Faculty updates
Changfeng Ge
May 6 2011
•APC Center for
Packaging Innovation
•Teaching
•Service
•Research
NSF- $400K
American Packaging Corporation
Gift- $1,000,000.00
---Received Federal Grants( 2006-:
NASA
NSF
NPS
American Packaging Corporation Center
for Packaging Innovation
Packaging
Research and
Development
Plastics
Education
Other MFG
•Consulting and
Testing
•Service to Industry
Plastics
Characterization
Lab
Plastics Processing
Lab
Lab Instruments
RCS system with DSC Q1000
TGA Q500 with standard furnace
Lab Instruments
MOCON OX-TRAN &
PERMATRAN-W
(Below)
Fourier Transform Infrared
Spectroscopy (Above)
Lab Instruments
INSTRON 5567
Plastics Processing Laboratory (PPL)
• Plastics Processing Laboratory (PPL) is a teaching facility that
serves the academic and industrial needs in testing and
processing of plastics.
• PPL is used for various purposes. The main function is in the
education of plastics processing techniques and explanation of
different type of experiments conducted in applied plastics
research and development. The teaching lab is also used for
industrial partnership programs in the work force and product
development.
3 layer Co- extrusion blown film line with 20 mm extruders
NEW!
Teaching
•Engineering Design Graphics
( Solid Works)
•Advanced Packaging Design
•Distribution System
•Plastics technology
•Teaching Advanced
Packaging Design using SkyPe
•Using WIKI to teach the
Plastic technology
Service
•Co- Chair –ASTM D10
Packaging, University liaison
•Chair- ASTM D 10.13 Sub
committee
•Co-Editor- Journal of Applied
Packaging Research
A STUDY OF BARRIER PROPERTIES FROM A FILM TO A TOTAL PACKAGE
•Regression models of the package water vapor and oxygen rates vs.
total area will be established to determine a relationship.
•Mathematic Relationship between film OTR/WVTR rate and package rate
will be determined using different temperature settings.
•Pouches with more faces produce a higher or lower rate.
These rates will then be turned into ratios to examine the effect on adding extra sides.
Packaging design for daguerreotypes- George Eastman House
a maintainable argon enclosure as the optimal
preservation housing
Packaging structure to insulate and
buffer temperature changes
Temperature of Chocolate in Proposed
Proposed Packaging A
Packaging
Original Packaging
Proposed Packaging B
120
Blank Insert
100
Degrees F
RIT propose introducing a slim layer of
packaging or sleeve that can be added to a
standard heat sealed polymer film package.
The proposed packaging system consists of an
approved polymeric material which is tuned to
be sensitive to temperature changes in
ambient environments and a carrier material
to hold polymeric material. If the temperature
sensitive products such as chocolate becomes
exposed to increasing temperatures, this
materials will absorb heat so that the
chocolate will stay cooler for a longer period of
time
80
60
40
20
0
0
500
1000
1500
2000
Seconds in Chamber
2500
3000
3500
Simulation and measurement of the heat flow in an
insulated packaging during transport
40
Ambient Temp VS. RFID-Product Temp VS.
Sensitech-Product Temp
35
25
Ambient
Temp
20
15
10
5
0
-5
-10
1
25
49
73
97
121
145
169
193
217
241
265
289
313
337
361
385
409
433
457
481
505
529
Temperature (°
° c)
30
Flexible Packaging Minor
•Undergraduate Minor
•Offered by Packaging Program
•Several Courses offered by printing major
Your thought?