COMMITTEE CO-CHAIRS:
David G. Seller, NIST
Robert McDonald, Metara, Inc.
Alain C. Diebold, International SEMATECH
Thomas J. Shaffner, NIST
Rajinder P. Khosla, NSF
Stefan Zollner, Motorola
COMMITTEE MEMBERS:
Mark Anthony, Omniprobe
Dick Hockett, Charles Evans and Associates
Caroline Ayre, Intel
Harold Hosack, SRC
Christopher R. Brundle, C. R. Brundle and Associates
Stephen Knight, NIST
Yok Chen, DoE
Robert G. Mazur, Solid State Measurements
Bruce Gehman, SEMI
Lori Nye, Silicon Genesis Corp.
James Greed, Jr., Foothill Technology
Gary Rubloff, University of Maryland
Masataka Hirose, Hiroshima University
Anne Testoni, formerly of KLA-Tencor
Paul Ho, University of Texas
Ehrenfried Zschech, AMD
SHORT COURSE INSTRUCTORS:
Robert G. Mazur, Gilbert A. Gruber, and Robert J.
Hillard, Solid State Measurements; and Catherine
Hartford, WaferNet, Inc.
Electrical Metrology for ULSI Process Control
Christopher R. Brundle, C. R. Brundle and Associates
Full Wafer Defect Detection, Review, and
Characterization
Richard J. Matyi, NIST
High Resolution X-ray Reflection and Diffraction
Methods for ULSI Materials
Thomas E. Tiwald, J. A. Woollam Co., Inc.
Variable Angle Spectroscopic Ellipsometry for
Semiconductor Applications
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