Matsuo Bridge Company, Ltd. of Japan Scholarship Application Package FOR A TRAINING OPPORTUNITY AT MATSUO BRIDGE COMPANY’S FACILITIES AND JOB SITES IN JAPAN Provided through the AWS Foundation, Inc. 550 N. W. LeJeune Road Miami, Florida 33126 Matsuo Bridge Company, Ltd. of Japan Scholarship Introduction Matsuo Bridge Company, Ltd. of Japan is one of Japan’s leading fabricators of steel for bridges, buildings and other structures. Established in 1925, the company operates steel fabrication plants in Sakai (Osaka), Chiba (Tokyo) and Shanghai, China. In addition to sales offices in every major city throughout Japan, the company has overseas representative offices in Houston, Texas and Hanoi, Vietnam and a subsidiary company, Hamilton Construction Company, in Springfield, Oregon. Listed on the Tokyo and Osaka stock exchanges, Matsuo Bridge boasts numerous signature projects throughout Japan, including the world’s longest suspension bridge. The company has also completed projects in North and South America, Asia and the Middle East. Dedicated to promoting international exchange, the Matsuo Bridge Company, Ltd. of Japan Scholarship was established to provide a unique opportunity for students enrolled in a civil or welding engineering curriculum in the United States to travel to Japan to study Japanese steel fabrication and construction. The goal of the scholarship is to foster goodwill and mutual understanding among members of the international steel industry. Purpose The purpose of this scholarship is to provide a two to three week training opportunity at Matsuo Bridge Company’s facilities and job sites in Japan to individuals interested in pursuing a career in civil engineering, welding engineering, or welding engineering technology. Eligibility The Matsuo Bridge Company, Ltd. of Japan Scholarship will be awarded to a college junior or senior, or a graduate student pursuing a degree in civil engineering, welding engineering, welding engineering technology, or related discipline. All applicants must meet the following eligibility requirements: 1. Applicant must be a minimum of eighteen years of age. 2. Applicant must have a high school diploma. 3. Applicant must have a 3.0 overall grade point average. 4. Student must be enrolled full or part time in an accredited college or university in the United States. 5. Applicant must submit all application information. 6. Applicant must be able to travel in July or August. 7. Applicant must be a citizen of the United States and have a valid passport. Note: The award will be available to students nationwide; however, priority will be given to individuals residing in the states of California, Texas, Oregon or Washington. (A resident is defined as having lived in a specified area for a minimum of one year.) The recipient does not have to be a member of the American Welding Society; however, he/she must agree to participate in AWS Foundation or Matsuo Bridge Company, Ltd. of Japan sponsored publicity. The AWS Foundation, Inc. does not discriminate by age, race, color, national origin, disability, creed, or gender. Selection The recipient will be chosen by a Selection Committee comprised of five (5) members, selected by the Education Scholarship Committee. The Selection Committee will determine award recipient in February of each year. Recipient will be announced at the National Awards Luncheon. Award One $2,500 award will be given annually, which will cover airfare, room and board, and per diem. Recipient will be accompanied by a Matsuo Bridge representative. Application information Procedure Applicant must provide the following: 1. Application Form 2. Two letters of reference only. One should speak to your academic background and character, i.e., extra-curricular activities. 3. Personal Statement which includes your career objectives, background, and how this scholarship relates to your professional growth. 4. Transcript 5. Verification of Enrollment 6. Acknowledgement and Release Deadline Deadline for application is January 15, for the following Fall term. For More Information Please contact: AWS Foundation, Inc. 550 N. W. LeJeune Road Miami, FL 33126 800-443-9353, extension 461 305-445-6628 Fax 305-443-7559 Revised 3/02 Matsuo Bridge Company, Ltd. of Japan Scholarship Application Package Checklist Eligibility Requirements (Please check each requirement met.) ! ! ! ! ! ! ! Are you a minimum of eighteen years of age? Do you have a high school diploma? Do you have a minimum 3.0 overall grade point average? Are you a college junior or senior, or a graduate student? Are you enrolled full time or part time? Are you pursuing a four-year bachelors degree in civil engineering, welding engineering, welding engineering technology. or a related discipline at an accredited university? Are you a citizen of the United States? Have you included the following in your package? (Please check each item included, and if not included, please note the date the item(s) should be received at the AWS Foundation office.) ! ! ! ! ! ! ! Date Application Two letters of reference only ___________ (One should speak to your academic background and character, i.e., extra-curricular activities) ___________ Transcripts (High school and College) ___________ Verification of Enrollment ___________ Personal Statement of goals and how this scholarship would help you achieve these goals and increase your professional growth (300-500 words) ___________ Matsuo Bridge Co., Ltd. of Japan Release ___________ AWS Foundation Acknowledgement and Release ___________ Comments ___________________________________________________________________________________________ ___________________________________________________________________________________________ _____________________________________________________________ ______________________________ Signature __________ Date National Scholarship Application Package Disclaimer The AWS Foundation, Inc. is not responsible for assembling student scholarship application packages; however, with prior notification, official transcripts sent directly from the Registrars Office will be added. Incomplete application packages and application packages postmarked after the scholarship deadline will be automatically disqualified. Matsuo Bridge Company, Ltd. of Japan Scholarship Application Deadline for Submission: January 15 (Print in dark ink or type) Please Return To: AWS Foundation, Inc. 550 NW LeJeune Road Miami, FL 33126 Social Security Number ________________________ Are you an AWS member? Yes _____ No _____ Date ________ Applicant’s Name ___________________________________________________________________________________ Current Address _____________________________________________________________________________________ Number Street Apt. No. _________________________________________________ Home Phone Number ( City State Zip )__________________________ RESIDENCY STATUS: Resident of ____________________ (State) Non U. S. Citizen ________________(Country) Sex: Male ______ Female: ______ Date of Birth _________________________________________________________ MARITAL STATUS: Single ______ Married ______ (Number of Dependents ____) Separated ______ Divorced _____ Parent/Guardian’s Name ______________________________________________________________________________ Parent/Guardian’s Address ____________________________________________________________________________ Number Street