• Lecture 25: Silicon chip fab
ECEN 1400 Introduction to Analog and Digital Electronics
Lecture 25
Fabrication of silicon chips
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Materials: doping and metals
Growing silicon crystals
Optical lithography
Moore’s Law
http://www-03.ibm.com/press/us/en/pressrelease/39641.wss
Robert R. McLeod, University of Colorado
197
• Lecture 25: Silicon chip fab
ECEN 1400 Introduction to Analog and Digital Electronics
Doping and wiring
http://tymkrs.tumblr.com/post/3525431464/thirteenth-ham-lesson-o-de-day
http://pcplus.techradar.com/files/pcp_images/sand_to_silicon_step_8.jpg`
Robert R. McLeod, University of Colorado
198
• Lecture 25: Silicon chip fab
ECEN 1400 Introduction to Analog and Digital Electronics
Silicon boules and wafers
http://www.ami.ac.uk/courses/ami4202_mdesign/u02/
http://www.quora.com/Semiconductors/How-do-silicon-boules-not-break-offduring-semiconductor-fabrication
http://www.ami.ac.uk/courses/ami4202_mdesign/u02/
http://www.peekreview.net/the-many-processes-of-silicon-wafer-processing/
Robert R. McLeod, University of Colorado
199
• Lecture 25: Silicon chip fab
ECEN 1400 Introduction to Analog and Digital Electronics
Optical pattern transfer
http://britneyspears.ac/
physics/fabrication/
photolithography.htm
http://www.hitequest.com/Kiss/VLSI.htm
Robert R. McLeod, University of Colorado
200
• Lecture 25: Silicon chip fab
ECEN 1400 Introduction to Analog and Digital Electronics
Optical
Lithography
ArF laser
l=193 nm
193 nm light illuminates a mask
The mask puts a pattern on the light
The light is reduced 4X in size on the resist
The resist hardens where illuminated
A solvent washes away the soft resist
An acid could then etch the Si
Or a metal could be deposted on the Si
Illuminatio
n Shaping
Mask
http://www.opticalres.com/cv/gallery.swf
Projection Camera
Water
Si Wafer
Resist
http://www.nature.com/nphoton/journal/v1/n11/covers/tech_focus_index.html
Robert R. McLeod, University of Colorado
Slide adapted from Tom Milster, “Application of ODS Technology
to Lithography” ODS 2008.
201
• Lecture 25: Silicon chip fab
ECEN 1400 Introduction to Analog and Digital Electronics
From wafer to package
Structured wafer
Bonded and encapsualted chip
Wire bond
http://www.sunnyray.org/Solar-pv-jargon.htm
Wafer dicing
http://www.chemistryexplained.com/Ru-Sp/Semiconductors.html
Wire bonder
aspentechnologies.com
http://forsoft.pl/grommet/transponder-wirebond.html
Robert R. McLeod, University of Colorado
http://www.wireandtubenews.com/2012/07/09/bonding-wire-is-scalability-thewave-of-the-future/
202
• Lecture 25: Silicon chip fab
ECEN 1400 Introduction to Analog and Digital Electronics
Moore’s Law
http://en.wikipedia.org/wiki/Moore%27s_law
Robert R. McLeod, University of Colorado
http://asia.stanford.edu/events/spring06/ee402s/slides/041306-Kamins.pdf
203
• Lecture 25: Silicon chip fab
ECEN 1400 Introduction to Analog and Digital Electronics
Moore’s “second law”
ASML TWINSCAN 1900Gi
Illumination
Mask
Projection lens
Wafer
Laser
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Robert R. McLeod, University of Colorado
Resolution
Transfer rate
Cost
40 nm
~100 THz
41 M$
http://asia.stanford.edu/events/spring06/ee402s/slides/041306-Kamins.pdf
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