illustrated in c) and d). We observed that for low (-60 to -100 V) bias voltages, the tolerance to strain is improved and the layers do not crack until 5.5 % (Figure 2d)). But self-bias voltages between -200 V and -500 V result in initial cracks at 1.5 % to 2 % strain. Figure 2: Microcracking patterns of a-C:H layers for different plasma parameters. a) and b) show layers deposited at 1 and 5 Pa respectively. While a) is already cracked in both the direction of strain (horizontal) and perpendicular to it, b) is completely intact. Figure c) also shows cracks, as well as meander-like structures, whereas d), deposited at low bias, is free of defects. Figure 1: Oxygen transmission rate (OTR) of different coat-ings deposited directly on the PET substrate: The thin (10 nm) a-Si:H coating shows a good barrier performance, as well as the 17 nm a-C:H coating. However, a combination of these two in a double layer has a decreased barrier performance. A possible explanation for this behavior is the residual stress of the coatings. a-C:H layers are known to possess residual stress in the range of GPa, depending strongly on the deposition parameters [8]. Self-bias voltages in the range of -100 V to -300 V create hard, diamond like carbon layers with high compressive stress [9]. Impinging, energetic ions densifying the deposited layer are considered to be the origin of this stress. Soft, polymer like layers form at low bias-voltages or even ground potential [10]. a-C:H coatings deposited at low pressure and -100 V bias show cracks both in the direction of strain (horizontal) and perpendicular to it at 4.5 %. On the contrary, the a-C:H layer deposited at 5 Pa is free of cracks at the same elongation. In addition to the cracks due to the strain, the a-C:H layer deposited at -200 V selfbias also shows meander-like structures, which are also visible in the pictures without strain (not shown here). These meander-like structures occur at high self-bias voltages and are possibly due to the compressive stress in the layer. st 21 International Symposium on Plasma Chemistry (ISPC 21) Sunday 4 August – Friday 9 August 2013 Cairns Convention Centre, Queensland, Australia 4. Conclusion We deposited different gas barrier layers. a-Si:H layers were found to work as oxygen gas barrier for very thin and (10 nm) intermediate (40 nm) thicknesses. In contrast, hard a-C:H layers only had a considerable gas barrier for thin (17 nm) coatings due their compressive stress. By varying the a-C:H deposition parameters, they were found to have lower maximum strains when deposited at parameters that are considered to produce hard coatings. Therefore, a combination of soft a-C:H layers with a-Si:H layers is a promising approach and should be further investigated. Figure 3: The maximum strain before first cracks occur decreases by a factor of two for self-bias voltages below -100 V. Figure 3 and Figure 4 show an analysis of the pictures taken from the strain tests. We label the strain at which the first cracks are visible in the micrographs maximum strain. This maximum strain decreases by a factor of two at bias voltages below -100 V. This is probably due to compressive stress that builds up in the a-C:H layer. Meander-like structures as shown in Figure 2 c) appear in all layers deposited at higher bias voltages, and the films are curved after they are released from the sample holder. This means that hard a-C:H layers deposited on PET have a much lower tolerance to strain than soft a-C:H layers. Figure 4: The maximum strain before first cracks occur vs the pressure during the plasma deposition. Higher pressures increase the maximum strain. For the pressure variation shown in Figure 4, the maximum strain doubles for higher pressures from 3.5 % at 1 Pa up to 6 % at 4 Pa. Layers deposited at higher pressures have seen lower ion energies, since ions collide more often while travelling through the plasma sheath. In addition, the fragmentation of C2H2 is lower at higher pressures for the same applied power, which means that larger molecules at lower energies are implemented into the a-C:H layer. 5. Acknowledgements This project is supported by DFG (German Research Foundation) within the framework of the Special Research Field SFB-TR 87 and the Research Department ‘Plasmas with Complex Interactions’ at Ruhr-Universität Bochum. 6. References [1] P. Krüger, Vakuum in Forschung und Praxis, 12, 4, (2000). [2] A. Bieder; A. Gruniger; R. von Rohr, Surface and Coatings Technology, 200, 1-4, (2005). [3] C. Bichler; T. Kerbstadt; H. Langowski; U. Moosheimer, Surface and Coatings Technology, 97, 1-3 (1997). [4] G. Dennler, C. Lungenschmied, H. Neugebauer, N. S. Sariciftci, M. Latreche, G. Czeremuszkin and M. R. Wertheimer, Thin Solid Films, 511–512, (2006). [5] L. Martinu, J. Vac. Sci. Technol, A 12, 4 (1994). [6] J. Fahlteich, M. Fahland, W. Schoneberger and Schiller, Thin Solid Films 517 3075-80 (2009). [7] H. Chatham, Surface and Coatings Technology, 78, 13 (1996). [8] J. Damasceno, Surface and Coatings Technology, 133-134, 1, (2000). [9] P. Couderc, Y. Catherine, Thin Solid Films, 146, 1 (1987) [10] A. Grill, IBM J. Res. & Dev., 43 (1.2), (1999).
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