Apt. No. _________________________________________________________________________________________________ City State Zip Parent/Guardian’s Home Phone Number ( ) ______________ Work Phone Number ( ) ______________ Are you employed ? _____ Yes _____ No If yes, please give the following: EMPLOYER’S NAME _______________________________________________________________________________ Employer’s Address __________________________________________________________________________________ Number Street Apt. No. ____________________________________________________ Employer’s Phone Number ( ) ____________________ City State Zip ATTENDING SCHOOL (Institute, College, University) NAME ______________________________________________ School Address _______________________________________________________________________________________ Number Street ____________________________________________________________________________________________________ City State Zip Contact at your School ____________________________________ Phone Number ( ) ________________________ Major Area of Study ___________________________________________________ Date of Graduation _______________ I affirm the information that I have (will) provided on this application, or any supportive materials, is (will be) complete, accurate, and true to the best of my knowledge. I understand that furnishing false information may result in not being considered. Signature of Applicant ___________________________________________________ Date _________________________ Signature of Parent or Guardian ____________________________________________ Date ________________________ LIST OF SCHOOLS YOU PREVIOUSLY ATTENDED (From High School through the Present) Name of School Address Date Attended *** Attach a transcript from all previous institutions attended *** DEMONSTRATED WELDING EXCELLENCE (Include School/Community Activities/Honors & welding work experience) Activity Year Offices & Honors WORK EXPERIENCE (Include present and previous employment, and use additional paper if required) Year Company Name Job Description (be specific) FINANCIAL AID REPORT (List previous and current educational scholarships, grants, loans, work-study, or student employment) Attach a copy of your Student Financial Aid form even if no financial aid was received. Year Institution and Location Type of Aid Amount LIST OF PERSONAL REFERENCES: Name Street/City/State/Zip Occupation __________________________________________________________________________________________ Personal Statement – Attach a supplementary sheet to give information about your ambitions, goals, background, leadership, and how this scholarship would relate to them. This will assist the committee in judging your eligibility. Verification of Enrollment Dear Admissions/Registrar: This student is applying for a scholarship from the American Welding Society through the AWS Foundation. Please complete the information requested below for verification of the student’s acceptance to this academic institution. In addition, please verify the student’s current enrollment status and total number of hours completed. This information should be included in the student’s scholarship application package. Thank you. AWS Foundation, Inc. -----------------------------------------------------------------------------------------------------------To be completed by Student: I authorize the above requested information to be released to the AWS Foundation, Inc. in connection with my application for a National Scholarship. _____________________________ Student ____________________________ Academic Institution ______________________________ ____________________________ Social Security Number Date -----------------------------------------------------------------------------------------------------------To be completed by Admissions/Registrar: _____________________________ Student ____________________________ Academic Institution Date of Acceptance to this Institution: _________________________________________ Is this student currently enrolled? ____________________________________________ Course of study currently enrolled: ___________________________________________ Number of Academic Hours Completed: ______________________________________ Student State: (circle one) Freshman Sophomore Junior Senior Other Signature __________________________________ Title _________________________ Print Name _______________________________ Telephone (_______)_____________ AWS Foundation Acknowledgement and Release The undersigned acknowledges that the Matsuo Bridge Company, Ltd. of Japan Scholarship is administered by the AWS Foundation but that funding is provided by Matsuo Bridge Company, Ltd. of Japan. All logistics associated with the Scholarship, including travel, lodging, hosting, and training are handled by and are the responsibility of Matsuo Bridge Company, Ltd. of Japan and not the AWS Foundation or the American Welding Society. The undersigned expressly releases the AWS Foundation, the American Welding Society, and their officers, directors, employees, and agents (each a “Released Party”) from any and all liability for injury to the person or property of the undersigned unless caused by the negligence of the Released Party sought to be held liable. This Acknowledgement and Release shall be binding on the successors, heirs, executors, representatives, and assigned of the undersigned. The undersigned acknowledges that he/she is participating in the Matsuo Bridge Company, Ltd. of Japan Scholarship freely and voluntary and assumes all risk of such participation. _________________ Date ______________________________ Signature of Applicant ______________________________ Printed Name _________________ Date ______________________________ Signature of Parent/Guardian ______________________________ Printed Name Matsuo Bridge Company, Ltd. of Japan Acknowledgement and Release The undersigned recipient of the Matsuo Bridge Company, Ltd. of Japan Scholarship acknowledges that there are certain risks inherent in international visits, including with respect to air travel and ground transportation, as well as the general risks associated with living, working, and traveling in cities such as Tokyo and Osaka. The undersigned expressly assumes those risks. The undersigned also releases the Matsuo Bridge Company, Ltd. of Japan, Matsuo America Company, and their officers, directors, employees, and agents (each a “Released Party”) from any and all liability for injury to the person or property of the undersigned unless caused by the negligence of the Released Party sough to be held liable. This Acknowledgement and Release shall be binding on the successors, heirs, executors, representatives, and assigns of the undersigned. The undersigned acknowledges that he/she is participating in the Matsuo Bridge Company, Ltd. of Japan Scholarship freely and voluntarily and executes this document on the same basis. _________________ Date ______________________________ Signature of Applicant ______________________________ Printed Name _________________ Date ______________________________ Signature of Parent/Guardian ______________________________ Printed Name Personal Statement Personal Statement of your career objectives, background, and how this scholarship relates to your professional growth. _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________ _____________________________________________________________
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