Corporate Headquarters
400 Valley Road
Warrington, PA 18976
1-800-523-2575
FAX 1-800-343-3291
Email: [email protected]
www.polysciences.com
Europe - Germany
Polysciences Europe GmbH
Handelsstr. 3
D-69214 Eppelheim, Germany
(49) 6221-765767
FAX (49) 6221-764620
Email: [email protected]
TECHNICAL DATA SHEET 640
Page 1 of 1
NoSWEEP™ Wire Bond Encapsulant
EW7072
Polysciences, Inc. NoSWEEP™ Wire Bond Encapsulant is a novel, 100% solids, one component, silica filled liquid
encapsulant designed for encapsulation of very narrow diameter, long and ultra fine pitch wire bonds on semiconductor
devices. NoSWEEP™ is dispensed onto the wires immediately after wire bonding, flowing easily between and around the
wires without causing sweep or sag and without voids. NoSWEEP™ is quickly gelled with UV energy to lock the wires in
place so the device can be handled and molded with no damage to the wires.
Customer Benefits
Cured Properties
NoSWEEP™ Wire Encapsulant offers the following distinct
advantages over conventional molding systems:
Glass Transition Temperature (Tg) by DMA
>180°C
• Enables implementation of 35 µm pitch roadmap
wire bonding
Coefficient of Thermal Expansion (CTE)
Alpha 1 = 14 ppm/°C
Alpha 2 = 29 ppm/°C
• Allows for the use of longer wires with low cost,
high-density substrates and enables simple die
shrinks
• Enables cost reduction through the use of thinner
diameter gold wire
Uncured (Wet) Properties
Color
Grayish white pearlescent
Filler Content
84%
Viscosity @ 25°C RVDV-II+ Spindle 14, Cup 6R
115 ± 25 kcps @ 0.5 rpm
Flexural Modulus (Three Point Bend)
14.0 GPa @ 25°C
Extractable Ionic Content (Na, K, Cl)
<10 ppm
Dielectric Constant @ 1MHz
3.94
Dielectric Strength v/mil @ 1/16”
453
Volume Resistivity ohm-cm @ 23°C
7.11 x 1014
Thermal Conductivity W/m°K
0.53
Pot Life @ 25°C
>12 hours @ 25°C
Storage and Handling
Process Parameters
Storage
Store at -40°C for up to 12 months
Dispensing
Recommended needle size: 17 gauge
Heat dispense needle to 60°C
Heat substrate to 90-100°C
Recommended Cure Cycle
UVA 1.0 Joules/cm2 @ 90°C plus convection
oven 170°C for 2-4 hours*
Alternative Thermal Only Cure Cycle
Convection oven @ 130°C for 2 hours
plus 170°C for 2-4 hours*
*Second cure step can be done simultaneous
with post mold cure
Shipment
Recommended temperature is -40°C
Safety
Refer to MSDS for safe handling practices.
All values are considered typical based on tests believed to be
accurate. Polysciences, Inc. may change the data as appropriate.
Ordering Information
In The U.S. Call: 1-800-523-2575 • 215-343-6484
In The U.S. FAX: 1-800-343-3291 • 215-343-0214
In Europe Call:
In Europe FAX:
(49) 6221-765767
(49) 6221-764620
Should any of our materials fail to perform to our specifications, we will be pleased to provide replacements or return the purchase price. We solicit your inquiries concerning all needs for life sciences work. The
information given in this bulletin is to the best of our knowledge accurate, but no warranty is expressed or implied. It is the user’s responsibility to determine the suitability for his own use of the products described
herein, and since conditions of use are beyond our control, we disclaim all liability with respect to the use of any material supplied by us. Nothing contained herein shall be construed as a recommendation to use
any product or to practice any process in violation of any law or any government regulation.
© Polysciences, Inc.
0405 RevB
Data Sheet #640
1